MMBZ5226B - MMBZ5257B Series
MMBZ5226B-MMBZ5257B Rev A2
Tolerance: B = 5%
Electrical Characteristics TA = 25°C unless otherwise noted
Absolute Maximum Ratings* TA = 25°C unless otherwise noted
Symbol
Parameter
Value
Units
TSTG Storage Temperature Range -55 to +150 °C
TJ Maximum Junction Operating
Temperature
+ 150 °C
PD Total Device Dissipation
Derate above 25°C
350
2.8
mW
mW/°C
*These ratings are limiting values above which the serviceability of the diode may be impaired.
NOTES:
1) These ratings are based on a maximum junction temperature of 150 degrees C.
2) These are steady state limits. The factory should be consulted on applications involving pulsed
or low duty cycle operations.
Device Mark VZ
(V)
ZZ
(
)
IZT
(mA)
ZZK
(
)
IZK
(mA)
VR
(V)
IR
(µ
µµ
µA)
MMBZ 5226B
MMBZ 5227B
MMBZ 5228B
MMBZ 5229B
8A
8B
8C
8D
3.3
3.6
3.9
4.3
28
24
23
22
20
20
20
20
1,600
1,700
1,900
1,000
0.25
0.25
0.25
0.25
1.0
1.0
1.0
1.0
25
15
10
5.0
MMBZ 5230B
MMBZ 5231B
MMBZ 5232B
MMBZ 5233B
8E
8F
8G
8H
4.7
5.1
5.6
6.0
19
17
11
7.0
20
20
20
20
1,900
1,600
1,600
1,600
0.25
0.25
0.25
0.25
2.0
2.0
3.0
3.5
5.0
5.0
5.0
5.0
MMBZ 5234B
MMBZ 5235B
MMBZ 5236B
MMBZ 5237B
8J
8K
8L
8M
6.2
6.8
7.5
8.2
7.0
5.0
6.0
8.0
20
20
20
20
1,000
750
500
500
0.25
0.25
0.25
0.25
4.0
5.0
6.0
6.5
5.0
3.0
3.0
3.0
MMBZ 5238B
MMBZ 5239B
MMBZ 5240B
MMBZ 5241B
MMBZ 5242B
8N
8P
8Q
8R
8S
8.7
9.1
10
11
12
8.0
10
17
22
30
20
20
20
20
20
600
600
600
600
600
0.25
0.25
0.25
0.25
0.25
6.5
7.0
8.0
8.4
9.1
3.0
3.0
3.0
2.0
1.0
VF Foward Voltage = 0.9 V Maximum @ IF = 10 mA for all MMBZ 5200 series
@
@@
NOTE: National preferred devices in BOLD
MMBZ5226B - MMBZ5257B Series Zeners
SOT-23
3
1
2
2001 Fairchild Semiconductor Corporation
CONNECTION
DIAGRAM
2 NC
3
1
MMBZ5226B - MMBZ5257B Series
MMBZ5226B-MMBZ5257B Rev A2
Electrical Characteristics (continued) TA = 25°C unless otherwise noted
MMBZ Series Zeners
(continued)
Device Mark VZ
(V)
ZZ
(
)
IZT
(mA)
ZZK
(
)
IZK
(mA)
VR
(V)
IR
(nA)
MMBZ 5243B
MMBZ 5244B
MMBZ 5245B
MMBZ 5246B
MMBZ 5247B
8T
8U
8V
8W
8X
13
14
15
16
17
13
15
16
17
19
9.5
9.0
8.5
7.8
7.4
600
600
600
600
600
0.25
0.25
0.25
0.25
0.25
9.9
10
11
12
13
500
100
100
100
100
MMBZ 5248B
MMBZ 5249B
MMBZ 5250B
MMBZ 5251B
MMBZ 5252B
8Y
8Z
81A
81B
81C
18
19
20
22
24
21
23
25
29
33
7.0
6.6
6.2
5.6
5.2
600
600
600
600
600
0.25
0.25
0.25
0.25
0.25
14
14
15
17
18
100
100
100
100
100
MMBZ 5253B
MMBZ 5254B
MMBZ 5255B
MMBZ 5256B
MMBZ 5257B
81D
81E
81F
81G
81H
25
27
28
30
33
35
41
44
49
58
5.0
4.6
4.5
4.2
3.8
600
600
600
600
700
0.25
0.25
0.25
0.25
0.25
19
21
21
23
25
100
100
100
100
100
VF Foward Voltage = 0.9 V Maximum @ IF = 10 mA for all MMBZ 5200 series
NOTE: National preferred devices in BOLD
MMBZ5226B - MMBZ5257B Series
MMBZ5226B-MMBZ5257B Rev A2
Typical Characteristics
Zener Current vs. Zener Impedence
0.1 0.2 0.5 1 2 5 10 20
1
2
5
10
20
50
100
200
500
1000
2000
5000
I - ZENER CURRENT (mA)
Z - IMPEDANCE (ohms)
T = 25 C
º
A
Z
Z
V = 3.3V
Z
V = 5.1V
Z
V = 12.0V
Z
V = 33.0V
Z
3.3 Zener Voltage vs. Temperature
12 5102030
1
2
3
4
5
I - ZENER CURRENT (mA)
V - ZENER VOLTAGE (V)
T = -25 C
º
A
Z
Z
V = 3.3V
Z
T = 85 C
º
A
T = 100 C
º
A
T = 25 C
º
A
T = 125 C
º
A
Zener Current vs. Zener Voltage
12 5102030
5
10
15
20
25
30
35
I - ZENER CURRENT (mA)
V - ZENER VOLTAGE (V)
T = 25 C
º
A
Z
Z
V = 12.0V
Z
V = 3.3V
Z
V = 5.1V
Z
V = 33.0V
Z
5.1 Zener Voltage vs. Temperature
12 5102030
4
4.5
5
5.5
6
I - ZENER CURRENT (mA)
V - ZENER VOLTAGE (V)
T = -25 C
º
A
Z
Z
V = 5.1V
Z
T = 85 C
º
A
T = 100 C
º
A
T = 25 C
º
A
T = 125 C
º
A
12 Zener Voltage vs. Zener Temperature
12 5102030
0
5
10
15
I - ZENER CURRENT (mA)
V - ZENER VOLTAGE (V)
T = -25 C
º
A
Z
Z
V = 12.0V
Z
T = 85 C
º
A T = 100 C
º
A
T = 25 C
º
A
T = 125 C
º
A
33 Zener Voltage vs. Zener Temperature
12 5102030
20
25
30
35
40
I - ZENER CURRENT (mA)
V - ZENER VOLTAGE (V)
T = -25 C
º
A
Z
Z
V = 33.0V
Z
T = 85 C
º
A
T = 100 C
º
A
T = 25 C
º
A
T = 125 C
º
A
SOT-23 Packaging
Configurat ion: Figure 1.0
Components Leader Tape
500mm mini mum or
125 emp ty pocket s
Tr ailer Tape
300mm mini mum or
75 empty pockets
SOT-23 Tape Leader and Trailer
Configuration: Figure 2.0
Cover Tape
Carrier Tape
Note/Comments
Packaging Option
SOT-23 Packaging Information
Standard
(no flow code) D87Z
Packaging type
Reel Si ze
TNR
7" Dia
TNR
13"
Qty per Reel/Tube/Bag 3,000 10,000
Bo x Dim en s i on (mm ) 187x107x183 343x343x64
Max qt y per B o x 24,000 30,000
Weight per unit (gm) 0.0082 0.0082
Weight per Reel (kg) 0.1175 0.4006
Human readable
Label
Human Readable Label
Human Readable Label sample
343mm x 342mm x 64mm
Intermediate box for L87Z Option
187mm x 107mm x 183mm
Intermediate Box for Standard Option
SOT-23 Unit Orientation
3P 3P 3P 3P
Human Readable
Label
Cu stomized Label
Embossed
Carrier Tape
Antistatic Co ver Tape
Packaging Description:
SOT-23
made from a dissipative (carbon filled) polycarbonate
resin. The cover tape is a multilayer film (H eat Activated
Adhesive in nature) primaril y composed of polyester film,
adhesive layer, sealant, and anti-static sprayed agent.
These reeled parts in standard option are shipped with
3,000 uni ts per 7" or 177cm diameter reel. The reels are
dark blue in color and is made of polystyrene plastic (anti-
static coated). Other option comes in 10,000 units per 13"
or 330cm diameter reel. Thi s and some other opt i ons are
described in the Packaging Information table.
These full reels are individually labeled and placed inside
a standard intermediate made of recyclable corrugated
brown paper w i th a Fai r child l ogo pri nti ng. One pizza box
contains eight reels maximum. And these intermediate
boxes are placed inside a labeled shipping box which
comes in different si zes depending on the number of parts
shipped.
parts are shipped in tape. The carrier tape is
SOT-23 Tape and Reel Data
September 1999, Rev . C
©2000 Fairchild Semiconductor International
Dimensions are in millimeter
Pkg type
A0 B0 W D0 D1 E1 E2 F P1 P0 K0 T Wc Tc
SOT-23
(8mm)
3.15
+/-0.10 2.77
+/-0.10 8.0
+/-0.3 1.55
+/-0.05 1.125
+/-0.125 1.75
+/-0.10 6.25
min 3.50
+/-0.05 4.0
+/-0.1 4.0
+/-0.1 1.30
+/-0.10 0.228
+/-0.013 5.2
+/-0.3 0.06
+/-0.02
Dimensions are in inches and millimeters
Tape Size Reel
Option Dim A Dim B Dim C Dim D Dim N Dim W1 Dim W2 Dim W3 (LSL-USL)
8mm 7" Dia 7.00
177.8 0.059
1.5 512 +0. 020/-0. 008
13 +0.5/-0.2 0.795
20.2 2.165
55 0.331 +0.059/-0.000
8.4 +1.5/0 0.567
14.4 0.311 – 0.429
7.9 – 10.9
8m m 13" Dia 13.00
330 0.059
1.5 512 +0. 020/-0. 008
13 +0.5/-0.2 0.795
20.2 4.00
100 0.331 +0.059/-0.000
8.4 +1.5/0 0.567
14.4 0.311 – 0.429
7.9 – 10.9
See detail AA
Dim A
max
13" Diameter Option
7" Diameter Option
Dim A
Max
See detail AA
W3
W2 max Measured at Hub
W1 Measured at Hub
Dim N
Dim D
min
Dim C
B Min
DETAIL AA
Notes: A0, B0, and K0 dimensions are determined with respect to the EIA/Jedec RS-481
rotational and lateral movement requirements (see sketches A, B, and C).
20 deg maximum component rotation
0.5mm
maximum
0.5mm
maximum
Sketch C (Top View)
Component lateral movement
Typical
component
cavity
center line
20 deg maximum
Typical
component
center line
B0
A0
Sketch B (Top View)
Component Rotation
Sketch A (Side or Front Sectional View)
Component Rotation
User Direction of Feed
SOT-23 Embossed Carrier Tape
Configu ration: Figure 3.0
SOT-23 Reel Configuration: Figure 4.0
P1 A0
D1
FW
E1
E2
Tc
Wc
K0
T
B0
D0P0 P2
SOT-23 Tape and Reel Data, continued
September 1999, Rev . C
SOT-23 (FS PKG Code 49)
SOT-23 Package Dimensions
September 1998, Rev . A1
1:1
Scale 1:1 on letter size paper
Dimensions shown below are in:
inches [millimeters]
Par t Weight per unit (gram): 0.0082
©2000 Fairchild Semiconductor International
TRADEMARKS
The following are registered and unregistered trademarks Fairchild Semiconductor owns or is authorized to use and is
not intended to be an exhaustive list of all such trademarks.
LIFE SUPPORT POLICY
FAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT
DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF F AIRCHILD SEMICONDUCTOR CORPORATION.
As used herein:
1. Life support devices or systems are devices or
systems which, (a) are intended for surgical implant into
the body, or (b) support or sustain life, or (c) whose
failure to perform when properly used in accordance
with instructions for use provided in the labeling, can be
reasonably expected to result in significant injury to the
user.
2. A critical component is any component of a life
support device or system whose failure to perform can
be reasonably expected to cause the failure of the life
support device or system, or to affect its safety or
effectiveness.
PRODUCT ST A TUS DEFINITIONS
Definition of Terms
Datasheet Identification Product Status Definition
Advance Information
Preliminary
No Identification Needed
Obsolete
This datasheet contains the design specifications for
product development. Specifications may change in
any manner without notice.
This datasheet contains preliminary data, and
supplementary data will be published at a later date.
Fairchild Semiconductor reserves the right to make
changes at any time without notice in order to improve
design.
This datasheet contains final specifications. Fairchild
Semiconductor reserves the right to make changes at
any time without notice in order to improve design.
This datasheet contains specifications on a product
that has been discontinued by Fairchild semiconductor.
The datasheet is printed for reference information only.
Formative or
In Design
First Production
Full Production
Not In Production
DISCLAIMER
FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER
NOTICE TO ANY PRODUCTS HEREIN T O IMPROVE RELIABILITY, FUNCTION OR DESIGN. FAIRCHILD
DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE APPLICA TION OR USE OF ANY PRODUCT
OR CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS P ATENT
RIGHTS, NOR THE RIGHTS OF OTHERS.
PowerTrench
QFET™
QS™
QT Optoelectronics™
Quiet Series™
SILENT SWITCHER
SMART ST ART™
SuperSOT™-3
SuperSOT™-6
SuperSOT™-8
FASTr™
GlobalOptoisolator™
GTO™
HiSeC™
ISOPLANAR™
MICROWIRE™
OPTOLOGIC™
OPTOPLANAR™
PACMAN™
POP™
Rev . G
ACEx™
Bottomless™
CoolFET™
CROSSVOLT
DOME™
E2CMOSTM
EnSignaTM
FACT™
F ACT Quiet Series™
FAST
SyncFET™
TinyLogic™
UHC™
VCX™