MBRS3200T3G - ON Semiconductor L.L.C.

June, 2012 − Rev. 5

1Publication Order Number:

MBRS3200T3/D

MBRS3200T3G,

NRVBS3200T3G

Surface Mount

Schottky Power Rectifier

This device employs the Schottky Barrier principle in a large area

metal−to−silicon power diode. State−of−the−art geometry features

epitaxial construction with oxide passivation and metal overlay

contact. Ideally suited for low voltage, high frequency rectification, or

as free wheeling and polarity protection diodes in surface mount

applications where compact size and weight are critical to the system.

Features

•Small Compact Surface Mountable Package with J−Bend Leads

•Rectangular Package for Automated Handling

•Highly Stable Oxide Passivated Junction

•Very High Blocking Voltage − 200 V

•175°C Operating Junction Temperature

•Guard−Ring for Stress Protection

•NRVB Prefix for Automotive and Other Applications Requiring

Unique Site and Control Change Requirements: AEC−Q101

Qualified and PPAP Capable

•All Packages are Pb−Free*

Mechanical Charactersistics

•Case: Epoxy, Molded, Epoxy Meets UL 94, V−0

•Weight: 95 mg (approximately)

•Finish: All External Surfaces Corrosion Resistant and Terminal

Leads are Readily Solderable

•Lead and Mounting Surface Temperature for Soldering Purposes:

260°C Max. for 10 Seconds

•Cathode Polarity Band

•Device Meets MSL 1 Requirements

•ESD Ratings:

♦Machine Model = A

♦Human Body Model = 1C

*For additional information on our Pb−Free strategy and soldering details, please

download the ON Semiconductor Soldering and Mounting Techniques

Reference Manual, SOLDERRM/D.

Device Package Shipping†

ORDERING INFORMATION

SMB

CASE 403A

PLASTIC

SCHOTTKY BARRIER

RECTIFIER

3.0 AMPERE

200 VOLTS

http://onsemi.com

†For information on tape and reel specifications,

including part orientation and tape sizes, please

refer to our Tape and Reel Packaging Specification

Brochure, BRD8011/D.

MBRS3200T3G SMB

(Pb−Free)

2,500 /

Tape & Reel

B320 = Specific Device Code

A = Assembly Location

Y = Year

WW = Work Week

G= Pb−Free Package

(Note: Microdot may be in either location)

AYWW

B320G

MARKING DIAGRAM

NRVBS3200T3G SMB

(Pb−Free)

2,500 /

Tape & Reel

MBRS3200T3G, NRVBS3200T3G

http://onsemi.com

MAXIMUM RATINGS

Rating Symbol Value Unit

Peak Repetitive Reverse Voltage

Working Peak Reverse Voltage

DC Blocking Voltage

VRRM

VRWM

200 V

Average Rectified Forward Current (TL = 120 °C) IF(AV) 3.0 A

Non−Repetitive Peak Surge Current

(Surge Applied at Rated Load Conditions Halfwave, Single Phase, 60 Hz)

IFSM 100

Operating Junction Temperature TJ−65 to +175 °C

Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the

Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect

device reliability.

THERMAL CHARACTERISTICS

Characteristic Symbol Value Unit

Thermal Resistance, Junction−to−Lead (Note 1)

Thermal Resistance, Junction−to−Ambient (Note 2)

RqJL

RqJA

°C/W

ELECTRICAL CHARACTERISTICS

Maximum Instantaneous Forward Voltage (Note 3)

(IF = 3.0 A, TJ = 25°C)

(IF = 4.0 A, TJ = 25°C)

(IF = 3.0 A, TJ = 150°C)

VF0.84

0.86

0.59

Maximum Instantaneous Reverse Current (Note 3)

(Rated dc Voltage, TJ = 25°C)

(Rated dc Voltage, TJ = 150°C)

IR1.0

5.0

1. Minimum pad size (0.108 × 0.085 inch) for each lead on FR4 board.

2. 1 inch square pad size (1 × 0.5 inch) for each lead on FR4 board.

3. Pulse Test: Pulse Width = 300 ms, Duty Cycle ≤ 2.0%.

100

0.1

1.00.2 0.3 0.4 0.5 0.6 0.7

, FORWARD VOLTAGE (V)

Figure 1. Typical Forward Voltage Figure 2. Maximum Forward Voltage

0.8 0.9 1.1 1.3

, FORWARD CURRENT (A)

TA = 25°C

TA = 150°C

100

0.1

1.00.2 0.3 0.4 0.5 0.6 0.7

, FORWARD VOLTAGE (V)

0.8 0.9 1.1 1.3

, FORWARD CURRENT (A)

TA = 25°C

TA = 150°C

1.2

TA = 175°CTA = 175°C

1.2

TA = 100°C

MBRS3200T3G, NRVBS3200T3G

http://onsemi.com

1.0E−09

1600 20 40 60 80 100

VR, REVERSE VOLTAGE (V)

Figure 3. Typical Reverse Current

120 140 180 200

IR, REVERSE CURRENT (A)

TA = 25°C

TA = 150°C

TA = 100°C

1.0E−08

1.0E−07

1.0E−06

1.0E−05

1.0E−04

1.0E−02

1.0E−09

1600 20 40 60 80 100

VR, REVERSE VOLTAGE (V)

Figure 4. Maximum Reverse Current

120 140 180 200

IR, REVERSE CURRENT (A)

1.0E−05

1.0E−04

1.0E−03

1.0E−07

1.0E−02

TA = 175°C

1.0E−03

TA = 25°C

TA = 150°C

TA = 100°C

TA = 175°C

1.0E−06

1.0E−08

Figure 5. Typical Capacitance

1000

1600 20 40 60 80 100

VR, REVERSE VOLTAGE (V)

100

120 140 180 200

C, CAPACITANCE (pF)

TC = 25°C

f = 1 MHz

Typical Capacitance

at 0 V = 209 V

15080 90 100 110 120

TL, LEAD TEMPERATURE (°C)

Figure 6. Current Derating − Lead

130 140 180

, AVERAGE FORWARD CURRENT (A)

SQUARE WAVE

Figure 7. Forward Power Dissipation

40123

IO, AVERAGE FORWARD CURRENT (A)

2.5

Pfo, AVERAGE POWER DISSIPATION (W)

0.5

1.5

4.5

3.5

4SQUARE WAVE

160 170

RqJL = 13°C/W

MBRS3200T3G, NRVBS3200T3G

http://onsemi.com

PACKAGE DIMENSIONS

SMB

CASE 403A−03

ISSUE H

NOTES:

1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982.

2. CONTROLLING DIMENSION: INCH.

3. D DIMENSION SHALL BE MEASURED WITHIN DIMENSION P.

2.261

0.089

2.743

0.108

2.159

0.085 ǒmm

inchesǓ

SCALE 8:1

*For additional information on our Pb−Free strategy and soldering

details, please download the ON Semiconductor Soldering and

Mounting Techniques Reference Manual, SOLDERRM/D.

SOLDERING FOOTPRINT*

DIM

MIN NOM MAX MIN

MILLIMETERS

1.90 2.20 2.28 0.075

INCHES

A1 0.05 0.10 0.19 0.002

b1.96 2.03 2.20 0.077

c0.15 0.23 0.31 0.006

D3.30 3.56 3.95 0.130

E4.06 4.32 4.60 0.160

L0.76 1.02 1.60 0.030

0.087 0.090

0.004 0.007

0.080 0.087

0.009 0.012

0.140 0.156

0.170 0.181

0.040 0.063

NOM MAX

5.21 5.44 5.60 0.205 0.214 0.220

0.51 REF 0.020 REF

POLARITY INDICATOR

OPTIONAL AS NEEDED

ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice

to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability

arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.

“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All

operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights

nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications

intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should

Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates,

and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death

associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal

Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.

PUBLICATION ORDERING INFORMATION

N. American Technical Support: 800−282−9855 Toll Free

USA/Canada

Europe, Middle East and Africa Technical Support:

Phone: 421 33 790 2910

Japan Customer Focus Center

Phone: 81−3−5817−1050

MBRS3200T3/D

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Fax: 303−675−2176 or 800−344−3867 Toll Free USA/Canada

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