LTL-4221N-022 - LITE-ON ELECTRONICS

November, 2017 − Rev. 5 1Publication Order Number:

NL17SGU04/D

NL17SGU04

Unbuffered Inverter

The NL17SGU04 MiniGatet is an advanced high−speed CMOS

unbuffered inverter in ultra−small footprint.

The NL17SGU04 input structures provides protection when

voltages up to 3.6 V are applied.

Features

•Wide Operating VCC Range: 0.9 V to 3.6 V

•High Speed: tPD = 1.9 ns (Typ) at VCC = 3.0 V, CL = 15 pF

•Low Power Dissipation: ICC = 0.5 mA (Max) at TA = 25°C

•3.6 V Overvoltage Tolerant (OVT) Input Pins

•Ultra−Small Packages

•NLV Prefix for Automotive and Other Applications Requiring

Unique Site and Control Change Requirements; AEC−Q100

Qualified and PPAP Capable

•These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS

Compliant

VCC

IN A

OUT Y

GND

Figure 1. SOT−953

(Top Thru View)

VCC

IN A

GND

Figure 2. SC−88A

(Top View)

Figure 3. UDFN

(Top View)

IN A

GND

VCC

OUT Y

Figure 4. Logic Symbol

IN A OUT Y

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ORDERING INFORMATION

See detailed ordering and shipping information on page 5 o

this data sheet.

MARKING

DIAGRAMS

SOT−953

CASE 527AE 4 M

A Input Y Output

FUNCTION TABLE

UDFN6

1.0 x 1.0

CASE 517BX M

UDFN6

1.45 x 1.0

CASE 517AQ M

SC−88A

DF SUFFIX

CASE 419A AY M G

PIN ASSIGNMENT

3NC

IN A

GND

OUT Y

SOT−953 SC−88A UDFN6

IN A

GND

VCC

OUT Y

GND

IN A

VCC

OUT Y

GND

IN A

OUT Y

VCC

M = Date Code*

G= Pb−Free Package

(Note: Microdot may be in either location)

*Date Code orientation and/or position may vary

depending upon manufacturing location.

NL17SGU04

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MAXIMUM RATINGS

Symbol Parameter Value Unit

VCC DC Supply Voltage −0.5 to +4.6 V

VIN DC Input Voltage −0.5 to +4.6 V

VOUT DC Output Voltage Output at High or Low State

Power−Down Mode (VCC = 0 V) −0.5 to VCC +0.5

−0.5 to +4.6 V

IIK DC Input Diode Current VIN < GND −20 mA

IOK DC Output Diode Current VOUT < GND −20 mA

IOUT DC Output Source/Sink Current ±20 mA

ICC DC Supply Current per Supply Pin ±20 mA

IGND DC Ground Current per Ground Pin ±20 mA

TSTG Storage Temperature Range −65 to +150 °C

TLLead Temperature, 1 mm from Case for 10 Seconds 260 °C

TJJunction Temperature Under Bias +150 °C

MSL Moisture Sensitivity Level 1

FRFlammability Rating Oxygen Index: 28 to 34 UL 94 V−0 @ 0.125 in

VESD ESD Withstand Voltage Human Body Model (Note 2)

Machine Model (Note 3) >2000

>150 V

ILATCHUP Latchup Performance Above VCC and Below GND at 125°C (Note 4) ±100 mA

Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality

should not be assumed, damage may occur and reliability may be af fected.

1. Measured with minimum pad spacing on an FR4 board, using 10 mm−by−1 inch, 2−ounce copper trace with no air flow.

2. Tested to EIA/JESD22−A114−A.

3. Tested to EIA/JESD22−A115−A.

4. Tested to EIA/JESD78.

RECOMMENDED OPERATING CONDITIONS

Symbol Characteristics Min Max Unit

VCC Positive DC Supply Voltage 0.9 3.6 V

VIN Digital Input Voltage 0.0 3.6 V

VOUT Output Voltage Output at High or Low State

Power−Down Mode (VCC = 0 V) 0.0

0.0 VCC

3.6 V

TAOperating Temperature Range −55 +125 °C

Dt / DVInput Transition Rise or Fail Rate VCC = 3.3 V ± 0.3 V 0 10 ns/V

Functional operation above the stresses listed in the Recommended Operating Ranges is not implied. Extended exposure to stresses beyond

the Recommended Operating Ranges limits may affect device reliability.

NL17SGU04

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DC ELECTRICAL CHARACTERISTICS

Symbol Parameter Conditions VCC (V)

TA = 255CTA =

-555C to +1255C

Min Max Min Max Unit

VIH High-Level Input

Voltage 0.9 VCC VCC V

1.1 to 1.3 0.7xVCC 0.7xVCC

1.4 to 1.6 0.65xVCC 0.65xVCC

1.65 to 1.95 0.65xVCC 0.65xVCC

2.3 to 2.7 1.7 1.7

3.0 to 3.6 2.0 2.0

VIL Low-Level Input

Voltage 0.9 GND GND V

1.1 to 1.3 0.3xVCC 0.3xVCC

1.4 to 1.6 0.35xVCC 0.35xVCC

1.65 to 1.95 0.35xVCC 0.35xVCC

2.3 to 2.7 0.7 0.7

3.0 to 3.6 0.8 0.8

VOH High-Level

Output Voltage VIN =

VIH or

VIL

IOH = −20 mA0.9 0.75 0.75 V

IOH = -0.3 mA 1.1 to 1.3 0.75xVCC 0.75xVCC

IOH = -1.7 mA 1.4 to 1.6 0.75xVCC 0.75xVCC

IOH = -3.0 mA 1.65 to 1.95 Vcc-0.45 Vcc-0.45

IOH = -4.0 mA 2.3 to 2.7 2.0 2.0

IOH = -8.0 mA 3.0 to 3.6 2.48 2.48

VOL Low-Level

Output Voltage VIN =

VIH or

VIL

IOL = 20 mA0.9 0.1 0.1 V

IOL = 0.3 mA 1.1 to 1.3 0.25xVCC 0.25xVCC

IOL = 1.7 mA 1.4 to 1.6 0.25xVCC 0.25xVCC

IOL = 3.0 mA 1.65 to 1.95 0.45 0.45

IOL = 4.0 mA 2.3 to 2.7 0.4 0.4

IOL = 8.0 mA 3.0 to 3.6 0.4 0.4

IIN Input Leakage

Current 0 ≤ VIN ≤ 3.6 V 0 to 3.6 $0.1 $1.0 mA

ICC Quiescent

Supply Current VIN = VCC or GND 3.6 0.5 10.0 mA

Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product

performance may not be indicated by the Electrical Characteristics if operated under different conditions.

NL17SGU04

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ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ

AC ELECTRICAL CHARACTERISTICS Input tr = tf = 3.0 ns

Symbol Parameter Test Condition VCC (V) TA = 255 C TA =

-555C to +1255C

Min Typ Max Min Max Unit

tPLH,

tPHL Propagation Delay,

A to Y CL = 10 pF,

RL = 1 MW0.9 - 8.0 10.3 - 13.3 ns

1.1 to 1.3 - 6.0 9.4 - 12.2

1.4 to 1.6 - 3.2 8.5 - 10.0

1.65 to 1.95 - 2.6 6.2 - 6.7

2.3 to 2.7 - 2.0 3.9 - 4.4

3.0 to 3.6 - 1.7 3.1 - 3.7

CL = 15 pF,

RL = 1 MW0.9 - 19.5 11.7 - 14.5 ns

1.1 to 1.3 - 7.0 9.2 - 12.2

1.4 to 1.6 - 3.5 6.3 - 10.2

1.65 to 1.95 - 3.0 5.9 - 7.1

2.3 to 2.7 - 2.3 4.4 - 5.0

3.0 to 3.6 - 1.9 3.4 - 3.9

CL = 30 pF,

RL = 1 MW0.9 - 10.0 12.5 - 15.6 ns

1.1 to 1.3 - 9.0 11.6 - 13.8

1.4 to 1.6 - 6.0 9.1 - 12.9

1.65 to 1.95 - 4.5 8.2 - 9.6

2.3 to 2.7 - 3.2 5.7 - 6.1

3.0 to 3.6 - 2.5 4.4 - 4.8

CIN Input Capacitance 0 to 3.6 3 - - - pF

COOutput Capacitance VO = GND 0 3 - - - pF

CPD Power Dissipation

Capacitance (Note 5) f = 10 MHz 0.9 to 3.6 - 4 - - - pF

Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product

performance may not be indicated by the Electrical Characteristics if operated under different conditions.

5. CPD is defined as the value of the internal equivalent capacitance which is calculated from the operating current consumption without load.

Average operating current can be obtained by the equation: ICC(OPR) = CPD  VCC  fin + ICC. CPD is used to determine the no−load dynamic

power consumption; PD = CPD  VCC2  fin + ICC  VCC.

NL17SGU04

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Figure 5. Switching Waveforms

Figure 6. Test Circuit

GND

50%

50% VCC

A or B

tPHL

tPLH

50% VCC

INPUT

CL*

*Includes all probe and jig capacitances

A 1−MHz square input wave is recommended

for propagation delay tests.

OUTPUT

ORDERING INFORMATION

Device Package Shipping†

NL17SGU04P5T5G SOT−953

(Pb−Free) 8000 / Tape & Reel

NL17SGU04DFT2G SC−88A

(Pb−Free) 3000 / Tape & Reel

NLV17SGU04DFT2G* SC−88A

(Pb−Free) 3000 / Tape & Reel

NL17SGU04AMUTCG

(In Development) UDFN6 1.45x1 mm

(Pb−Free) 3000 / Tape & Reel

NL17SGU04CMUTCG

(In Development) UDFN6 1x1 mm

(Pb−Free) 3000 / Tape & Reel

NLV17SGU04AMUTCG*

(In Development) UDFN6 1.45x1 mm

(Pb−Free) 3000 / Tape & Reel

NLV17SGU04CMUTCG*

(In Development) UDFN6 1x1 mm

(Pb−Free) 3000 / Tape & Reel

†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging

Specifications Brochure, BRD8011/D.

*NLV Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC−Q100 Qualified and PPAP

Capable.

NL17SGU04

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PACKAGE DIMENSIONS

NOTES:

1. DIMENSIONING AND TOLERANCING

PER ANSI Y14.5M, 1982.

2. CONTROLLING DIMENSION: INCH.

3. 419A−01 OBSOLETE. NEW STANDARD

419A−02.

4. DIMENSIONS A AND B DO NOT INCLUDE

MOLD FLASH, PROTRUSIONS, OR GATE

BURRS.

DIM

MIN MAX MIN MAX

MILLIMETERS

1.80 2.200.071 0.087

INCHES

B1.15 1.350.045 0.053

C0.80 1.100.031 0.043

D0.10 0.300.004 0.012

G0.65 BSC0.026 BSC

H--- 0.10---0.004

J0.10 0.250.004 0.010

K0.10 0.300.004 0.012

N0.20 REF0.008 REF

S2.00 2.200.079 0.087

B0.2 (0.008) MM

12 3

D 5 PL

−B−

SC−88A (SC−70−5/SOT−353)

CASE 419A−02

ISSUE L

ǒmm

inchesǓ

SCALE 20:1

0.65

0.025

0.65

0.025

0.50

0.0197

0.40

0.0157

1.9

0.0748

SOLDER FOOTPRINT*

*For additional information on our Pb−Free strategy and soldering

details, please download the ON Semiconductor Soldering and

Mounting Techniques Reference Manual, SOLDERRM/D.

NL17SGU04

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PACKAGE DIMENSIONS

SOT−953

CASE 527AE

ISSUE E

*For additional information on our Pb−Free strategy and soldering

details, please download the ON Semiconductor Soldering and

Mounting Techniques Reference Manual, SOLDERRM/D.

SOLDERING FOOTPRINT*

123

NOTES:

1. DIMENSIONING AND TOLERANCING PER ASME

Y14.5M, 1994.

2. CONTROLLING DIMENSION: MILLIMETERS

3. MAXIMUM LEAD THICKNESS INCLUDES LEAD

FINISH. MINIMUM LEAD THICKNESS IS THE

MINIMUM THICKNESS OF THE BASE MATERIAL.

4. DIMENSIONS D AND E DO NOT INCLUDE MOLD

FLASH, PROTRUSIONS, OR GATE BURRS.

DIM MIN NOM MAX

MILLIMETERS

A0.34 0.37 0.40

b0.10 0.15 0.20

C0.07 0.12 0.17

D0.95 1.00 1.05

E0.75 0.80 0.85

e0.35 BSC

L0.95 1.00 1.05

PIN ONE

INDICATOR

X0.08 Y

L2 0.05 0.10 0.15

L3 −−− −−− 0.15

0.175 REF

TOP VIEW SIDE VIEW

BOTTOM VIEW 1.20

DIMENSIONS: MILLIMETERS

0.20

PACKAGE

OUTLINE

0.35

PITCH

0.35

NL17SGU04

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PACKAGE DIMENSIONS

UDFN6 1.0x1.0, 0.35P

CASE 517BX

ISSUE O

ÉÉÉ

NOTES:

1. DIMENSIONING AND TOLERANCING PER

ASME Y14.5M, 1994.

2. CONTROLLING DIMENSION: MILLIMETERS.

3. DIMENSION b APPLIES TO PLATED

TERMINAL AND IS MEASURED BETWEEN

0.15 AND 0.20 MM FROM TERMINAL TIP.

4. PACKAGE DIMENSIONS EXCLUSIVE OF

BURRS AND MOLD FLASH.

*For additional information on our Pb−Free strategy and soldering

details, please download the ON Semiconductor Soldering and

Mounting Techniques Reference Manual, SOLDERRM/D.

SOLDERING FOOTPRINT*

RECOMMENDED

DIM MIN MAX

MILLIMETERS

A0.45 0.55

A1 0.00 0.05

A3 0.13 REF

b0.12 0.22

D1.00 BSC

E1.00 BSC

e0.35 BSC

L0.25 0.35

L1 0.30 0.40

A B

0.10 C

PIN ONE

REFERENCE

TOP VIEW

0.10 C

0.05 C

CSEATING

PLANE

SIDE VIEW

BOTTOM VIEW

0.10 B

0.05

L5X

NOTE 3

MDIMENSIONS: MILLIMETERS

0.22

0.48 6X

1.18

0.53 PITCH

0.35

PKG

OUTLINE

NL17SGU04

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PACKAGE DIMENSIONS

UDFN6 1.45x1.0, 0.5P

CASE 517AQ

ISSUE O

NOTES:

1. DIMENSIONING AND TOLERANCING PER

ASME Y14.5M, 1994.

2. CONTROLLING DIMENSION: MILLIMETERS.

3. DIMENSION b APPLIES TO PLATED TERMINAL

AND IS MEASURED BETWEEN 0.15 AND

0.30 mm FROM THE TERMINAL TIP.

ÉÉÉ

BOTTOM VIEW

0.10 B

0.05

L6X

NOTE 3

0.10 C

PIN ONE

REFERENCE

TOP VIEW

0.10 C

0.05 C

CSEATING

PLANE

SIDE VIEW

DIM MIN MAX

MILLIMETERS

A0.45 0.55

A1 0.00 0.05

b0.20 0.30

D1.45 BSC

E1.00 BSC

e0.50 BSC

L0.30 0.40

L1 −−− 0.15

DIMENSIONS: MILLIMETERS

0.30

1.24

0.53 PITCH

*For additional information on our Pb−Free strategy and soldering

details, please download the ON Semiconductor Soldering and

Mounting Techniques Reference Manual, SOLDERRM/D.

0.50

MOUNTING FOOTPRINT

PACKAGE

OUTLINE

DETAIL A

OPTIONAL

CONSTRUCTIONS

ÉÉ

DETAIL B

MOLD CMPDEXPOSED Cu

OPTIONAL

CONSTRUCTIONS

A2 0.07 REF

DETAIL B

DET AIL A

NL17SGU04/D

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