BAS21WS
High Voltage
Switching Diode
Features
.
Maximum Ratings
Symbol Rating Value Unit
VRContinuous Reverse Voltage 250 Vdc
IFPeak Forward Current 200 mAdc
IFM(surge) Peak Forward Surge Current 625 mAdc
Thermal Characteristics
Symbol Characteristic Max Unit
PD
Total Device Dissipation FR-5
Board *, TA=25OC
Derate above 25OC
200
1.57
mW
mW/OC
RJA
Thermal Resistance Junction to
Ambient 635 OC/W
TJ, TSTG
Junction and Storage Temperature
Range
-55 to
+155
OC
Electrical Characteristics @ 25OC Unless Otherwise Specified
Symbol Characteristic Min Max Unit
Off Characteristics
IRReverse Voltage Leakage Current
(VR=200Vdc)
(VR=200Vdc, TJ=150OC)
---
---
0.1
100
uAdc
V(BR) Reverse Breakdown Voltage
(IBR=100uAdc) 250 --- Vdc
VFForward Voltage
(IF=100mAdc)
(I F=200mAdc)
---
---
1000
1250
mVdc
CDDiode Capacitance
(VR=0, f=1.0MHz) --- 5.0 pF
trr Reverse Recovery Time
(IF=I
R=30mAdc, RL=100 OHM) --- 50 ns
omponents
20736 Marilla Street Chatsworth
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MCC
www.mccsemi.com
TM
Micro Commercial Components
1 of 2
xFor Surface Mount Application.
.
• For Surface Mount Application.
.
• Device Marking: JS
• Lead Free Finish/RoHS Compliant("P" Suffix
designates RoHS Compliant. See ordering information)
*FR-5 Minimum Pad
DIMENSIONS
INCHES MM
DIM
MIN MAX MIN MAX
NOTE
A .090 .107 2.30 2.70
B .063 .071 1.60 1.80
C .045 .053 1.15 1.35
D .031 .045 0.80 1.15
E .010 .016 0.25 0.40
G .004 .018 0.10 0.45
H .004 .010 0.10 0.25
J ----- .006 ----- 0.15
A
B
E
C
J
D
H
SOD-323
0.022”
0.074"
0.027”
SUGGESTED SOLDER
PAD LAYOUT
G
Revision: A 2011/01/01
• Epoxy meets UL 94 V-0 flammability rating
• Moisture Sensitivity Level 1
MCC
TM
Micro Commercial Components
www.mccsemi.com
2 of 2
Revision: A 2011/01/01
Device Packing
Part Number-TP Tape&Reel: 3Kpcs/Reel
Ordering Information :
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approval of Micro Commercial Components Corporation.
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