ES3AB - ES3JB
Taiwan Semiconductor
1 Version:B1706
3A, 50V - 600V Surface Mount Super Fast Rectifier
FEATURES
● Glass passivated junction chip
● Ideal for automated placement
● Low profile package
● Super fast recovery time for high efficiency
● Compliant to RoHS Directive 2011/65/EU and
in accordance to WEEE 2002/96/EC
● Halogen-free according to IEC 61249-2-21
APPLICATIONS
● Switching mode power supply (SMPS)
● Adapters
● Lighting application
● Converter
MECHANICAL DATA
● Case: DO-214AA (SMB)
● Molding compound meets UL 94V-0 flammability rating
● Part no. with suffix “H” means AEC-Q101 qualified
● Packing code with suffix "G" means green compound
(halogen-free)
● Moisture sensitivity level: level 1,per J-STD-020
● Terminal: Matte tin plated leads, solderable per J-STD-002
● Meet JESD 201 class 2 whisker test
● Polarity: As marked
● Weight: 0.11 g (approximately)
KEY PARAMETERS
PARAMETER
VALUE
UNIT
IF(AV)
3
A
VRRM
50 - 600
V
IFSM
100
A
TJ MAX
150
°C
Package
DO-214AA (SMB)
Configuration
Single die
DO-214AA (SMB)
ABSOLUTE MAXIMUM RATINGS (TA = 25°C unless otherwise noted)
SYMBOL
ES
3AB
ES
3BB
ES
3CB
ES
3DB
ES
3FB
ES
3GB
ES
3HB
ES
3JB
UNIT
ES
3AB
ES
3BB
ES
3CB
ES
3DB
ES
3FB
ES
3GB
ES
3HB
ES
3JB
VRRM
50
100
150
200
300
400
500
600
V
VR(RMS)
30
70
105
140
210
280
350
420
V
IF(AV)
3
A
IFSM
100
A
TJ
- 55 to +150
°C
TSTG
- 55 to +150
°C
ES3AB - ES3JB
Taiwan Semiconductor
2 Version:B1706
THERMAL PERFORMANCE
PARAMETER
SYMBOL
LIMIT
UNIT
Junction-to-lead thermal resistance
RӨJL
24
°C/W
Junction-to-ambient thermal resistance
RӨJA
84
°C/W
Junction-to-case thermal resistance
RӨJC
26
°C/W
Thermal Performance Note: Units mounted on recommended PCB (10mm x 10mm Cu pad test board)
ELECTRICAL SPECIFICATIONS (TA = 25°C unless otherwise noted)
PARAMETER
CONDITIONS
SYMBOL
TYP
MAX
UNIT
Forward voltage per diode (1)
ES3AB
ES3BB
ES3CB
ES3DB
IF = 1.5A,TJ = 25°C
VF
0.80
0.92
V
ES3FB
ES3GB
0.90
1.04
V
ES3HB
ES3JB
1.11
1.30
V
ES3AB
ES3BB
ES3CB
ES3DB
IF = 3.0A,TJ = 25°C
VF
0.86
1.00
V
ES3FB
ES3GB
0.98
1.13
V
ES3HB
ES3JB
1.24
1.45
V
ES3AB
ES3BB
ES3CB
ES3DB
IF = 1.5A,TJ = 125°C
VF
0.66
0.75
V
ES3FB
ES3GB
0.73
0.85
V
ES3HB
ES3JB
0.85
0.98
V
ES3AB
ES3BB
ES3CB
ES3DB
IF = 3.0A,TJ = 125°C
VF
0.73
0.84
V
ES3FB
ES3GB
0.83
0.95
V
ES3HB
ES3JB
0.99
1.13
V
Reverse current @ rated VR per diode (2)
TJ = 25°C
IR
-
10
µA
TJ = 125°C
-
100
µA
Junction capacitance
ES3AB
ES3BB
ES3CB
ES3DB
1 MHz, VR=4.0V
CJ
46
-
pF
ES3FB
ES3GB
41
-
pF
ES3HB
ES3JB
34
-
pF
Reverse recovery time
IF=0.5A ,IR=1.0A
IRR=0.25A
trr
-
35
ns
Notes:
1. Pulse test with PW=0.3 ms
2. Pulse test with PW=30 ms
ES3AB - ES3JB
Taiwan Semiconductor
3 Version:B1706
ORDERING INFORMATION
PART NO.
PART NO.
SUFFIX
PACKING
CODE
PACKING CODE
SUFFIX
PACKAGE
PACKING
ES3xB
(Note 1, 2)
H
R5
G
SMB
850 / 7" Plastic reel
R4
SMB
3,000 / 13" Paper reel
M4
SMB
3,000 / 13" Plastic reel
Notes:
1. "x" defines voltage from 50V (ES3AB) to 600V (ES3JB)
2. Whole series with green compound (halogen-free)
EXAMPLE P/N
EXAMPLE P/N
PART NO.
PART NO.
SUFFIX
PACKING
CODE
PACKING CODE
SUFFIX
DESCRIPTION
ES3JBHR5G
ES3JB
H
R5
G
AEC-Q101 qualified
Green compound
ES3AB - ES3JB
Taiwan Semiconductor
4 Version:B1706
CHARACTERISTICS CURVES
(TA = 25°C unless otherwise noted)
Fig.1 Forward Current Derating Curve
Fig.2 Typical Junction Capacitance
Fig.3 Typical Reverse Characteristics
Fig.4 Typical Forward Characteristics
0
1
2
3
4
25 50 75 100 125 150
LEAD TEMPERATURE (°C)
Heat sink
10mm x 10mm
Cu pad test board
1
10
100
1000
110 100
REVERSE VOLTAGE (V)
f=1.0MHz
Vsig=50mVp-p
ES3AB - ES3DB
0.001
0.010
0.100
1.000
10.000
10 20 30 40 50 60 70 80 90 100
TJ=25°C
TJ=125°C
ES3AB - ES3DB
0.1
1
10
100
0.4 0.6 0.8 1.0 1.2 1.4
Pulse width 300μs
1% duty cycle
TJ=25°C
TJ=125°C
ES3AB - ES3DB
CAPACITANCE (pF)
INSTANTANEOUS REVERSE CURRENT (μA)
PERCENT OF RATED PEAK REVERSE VOLTAGE (%)
INSTANTANEOUS FORWARD CURRENT (A)
(A)
0.001
0.01
0.1
1
10
0.3 0.4 0.5 0.6 0.7 0.8 0.9 1 1.1 1.2
Pulse width
TJ=25°C
TJ=125°C
UF1DLW
FORWARD VOLTAGE (V)
AVERAGE FORWARD CURRENT (A)
ES3AB - ES3JB
Taiwan Semiconductor
5 Version:B1706
CHARACTERISTICS CURVES
(TA = 25°C unless otherwise noted)
Fig.5 Typical Junction Capacitance
Fig.6 Typical Reverse Characteristics
Fig.7 Typical Forward Characteristics
1
10
100
1000
110 100
REVERSE VOLTAGE (V)
f=1.0MHz
Vsig=50mVp-p
ES3FB - ES3GB
0.001
0.010
0.100
1.000
10.000
10 20 30 40 50 60 70 80 90 100
TJ=25°C
TJ=125°C
ES3FB - ES3GB
0.1
1
10
100
0.4 0.6 0.8 1.0 1.2 1.4 1.6
Pulse width 300μs
1% duty cycle
TJ=25°C
TJ=125°C
ES3FB - ES3GB
INSTANTANEOUS REVERSE CURRENT (μA)
PERCENT OF RATED PEAK REVERSE VOLTAGE (%)
INSTANTANEOUS FORWARD CURRENT (A)
(A)
FORWARD VOLTAGE (V)
AVERAGE FORWARD CURRENT (A)
ES3AB - ES3JB
Taiwan Semiconductor
6 Version:B1706
CHARACTERISTICS CURVES
(TA = 25°C unless otherwise noted)
Fig.8 Typical Junction Capacitance
Fig.9 Typical Reverse Characteristics
Fig.10 Typical Forward Characteristics
1
10
100
1000
110 100
REVERSE VOLTAGE (V)
f=1.0MHz
Vsig=50mVp-p
ES3HB - ES3JB
0.001
0.010
0.100
1.000
10.000
10 20 30 40 50 60 70 80 90 100
TJ=25°C
TJ=125°C
ES3HB - ES3JB
0.1
1
10
100
0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0 2.2
Pulse width 300μs
1% duty cycle
TJ=25°C
TJ=125°C
ES3HB - ES3JB
CAPACITANCE (pF)
INSTANTANEOUS REVERSE CURRENT (μA)
PERCENT OF RATED PEAK REVERSE VOLTAGE (%)
INSTANTANEOUS FORWARD CURRENT (A)
(A)
0.001
0.01
0.1
1
10
0.3 0.4 0.5 0.6 0.7 0.8 0.9 1 1.1 1.2
Pulse width
TJ=25°C
TJ=125°C
UF1DLW
FORWARD VOLTAGE (V)
ES3AB - ES3JB
Taiwan Semiconductor
7 Version:B1706
PACKAGE OUTLINE DIMENSIONS
DO-214AA (SMB)
SUGGESTED PAD LAYOUT
MARKING DIAGRAM
P/N = Marking Code
G = Green Compound
YW = Date Code
F = Factory Code
DIM.
Unit (mm)
Unit (inch)
Min
Max
Min
Max
A
1.95
2.20
0.077
0.087
B
4.05
4.60
0.159
0.181
C
3.30
3.95
0.130
0.156
D
1.95
2.65
0.077
0.104
E
0.75
1.60
0.030
0.063
F
5.10
5.60
0.201
0.220
G
0.05
0.20
0.002
0.008
H
0.15
0.31
0.006
0.012
Symbol
Unit (mm)
Unit (inch)
A
2.3
0.091
B
2.5
0.098
C
4.3
0.169
D
1.8
0.071
E
6.8
0.268
ES3AB - ES3JB
Taiwan Semiconductor
8 Version:B1706
Notice
Specifications of the products displayed herein are subject to change without notice. TSC or anyone on its behalf,
assumes no responsibility or liability for any errors or inaccuracies.
Information contained herein is intended to provide a product description only. No license, express or implied, to
any intellectual property rights is granted by this document. Except as provided in TSC’s terms and conditions of
sale for such products, TSC assumes no liability whatsoever, and disclaims any express or implied warranty,
relating to sale and/or use of TSC products including liability or warranties relating to fitness for a particular purpose,
merchantability, or infringement of any patent, copyright, or other intellectual property right.
The products shown herein are not designed for use in medical, life-saving, or life-sustaining applications.
Customers using or selling these products for use in such applications do so at their own risk and agree to fully
indemnify TSC for any damages resulting from such improper use or sale.