GE
Data Sheet
April 26, 2016 ©2016 General Electric Company. All rights reserved. Page 1
QHHD019A0B Hammerhead* Series; DC-DC Converter Power Modules
18Vdc –75Vdc input; 12Vdc output; 19A Output Current
Features
Compliant to RoHS II EU “Directive 2011/65/EU (-Z versions)
Compliant to REACH Directive (EC) No 1907/2006
Small Size and low profile, follows industry standard DOSA 1/4th
Brick footprint
58.4 mm x 36.8 mm x 10.2 mm
(2.30 in x 1.45 in x 0.40 in)
Ultra-wide Input Voltage Range, 18Vdc to 75Vdc
No minimum load
High efficiency – 93.5% at full load
Constant switching frequency
Low output ripple and noise
Paste-in-hole reflow compliant for all versions, TH pins and heat
plates
Negative Remote On/Off logic
Output overcurrent/voltage protection (hiccup)
Over-temperature protection
Output Voltage adjust: 90% to 110% of Vo,nom
Suitable for cold wall cooling using heatplate version of the
module
ANSI/UL#60950-1-2011 and CAN/CSA† C22.2 No. 60950-1-07,
Second Edition + A1:2011 (MOD), dated March 19, 2011; and DIN
EN 60950-1 (VDE‡ 0805 Teil 1):2011-01; EN 60950-1:2006 +
A11:2009 + A1:2010, DIN EN 60950-1/A12 (VDE 0805-
1/A12):2011-08; EN 60950-1/A12:2011-02, IEC 60950-
1(ed.2);am1:2009
CE mark meets 2006/95/EC directive§
Meets the voltage and current requirements for ETSI 300-132-2
and complies with and licensed for Basic insulation rating per
EN60950-1
2250 Vdc Isolation tested in compliance with IEEE 802.3¤ PoE
standards
ISO**9001 and ISO 14001 certified manufacturing facilities
Applications
Hybrid power architectures
Wireless Networks
Enterprise Networks including Power over Ethernet
(PoE)
Industrial Equipment
Options
1/4th Brick heat plate with unthreaded inserts
1/4th Brick heat plate with threaded inserts
Description
The QHHD019A0B [HAMMERHEAD*] Series, quarter-brick, low-height power modules are isolated dc-dc converters which provide a
single, precisely regulated output voltage over an ultra-wide input voltage range of 18-75Vdc. The QHHD019A0B provides 12Vdc
nominal output voltage rated for 19Adc output current. The module incorporates GE
’s vast heritage for reliability and quality, while
also using the latest in
technology, and component and process standardization to achieve highly competitive cost. The open frame
module construction, enable designers to develop cost and space efficient solutions. The module achieves typical full load efficiency
greater than 93% at VIN=24Vdc and VIN=48Vdc
. Standard features include remote On/Off, remote sense, output voltage adjustment,
overvoltage, overcurrent and over temperature protection. An optional heat plate allows for external standard, quarter-
brick heat
sink attachment to achieve higher output current in high temperature applications.
* Trademark of General Electric Company.
# UL is a registered trademark of Underwriters Laboratories, Inc.
† CSA is a registered trademark of Canadian Standards Association.
‡ VDE is a trademark of Verband Deutscher Elektrotechniker e.V.
§ This product is intended for integration into end-user equipment . All of the required procedures of end-use equipment should be followed.
¤ IEEE and 802 are registered trademarks of the Institute of Electrical and Electronics Engineers, Incorporated.
** ISO is a registered trademark of the International Organization of Standards
RoHS Compliant
GE
Data Sheet
QHHD019A0B Series: DC-DC Converter Power Module
18 to 75V
dc
Input; 12V
dc
, 19A, 225W Output
April 26, 2016 ©2016 General Electric Company. All rights reserved. Page 2
Absolute Maximum Ratings
Stresses in excess of the absolute maximum ratings can cause permanent damage to the device. These are absolute stress ratings
only, functional operation of the device is not implied at these or any other conditions in excess of those given in the operations
sections of the technical requirement. Exposure to absolute maximum ratings for extended periods can adversely affect the device
reliability.
Parameter Device Symbol Min Max Unit
Input Voltage (Continuous) All VIN -0.3 80 Vdc
Transient (100ms) All VIN, trans -0.3 100 Vdc
Operating Ambient Temperature All TA -40 85 °C
(see Thermal Considerations section)
Storage Temperature All Tstg -55 125 °C
Operating altitude (see section on thermal considerations) All 5000 m
I/O Isolation Voltage (100% factory Hi-Pot tested) All 2250 Vdc
Electrical Specifications
Unless otherwise indicated, specifications apply at VIN = 48Vdc, resistive load, and TA=25C conditions with airflow=300LFM apply
over all operating input voltage, resistive load, and temperature conditions.
Parameter Device Symbol Min Typ Max Unit
Operating Input Voltage All VIN 18 24/48 75 Vdc
Input No Load Current
VIN = 24Vdc, (IO = 0, module enabled) All IIN,No load 180 mA
VIN = 48Vdc, (IO = 0, module enabled) All IIN,No load 120 mA
Input Stand-by Current All IIN,stand-by 8 mA
(VIN = 24 to 48Vdc, module disabled)
Maximum Input Current (VIN=18Vdc, IO=IO, max)
Adc
12.0 VO 14
Inrush Transient All I2t 0.1 A2s
Input Reflected Ripple Current, peak-to-peak
(5Hz to 20MHz, 12μH source impedance; VIN=0V to
75Vdc, IO= IOmax ; see Test configuration section)
All 30 mAp-p
Input Ripple Rejection (120Hz) All 60 dB
EMC, EN55022 See EMC Considerations section
CAUTION: This power module is not internally fused. An input line fuse must always be used.
This power module can be used in a wide variety of applications, ranging from simple standalone operation to being part of
complex power architecture. To preserve maximum flexibility, internal fusing is not included; however, to achieve maximum safety
and system protection, always use an input line fuse. The safety agencies require a fast-acting fuse with a maximum rating of 25A
(voltage rating 125Vac) in the ungrounded input lead. (Littelfuse Part #0456025, Surface Mount 456 Series - Nano2® or equivalent,
see Safety Considerations section)
GE
Data Sheet
QHHD019A0B Series: DC-DC Converter Power Module
18 to 75V
dc
Input; 12V
dc
, 19A, 225W Output
April 26, 2016 ©2016 General Electric Company. All rights reserved. Page 3
Electrical Specifications (continued)
Parameter Device Symbol Min Typ Max Unit
V
dc
IN
dc
O
O, max
A
12 V
O
V
O, set
11.82
12.00
12.18
V
dc
All VO -3.0 +3.0 % VO, set
12 Vo
V
O, adj
-10
+10*
% V
O, set
IN
IN, min
IN, max
All
0.05
0.2
% V
O, set
Load (IO=IO, min to IO, max) All 0.05 0.2 % VO, set
ref
A, min
A, max
All
1.0
1.5
% V
O, set
IN
dc
O
O, max
A
12 VO
75
mV
rms
Peak-to-Peak (5Hz to 20MHz bandwidth) 160 mVpk-pk
12 VO CO, max 0 5000 μF
12 VO Io 0 19.0 Adc
12 VO IO, lim 23 Adc
VO ≤ 250 mV @ 25o C All IO, s/c 1.2 Arms
Efficiency
VIN=24Vdc, TA=25°C, IO=IO, max
12.0V
O
η
93.5
%
VIN=48Vdc, TA=25°C, IO=IO, max
12.0V
O
η
93
%
Switching Frequency (Fixed) All fsw 250 kHz
IN
dc
O
O, max
(∆IO/∆t=0.1A/µs, VIN=24 to 48Vdc, TA=25°C, CO =0uF)
Load Change from IO= 50% to 75% or 25% to 50% of IO,max:
Peak Deviation All Vpk 3.0 % VO, set
Settling Time (Vo<10% peak deviation) All ts 800 µs
Isolation Specifications
Parameter Symbol Min Typ Max Unit
Isolation Capacitance Ciso 1000 pF
Isolation Resistance Riso 10 MΩ
I/O Isolation Voltage All 2250 Vdc
GE
Data Sheet
QHHD019A0B Series: DC-DC Converter Power Module
18 to 75V
dc
Input; 12V
dc
, 19A, 225W Output
April 26, 2016 ©2016 General Electric Company. All rights reserved. Page 4
General Specifications
Parameter
Min Typ Max Unit
Calculated Reliability based upon Telcordia SR-332 Issue 2:
Method I Case 3 (IO=80%IO, max, TA=40°C, airflow = 200 lfm, 90%
confidence)
FIT 128.7 109/Hours
MTBF 7,769,746 Hours
Weight (open frame)
43.1 (1.52) g (oz.)
Weight (Heat Plate)
58 (2.05) g (oz.)
Feature Specifications
Unless otherwise indicated, specifications apply over all operating input voltage, resistive load, and temperature conditions. See
Feature Descriptions for additional information.
Parameter Device Symbol Min Typ Max Unit
Remote On/Off Signal Interface
(VIN=VIN, min to VIN, max ; open collector or equivalent,
Signal referenced to VIN- terminal)
Negative Logic: device code suffix “1”
Logic Low = module On, Logic High = module Off
Logic Low = module Off, Logic High = module On
Logic Low - Remote On/Off Current (Von/off = -0.7Vdc) All Ion/off 0.15 mA
Logic Low - On/Off Voltage All Von/off -0.7 0.6 Vdc
Logic High Voltage (Ion/off = 0Adc) All Von/off 2.5 6.7 Vdc
Logic High maximum allowable leakage current All Ion/off 20 μA
Turn-On Delay and Rise Times
(IO=80% of IO, max, TA=25°C)
Case 1: Input power is applied for at least 1second, and then
the On/Off input is set from OFF to ON (Tdelay = on/off pin
transition until VO = 10% of VO, set)
All Tdelay
Case1 35 ms
Case 2: On/Off input is set to Module ON, and then input
power is applied
(Tdelay = VIN reaches VIN, min until VO = 10% of VO,set)
All Tdelay
Case2 35 ms
Output voltage Rise time (time for Vo to rise from 10%
of Vo,set to 90% of Vo, set) All Trise 20 ms
Output Voltage Overshoot 3 % VO, set
(IO=80% of IO, max, VIN= 24 to 48Vdc, TA=25°C)
Output Overvoltage Protection
12.0VO VO, limit 13.61 16.6 Vdc
Input Undervoltage Lockout
Turn-on Threshold All Vuv/on 17.5 18 Vdc
Turn-off Threshold All Vuv/off 15 15.5 Vdc
Hysteresis All Vhyst 1.0 Vdc
1 – OVP voltages lower than 13.6Vin for 18-20Vin
GE
Data Sheet
QHHD019A0B Series: DC-DC Converter Power Module
18 to 75V
dc
Input; 12V
dc
, 19A, 225W Output
April 26, 2016 ©2016 General Electric Company. All rights reserved. Page 5
Characteristic Curves
The following figures provide typical characteristics for the QHHD019A0B (12V, 19A) at 25 OC.
EFFICIENCY, η (%)
OUTPUT CURRENT OUTPUT VOLTAGE
Io(A) (5A/div) VO (V) (200mV/div)
OUTPUT CURRENT, I
O
(A)
TIME, t (200µs/div)
Figure 1. Converter Efficiency versus Output Current.
Figure 4. Transient Response to 0.1A/µS Dynamic Load
Change from 50% to 75% to 50% of full load, Vin=48V.
OUTPUT VOLTAGE
VO (V) (100mV/div)
On/Off VOLTAGE OUTPUT VOLTAGE
VOn/Off (V) (2V/div) VO (V) (5V/div)
TIME, t (2µs/div)
TIME, t (10ms/div)
Figure 2. Typical output ripple and noise (I
o
= I
o,max
).
Figure 5. Typical Start-up Using Remote On/Off, negative
logic version shown (VIN = 48V, Io = Io,max).
OUTPUT CURRENT OUTPUT VOLTAGE
Io(A) (5A/div) VO (V) (200mV/div)
InTPUT VOLTAGE OUTPUT VOLTAGE
VIN (V) (20V/div) VO (V) (5V/div)
TIME, t (200µs/div)
TIME, t (20ms/div)
Figure 3. Transient Response to 0.1A/µS Dynamic Load
Change from 50% to 75% to 50% of full load, Vin=24V
Figure 6. Typical Start-up Using Input Voltage (V
IN
= 48V, I
o
=
Io,max).
48Vin
75Vin
24Vin
18Vin
GE
Data Sheet
QHHD019A0B Series: DC-DC Converter Power Module
18 to 75V
dc
Input; 12V
dc
, 19A, 225W Output
April 26, 2016 ©2016 General Electric Company. All rights reserved. Page 6
Test Configurations
Figure 7. Input Reflected Ripple Current Test Setup.
NOTE: All voltage measurements to be taken at the module
terminals, as shown above. If sockets are used then
Kelvin connections are required at the module terminals
to avoid measurement errors due to socket contact
resistance.
V
O
(+)
V
O
(
–
)
RESISTIVE
LOAD
SCOPE
COPPER STRIP
GROUND PLANE
10uF
1uF
Figure 8. Output Ripple and Noise Test Setup.
Vout+
Vout-
Vin+
Vin-
R
LOAD
R
contact
R
distribution
R
contact
R
distribution
R
contact
R
contact
R
distribution
R
distribution
V
IN
V
O
NOTE: All voltage measurem ents to be taken at the module
terminals, as shown above. If sockets are used then
Kelvin connections are required at the module terminals
to avoid measurement errors due to socket contact
resistance.
Figure 9. Output Voltage and Efficiency Test Setup.
η
=
V
O
.
I
O
V
IN
.
I
IN
x
100
%
Efficiency
Design Considerations
Input Source Impedance
The power module should be connected to a low
ac-impedance source. Highly inductive source impedance can
affect the stability of the power module. For the test
configuration in Figure 7, a 220μF electrolytic capacitor Cin
(ESR<0.7Ω at 100kHz), mounted close to the power module
helps ensure the stability of the unit. Consult the factory for
further application guidelines.
Safety Considerations
For safety-agency approval of the system in which the power
module is used, the power module must be installed in
compliance with the spacing and separation requirements of
the end-use safety agency standard, i.e., UL 60950-1-3, CSA
C22.2 No. 60950-00, and VDE 0805 (IEC60950, 3rd Edition).
If the input source is non-SELV (ELV or a hazardous voltage
greater than 60 Vdc and less than or equal to 75Vdc), for the
module’s output to be considered as meeting the requirements
for safety extra-low voltage (SELV), all of the following must be
true:
The input source is to be provided with reinforced
insulation from any other hazardous voltages, including
the ac mains.
One VIN pin and one VOUT pin are to be grounded, or both
the input and output pins are to be kept floating.
The input pins of the module are not operator accessible.
Another SELV reliability test is conducted on the whole
system (combination of supply source and subject
module), as required by the safety agencies, to verify that
under a single fault, hazardous voltages do not appear at
the module’s output.
Note: Do not ground either of the input pins of the module
without grounding one of the output pins. This may
allow a non-SELV voltage to appear between the output
pins and ground.
The power module has extra-low voltage (ELV) outputs when all
inputs are ELV.
For input voltages exceeding –60 Vdc but less than or equal to
–75 Vdc, these converters have been evaluated to the
applicable requirements of BASIC INSULATION between
secondary DC MAINS DISTRIBUTION input (classified as TNV-2
in Europe) and unearthed SELV outputs.
The input to these units is to be provided with a fast-acting
fuse with a maximum rating of 25A (voltage rating 125Vac) in
the ungrounded input lead. (Littelfuse Part #0456025, Surface
Mount 456 Series Nano2® or equivalent).
Cin
GE
Data Sheet
QHHD019A0B Series: DC-DC Converter Power Module
18 to 75V
dc
Input; 12V
dc
, 19A, 225W Output
April 26, 2016 ©2016 General Electric Company. All rights reserved. Page 7
Feature Description
Remote On/Off
Negative logic remote on/off, device code suffix “1”, turns the
module off during a logic high and on during a logic low.
ON/OFF
Vin+
Vin-
I
on/off
V
on/off
Vout+
TRIM
Vout-
Figure 10. Circuit configuration for using Remote On/Off
Implementation.
To turn the power module on and off, the user must supply a
switch (open collector or equivalent) to control the voltage
(Von/off) between the ON/OFF terminal and the VIN(-) terminal.
Logic low is 0V ≤ Von/off ≤ 0.6V. The maximum Ion/off during a
logic low is 0.15mA, the switch should be maintain a logic low
level whilst sinking this current.
During a logic high, the typical Von/off generated by the module
is 5V, and the maximum allowable leakage current at Von/off =
5V is 1μA.
If not using the remote on/off feature:
For negative logic, short the ON/OFF pin to VIN(-).
Remote Sense
Remote sense minimizes the effects of distribution losses by
regulating the voltage at the remote-sense connections (See
Figure 11). The voltage between the remote-sense pins and the
output terminals must not exceed the output voltage sense
range given in the Feature Specifications table:
[VO(+) – VO(–)] – [SENSE(+) – SENSE(–)] ≤ 0.5 V
Although the output voltage can be increased by both the
remote sense and by the trim, the maximum increase for the
output voltage is not the sum of both. The maximum increase
is the larger of either the remote sense or the trim.
The amount of power delivered by the module is defined as the
voltage at the output terminals multiplied by the output
current. When using remote sense and trim, the output voltage
of the module can be increased, which at the same output
current would increase the power output of the module. Care
should be taken to ensure that the maximum output power of
the module remains at or below the maximum rated power
(Maximum rated power = Vo,set x Io,max).
Figure 11. Circuit Configuration for remote sense .
Overcurrent Protection
To provide protection in a fault (output overload) condition, the
unit is equipped with internal
current-limiting circuitry and can endure current
limiting continuously. At the point of current-limit
inception, the unit enters hiccup mode. If the unit is
not configured with auto–restart, then it will latch off following
the over current condition. The module can be restarted by
cycling the dc input power for at least one second or by
toggling the remote on/off signal for at least one second.
If the unit is configured with the auto-restart option (4), it will
remain in the hiccup mode as long as the overcurrent
condition exists; it operates normally, once the output current
is brought back into its specified range. The average output
current during hiccup is 10% IO, max.
Overtemperature Protection
To provide protection under certain fault conditions, the unit is
equipped with a thermal shutdown circuit. The unit will
shutdown if the thermal reference point Tref (Figure 13),
exceeds 135oC (typical), but the thermal shutdown is not
intended as a guarantee that the unit will survive temperatures
beyond its rating. The module will automatically restart upon
cool-down to a safe temperature.
Input Undervoltage Lockout
At input voltages below the input undervoltage lockout limit,
the module operation is disabled. The module will only begin to
operate once the input voltage is raised above the
undervoltage lockout turn-on threshold, VUV/ON.
Once operating, the module will continue to operate until the
input voltage is taken below the undervoltage turn-off
threshold, VUV/OFF.
Output Over Voltage Protection
The output over voltage protection scheme of the modules has
an independent over voltage loop to prevent single point of
failure. This protection feature latches in the event of over
voltage across the output. Cycling the on/off pin or input
voltage resets the latching protection feature. If the auto-
V
O
(+)
SENSE(+)
SENSE(–)
V
O
(–)
V
I
(+)
V
I
(-)
I
O
LOAD
CONTACTAND
DISTRIBUTION LOSSES
SUPPLYI
I
CONTACT
RESISTANCE
GE
Data Sheet
QHHD019A0B Series: DC-DC Converter Power Module
18 to 75V
dc
Input; 12V
dc
, 19A, 225W Output
April 26, 2016 ©2016 General Electric Company. All rights reserved. Page 8
restart option (4) is ordered, the module will automatically
restart upon an internally programmed time elapsing.
Output Voltage Programming
Trimming allows the output voltage set point to be increased or
decreased from the default value; this is accomplished by
connecting an external resistor between the TRIM pin and
either the VO(+) pin or the VO(-) pin.
V
O
(+)
V
O
TRIM
V
O
(-)
R
trim-down
LOAD
V
IN
(+)
ON/OFF
V
IN
(-)
R
trim-up
Figure 12. Circuit Configuration to Trim Output Voltage.
Connecting an external resistor (Rtrim-down) between the TRIM pin
and the VO(-) (or Sense(-)) pin decreases the output voltage set
point. To maintain set point accuracy, the trim resistor
tolerance should be ±1.0%.
The following equation determines the required external
resistor value to obtain a percentage output voltage change of
Δ%
ΚΩ
−
∆
=
−22.10
%
511
downtrim
R
Where
100
0.12
0.12
%×
−
=∆ V
VV
desired
Connecting an external resistor (Rtrim-up) between the TRIM pin
and the VO(+) (or Sense (+)) pin increases the output voltage set
point. The following equation determines the required external
resistor value to obtain a percentage output voltage change of
Δ%:
ΚΩ
−
∆
−
∆×
∆+××
=
−
22.10
%
511
%225.1 %)100(0.1211.5
uptrim
R
Where
100
0.12
0.12
%×
−
=∆
desired
V
The voltage between the VO(+) and VO(–) terminals must not
exceed the minimum output overvoltage protection value
shown in the Feature Specifications table. This limit includes
any increase in voltage due to remote-sense compensation
and output voltage set-point adjustment trim.
Although the output voltage can be increased by both the
remote sense and by the trim, the maximum increase for the
output voltage is not the sum of both. The maximum increase
is the larger of either the remote sense or the trim. The amount
of power delivered by the module is defined as the voltage at
the output terminals multiplied by the output current. When
using remote sense and trim, the output voltage of the module
can be increased, which at the same output current would
increase the power output of the module. Care should be taken
to ensure that the maximum output power of the module
remains at or below the maximum rated power (Maximum
rated power = VO,set x IO,max).
Thermal Considerations
The power modules operate in a variety of thermal
environments; however, sufficient cooling should be provided
to help ensure reliable operation.
Considerations include ambient temperature, airflow, module
power dissipation, and the need for increased reliability. A
reduction in the operating temperature of the module will
result in an increase in reliability.
The thermal data presented here is based on physical
measurements taken in a wind tunnel, using automated
thermo-couple instrumentation to monitor key component
temperatures: FETs, diodes, control ICs, magnetic cores,
ceramic capacitors, opto-isolators, and module pwb
conductors, while controlling the ambient airflow rate and
temperature. For a given airflow and ambient temperature, the
module output power is increased, until one (or more) of the
components reaches its maximum derated operating
temperature, as defined in IPC-9592. This procedure is then
repeated for a different airflow or ambient temperature until a
family of module output derating curves is obtained.
The thermal reference points, Tref1, and Tref2 used in the
specifications for open frame modules are shown in Figure 13.
For reliable operation these temperatures should not exceed
124 OC & 124 OC respectively.
For altitude adjustment the following equations should be
applied:
Talt = Tsea + ΔT
where:
Tsea is the comp. / Tref temperature at sea level measurement
Tamb is the temperature at the operating altitude
ρsea is the density of air at sea level,
ρalt is the density of air at the chosen altitude
GE
Data Sheet
QHHD019A0B Series: DC-DC Converter Power Module
18 to 75V
dc
Input; 12V
dc
, 19A, 225W Output
April 26, 2016 ©2016 General Electric Company. All rights reserved. Page 9
Figure 13. Tref Temperature Measurement Location for open
frame version.
The thermal reference point, Tref used in the specifications is
shown in Figure 14. For reliable operation these temperatures
should not exceed 105 OC
Figure 14. Tref Temperature Measurement Location for heat
plate version.
The thermal reference points, Tref1, and Tref2 used in the
specifications is shown in Figure 15. For reliable operation
these temperatures should not exceed 100 OC & 125 OC
respectively.
Figure 15. Tref Temperature Measurement Location for
coldwall applications version.
Heat Transfer via Convection
Increased airflow over the module enhances the heat transfer
via convection. Derating figures showing the maximum output
current that can be delivered by each module versus local
ambient temperature (TA) for natural convection and up to
3m/s (600 ft./min) are shown in in Figures 16 - 22.
Please refer to the Application Note “Thermal Characterization
Process For Open-Frame Board-Mounted Power Modules” for a
detailed discussion of thermal aspects including maximum
device temperatures.
OUTPUT CURRENT, IO (A)
AMBIENT TEMEPERATURE, T
A
(
o
C)
Figure 16. Output Current Derating for the Open Frame
Module; Airflow in the Transverse Direction from Vout(+) to
Vout(-); VIN =48V, VO=12V.
OUTPUT CURRENT, IO (A)
AMBIENT TEMEPERATURE, T
A
(
o
C)
1
4
7
10
13
16
19
30 35 40 45 50 55 60 65 70 75 80 85 90
NC
0.5m/s
(100LFM) 1m/s
(200LFM)
2m/s
(400LFM)
3m/s
(600LFM)
1
4
7
10
13
16
19
25 30 35 40 45 50 55 60 65 70 75 80 85 90
NC
0.5m/s
(100LFM) 1m/s
(200LFM)
2m/s
(400LFM)
3m/s
(600LFM)
Air
GE
Data Sheet
QHHD019A0B Series: DC-DC Converter Power Module
18 to 75V
dc
Input; 12V
dc
, 19A, 225W Output
April 26, 2016 ©2016 General Electric Company. All rights reserved. Page 10
Figure 17. Output Current Derating for the Module with
Heatplate; Airflow in the Transverse Direction from Vout(+) to
Vout(-);VIN =48V, VO=12V
OUTPUT CURRENT, IO (A)
AMBIENT TEMEPERATURE, T
A
(
o
C)
Figure 18. Output Current Derating for the Open Frame
Module; Airflow in the Transverse Direction from Vout(+) to
Vout(-); VIN =24V, VO=12V.
OUTPUT CURRENT, IO (A)
AMBIENT TEMEPERATURE, T
A
(
o
C)
Figure 19. Output Current Derating for the Module with
Heatplate; Airflow in the Transverse Direction from Vout(+) to
Vout(-);VIN =24V, VO=12V.
Heat Transfer via Conduction
The module can also be used in a sealed environment with
cooling via conduction from the
module’s top surface through a heat plate to a
cold wall, as shown in Figure 20. The output current derating
versus cold wall temperature, when using thermal pad/grease
is shown in Figure 21.
Figure 20. Cold Wall Mounting
Figure 21. Derated Output Current versus Cold Wall
Temperature with local ambient temperature around
module at 75C; VIN =24V or 48V.
Through-Hole Soldering Information
Lead-Free Soldering
The RoHS-compliant (Z codes) through-hole products use the
SAC (Sn/Ag/Cu) Pb-free solder and RoHS-compliant
components. They are designed to be processed through
single or dual wave soldering machines or reflow soldering
processes. The pins have an RoHS-compliant finish that is
compatible with both Pb and Pb-free wave soldering
processes. A maximum preheat rate of 3°C/s is suggested. The
wave preheat process should be such that the temperature of
the power module board is kept below 210°C. For Pb solder,
the recommended pot temperature is 260°C, while the Pb-free
solder pot is 270°C max. If additional information is needed,
please consult with your GE Energy representative for more
details.
Paste-in-Hole Soldering
The QHHD019A0Bxx and the QHHD019A0B xx-HZ module is
compatible with reflow paste-in-hole soldering processes
shown in Figures 22-23. Please contact your GE Sales
Representative for further information.
MSL Rating
The QHHD_225W series modules have a MSL rating of 2a.
Tin Lead Soldering
The QHHD019A0B power modules are lead free modules and
can be soldered either in a lead-free solder process or in a
conventional Tin/Lead (Sn/Pb) process. It is recommended that
the customer review data sheets in order to customize the
solder reflow profile for each application board assembly. The
following instructions must be observed when soldering these
units. Failure to observe these instructions may result in the
failure of or cause damage to the modules, and can adversely
affect long-term reliability.
In a conventional Tin/Lead (Sn/Pb) solder process peak reflow
temperatures are limited to less than 235°C. Typically, the
eutectic solder melts at 183°C, wets the land, and subsequently
wicks the device connection. Sufficient time must be allowed
to fuse the plating on the connection to ensure a reliable solder
joint. For reliable soldering the solder reflow profile should be
1
4
7
10
13
16
19
25 30 35 40 45 50 55 60 65 70 75 80 85 90
NC
0.5m/s
(100LFM)
1m/s
(200LFM)
2m/s
(400LFM)
3m/s
(600LFM)
1
4
7
10
13
16
19
25 30 35 40 45 50 55 60 65 70 75 80 85 90
NC
0.5m/s
(100LFM) 1m/s
(200LFM)
2m/s
(400LFM)
3m/s
(600LFM)
0
2
4
6
8
10
12
14
16
18
20
30 40 50 60 70 80 90 100
OUTPUT CURRENT, Io(A)
COLDPLATE TEMPERATURE, Tc(oC)
GE
Data Sheet
QHHD019A0B Series: DC-DC Converter Power Module
18 to 75V
dc
Input; 12V
dc
, 19A, 225W Output
April 26, 2016 ©2016 General Electric Company. All rights reserved. Page 11
established by accurately measuring the modules CP
connector temperatures.
Lead Free Soldering
The –Z version of the QHHD019A0B modules are lead-free
(Pb-free) and RoHS compliant and are both forward and
backward compatible in a Pb-free and a SnPb soldering
process. Failure to observe the instructions below may result in
the failure of or cause damage to the modules and can
adversely affect long-term reliability.
REFLOW TEMP (°C)
REFLOW TIME (S)
Figure 22. Reflow Profile for Tin/Lead (Sn/Pb) process.
MAX TEMP SOLDER (°C)
Figure 23. Time Limit Curve Above 205oC for Tin/Lead (Sn/Pb)
process
Post Solder Cleaning and Drying Considerations
Post solder cleaning is usually the final circuit-board assembly
process prior to electrical board testing. The result of
inadequate cleaning and drying can affect both the reliability
of a power module and the testability of the finished
circuit-board assembly. For guidance on appropriate soldering,
cleaning and drying procedures, refer to GE Board
Mounted Power Modules: Soldering and Cleaning Application
Note (AN04-001).
Layout Considerations
The QHHD_225W power module series are low profile in order
to be used in fine pitch system card architectures. As such,
component clearance between the bottom of the power
module and the mounting board is limited. Avoid placing
copper areas on the outer layer directly underneath the power
module. Also avoid placing via interconnects underneath the
power module.
For additional layout guide-lines, refer to the FLT012A0 data
sheet.
GE
Data Sheet
QHHD019A0B Series: DC-DC Converter Power Module
18 to 75V
dc
Input; 12V
dc
, 19A, 225W Output
April 26, 2016 ©2016 General Electric Company. All rights reserved. Page 12
EMC Requirements
Figure 24 shows a maximum filter configuration to meet the conducted emission limits of EN55022 Class A.
Notes: C1 is a low impedance 100V SMT ceramics. C4 and C5 are low impedance >1500V ceramics.
Figure 24. Suggested Configuration for EN55022 Class A.
For further information on designing for EMC compliance, please refer to the FLT012A0Z data sheet
VIN = 48V, Io = Io,max, L Line
VIN = 48V, Io = Io,max, N Line
GE
Data Sheet
QHHD019A0B Series: DC-DC Converter Power Module
18 to 75V
dc
Input; 12V
dc
, 19A, 225W Output
April 26, 2016 ©2016 General Electric Company. All rights reserved. Page 13
EMC Requirements
Figure 25 shows a maximum filter configuration to meet the conducted emission limits of EN55022 Class B.
Notes: C1, C2, C3, C4 are low impedance 100V SMT ceramics. C5 and C6 are low impedance >1500V ceramics.
Figure 25. Suggested Configuration for EN55022 Class B.
VIN = 48V, Io = Io,max, L Line
VIN = 48V, Io = Io,max, N Line
GE
Data Sheet
QHHD019A0B Series: DC-DC Converter Power Module
18 to 75V
dc
Input; 12V
dc
, 19A, 225W Output
April 26, 2016 ©2016 General Electric Company. All rights reserved. Page 14
Mechanical Outline for Through-Hole Module (Open Frame)
Dimensions are in millimeters and [inches].
Tolerances: x.x mm ± 0.5 mm [x.xx in. ± 0.02 in.] (Unless otherwise indicated)
x.xx mm ± 0.25 mm [x.xxx in ± 0.010 in.]
GE
Data Sheet
QHHD019A0B Series: DC-DC Converter Power Module
18 to 75V
dc
Input; 12V
dc
, 19A, 225W Output
April 26, 2016 ©2016 General Electric Company. All rights reserved. Page 15
Mechanical Outline for Through Hole Module with heat plate (-H, -18H Option)
Dimensions are in millimeters and (inches).
Tolerances: x.x mm ± 0.5 mm (x.xx in. ± 0.02 in.) [Unless otherwise indicated]
x.xx mm ± 0.25 mm (x.xxx in ± 0.010 in.)
GE
Data Sheet
QHHD019A0B Series: DC-DC Converter Power Module
18 to 75V
dc
Input; 12V
dc
, 19A, 225W Output
April 26, 2016 ©2016 General Electric Company. All rights reserved. Page 16
Recommended Pad Layout for Through Hole Module
Dimensions are in millimeters and (inches).
Tolerances: x.x mm ± 0.5 mm (x.xx in. ± 0.02 in.) [Unless otherwise indicated]
x.xx mm ± 0.25 mm (x.xxx in ± 0.010 in.)
Hole and Pad diameter recommendations
Pin Number
Hole Dia (mm)
Pad Dia (mm)
1-3, 5-7
1.6
2.1
4, 8
2.2
3.2
GE
Data Sheet
QHHD019A0B Series: DC-DC Converter Power Module
18 to 75V
dc
Input; 12V
dc
, 19A, 225W Output
April 26, 2016 ©2016 General Electric Company. All rights reserved. Page 17
Packaging Details
The open frame versions of the QHHD019A0B are supplied
as standard in the plastic trays shown in Figure 26.
Tray Specification
Material PET (1mm)
Max surface resistivity 109-1011Ω/sq
Color Clear
Capacity 12 power modules
Min order quantity 24 pcs (1 box of 2 full trays + 1
empty top tray)
Each tray contains a total of 12 power modules. The trays
are self-stacking and each shipping box the QHHD019A0B
through hole module will contain 2 full trays plus one empty
hold down tray giving a total number of 24 power
Figure 26. Open Frame Through Hole Packaging Tray
GE
Data Sheet
QHHD019A0B Series: DC-DC Converter Power Module
18 to 75V
dc
Input; 12V
dc
, 19A, 225W Output
April 26, 2016 ©2016 General Electric Company. All rights reserved. Page 18
Packaging Details
The Heat Plate versions of the QHHD019A0B (suffix –H) are
supplied as standard in the plastic trays shown in Figure 27.
Tray Specification
Material PET(1mm)
Max surface resistivity 109-1011Ω/sq
Color Clear
Capacity 12 power modules
Min order quantity 24 pcs (1 box of 2 full trays + 1 empty
top tray)
Each tray contains a total of 12 power modules. The trays
are self-stacking and each shipping box the QHHD019A0B
(suffix –H) through hole module will contain 2 full trays plus
one empty hold down tray giving a total number of 24
power
Figure 27. Heat Plate version Packaging Tray
GE
Data Sheet
QHHD019A0B Series: DC-DC Converter Power Module
18 to 75V
dc
Input; 12V
dc
, 19A, 225W Output
Contact Us
For more information, call us at
USA/Canada:
+1 877 546 3243, or +1 972 244 9288
Asia-Pacific:
+86.021.54279977*808
Europe, Middle-East and Africa:
+49.89.878067-280
www.gecriticalpower.com
GE Critical Power reserves the right to make changes to the product(s) or information contained herein without notice, and no
liability is assumed as a result of their use or application. No rights under any patent accompany the sale of any such product(s)
or information.
April 26, 2016 ©2016 General Electric Company. All International rights reserved. Version 1.2
Ordering Information
Please contact your GE Energy Sales Representative for pricing, availability and optional features.
Table 1. Device Codes
Product codes Input Voltage
Output
Current
Output
Voltage
Remote On/Off
Logic
Connector
Type Comcodes
QHHD019A0B41Z 24V/48V (18-75Vdc) 19.0A 12.0V Negative Through hole 150029667
QHHD019A0B41-HZ
24V/48V (18-75Vdc)
19.0A
12.0V
Negative
Through hole
150030812
QHHD019A0B41-18HZ 24V/48V (18-75Vdc) 19.0A 12.0V Negative Through hole 150030813
QHHD019A0B641-HZ
24V/48V (18-75Vdc)
19.0A
12.0V
Negative
Through hole
150037357
Table 2. Device Options
Characteristic
Definition
Form Factor Q
Q = 1 /4th Brick
Family Designator HH
HH = Hammerhead™ Series
Input Voltage D
D = UltraWide Range, 18V-75V
Output Current
019A0 019A0 = 019.0 Amps Maximum Output Current
Output Voltage B
B=12V Nominal
Omit = Default Pin Length shown in Mechanical Outline Figures
6
6 = Pin Length: 3.68 mm ± 0.25mm , (0.145 in. ± 0.010 in.)
8
8 = Pin Length: 2.79 mm ± 0.25mm , (0.110 in. ± 0.010 in.)
Omit = Positive Logic
1
1 = Negative Logic
Customer Specific XY
XY = Customer Specific Modified Code, Omit for Standard Code
Omit = Standard open Frame Module
H = 1/4th Brick size heat plate, for use with heat sinks (not available
with -S option)
18H = 1/4th Brick size heat plate with unthreaded inserts for use in
coldwall applications (not available with -S option)
S = Surface Mount connections
Omit = RoHS 5/6, Lead Based Solder Used
Z
Z = RoHS 6/6 Compliant, Lead free
Ratings
Options
Pin Length
Action following
Protective Shutdown
4
4 = Auto-restart following shutdown (Overcurrent/Overvoltage)
Must be ordered
On/Off Logic
Mechanical Features
RoHS
Character and Position
H
18H
S