Rev Date: 06/19/2012 2 www.seielect.com
This specification may be changed at any time without prior notice marketing@seielect.com
Please confirm technical specifications before you order and/or use.
RPC Series
Pulse Withstanding Thick Film Chip Resistor
Stackpole Electronics, Inc.
Resistive Product Solutions
Operating Temperature Range: -55ºC to +155ºC
Variation of Resistance with
Temperature
Overload ∆R ≤ ± 1% +0.05Ω
No visible damage, legible markings
No breakdown or flashover
R ≥ 1G Ohm
See ratings table
Clause 4.8 +20ºC/ -55ºC / +20ºC/ +125ºC/ +20ºC: RPC 2010, 2512
+20ºC/ -55ºC/ +20ºC/ +155ºC/ +20ºC: RPC 0603, 0805, 1206, 1210
Clause 4.13 The applied voltage shall be 2.5 times of the rated voltage or
twice of the limiting element voltage, whichever is the less severe, 2s.
Test ResultsTest Test Methods (JIS C 5201-1 : 1198)
Voltage Proof Clause 4.7 500Va.a., 60s
∆R ≤ ± 1% +0.05Ω
Clause 4.17 235ºC, 2s.Solderability In accordance with Clause 4.17.4.5
Bend of Strength of the Face
Plating
Climatic Sequence Clause 4.23 Dry/Damp heat (12+12h cycle), first cycle/ ∆R ≤ ± 5% +0.1Ω
Cold/Damp heat (12+12h cycle), remaining cycle / D.C. Load No visible damage
Damp Test, Steady State ∆R ≤ ± 5% +0.1Ω
No visible damage, legible markings
∆R ≤ ± 1% +0.05Ω
Clause 4.33 Amount of bend: 3mm RPC 0603, 0805, 1206, 1210
Amount of bend: 1mm RPC 2010, 2512
Clause 4.19 Cycle: -55ºC/ +125ºC 5 times: RPC 2010, 2512
Adhesion Clause 4.32 5N, 10s No visible damage
Endurance at the Upper Category
Temperature
Clause 4.25.3 125ºC, no load, 1.000h: RPC 2010, 2512
155ºC, no load, 1.000h: RPC 0603, 0805, 1206, 1210
∆R ≤ ± 5% +0.1Ω
No visible damage
Cycle: -55ºC/ +155ºC 5 times: RPC 0603, 0805, 1206, 1210
∆R ≤ ± 1% +0.05Ω
Endurance @ 70ºC Clause 4.25.1 Rated voltage, 1.5h "ON", 0.5h "OFF", 70ºC, 1,000h ∆R ≤ ± 5% +0.1Ω
No visible damage
Resistance to Soldering Heat
Rapid Change of Temperature
Clause 4.24 40ºC, 95% R.H., 56 days, test a) and b) of Clause 4.24.2.1
No visible damage
Clause 4.18 After immersion into the flux, the immersion into
solder shall be carried out in solder bath at 260º for 5s.
Performance Characteristics
Power Derating Curve:
0
Percent Rated Power (%)
100
-55ºC 70ºC
80
60
40
20
155ºC
-60 -40 -20 0 20 40 60 80 100
Ambient Temperature (ºC)
120 140 160 180