BAS70J / BAS70W BAS70-04W /BAS70-05W / BAS70-06W SMALL SIGNAL SCHOTTKY DIODE FEATURES AND BENEFITS n n n n K2 NC VERY SMALL CONDUCTION LOSSES NEGLIGIBLE SWITCHING LOSSES LOW FORWARD VOLTAGE DROP SURFACE MOUNT DEVICE K K A K1 A A K1 BAS70W BAS70-06W A2 DESCRIPTION Schottky barrier diodes encapsulated either in SOT-323 or SOD-323 small SMD packages. Single and double diodes with different pining are available. A K2 NC K2 A2 K1 K A2 K A2 K1 K2 A1 A1 A1 A1 BAS70-04W BAS70-05W SOT-323 A 76 K BAS70J SOD-323 ABSOLUTE RATINGS (limiting values) Symbol VRRM IF Parameter Value Unit Repetitive peak reverse voltage 70 V Continuous forward current 15 mA IFSM Surge non repetitive forward current tp = 10 ms 1 A Ptot Power dissipation (note 1) Tamb = 25C SOD-323 230 mW - 65 to +150 C Tstg SOT-323 Maximum storage temperature range Tj Maximum operating junction temperature * 150 C TL Maximum temperature for soldering during 10s 260 C Note 1: for double diodes, Ptot is the total dissipation of both diodes. * : dPtot 1 < thermal runaway condition for a diode on its own heatsink dTj Rth(j - a) February 2000 - Ed: 3B 1/5 BAS70J / BAS70W / BAS70-04W / BAS70-05W / BAS70-06W THERMAL RESISTANCE Symbol Rth (j-a) Parameters Junction to ambient (*) SOD-323 Value Unit 550 C/W C/W SOT-323 (*) Mounted on epoxy board, with recommended pad layout. STATIC ELECTRICAL CHARACTERISTICS (per diode) Symbol Test Conditions Min. Typ. Max. VBR Tj = 25C IR = 10A VF * Tj = 25C IF = 1mA 410 mV IR ** Tj = 25C VR = 50V 100 nA Max. Unit 2 pF 100 ps Pulse test: 70 Unit V * tp = 380s, < 2% ** tp = 5 ms, < 2% DYNAMIC CHARACTERISTICS Symbol Test Conditions C Tj = 25C F = 1MHz * Tj = 25C IF = 5mA Krakauer Method * Effective carrier life time. 2/5 VR = 0V Min. Typ. BAS70-05W / BAS70-06W BAS70J / BAS70W / BAS70-04W / Fig. 1: Forward voltage drop versus forward current. Fig. 2: Reverse leakage current versus reverse voltage applied (typical values). IR(A) IFM(A) 1E+1 7E-2 Tj=100C Typical values Tj=100C 1E+0 1E-2 Tj=25C Maximum values 1E-1 Tj=25C 1E-3 Tj=25C Typical values 1E-2 VFM(V) 1E-4 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0 Fig. 3: Reverse leakage current versus junction temperature (typical values). VR(V) 1E-3 0 5 10 15 20 25 30 35 40 45 50 55 60 65 70 Fig. 4: Junction capacitance versus reverse voltage applied (typical values). IR(A) C(pF) 5E+2 2.0 F=1MHz Tj=25C VR=70V 1E+2 1.0 1E+1 1E+0 1E-1 Tj(C) 1E-2 0 25 50 75 100 125 150 Fig. 5: Relative variation of thermal impedance junction to ambient versus pulse duration (epoxy FR4 with recommended pad layout, S(Cu)=35m). 0.1 VR(V) 1 10 100 Fig. 6: Thermal resistance junction to ambient versus copper surface under each lead (Epoxy printed circuit board FR4, copper thickness: 35m). Rth(j-a) (C/W) Zth(j-a)/Rth(j-a) 600 1.00 550 = 0.5 500 = 0.2 0.10 450 = 0.1 400 T Single pulse 0.01 1E-3 P=0.2W 1E-2 tp(s) 1E-1 =tp/T 1E+0 1E+1 350 S(Cu) (mm ) tp 1E+2 300 0 5 10 15 20 25 30 35 40 45 50 3/5 BAS70J / BAS70W / BAS70-04W / BAS70-05W / BAS70-06W PACKAGE MECHANICAL DATA SOT-323 DIMENSIONS REF. A Millimeters Min. A1 D b L E c 4/5 e Min. Typ. Max. A 0.8 1.1 0.031 0.043 A1 0.0 0.1 0.0 0.004 b 0.25 0.4 0.010 0.016 c 0.1 0.26 0.004 0.010 D 1.8 2.0 2.2 E 1.15 1.25 1.35 0.045 0.049 0.053 e H Typ. Max. Inches 0.071 0.079 0.086 0.65 0.026 H 1.8 2.1 2.4 0.071 0.083 0.094 L 0.1 0.2 0.3 0.004 0.008 0.012 0 30 0 30 BAS70-05W / BAS70-06W BAS70J / BAS70W / BAS70-04W / PACKAGE MECHANICAL DATA SOD-323 H DIMENSIONS A1 REF. b Millimeters Min. E A A D c Q1 L n Max. Inches Min. 1.17 Max. 0.046 A1 0 0.1 0 0.004 b 0.25 0.44 0.01 0.017 c 0.1 0.25 0.004 0.01 D 1.52 1.8 0.06 0.071 E 1.11 1.45 0.044 0.057 H 2.3 2.7 0.09 0.106 L 0.1 0.46 0.004 0.02 Q1 0.1 0.41 0.004 0.016 Ordering type Marking Package Weight Base qty Delivery mode BAS70W D28 SOT-323 0.006g 3000 Tape & reel BAS70-04W D31 SOT-323 0.006g 3000 Tape & reel BAS70-05W D30 SOT-323 0.006g 3000 Tape & reel BAS70-06W D29 SOT-323 0.006g 3000 Tape & reel BAS70J 76 SOD-323 0.005g 3000 Tape & reel Epoxy meets UL94,V0 Information furnished is believed to be accurate and reliable. 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