LMV321 SINGLE, LMV358 DUAL LMV324 QUAD, LMV324S QUAD WITH SHUTDOWN www.ti.com SLOS263U - AUGUST 1999 - REVISED JULY 2012 LOW-VOLTAGE RAIL-TO-RAIL OUTPUT OPERATIONAL AMPLIFIERS Check for Samples: LMV321 SINGLE, LMV358 DUAL, LMV324 QUAD, LMV324S QUAD WITH SHUTDOWN FEATURES 1 * * * * * * * 2.7-V and 5-V Performance -40C to 125C Operation Low-Power Shutdown Mode (LMV324S) No Crossover Distortion Low Supply Current - LMV321 . . . 130 A Typ - LMV358 . . . 210 A Typ - LMV324 . . . 410 A Typ - LMV324S . . . 410 A Typ Rail-to-Rail Output Swing ESD Protection Exceeds JESD 22 - 2000-V Human-Body Model (A114-A) - 1000-V Charged-Device Model (C101) DESCRIPTION/ ORDERING INFORMATION The LMV321, LMV358, and LMV324/LMV324S are single, dual, and quad low-voltage (2.7 V to 5.5 V) operational amplifiers with rail-to-rail output swing. The LMV324S, which is a variation of the standard LMV324, includes a power-saving shutdown feature that reduces supply current to a maximum of 5 A per channel when the amplifiers are not needed. Channels 1 and 2 together are put in shutdown, as are channels 3 and 4. While in shutdown, the outputs actively are pulled low. The LMV321, LMV358, LMV324, and LMV324S are the most cost-effective solutions for applications where low-voltage operation, space saving, and low cost are needed. These amplifiers are designed specifically for low-voltage (2.7 V to 5 V) operation, with performance specifications meeting or exceeding the LM358 and LM324 devices that operate from 5 V to 30 V. Additional features of the LMV3xx devices are a common-mode input voltage range that includes ground, 1-MHz unity-gain bandwidth, and 1V/s slew rate. LMV324 . . . D (SOIC) OR PW (TSSOP) PACKAGE (TOP VIEW) 1OUT 1IN- 1IN+ VCC+ 2IN+ 2IN- 2OUT 1 14 2 13 3 12 4 11 5 10 6 9 7 8 4OUT 4IN- 4IN+ GND 3IN+ 3IN- 3OUT LMV324S . . . D (SOIC) OR PW (TSSOP) PACKAGE (TOP VIEW) 1OUT 1IN- 1IN+ VCC 2IN+ 2IN- 2OUT 1/2 SHDN 1 16 2 15 3 14 4 13 5 12 6 11 7 10 8 9 4OUT 4IN- 4IN+ GND 3IN+ 3IN- 3OUT 3/4 SHDN LMV358 . . . D (SOIC), DDU (VSSOP), DGK (MSOP), OR PW (TSSOP) PACKAGE (TOP VIEW) 1OUT 1IN- 1IN+ GND 1 8 2 7 3 6 4 5 VCC+ 2OUT 2IN- 2IN+ LMV321 . . . DBV (SOT-23) OR DCK (SC-70) PACKAGE (TOP VIEW) 1IN+ 1 GND 2 1IN- 3 5 VCC+ 4 OUT The LMV321 is available in the ultra-small DCK (SC70) package, which is approximately one-half the size of the DBV (SOT-23) package. This package saves space on printed circuit boards and enables the design of small portable electronic devices. It also allows the designer to place the device closer to the signal source to reduce noise pickup and increase signal integrity. 1 Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright (c) 1999-2012, Texas Instruments Incorporated LMV321 SINGLE, LMV358 DUAL LMV324 QUAD, LMV324S QUAD WITH SHUTDOWN SLOS263U - AUGUST 1999 - REVISED JULY 2012 www.ti.com ORDERING INFORMATION (1) PACKAGE (2) TA -40C to 85C Single SC-70 - DCK -40C to 125C Single SOT-23 - DBV MSOP/VSSOP - DGK -40C to 125C Dual SOIC - D TSSOP - PW VSSOP - DDU -40C to 125C Quad SOIC - D -40C to 85C Quad SOIC - D -40C to 125C Quad TSSOP - PW MSOP/VSSOP - DGK Dual SOIC - D TSSOP - PW -40C to 125C VSSOP - DDU SOIC - D Quad TSSOP - PW (1) (2) (3) 2 TOP-SIDE MARKING (3) ORDERABLE PART NUMBER Reel of 3000 LMV321IDCKR Reel of 250 LMV321IDCKT Reel of 3000 LMV321IDBVR Reel of 250 LMV321IDBVT Reel of 2500 LMV358IDGKR R5_ Reel of 250 LMV358IDGKT PREVIEW Tube of 75 LMV358ID Reel of 2500 LMV358IDR Tube of 150 LMV358IPW Reel of 2000 LMV358IPWR Reel of 3000 LMV358IDDUR Tube of 50 LMV324ID Reel of 2500 LMV324IDR Tube of 50 LMV324SID Reel of 2500 LMV324SIDR Reel of 2000 LMV324IPWR MV324I Reel of 2000 LMV324SIPWR MV324SI Reel of 2500 LMV358QDGKR Reel of 250 LMV358QDGKT Tube of 75 LMV358QD Reel of 2500 LMV358QDR Tube of 150 LMV358QPW Reel of 2000 LMV358QPWR Reel of 3000 LMV358QDDUR Tube of 50 LMV324QD Reel of 2500 LMV324QDR Tube of 90 LMV324QPW Reel of 2000 LMV324QPWR R3_ RC1_ MV358I MV358I RA5_ LMV324I LMV324SI RH_ MV358Q MV358Q RAH_ LMV324Q MV324Q For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI web site at www.ti.com. Package drawings, thermal data, and symbolization are available at www.ti.com/packaging. DBV/DCK/DDU/DGK: The actual top-side marking has one additional character that designates the wafer fab/assembly site. Submit Documentation Feedback Copyright (c) 1999-2012, Texas Instruments Incorporated LMV321 SINGLE, LMV358 DUAL LMV324 QUAD, LMV324S QUAD WITH SHUTDOWN www.ti.com SLOS263U - AUGUST 1999 - REVISED JULY 2012 SYMBOL (EACH AMPLIFIER) IN- - OUT IN+ + LMV324 SIMPLIFIED SCHEMATIC VCC VBIAS1 + VCC - VBIAS2 + Output - VCC VCC VBIAS3 + ININ+ VBIAS4- + - Copyright (c) 1999-2012, Texas Instruments Incorporated Submit Documentation Feedback 3 LMV321 SINGLE, LMV358 DUAL LMV324 QUAD, LMV324S QUAD WITH SHUTDOWN SLOS263U - AUGUST 1999 - REVISED JULY 2012 www.ti.com Absolute Maximum Ratings (1) over operating free-air temperature range (unless otherwise noted) MIN (2) VCC Supply voltage VID Differential input voltage (3) VI Input voltage range (either input) Duration of output short circuit (one amplifier) to ground (4) -0.2 At or below TA = 25C, VCC 5.5 V D package JA Package thermal impedance (5) (6) Operating virtual junction temperature Tstg Storage temperature range (1) (2) (3) (4) (5) (6) UNIT 5.5 V 5.5 V 5.5 V Unlimited 8 pin 97 14 pin 86 16 pin 73 DBV package 5 pin 206 DCK package 5 pin 252 DDU package 8 pin 210 DGK package 8 pin 172 8 pin 149 14 pin 113 16 pin 108 PW package TJ MAX -65 C/W 150 C 150 C Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. All voltage values (except differential voltages and VCC specified for the measurement of IOS) are with respect to the network GND. Differential voltages are at IN+ with respect to IN-. Short circuits from outputs to VCC can cause excessive heating and eventual destruction. Maximum power dissipation is a function of TJ(max), JA, and TA. The maximum allowable power dissipation at any allowable ambient temperature is PD = (TJ(max) - TA)/JA. Operating at the absolute maximum TJ of 150C can affect reliability. The package thermal impedance is calculated in accordance with JESD 51-7. Recommended Operating Conditions (1) VCC Supply voltage (single-supply operation) VIH Amplifier turn-on voltage level (LMV324S) (2) VIL Amplifier turn-off voltage level (LMV324S) TA (1) (2) 4 Operating free-air temperature MIN MAX 2.7 5.5 VCC = 2.7 V 1.7 VCC = 5 V 3.5 UNIT V V VCC = 2.7 V 0.7 VCC = 5 V 1.5 I temperature (LMV321, LMV358, LMV324) -40 125 I temperature (LMV324S, LMV321IDCK) -40 85 Q temperature -40 125 V C All unused control inputs of the device must be held at VCC or GND to ensure proper device operation. See the TI application report, Implications of Slow or Floating CMOS Inputs, literature number SCBA004. VIH should not be allowed to exceed VCC. Submit Documentation Feedback Copyright (c) 1999-2012, Texas Instruments Incorporated LMV321 SINGLE, LMV358 DUAL LMV324 QUAD, LMV324S QUAD WITH SHUTDOWN www.ti.com SLOS263U - AUGUST 1999 - REVISED JULY 2012 Electrical Characteristics VCC+ = 2.7 V, TA = 25C (unless otherwise noted) PARAMETER TEST CONDITIONS MIN TYP (1) MAX 1.7 7 UNIT VIO Input offset voltage VIO Average temperature coefficient of input offset voltage IIB Input bias current IIO Input offset current CMRR Common-mode rejection ratio VCM = 0 to 1.7 V 50 63 dB kSVR Supply-voltage rejection ratio VCC = 2.7 V to 5 V, VO = 1 V 50 60 dB VICR Common-mode input voltage range CMRR 50 dB 0 -0.2 VO Output swing RL = 10 k to 1.35 V ICC Supply current V/C 5 11 250 nA 5 50 nA 1.9 High level VCC - 100 mV V 1.7 VCC - 10 Low level LMV321I 60 180 80 170 LMV358I (both amplifiers) 140 340 LMV324I/LMV324SI (all four amplifiers) 260 680 A B1 Unity-gain bandwidth 1 MHz m Phase margin 60 deg Gm Gain margin 10 dB Vn Equivalent input noise voltage f = 1 kHz 46 nV/Hz In Equivalent input noise current f = 1 kHz 0.17 pA/Hz (1) CL = 200 pF mV Typical values represent the likely parametric nominal values determined at the time of characterization. Typical values depend on the application and configuration and may vary over time. Typical values are not ensured on production material. Shutdown Characteristics (LMV324S) VCC+ = 2.7 V, TA = 25C (unless otherwise noted) PARAMETER TEST CONDITIONS MIN TYP (1) MAX UNIT ICC(SHDN) Supply current in shutdown mode (per channel) SHDN 0.6 V t(on) Amplifier turn-on time AV = 1, RL = Open (measured at 50% point) 2 s t(off) Amplifier turn-off time AV = 1, RL = Open (measured at 50% point) 40 ns (1) 5 A Typical values represent the likely parametric nominal values determined at the time of characterization. Typical values depend on the application and configuration and may vary over time. Typical values are not ensured on production material. Copyright (c) 1999-2012, Texas Instruments Incorporated Submit Documentation Feedback 5 LMV321 SINGLE, LMV358 DUAL LMV324 QUAD, LMV324S QUAD WITH SHUTDOWN SLOS263U - AUGUST 1999 - REVISED JULY 2012 www.ti.com Electrical Characteristics VCC+ = 5 V, at specified free-air temperature (unless otherwise noted) PARAMETER TEST CONDITIONS TA (1) MIN 25C TYP (2) MAX 1.7 7 UNIT VIO Input offset voltage VIO Average temperature coefficient of input offset voltage IIB Input bias current IIO Input offset current CMRR Common-mode rejection ratio VCM = 0 to 4 V 25C 50 65 dB kSVR Supply-voltage rejection ratio VCC = 2.7 V to 5 V, VO = 1 V, VCM = 1 V 25C 50 60 dB VICR Common-mode input voltage range CMRR 50 dB 25C 0 -0.2 Full range Output swing High level RL = 10 k to 2.5 V Low level IOS Output short-circuit current RL = 2 k Sourcing, VO = 0 V Sinking, VO = 5 V LMV321I ICC Supply current LMV358I (both amplifiers) LMV324I/LMV324SI (all four amplifiers) B1 Unity-gain bandwidth m Gm Vn Equivalent input noise voltage In Equivalent input noise current SR Slew rate (1) (2) 6 25C 15 5 CL = 200 pF 25C VCC - 300 Full range VCC - 400 25C 120 VCC - 100 Full range VCC - 200 25C 65 V mV 180 280 25C 15 Full range 10 100 5 60 10 160 130 Full range V/mV mA 250 350 210 Full range 25C nA 300 VCC - 10 Full range 25C 4 400 25C 25C 50 nA VCC - 40 Full range 25C 250 150 4.2 mV V/C 500 25C Low level Large-signal differential voltage gain 5 Full range RL = 2 k to 2.5 V AVD 25C Full range High level VO 9 440 615 410 Full range A 830 1160 25C 1 MHz Phase margin 25C 60 deg Gain margin 25C 10 dB f = 1 kHz 25C 39 nV/Hz f = 1 kHz 25C 0.21 pA/Hz 25C 1 V/s Full range TA = -40C to 125C for I temperature(LMV321, LMV358, LMV324), -40C to 85C for (LMV324S, LMV321IDCK) and -40C to 125C for Q temperature. Typical values represent the likely parametric nominal values determined at the time of characterization. Typical values depend on the application and configuration and may vary over time. Typical values are not ensured on production material. Submit Documentation Feedback Copyright (c) 1999-2012, Texas Instruments Incorporated LMV321 SINGLE, LMV358 DUAL LMV324 QUAD, LMV324S QUAD WITH SHUTDOWN www.ti.com SLOS263U - AUGUST 1999 - REVISED JULY 2012 Shutdown Characteristics (LMV324S) VCC+ = 5 V, TA = 25C (unless otherwise noted) PARAMETER TEST CONDITIONS MIN TYP (1) MAX UNIT ICC(SHDN) Supply current in shutdown mode (per channel) SHDN 0.6 V, TA = Full Temperature Range t(on) Amplifier turn-on time AV = 1, RL = Open (measured at 50% point) 2 s t(off) Amplifier turn-off time AV = 1, RL = Open (measured at 50% point) 40 ns (1) 5 A Typical values represent the likely parametric nominal values determined at the time of characterization. Typical values depend on the application and configuration and may vary over time. Typical values are not ensured on production material. Copyright (c) 1999-2012, Texas Instruments Incorporated Submit Documentation Feedback 7 LMV321 SINGLE, LMV358 DUAL LMV324 QUAD, LMV324S QUAD WITH SHUTDOWN SLOS263U - AUGUST 1999 - REVISED JULY 2012 www.ti.com TYPICAL CHARACTERISTICS LMV321 FREQUENCY RESPONSE vs RESISTIVE LOAD LMV321 FREQUENCY RESPONSE vs RESISTIVE LOAD Vs = 2.7 V RL = 100 k, 2 k, 600 70 Phase 60 Gain - dB 40 70 90 60 75 60 2 k 100 k 30 105 45 Gain 20 30 600 10 100 k -10 1k 10 k 100 k Frequency - Hz 90 600 Phase 50 75 2 k 60 40 100 k 30 45 Gain 20 10 15 1M 0 0 -15 10 M -10 1k 15 10 k 70 100 100 Phase Phase 0 pF 80 80 60 60 50 0 pF 60 50 100 pF -20 Vs = 5.0 V RL = 600 CL = 0 pF 100 pF 500 pF 1000 pF -30 10 k -20 100 pF 0 pF -60 1000 pF -80 100 k 1M Frequency - Hz Figure 3. 8 -40 500 pF Submit Documentation Feedback -100 10 M Gain - dB Gain - dB Gain 40 40 30 500 pF Gain 20 20 0 10 -20 Vs = 5.0 V RL = 100 k -10 CL = 0 pF 100 pF -20 500 pF 1000 pF -30 10 k 100 k 0 0 pF -40 100 pF -60 500 pF Phase Margin - Deg 0 20 -10 20 Phase Margin - Deg 500 pF 1000 pF 100 pF 1000 pF 40 40 0 -15 10 M 100 k 1M Frequency - Hz LMV321 FREQUENCY RESPONSE vs CAPACITIVE LOAD 70 60 0 600 Figure 2. LMV321 FREQUENCY RESPONSE vs CAPACITIVE LOAD 10 30 100 k Figure 1. 30 105 2 k 2 k 0 120 Vs = 5.0 V RL = 100 k, 2 k, 600 Phase Margin - Deg 600 80 Phase Margin - Deg 50 120 Gain - dB 80 -80 1000 pF 1M Frequency - Hz -100 10 M Figure 4. Copyright (c) 1999-2012, Texas Instruments Incorporated LMV321 SINGLE, LMV358 DUAL LMV324 QUAD, LMV324S QUAD WITH SHUTDOWN www.ti.com SLOS263U - AUGUST 1999 - REVISED JULY 2012 TYPICAL CHARACTERISTICS (continued) STABILITY vs CAPACITIVE LOAD LMV321 FREQUENCY RESPONSE vs TEMPERATURE 120 80 Vs = 5.0 V RL = 2 k 60 Gain - dB 75 25C 60 40 -40C 45 Gain 20 30 85C 25C 10 -10 1k 10 k 100 VCC = 2.5 V AV = +1 RL = 2 k VO = 100 mVPP 10 -2 -15 10 M 100 k 1M Frequency - Hz -1.5 -1 10000 2.5 V _ RL CL Capacitive Load - nF Capacitive Load - pF VO + 2.5 V LMV324S (25% Overshoot) 100 LMV3xx (25% Overshoot) -1.5 0.5 1 1.5 STABILITY vs CAPACITIVE LOAD 10000 10 -2.0 0 Figure 6. STABILITY vs CAPACITIVE LOAD 1000 -0.5 Output Voltage - V Figure 5. VI CL LMV3xx (25% Overshoot) 0 -40C RL -2.5 V 1000 15 0 VO + VI Phase Margin - Deg Phase 30 _ 90 85C 50 2.5 V LMV324S (25% Overshoot) Capacitive Load - pF 70 10000 105 -1 -0.5 0 Output Voltage - V VCC = 2.5 V RL = 2 k AV = 10 VO = 100 mVPP 1000 LMV3xx (25% Overshoot) 100 134 k Figure 7. Copyright (c) 1999-2012, Texas Instruments Incorporated 1 1.21 M +2.5 V VCC = 2.5 V AV = +1 RL = 1 M VO = 100 mVPP 0.5 LMV324S (25% Overshoot) _ VI VO + RL CL -2.5 V 1.5 10 -2.0 -1.5 -1 -0.5 0 Output Voltage - V 0.5 1 1.5 Figure 8. Submit Documentation Feedback 9 LMV321 SINGLE, LMV358 DUAL LMV324 QUAD, LMV324S QUAD WITH SHUTDOWN SLOS263U - AUGUST 1999 - REVISED JULY 2012 www.ti.com TYPICAL CHARACTERISTICS (continued) SLEW RATE vs SUPPLY VOLTAGE STABILITY vs CAPACITIVE LOAD 10000 1.500 RL = 100 k 1.400 LMV3xx (25% Overshoot) 1.300 Slew Rate - V/s Capacitive Load - nF VCC = 2.5 V RL = 1 M AV = 10 VO = 100 mVPP 1000 LMV324S (25% Overshoot) 100 134 k 1.21 M Gain 1.200 NSLEW 1.100 1.000 LMV3xx PSLEW 0.900 0.800 +2.5 V NSLEW _ VI VO + RL 0.700 CL -2.5 V 10 -2.0 -1.5 -1 LMV324S 0.600 PSLEW -0.5 0 0.5 1 0.500 2.5 1.5 Output Voltage - V 3.0 4.0 4.5 5.0 V CC - Supply Voltage - V Figure 9. Figure 10. SUPPLY CURRENT vs SUPPLY VOLTAGE - QUAD AMPLIFIER INPUT CURRENT vs TEMPERATURE 700 -10 VCC = 5 V VI = VCC/2 LMV3xx 600 LMV324S -20 TA = 85C 500 Input Current - nA Supply Current - A 3.5 TA = 25C 400 300 TA = -40C 200 -30 LMV3xx -40 -50 100 LMV324S 0 0 1 2 3 4 VCC - Supply Voltage - V Figure 11. 10 Submit Documentation Feedback 5 6 -60 -40 -30 -20 -10 0 10 20 30 40 50 60 70 80 TA - C Figure 12. Copyright (c) 1999-2012, Texas Instruments Incorporated LMV321 SINGLE, LMV358 DUAL LMV324 QUAD, LMV324S QUAD WITH SHUTDOWN www.ti.com SLOS263U - AUGUST 1999 - REVISED JULY 2012 TYPICAL CHARACTERISTICS (continued) SOURCE CURRENT vs OUTPUT VOLTAGE SOURCE CURRENT vs OUTPUT VOLTAGE 100 100 VCC = 2.7 V VCC = 5 V 10 Sourcing Current - mA Sourcing Current - mA 10 LMV3xx 1 LMV324S 0.1 1 LMV324S 0.1 0.01 0.01 0.001 0.001 LMV3xx 0.01 0.1 1 0.001 0.001 10 0.01 Output Voltage Referenced to VCC+ - V Figure 13. 10 SINKING CURRENT vs OUTPUT VOLTAGE 100 100 VCC = 5 V VCC = 2.7 V 10 10 LMV324S Sinking Current - mA Sinking Current - mA 1 Figure 14. SINKING CURRENT vs OUTPUT VOLTAGE 1 LMV3xx 0.1 LMV324S 1 LMV324 0.1 0.01 0.01 0.001 0.001 0.1 Output Voltage Referenced to VCC+ - V 0.01 0.1 1 Output Voltage Referenced to GND - V Figure 15. Copyright (c) 1999-2012, Texas Instruments Incorporated 10 0.001 0.001 0.01 0.1 1 10 Output Voltage Referenced to GND - V Figure 16. Submit Documentation Feedback 11 LMV321 SINGLE, LMV358 DUAL LMV324 QUAD, LMV324S QUAD WITH SHUTDOWN SLOS263U - AUGUST 1999 - REVISED JULY 2012 www.ti.com TYPICAL CHARACTERISTICS (continued) SHORT-CIRCUIT CURRENT vs TEMPERATURE SHORT-CIRCUIT CURRENT vs TEMPERATURE 120 300 LMV324S VCC = 5 V 270 Sinking Current - mA LMV324S VCC = 5 V 210 Sourcing Current - mA 100 240 LMV3xx VCC = 5 V 180 150 120 LMV3xx VCC = 2.7 V 90 60 LMV324S VCC = 2.7 V 80 LMV3xx VCC = 5 V 60 LMV3xx VCC = 2.7 V 40 LMV324S VCC = 2.7 V 20 30 0 -40 -30 -20 -10 0 0 10 20 30 40 50 60 70 80 90 TA - C -40 -30 -20-10 0 TA - C Figure 17. Figure 18. -kSVR vs FREQUENCY +kSVR vs FREQUENCY 80 90 LMV324S VCC = -5 V RL = 10 k 70 LMV324S VCC = 5 V RL = 10 k 80 70 60 LMV3xx LMV3xx 60 50 +k SVR - dB -k SVR - dB 10 20 30 40 50 60 70 80 90 40 30 50 40 30 20 20 10 0 100 12 10 0 1k 10k 100k 1M 100 1k 10k Frequency - Hz Frequency - Hz Figure 19. Figure 20. Submit Documentation Feedback 100k 1M Copyright (c) 1999-2012, Texas Instruments Incorporated LMV321 SINGLE, LMV358 DUAL LMV324 QUAD, LMV324S QUAD WITH SHUTDOWN www.ti.com SLOS263U - AUGUST 1999 - REVISED JULY 2012 TYPICAL CHARACTERISTICS (continued) +kSVR vs FREQUENCY -kSVR vs FREQUENCY 80 80 VCC = -2.7 V RL = 10 k LMV324S 70 70 LMV3xx +k SVR - dB 50 40 30 50 30 20 10 10 100 1k 10k 100k 0 100 1M LMV3xx 40 20 0 1k 10k Frequency - Hz Figure 21. Figure 22. 6 RL = 10 k THD > 5% AV = 3 RL = 10 k 60 Peak Output Voltage - V OPP 5 LMV3xx LMV324S Negative Swing 1M OUTPUT VOLTAGE vs FREQUENCY 70 50 100k Frequency - Hz OUTPUT VOLTAGE SWING FROM RAILS vs SUPPLY VOLTAGE Output Voltage Swing - mV VCC = 2.7 V RL = 10 k 60 60 -kSVR - dB LMV324S 40 30 20 Positive Swing LMV3xx VCC = 5 V 4 LMV324S VCC = 5 V 3 LMV3xx VCC = 2.7 V 2 LMV324S VCC = 2.7 V 1 10 0 0 2.5 3.0 3.5 4.0 VCC - Supply Voltage - V Figure 23. Copyright (c) 1999-2012, Texas Instruments Incorporated 4.5 5.0 1k 10k 100k 1M 10M Frequency - Hz Figure 24. Submit Documentation Feedback 13 LMV321 SINGLE, LMV358 DUAL LMV324 QUAD, LMV324S QUAD WITH SHUTDOWN SLOS263U - AUGUST 1999 - REVISED JULY 2012 www.ti.com TYPICAL CHARACTERISTICS (continued) OPEN-LOOP OUTPUT IMPEDANCE vs FREQUENCY CROSSTALK REJECTION vs FREQUENCY 150 110 LMV3xx VCC = 5 V Impedance - 90 80 70 LMV324S VCC = 2.7 V 60 50 LMV324S VCC = 5 V 40 VCC = 5 V RL = 5 k AV = 1 VO = 3 VPP 140 Crosstalk Rejection - dB 100 LMV3xx VCC = 2.7 V 130 120 110 100 30 20 1 1M 2M 3M 90 100 4M 1k 10k Frequency - Hz Frequency - Hz Figure 25. Figure 26. NONINVERTING LARGE-SIGNAL PULSE RESPONSE NONINVERTING LARGE-SIGNAL PULSE RESPONSE Input LMV3xx LMV3xx 1 V/Div 1 V/Div Input LMV324S LMV324S VCC = 2.5 V RL = 2 k TA = 85C VCC = 2.5 V RL = 2 k T = 25C 14 100k 1 s/Div 1 s/Div Figure 27. Figure 28. Submit Documentation Feedback Copyright (c) 1999-2012, Texas Instruments Incorporated LMV321 SINGLE, LMV358 DUAL LMV324 QUAD, LMV324S QUAD WITH SHUTDOWN www.ti.com SLOS263U - AUGUST 1999 - REVISED JULY 2012 TYPICAL CHARACTERISTICS (continued) NONINVERTING LARGE-SIGNAL PULSE RESPONSE NONINVERTING SMALL-SIGNAL PULSE RESPONSE Input Input LMV3xx LMV324S 50 mV/Div 1 V/Div LMV3xx LMV324S VCC = 2.5 V RL = 2 k TA = -40C VCC = 2.5 V RL = 2 k TA = 25C 1 s/Div 1 s/Div Figure 29. Figure 30. NONINVERTING SMALL-SIGNAL PULSE RESPONSE NONINVERTING SMALL-SIGNAL PULSE RESPONSE Input Input 50 mV/Div 50 mV/Div LMV3xx LMV3xx LMV324S LMV324S VCC = 2.5 V RL = 2 k TA = 85C VCC = 2.5 V RL = 2 k TA = -40C 1 s/Div Figure 31. Copyright (c) 1999-2012, Texas Instruments Incorporated 1 s/Div Figure 32. Submit Documentation Feedback 15 LMV321 SINGLE, LMV358 DUAL LMV324 QUAD, LMV324S QUAD WITH SHUTDOWN SLOS263U - AUGUST 1999 - REVISED JULY 2012 www.ti.com TYPICAL CHARACTERISTICS (continued) INVERTING LARGE-SIGNAL PULSE RESPONSE INVERTING LARGE-SIGNAL PULSE RESPONSE Input Input LMV3xx 1 V/Div 1 V/Div LMV3xx LMV324S LMV324S VCC = 2.5 V RL = 2 k TA = 25C VCC = 2.5 V RL = 2 k TA = 85C 1 s/Div 1 s/Div Figure 33. Figure 34. INVERTING SMALL-SIGNAL PULSE RESPONSE INVERTING LARGE-SIGNAL PULSE RESPONSE Input Input LMV3xx 1 V/Div 50 mV/Div LMV3xx LMV324S VCC = 2.5 V RL = 2 k TA = -40C 16 LMV324S VCC = 2.5 V RL = 2 k TA = 25C 1 s/Div 1 s/Div Figure 35. Figure 36. Submit Documentation Feedback Copyright (c) 1999-2012, Texas Instruments Incorporated LMV321 SINGLE, LMV358 DUAL LMV324 QUAD, LMV324S QUAD WITH SHUTDOWN www.ti.com SLOS263U - AUGUST 1999 - REVISED JULY 2012 TYPICAL CHARACTERISTICS (continued) INVERTING SMALL-SIGNAL PULSE RESPONSE Input Input LMV3xx LMV3xx 50 mV/Div 50 mV/Div INVERTING SMALL-SIGNAL PULSE RESPONSE LMV324S LMV324S VCC = 2.5 V RL = 2 k TA = -40C VCC = 2.5 V RL = 2 k TA = 85C 1 s/Div 1 s/Div Figure 37. Figure 38. INPUT CURRENT NOISE vs FREQUENCY INPUT CURRENT NOISE vs FREQUENCY 0.50 0.80 0.60 0.40 0.20 VCC = 5 V 0.45 Input Current Noise - pA/ Hz Input Current Noise - pA/ Hz VCC = 2.7 V 0.40 0.35 0.30 0.25 0.20 0.15 0.10 0.05 0.00 0.00 10 100 1k Frequency - Hz Figure 39. Copyright (c) 1999-2012, Texas Instruments Incorporated 10k 10 100 1k 10k Frequency - Hz Figure 40. Submit Documentation Feedback 17 LMV321 SINGLE, LMV358 DUAL LMV324 QUAD, LMV324S QUAD WITH SHUTDOWN SLOS263U - AUGUST 1999 - REVISED JULY 2012 www.ti.com TYPICAL CHARACTERISTICS (continued) THD + N vs FREQUENCY INPUT VOLTAGE NOISE vs FREQUENCY 10.000 200 160 1.000 140 THD - % Input Voltage Noise - nV/ Hz 180 VCC = 2.7 V RL = 10 k AV = 1 VO = 1 VPP 120 100 LMV3xx 0.100 80 VCC = 2.7 V 60 0.010 LMV324S 40 VCC = 5 V 0.001 20 10 100 1k 10 10k 100 10000 Frequency - Hz Figure 41. Figure 42. 100000 THD + N vs FREQUENCY THD + N vs FREQUENCY 10.000 10.000 VCC = 2.7 V RL = 10 k AV = 10 VO = 1 VPP 1.000 1000 Frequency - Hz 1.000 VCC = 5 V RL = 10 k AV = 1 VO = 1 VPP THD - % THD - % LMV324S 0.100 0.100 LMV324S LMV3xx 0.010 0.010 LMV3xx 0.001 0.001 10 100 1000 Frequency - Hz Figure 43. 18 Submit Documentation Feedback 10000 100000 10 100 1000 10000 100000 Frequency - Hz Figure 44. Copyright (c) 1999-2012, Texas Instruments Incorporated LMV321 SINGLE, LMV358 DUAL LMV324 QUAD, LMV324S QUAD WITH SHUTDOWN www.ti.com SLOS263U - AUGUST 1999 - REVISED JULY 2012 TYPICAL CHARACTERISTICS (continued) THD + N vs FREQUENCY 10.000 VCC = 5 V RL = 10 k AV = 10 VO = 2.5 VPP 1.000 THD - % LMV324S 0.100 0.010 LMV3xx 0.001 10 100 1000 10000 100000 Frequency - Hz Figure 45. Copyright (c) 1999-2012, Texas Instruments Incorporated Submit Documentation Feedback 19 LMV321 SINGLE, LMV358 DUAL LMV324 QUAD, LMV324S QUAD WITH SHUTDOWN SLOS263U - AUGUST 1999 - REVISED JULY 2012 www.ti.com REVISION HISTORY Changes from Revision T (September 2007) to Revision U * 20 Page Updated JA value for DDU package. ................................................................................................................................... 4 Submit Documentation Feedback Copyright (c) 1999-2012, Texas Instruments Incorporated PACKAGE OPTION ADDENDUM www.ti.com 16-Aug-2012 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Qty Eco Plan (2) Lead/ Ball Finish MSL Peak Temp LMV321IDBVR ACTIVE SOT-23 DBV 5 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM LMV321IDBVRG4 ACTIVE SOT-23 DBV 5 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM LMV321IDBVT ACTIVE SOT-23 DBV 5 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM LMV321IDBVTE4 ACTIVE SOT-23 DBV 5 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM LMV321IDBVTG4 ACTIVE SOT-23 DBV 5 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM LMV321IDCKR ACTIVE SC70 DCK 5 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM LMV321IDCKRG4 ACTIVE SC70 DCK 5 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM LMV321IDCKT ACTIVE SC70 DCK 5 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM LMV321IDCKTE4 ACTIVE SC70 DCK 5 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM LMV321IDCKTG4 ACTIVE SC70 DCK 5 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM LMV324ID ACTIVE SOIC D 14 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM LMV324IDG4 ACTIVE SOIC D 14 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM LMV324IDR ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM LMV324IDRG4 ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM LMV324IPWR ACTIVE TSSOP PW 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM LMV324IPWRE ACTIVE TSSOP PW 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM LMV324IPWRG4 ACTIVE TSSOP PW 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Addendum-Page 1 (3) Samples (Requires Login) PACKAGE OPTION ADDENDUM www.ti.com 16-Aug-2012 Orderable Device Status (1) Package Type Package Drawing Pins Package Qty Eco Plan (2) Lead/ Ball Finish MSL Peak Temp LMV324QD ACTIVE SOIC D 14 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM LMV324QDG4 ACTIVE SOIC D 14 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM LMV324QDR ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM LMV324QDRG4 ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM LMV324QPW ACTIVE TSSOP PW 14 90 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM LMV324QPWE4 ACTIVE TSSOP PW 14 90 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM LMV324QPWG4 ACTIVE TSSOP PW 14 90 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM LMV324QPWR ACTIVE TSSOP PW 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM LMV324QPWRG4 ACTIVE TSSOP PW 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM LMV324SID NRND SOIC D 16 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM LMV324SIDE4 NRND SOIC D 16 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM LMV324SIDG4 NRND SOIC D 16 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM LMV324SIDR NRND SOIC D 16 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM LMV324SIDRE4 NRND SOIC D 16 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM LMV324SIDRG4 NRND SOIC D 16 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM LMV324SIPWR NRND TSSOP PW 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM LMV324SIPWRE4 NRND TSSOP PW 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM LMV324SIPWRG4 NRND TSSOP PW 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Addendum-Page 2 (3) Samples (Requires Login) PACKAGE OPTION ADDENDUM www.ti.com 16-Aug-2012 Orderable Device Status (1) Package Type Package Drawing Pins Package Qty Eco Plan (2) Lead/ Ball Finish MSL Peak Temp LMV358ID ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM LMV358IDDUR ACTIVE VSSOP DDU 8 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM LMV358IDDURE4 ACTIVE VSSOP DDU 8 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM LMV358IDDURG4 ACTIVE VSSOP DDU 8 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM LMV358IDE4 ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM LMV358IDG4 ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM LMV358IDGKR ACTIVE VSSOP DGK 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM LMV358IDGKRG4 ACTIVE VSSOP DGK 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM LMV358IDR ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM LMV358IDRE4 ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM LMV358IDRG4 ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM LMV358IPW ACTIVE TSSOP PW 8 150 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM LMV358IPWE4 ACTIVE TSSOP PW 8 150 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM LMV358IPWG4 ACTIVE TSSOP PW 8 150 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM LMV358IPWR ACTIVE TSSOP PW 8 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM LMV358IPWRE4 ACTIVE TSSOP PW 8 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM LMV358IPWRG4 ACTIVE TSSOP PW 8 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM LMV358QD ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Addendum-Page 3 (3) Samples (Requires Login) PACKAGE OPTION ADDENDUM www.ti.com Orderable Device 16-Aug-2012 Status (1) Package Type Package Drawing Pins Package Qty Eco Plan (2) Lead/ Ball Finish MSL Peak Temp LMV358QDDUR ACTIVE VSSOP DDU 8 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM LMV358QDDURE4 ACTIVE VSSOP DDU 8 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM LMV358QDDURG4 ACTIVE VSSOP DDU 8 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM LMV358QDE4 ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM LMV358QDG4 ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM LMV358QDGKR ACTIVE VSSOP DGK 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM LMV358QDGKRG4 ACTIVE VSSOP DGK 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM LMV358QDR ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM LMV358QDRE4 ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM LMV358QDRG4 ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM LMV358QPWR ACTIVE TSSOP PW 8 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM LMV358QPWRE4 ACTIVE TSSOP PW 8 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM LMV358QPWRG4 ACTIVE TSSOP PW 8 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM (3) Samples (Requires Login) (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Addendum-Page 4 PACKAGE OPTION ADDENDUM www.ti.com 16-Aug-2012 Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. 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OTHER QUALIFIED VERSIONS OF LMV321, LMV324, LMV358 : * Automotive: LMV321-Q1, LMV324-Q1, LMV358-Q1 NOTE: Qualified Version Definitions: * Automotive - Q100 devices qualified for high-reliability automotive applications targeting zero defects Addendum-Page 5 PACKAGE MATERIALS INFORMATION www.ti.com 16-Aug-2012 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) B0 (mm) K0 (mm) P1 (mm) LMV321IDBVR SOT-23 DBV 5 3000 180.0 9.2 LMV321IDBVR SOT-23 DBV 5 3000 178.0 LMV321IDBVT SOT-23 DBV 5 250 180.0 LMV321IDBVT SOT-23 DBV 5 250 LMV321IDCKR SC70 DCK 5 LMV321IDCKR SC70 DCK LMV321IDCKT SC70 DCK LMV321IDCKT SC70 LMV324IDR LMV324IDR W Pin1 (mm) Quadrant 3.17 3.23 1.37 4.0 8.0 Q3 9.0 3.23 3.17 1.37 4.0 8.0 Q3 9.2 3.17 3.23 1.37 4.0 8.0 Q3 178.0 9.0 3.23 3.17 1.37 4.0 8.0 Q3 3000 178.0 9.0 2.4 2.5 1.2 4.0 8.0 Q3 5 3000 180.0 9.2 2.3 2.55 1.2 4.0 8.0 Q3 5 250 180.0 9.2 2.3 2.55 1.2 4.0 8.0 Q3 DCK 5 250 178.0 9.0 2.4 2.5 1.2 4.0 8.0 Q3 SOIC D 14 2500 330.0 16.4 6.5 9.0 2.1 8.0 16.0 Q1 SOIC D 14 2500 330.0 16.4 6.5 9.0 2.1 8.0 16.0 Q1 LMV324IPWR TSSOP PW 14 2000 330.0 12.4 7.0 5.6 1.6 8.0 12.0 Q1 LMV324IPWR TSSOP PW 14 2000 330.0 12.4 6.9 5.6 1.6 8.0 12.0 Q1 LMV324IPWRG4 TSSOP PW 14 2000 330.0 12.4 6.9 5.6 1.6 8.0 12.0 Q1 LMV324QDR SOIC D 14 2500 330.0 16.4 6.5 9.0 2.1 8.0 16.0 Q1 LMV324QPWR TSSOP PW 14 2000 330.0 12.4 6.9 5.6 1.6 8.0 12.0 Q1 LMV324SIDR SOIC D 16 2500 330.0 16.4 6.5 10.3 2.1 8.0 16.0 Q1 LMV324SIPWR TSSOP PW 16 2000 330.0 12.4 6.9 5.6 1.6 8.0 12.0 Q1 LMV358IDDUR VSSOP DDU 8 3000 180.0 8.4 2.25 3.35 1.05 4.0 8.0 Q3 Pack Materials-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 16-Aug-2012 Device Package Package Pins Type Drawing SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant LMV358IDGKR VSSOP DGK 8 2500 330.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1 LMV358IDR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1 LMV358IDR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1 LMV358IPWR TSSOP PW 8 2000 330.0 12.4 7.0 3.6 1.6 8.0 12.0 Q1 LMV358IPWR TSSOP PW 8 2000 330.0 12.4 7.0 3.6 1.6 8.0 12.0 Q1 LMV358IPWRG4 TSSOP PW 8 2000 330.0 12.4 7.0 3.6 1.6 8.0 12.0 Q1 LMV358QDDUR VSSOP DDU 8 3000 180.0 8.4 2.25 3.35 1.05 4.0 8.0 Q3 LMV358QDGKR VSSOP DGK 8 2500 330.0 12.4 5.3 3.3 1.3 8.0 12.0 Q1 LMV358QDR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1 LMV358QPWR TSSOP PW 8 2000 330.0 12.4 7.0 3.6 1.6 8.0 12.0 Q1 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) LMV321IDBVR SOT-23 DBV 5 3000 205.0 200.0 33.0 LMV321IDBVR SOT-23 DBV 5 3000 180.0 180.0 18.0 LMV321IDBVT SOT-23 DBV 5 250 205.0 200.0 33.0 LMV321IDBVT SOT-23 DBV 5 250 180.0 180.0 18.0 LMV321IDCKR SC70 DCK 5 3000 180.0 180.0 18.0 LMV321IDCKR SC70 DCK 5 3000 205.0 200.0 33.0 LMV321IDCKT SC70 DCK 5 250 205.0 200.0 33.0 Pack Materials-Page 2 PACKAGE MATERIALS INFORMATION www.ti.com 16-Aug-2012 Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) LMV321IDCKT SC70 DCK 5 250 180.0 180.0 18.0 LMV324IDR SOIC D 14 2500 333.2 345.9 28.6 LMV324IDR SOIC D 14 2500 367.0 367.0 38.0 LMV324IPWR TSSOP PW 14 2000 364.0 364.0 27.0 LMV324IPWR TSSOP PW 14 2000 367.0 367.0 35.0 LMV324IPWRG4 TSSOP PW 14 2000 367.0 367.0 35.0 LMV324QDR SOIC D 14 2500 367.0 367.0 38.0 LMV324QPWR TSSOP PW 14 2000 367.0 367.0 35.0 LMV324SIDR SOIC D 16 2500 333.2 345.9 28.6 LMV324SIPWR TSSOP PW 16 2000 367.0 367.0 35.0 LMV358IDDUR VSSOP DDU 8 3000 202.0 201.0 28.0 LMV358IDGKR VSSOP DGK 8 2500 358.0 335.0 35.0 LMV358IDR SOIC D 8 2500 340.5 338.1 20.6 LMV358IDR SOIC D 8 2500 367.0 367.0 35.0 LMV358IPWR TSSOP PW 8 2000 367.0 367.0 35.0 LMV358IPWR TSSOP PW 8 2000 364.0 364.0 27.0 LMV358IPWRG4 TSSOP PW 8 2000 367.0 367.0 35.0 LMV358QDDUR VSSOP DDU 8 3000 202.0 201.0 28.0 LMV358QDGKR VSSOP DGK 8 2500 370.0 355.0 55.0 LMV358QDR SOIC D 8 2500 340.5 338.1 20.6 LMV358QPWR TSSOP PW 8 2000 367.0 367.0 35.0 Pack Materials-Page 3 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. 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