EN5329QI-E - ALTERA - Datasheet.Support

Enpirion® Power Datasheet

EN5329QI 2A PowerSoC

Low Profile Synchronous Buck DC-DC

Converter with Integrated Inductor

1 www.altera.com/enpirion

Description

The EN5329QI is a highly integrated, low profile,

highly efficient, 2A synchronous buck power system

on a chip (PowerSoCTM). The device features an

advance integrated inductor, integrated MOSFETs, a

PWM voltage-mode controller, and internal

compensation providing the smallest possible solution

size.

The EN5329QI is a member of the EN53x9QI family

of pin compatible and interchangeable devices. The

pin compatibility enables an easy to use scalable

family of products covering the load range from 1.5A

up to 3A in a low profile 4mm x 6mm x 1.1mm QFN

package.

The EN5329QI operates at high switching frequency

and allows for the use of tiny MLCC capacitors. It also

enables a very wide control loop bandwidth providing

excellent transient performance and reduced output

impedance. The internal compensation is designed

for unconditional stability across all operating

conditions.

Altera Enpirion integrated inductor solution

significantly helps to reduce noise. The complete

power converter solution enhances productivity by

offering greatly simplified board design, layout and

manufacturing requirements. All Altera Enpirion

products are RoHS compliant and lead-free

manufacturing environment compatible.

Features

 Integrated Inductor

 Solution Footprint as Small as 50 mm2

 Low Profile, 1.1mm

 High Reliability Solution: 42,000 Years MTBF

 High Efficiency, up to 95 %

 Low Output Ripple Voltage; <5mVP-P Typical

 2.4 V to 5.5 V Input Voltage Range

 2A Continuous Output Current Capability

 Pin Compatible w/ EN5319 1.5A and EN5339 3A

 Output Enable and Power OK Signal

 Under Voltage Lockout, Over Current, Short Circuit,

and Thermal Protection

 RoHS Compliant; Halogen Free; 260°C Reflow

Applications

 Applications with Low Profile Requirement such as

SSD and Embedded Computing

 SAN/NAS Accelerator Appliances

 Controllers, Raid, Processors, Network Processors,



 Noise Sensitive Applications

EN5329QI

VOUT

PVIN

AGND

VIN POK

TST0

TST1

TST2

ENABLE

AVIN PGND

CIN

22µF

COUT

2x 22µF

or

1x 47µF

100k

VOUT

PGND

Ra

Rb

VFB

POK

Ca

1µF

Figure 1. Simplified Applications Circuit

Figure 2. Highest Efficiency in Smallest Solution Size

0

10

20

30

40

50

60

70

80

90

100

0 0.5 1 1.5 2

EFFICIENCY (%)

OUTPUT CURRENT (A)

Efficiency vs. Output Current

VOUT = 2.5V

VOUT = 1.2V

CONDITIONS

VIN = 3.3V

Actual Solution Size

50mm2

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Ordering Information

Part Number

Package Markings

Temp Rating (°C)

Package Description

EN5329QI

EN5329

-40 to +85

24-pin (4mm x 6mm x 1.1mm) QFN T&R

EVB-EN5329QI

EN5329

QFN Evaluation Board

Packing and Marking Information: www.altera.com/support/reliability/packing/rel-packing-and-marking.html

Pin Assignments (Top View)

NC(SW)

PGND

VOUT

PGND

NC

VFB

AGND

AVIN

POK

ENABLE

PVIN

26

PGND

25

PGND

1

2

3

4

5 6 7 8 9 10 11 12

13

14

15

16

17

181920

21

22

2324

Keep-Out

TST2

TST1

TST0

Figure 3: Pin Out Diagram (Top View)

NOTE A: NC pins are not to be electrically connected to each other or to any external signal, ground, or voltage.

However, they must be soldered to the PCB. Failure to follow this guideline may result in part malfunction or damage.

NOTE B: Grey area highlights exposed metal on the bottom of the package that is not to be mechanically or electrically

connected to the PCB. There should be no traces on PCB top layer under these keep out areas.

NOTE C on top left is pin 1 indicator on top of the device package.

Pin Description

NAME

FUNCTION

1, 21-24

NC(SW)

NO CONNECT: These pins are internally connected to the common switching node of the

internal MOSFETs. They must be soldered to PCB but not be electrically connected to any

external signal, ground, or voltage. Failure to follow this guideline may result in device

damage.

2-3, 8-9

PGND

Input and output power ground. Connect these pins to the ground electrode of the input and

output filter capacitors. See VOUT, PVIN descriptions and Layout Recommendation for more

details.

4-7

VOUT

Regulated converter output. Connect to the load and place output filter capacitor(s) between

these pins and PGND pins 8 and 9. See layout recommendation for details

10

TST2

Test Pin. For Altera internal use only. Connect to AVIN at all times.

11

TST1

Test Pin. For Altera internal use only. Connect to AVIN at all times.

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NAME

FUNCTION

12

TST0

Test Pin. For Altera internal use only. Connect to AVIN at all times.

13

NC

NO CONNECT: This pin must be soldered to PCB but not electrically connected to any other

pin or to any external signal, voltage, or ground. This pin may be connected internally. Failure

to follow this guideline may result in device damage.

14

VFB

This is the external feedback input pin. A resistor divider connects from the output to AGND.

The mid-point of the resistor divider is connected to VFB. A feed-forward capacitor is required

parallel to the upper feedback resistor (RA). The output voltage regulation is based on the

VFB node voltage equal to 0.600V.

15

AGND

The quiet ground for the control circuits. Connect to the ground plane with a via right next to

the pin.

16

AVIN

Analog input voltage for the control circuits. Connect this pin to the input power supply (PVIN)

at a quiet point. Decouple with a 1uF capacitor to AGND.

17

POK

POK is an open drain output. Refer to Power OK section for details. Leave POK open if

unused.

18

ENABLE

Output Enable. A logic high level on this pin enables the output and initiates a soft-start. A

logic low signal disables the output and discharges the output to GND. This pin must not be

left floating.

19-20

PVIN

Input power supply. Connect to input power supply and place input filter capacitor(s) between

these pins and PGND pins 2 to 3.

25,26

PGND

Not a perimeter pin. Device thermal pad to be connected to the system GND plane for heat-

sinking purposes. See Layout Recommendation section.

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Absolute Maximum Ratings

CAUTION: Absolute Maximum ratings are stress ratings only. Functional operation beyond the recommended operating

conditions is not implied. Stress beyond the absolute maximum ratings may impair device life. Exposure to absolute

maximum rated conditions for extended periods may affect device reliability.

PARAMETER

SYMBOL

MIN

MAX

UNITS

Voltages on : PVIN, AVIN, VOUT

-0.3

6.5

V

Voltages on: ENABLE, POK, TST0, TST1, TST2

-0.3

VIN+0.3

V

Voltages on: VFB

-0.3

2.7

V

Storage Temperature Range

TSTG

-65

150

°C

Maximum Operating Junction Temperature

TJ-ABS Max

150

°C

Reflow Temp, 10 Sec, MSL3 JEDEC J-STD-020A

260

°C

ESD Rating (Human Body Model)

2000

V

ESD Rating (Charge Device Model)

500

V

Recommended Operating Conditions

PARAMETER

SYMBOL

MIN

MAX

UNITS

Input Voltage Range

VIN

2.4

5.5

V

Output Voltage Range (Note 1)

VOUT

0.6

VIN  VDO

V

Output Current

IOUT

0

2

A

Operating Ambient Temperature

TA

-40

+85

°C

Operating Junction Temperature

TJ

-40

+125

°C

Thermal Characteristics

PARAMETER

SYMBOL

TYP

UNITS

Thermal Resistance: Junction to Ambient (0 LFM) (Note 2)

JA

36

°C/W

Thermal Resistance: Junction to Case (0 LFM)

JC

6

°C/W

Thermal Shutdown

TSD

150

°C

Thermal Shutdown Hysteresis

TSDH

15

°C

Note 1: VDO (dropout voltage) is defined as (ILOAD x Dropout Resistance). Please see Electrical Characteristics Table.

Note 2: Based on 2oz. external copper layers and proper thermal design in line with EIJ/JEDEC JESD51-7 standard for

high thermal conductivity boards.

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Electrical Characteristics

NOTE: VIN = 5V, Minimum and Maximum values are over operating ambient temperature range unless otherwise noted.

Typical values are at TA = 25°C.

PARAMETER

SYMBOL

TEST CONDITIONS

MIN

TYP

MAX

UNITS

Operating Input Voltage

VIN

2.4

5.5

V

Feedback Node Initial

Accuracy

VVFB

TA = 25°C; VIN = 5V

ILOAD = 100 mA

0.588

0.600

0.612

V

Output Variation (Note 3)

(Line, Load, Temperature)

VOUT

2.4V  VIN  5.5V

0 ≤ ILOAD 2A

-3

+3

%

VFB, ENABLE, TST0/1/2

Pin Input Current (Note 4)

+/-40

nA

Shutdown Current

ENABLE Low

20

A

Under Voltage Lock-out 

VIN Rising

VUVLOR

Voltage Above Which UVLO is

Not Asserted

2.2

V

Under Voltage Lock-out 

tVIN Falling

VUVLOF

Voltage Below Which UVLO is

Asserted

2.1

V

Soft-start Time

Time from Enable High (Note 4)

0.91

1.40

1.89

ms

Dropout Resistance

150

300

m

ENABLE Voltage

Threshold

Logic Low

Logic High

0.0

1.4

0.4

VIN

V

POK Threshold

VOUT Rising

92

%

POK Threshold

VOUT Falling

90

%

POK Low Voltage

ISINK = 1 mA

0.15

0.4

V

POK Pin VOH Leakage

Current

POK High

0.5

2

µA

Current Limit Threshold

2.4V  VIN  5.5V

3.2

5

A

Operating Frequency

FOSC

3.2

MHz

Output Ripple Voltage

VRIPPLE

COUT = 2 x 22 F 0603 X5R

MLCC, VOUT = 3.3 V, ILOAD = 2A

5

mVP-P

COUT = 2 x 22 F 0603 X5R

MLCC, VOUT = 1.8 V, ILOAD = 2A

5

mVP-P

Note 3: Output voltage variation is based on using 0.1% accuracy resistor values.

Note 4: Parameter not production tested but is guaranteed by design.

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Typical Performance Curves

0

10

20

30

40

50

60

70

80

90

100

0 0.5 1 1.5 2

EFFICIENCY (%)

OUTPUT CURRENT (A)

Efficiency vs. Output Current

VOUT = 2.5V

VOUT = 1.8V

VOUT = 1.2V

VOUT = 1.0V

CONDITIONS

VIN = 3.3V

0

10

20

30

40

50

60

70

80

90

100

0 0.5 1 1.5 2

EFFICIENCY (%)

OUTPUT CURRENT (A)

Efficiency vs. Output Current

VOUT = 3.3V

VOUT = 2.5V

VOUT = 1.8V

VOUT = 1.2V

VOUT = 1.0V

CONDITIONS

VIN = 5V

2.8

2.9

3

3.1

3.2

3.3

3.4

3.5

3.6

3.2 3.3 3.4 3.5 3.6 3.7 3.8 3.9 4

OUTPUT VOLTAGE (V)

INPUT VOLTAGE(V)

Dropout Voltage

IOUT = 1A

IOUT = 2A

CONDITIONS

VOUT = 3.3V

3.24

3.26

3.28

3.3

3.32

3.34

3.36

0 0.5 1 1.5 2

OUTPUT VOLTAGE (V)

OUTPUT CURRENT (A)

Output Voltage vs. Output Current

VOUT = 3.3V

CONDITIONS

VIN = 5V

2.44

2.46

2.48

2.5

2.52

2.54

2.56

0 0.5 1 1.5 2

OUTPUT VOLTAGE (V)

OUTPUT CURRENT (A)

Output Voltage vs. Output Current

VOUT = 2.5V

CONDITIONS

VIN = 5V

1.74

1.76

1.78

1.8

1.82

1.84

1.86

0 0.5 1 1.5 2

OUTPUT VOLTAGE (V)

OUTPUT CURRENT (A)

Output Voltage vs. Output Current

VOUT = 1.8V

CONDITIONS

VIN = 5V

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Typical Performance Curves (Continued)

1.14

1.16

1.18

1.2

1.22

1.24

1.26

0 0.5 1 1.5 2

OUTPUT VOLTAGE (V)

OUTPUT CURRENT (A)

Output Voltage vs. Output Current

VOUT = 1.2V

CONDITIONS

VIN = 5V

2.44

2.46

2.48

2.5

2.52

2.54

2.56

0 0.5 1 1.5 2

OUTPUT VOLTAGE (V)

OUTPUT CURRENT (A)

Output Voltage vs. Output Current

VOUT = 2.5V

CONDITIONS

VIN = 3.3V

1.74

1.76

1.78

1.8

1.82

1.84

1.86

0 0.5 1 1.5 2

OUTPUT VOLTAGE (V)

OUTPUT CURRENT (A)

Output Voltage vs. Output Current

VOUT = 1.8V

CONDITIONS

VIN = 3.3V

1.14

1.16

1.18

1.2

1.22

1.24

1.26

0 0.5 1 1.5 2

OUTPUT VOLTAGE (V)

OUTPUT CURRENT (A)

Output Voltage vs. Output Current

VOUT = 1.2V

CONDITIONS

VIN = 3.3V

1.780

1.785

1.790

1.795

1.800

1.805

1.810

1.815

1.820

2.5 3.1 3.7 4.3 4.9 5.5

OUTPUT VOLTAGE (V)

INPUT VOLTAGE (V)

Output Voltage vs. Input Voltage

CONDITIONS

Load = 5mA

1.780

1.785

1.790

1.795

1.800

1.805

1.810

1.815

1.820

2.5 3.1 3.7 4.3 4.9 5.5

OUTPUT VOLTAGE (V)

INPUT VOLTAGE (V)

Output Voltage vs. Input Voltage

CONDITIONS

Load = 500mA

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Typical Performance Curves (Continued)

1.780

1.785

1.790

1.795

1.800

1.805

1.810

1.815

1.820

2.5 3.1 3.7 4.3 4.9 5.5

OUTPUT VOLTAGE (V)

INPUT VOLTAGE (V)

Output Voltage vs. Input Voltage

CONDITIONS

Load = 1A

1.780

1.785

1.790

1.795

1.800

1.805

1.810

1.815

1.820

2.5 3.1 3.7 4.3 4.9 5.5

OUTPUT VOLTAGE (V)

INPUT VOLTAGE (V)

Output Voltage vs. Input Voltage

CONDITIONS

Load = 2A

0.960

0.970

0.980

0.990

1.000

1.010

1.020

1.030

1.040

-40 -15 10 35 60 85

OUTPUT VOLTAGE (V)

AMBIENT TEMPERATURE (C)

Output Voltage vs. Temperature

LOAD = 2A

LOAD = 100mA

CONDITIONS

VIN = 5V

VOUT_NOM = 1.0V

1.760

1.770

1.780

1.790

1.800

1.810

1.820

1.830

1.840

-40 -15 10 35 60 85

OUTPUT VOLTAGE (V)

AMBIENT TEMPERATURE (C)

Output Voltage vs. Temperature

LOAD = 2A

LOAD = 100mA

CONDITIONS

VIN = 5V

VOUT_NOM = 1.8V

CONDITIONS

VIN = 5V

VOUT_NOM = 1.8V

0

0.5

1

1.5

2

2.5

3

3.5

-40 -15 10 35 60 85

GUARANTEED OUTPUT CURRENT (A)

AMBIENT TEMPERATURE(C)

No Thermal Derating

Conditions

VIN = 5.0V

VOUT = 3.3V

CONDITIONS

VIN = 5.0V

VOUT = 1.0V

0

0.5

1

1.5

2

2.5

3

3.5

-40 -15 10 35 60 85

GUARANTEED OUTPUT CURRENT (A)

AMBIENT TEMPERATURE(C)

No Thermal Derating

Conditions

VIN = 5.0V

VOUT = 3.3V

CONDITIONS

VIN = 5.0V

VOUT = 3.3V

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Typical Performance Characteristics (Continued)

Output Ripple at 20MHz

CONDITIONS

VIN = 3.3V

VOUT = 1.8V

IOUT = 2A

CIN = 1x 22µF (0805)

COUT = 2 x 22µF (0603)

VOUT

(AC Coupled)

Output Ripple at 20MHz

CONDITIONS

VIN = 5V

VOUT = 3.3V

IOUT = 2A

CIN = 1x 22µF (0805)

COUT = 2 x 22µF (0603)

VOUT

(AC Coupled)

Output Ripple at 500MHz

CONDITIONS

VIN = 3.3V

VOUT = 1.8V

IOUT = 2A

CIN = 1x 22µF (0805)

COUT = 2 x 22µF (0603)

VOUT

(AC Coupled)

Output Ripple at 500MHz

VOUT

(AC Coupled)

CONDITIONS

VIN = 5V

VOUT = 3.3V

IOUT = 2A

CIN = 1x 22µF (0805)

COUT = 2 x 22µF (0603)

VOUT

Startup Waveforms at 0A

VIN = 5V, VOUT = 1.8V

CIN = 1 X 22µF (0805), COUT = 2 x 22µF (0603), IOUT = 0A

LOAD

ENABLE

POK

VOUT

Startup Waveforms at 2A

VIN = 5V, VOUT = 1.8V

CIN = 1 X 22µF (0805), COUT = 2 x 22µF (0603), IOUT = 2A

LOAD

ENABLE

POK

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Typical Performance Characteristics (Continued)

VOUT

(AC Coupled)

Load Transient from 0 to 1A

CONDITIONS

VIN = 3.3V

VOUT = 1.8V

CIN = 1 X 22µF (0805)

COUT = 2 x 22µF (0603)

LOAD

VOUT

(AC Coupled)

Load Transient from 0 to 2A

CONDITIONS

VIN = 3.3V

VOUT = 1.8V

CIN = 1 X 22µF (0805)

COUT = 2 x 22µF (0603)

LOAD

VOUT

(AC Coupled)

Load Transient from 0 to 1A

CONDITIONS

VIN = 5V

VOUT = 2.5V

CIN = 1 X 22µF (0805)

COUT = 2 x 22µF (0603)

LOAD

VOUT

(AC Coupled)

Load Transient from 0 to 2A

CONDITIONS

VIN = 5V

VOUT = 2.5V

CIN = 1 X 22µF (0805)

COUT = 2 x 22µF (0603)

LOAD

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Functional Block Diagram

DAC

VREF

(+)

(-)

Error

Amp

VFB

VOUT

Package Boundary

P-Drive

N-Drive

UVLO

Thermal Limit

Current Limit

Soft Start

Sawtooth

Generator

(+)

(-)PWM

Comp

PVIN

ENABLE

PGND

Logic

Compensation

Network

NC

(SW)

POK

AVIN AGND

BIAS

TST

Figure 4: Functional Block Diagram

Functional Description

Overview

The EN5329QI is a highly integrated synchronous

buck converter with an internal inductor utilizing

advanced CMOS technology to provide high

switching frequency, while also maintaining high

efficiency. The EN5329QI is a high power density

device packaged in a tiny 4x6x1.1mm 24-pin QFN

package. Its high switching frequency allows for the

use of very small MLCC input and output filter

capacitors and results in a total solution size as

small as 50mm2.

The EN5329QI is a member of a family of pin

compatible devices. This offers scalability for

applications where load currents may not be known

apriori, and/or speeds time to market with a

convenient common solution footprint.

The EN5329QI buck converter uses Type III

voltage mode control to provide pin-point output

voltage accuracy, high noise immunity, low output

impedance and excellent load transient response.

The EN5329QI features include Power OK, under

voltage lockout (UVLO), over current protection,

short circuit protection, and thermal overload

protection.

Stability and Compensation

The EN5329QI utilizes an internal compensation

network that is designed to provide stable operation

over a wide range of operating conditions. The

output compensation circuit may be customized to

improve transient performance or reduce output

voltage ripple with dynamic loads.

Soft-Start

The EN5329QI has an internal soft-start circuit that

controls the ramp of the output voltage. The control

circuitry limits the VOUT ramp rate to levels that are

safe for the Power MOSFETs and the integrated

inductor.

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The EN5329QI has a constant startup up time

which is independent of the VOUT setting. The

output rising slew rate is proportional to the output

voltage. The startup time is approximately 1.4ms

from when the ENABLE is first pulled high until

VOUT reaches the regulated voltage level.

Excess bulk capacitance on the output of the

device can cause an over-current condition at

startup. Maximum allowable output capacitance

       

indicated in the Electrical Characteristics Table, the

output current at startup, the minimum soft-start

time also in the Electrical Characteristics Table and

the output voltage.

The total maximum capacitance on the output rail is

estimated by the equation below:

COUT_MAX = 0.7 * (ILIMIT - IOUT) * tSS / VOUT

COUT_MAX = maximum allowable output capacitance

ILIMIT = minimum current limit = 3.2A

IOUT = output current at startup

tSS = minimum soft-start time = 0.91ms

VOUT = output voltage

NOTE:Device stability still needs to be verified in

the application if extra bulk capacitors are added to

the output rail.

Over Current/Short Circuit Protection

When an over current condition occurs, VOUT is

pulled low and the device disables switching

internally. This condition is maintained for a period

of 1.2 ms and then a normal soft-start cycle is

initiated. If the over current condition still persists,

this cycle will repeat.

Under Voltage Lockout

An under voltage lockout circuit will hold off

switching during initial power up until the input

voltage reaches sufficient level to ensure proper

operation. If the voltage drops below the UVLO

threshold the lockout circuitry will again disable

switching. Hysteresis is included to prevent

chattering between UVLO high and low states.

Enable

The ENABLE pin provides means to shut down the

converter or initiate normal operation. A logic high

on the ENABLE pin will initiate the converter to start

the soft-start cycle and regulate the output voltage

to the desired value. A logic low will allow the

device to discharge the output and go into

shutdown mode for minimal power consumption.

When the output is discharged, an auxiliary NFET

turns on and limits the discharge current to 300 mA

or below. The ENABLE pin should not be left

floating as it could be in an unknown and random

state. It is recommended to enable the device after

both PVIN and AVIN is in regulation. At extremely

cold conditions below -30°C, the controller may not

be properly powered if ENABLE is tied directly to

AVIN during startup. It is recommended to use an

external RC circuit to delay the ENABLE voltage

rise so that the internal controller has time to

startup into regulation (see circuit below). The RC

circuit may be adjusted so that AVIN and PVIN are

above UVLO before ENABLE is high. The startup

time will be delayed by the extra time it takes for

the capacitor voltage to reach the ENABLE

threshold.

Figure 5: ENABLE Delay Circuit

Thermal Shutdown

When excessive power is dissipated in the device,

its junction temperature rises. Once the junction

temperature exceeds the thermal shutdown

temperature of 150°C, the thermal shutdown circuit

turns off the converter, allowing the device to cool.

When the junction temperature drops 15°C, the

device will be re-enabled and go through a normal

startup process.

Power OK

The Power OK (POK) feature is an open drain

output signal used to indicate if the output voltage

is within 92% of the set value. Within this range, the

POK output is allowed to be pulled high. Outside

this range, the POK output is maintained low.

During transitions such as power up and power

down, the POK output will not change state until the

transition is complete for enhanced noise immunity.

AVIN

ENABLE

1k

1µF

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The POK has 1mA sink capability. When POK is

pulled high, the worst case pin leakage current is

as low as 500nA over temperature. This allows a

large pull up resistor such as 100k to be used for

minimal current consumption in shutdown mode.

The POK output can also be conveniently used as

an enable input of the next stage for power

sequencing of multiple converters.

Power-Up/Down Sequencing

During power-up, ENABLE should not be asserted

before PVIN, and PVIN should not be asserted

before AVIN. The PVIN should never be powered

when AVIN is off. During power down, the AVIN

should not be powered down before the PVIN.

Tying PVIN and AVIN or all three pins (AVIN, PVIN,

ENABLE) together during power up or power down

meets these requirements.

Pre-Bias Start-up

The EN5339QI does not support startup into a pre-

biased condition. Be sure the output capacitors are

not charged or the output of the EN5339QI is not

pre-biased when the EN5339QI is first enabled.

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Application Information

Setting the Output Voltage

The EN5329 uses a simple and flexible resistor

divider network to program the output voltage. A

feed-forward capacitor (Ca) is used to ensure the

stability of the converter. Table 3 shows the

required critical component values as a function of

VOUT. It is recommended to use 1% or better

feedback resistors to ensure output voltage

accuracy. The Ra resistor value is fixed at 348k as

shown in Table 3. Based on that value, the bottom

resistor Rb can be calculated below as:

V0.6V V0.6Ra

Rb

OUT 





The VOUT is the nominal output voltage. The Rb

and Ra resistors have the same units based on the

above equation.

EN5329QI

VOUT

PVIN

AGND

VIN POK

TST0

TST1

TST2

ENABLE

AVIN PGND

CIN

22µF

COUT

2x 22µF

or

1x 47µF

100k

VOUT

PGND

Ra

Rb

VFB

POK

Ca

1µF

Figure 6. Typical Application Circuit.

(NOTE: Enable can be separated from PVIN if the

application requires it)

AVIN Filter Capacitor

A 1.0 F, 10V, 0402 MLCC capacitor should be

placed between AVIN and AGND as close to the

pins as possible. This will provide high frequency

bypass to ensure clean chip supply for optimal

performance.

Input Filter Capacitor Selection

A single 22F, 0805 MLCC capacitor is needed on

PVIN for all applications. Connect the input

capacitor between PVIN and PGND as close to the

pins as possible. Placement of the input capacitor

is critical to ensure low conducted and radiated

EMI.

Low ESR MLCC capacitors with X5R or X7R or

equivalent dielectric should be used for the input

capacitors. Y5V or equivalent dielectrics lose too

much capacitance with frequency, DC bias, and

temperature. Therefore, they are not suitable for

switch-mode DC-DC converter filtering, and must

be avoided.

Table 1: Recommended Input Capacitors

Description

MFG

P/N

22µF, 10V,

X5R, 0805

Taiyo Yuden

LMK212BBJ226MG-T

Murata

GRM21BR61A226ME51

Output Filter Capacitor Selection

The EN5329QI output capacitor selection may be

determined based on two configurations. Table 3

provides the allowed output capacitor

configurations based on operating conditions. For

lower output ripple, choose 2 x 22µF for the output

capacitors. For smaller solution size, use one 47µF

output capacitor. Table 2 shows the recommended

type and brand of output capacitors to use.

In some rare applications modifications to the

compensation may be required. The EN5329QI

provides the capability to modify the control loop

response to allow for customization for specific

applications.

Table 2: Recommended Output Capacitors

Description

MFG

P/N

47µF, 6.3V,

X5R, 0805

Taiyo Yuden

JMK212BBJ476MG-T

Murata

GRM21BR60J476ME15

22µF, 6.3V,

X5R, 805

Taiyo Yuden

JMK212ABJ226MG

Murata

GRM21BR60J226ME39

22µF, 6.3V,

X5R, 0603

Murata

GRM188R60J226MEA0

Table 3. Required Critical Components

(Note: Follow Layout Recommendations)

VOUT (V)

Ca (pF)

Ra (kΩ)

Cout (µF)

Vo

8.2

348

1x47uF/0805



6.8



8.2

348

2x22uF/0603



6.8



8.2

348

2x22uF/0805



6.8

Vout > 3.3V

6.8

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Thermal Considerations

Thermal considerations are important power supply

design facts that cannot be avoided in the real

world. Whenever there are power losses in a

system, the heat that is generated needs to be

Enpirion PowerSoCTM helps

alleviate some of those concerns.

 Enpirion EN5329QI DC-DC converter is

packaged in a 4x6x1.1mm 24-pin QFN package.

The QFN package is constructed with exposed

thermal pads on the bottom of the package. The

exposed thermal pad should be soldered directly on

to a copper ground pad on the printed circuit board

(PCB) to act as a heat sink. The recommended

maximum junction temperature for continuous

operation is 125°C. Continuous operation above

125°C may reduce long-term reliability. The device

has a thermal overload protection circuit designed

to turn off the device at an approximate junction

temperature value of 150°C.

The EN5329QI is guaranteed to support the full 2A

output current up to 85°C ambient temperature.

The following example and calculations illustrate

the thermal performance of the EN5329QI.

Example:

VIN = 5V

VOUT = 3.3V

IOUT = 2A

First calculate the output power.

POUT = 3.3V x 2A = 6.6W

Next, determine the input power based on the

efficiency 6.

Figure 7: Efficiency vs. Output Current

For VIN = 5V, VOUT = 3.3V at 292%

OUT / PIN = 92% = 0.92

PIN = POUT 

PIN  6.6W / 0.92 7.2W

The power dissipation (PD) is the power loss in the

system and can be calculated by subtracting the

output power from the input power.

PD = PIN  POUT

 7.2W  6.6W  0.6W

With the power dissipation known, the temperature

rise in the device may be estimated based on the

t   JA).  JA parameter estimates

how much the temperature will rise in the device for

every watt of power dissipation. The EN5329QI has

JA value of 36 ºC/W without airflow.

Determine the change in die  

based on PD JA.

D JA

0.6W x 36°C/W = 21.622°C

The junction temperature (TJ) of the device is

approximately the ambient temperature (TA) plus

the change in temperature. We assume the initial

ambient temperature to be 25°C.

TJ = TA 

TJ 22°47°C

The maximum operating junction temperature

(TJMAX) of the device is 125°C, so the device can

operate at a higher ambient temperature. The

maximum ambient temperature (TAMAX) allowed can

be calculated.

TAMAX = TJMAX  PD JA

 22°103°C

The ambient temperature can actually rise by

another 78°C, bringing it to 103°C before the

device will reach TJMAX. This indicates that the

EN5329QI can support the full 2A output current

range up to approximately 103°C ambient

temperature given the input and output voltage

conditions. Note that the efficiency will be slightly

lower at higher temperatures and these calculations

are estimates.

0

10

20

30

40

50

60

70

80

90

100

0 0.5 1 1.5 2

EFFICIENCY (%)

OUTPUT CURRENT (A)

VOUT = 3.3V

CONDITIONS

VIN = 5V

CONDITIONS

VIN = 5V

CONDITIONS

VIN = 5V

CONDITIONS

VIN = 5V

~92%

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Engineering Schematic

Figure 8. Engineering Schematic with Critical Components

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Layout Recommendations

Figure 9. Optimized Layout Recommendations

This layout only shows the critical components

and top layer traces for minimum footprint with

ENABLE as a separate signal. Alternate

ENABLE configurations & the POK pin need to

be connected and routed according to

customer application. Please see the Gerber

files on EN5329QI’s product page at

www.altera.com/enpirion for details on all

layers.

Recommendation 1: Input and output filter

capacitors should be placed on the same side of

the PCB, and as close to the EN5329QI package

as possible. They should be connected to the

device with very short and wide traces. Do not use

thermal reliefs or spokes when connecting the

capacitor pads to the respective nodes. The +V and

GND traces between the capacitors and the

EN5329QI should be as close to each other as

possible so that the gap between the two nodes is

minimized, even under the capacitors.

Recommendation 2: The system ground plane

should be the first layer immediately below the

surface layer. This ground plane should be

continuous and un-interrupted below the converter

and the input/output capacitors.

Recommendation 3: The thermal pad underneath

the component must be connected to the system

ground plane through as many vias as possible.

The drill diameter of the vias should be 0.33mm,

and the vias must have at least 1 oz. copper plating

on the inside wall, making the finished hole size

around 0.20-0.26mm. Do not use thermal reliefs or

spokes to connect the vias to the ground plane.

This connection provides the path for heat

dissipation from the converter.

Recommendation 4: Multiple small vias (the same

size as the thermal vias discussed in

recommendation 3) should be used to connect

ground terminal of the input capacitor and output

capacitors to the system ground plane. It is

preferred to put these vias along the edge of the

GND copper closest to the +V copper. These vias

connect the input/output filter capacitors to the

GND plane, and help reduce parasitic inductances

in the input and output current loops.

Recommendation 5: AVIN is the power supply for

the small-signal control circuits. It should be

connected to the input voltage at a quiet point. In

Figure 9 this connection is made at the input

capacitor. Place a 1µF capacitor from the AVIN pin

to AGND right next to device pins.

Recommendation 6: The layer 1 metal under the

device must not be more than shown in Figure 8.

See the section regarding exposed metal on bottom

of package. As with any switch-mode DC/DC

converter, try not to run sensitive signal or control

lines underneath the converter package on other

layers.

Recommendation 7: The VOUT sense point should

be just after the last output filter capacitor. Keep the

sense trace short in order to avoid noise coupling

into the node.

Recommendation 8: Keep RA, CA, RB close to the

VFB pin (See Figures 6). The VFB pin is a high-

impedance, sensitive node. Keep the trace to this

pin as short as possible. Whenever possible,

connect RB directly to the AGND pin instead of

going through the GND plane.

Recommendation 9: Altera provides schematic

and layout reviews for all customer designs. Please

contact local sales representatives for references to

Power Applications support

(www.altera.com/mysupport).

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Design Considerations for Lead-Frame Based Modules

Exposed Metal Pads on Package Bottom

QFN lead-frame based package technology utilizes exposed metal pads on the bottom of the package that

provide improved thermal dissipation, lower package thermal resistance, smaller package footprint and

thickness, larger lead size and pitch, and excellent lead co-planarity. As the EN5329 package is a fully

integrated module consisting of multiple internal devices, the lead-frame provides circuit interconnection and

mechanical support of these devices resulting in multiple exposed metal pads on the package bottom.

Only the two large thermal pads and the perimeter leads are to be mechanically/electrically connected to the

PCB through a SMT soldering process. All other exposed metal is to remain free of any interconnection to the

PCB. Figure 9 shows the recommended PCB metal layout for the EN5329 package. A GND pad with a solder

mask "bridge" to separate into two pads and 24 signal pads are to be used to match the metal on the package.

The PCB should be clear of any other metal, including traces, vias, etc., under the package to avoid electrical

shorting.

The Solder Stencil Aperture should be smaller than the PCB ground pad. This will prevent excess solder from

causing bridging between adjacent pins or other exposed metal under the package. Please consult EN5329QI

Soldering Guidelines for more details and recommendations.

Figure 10. Recommended Footprint for PCB (Top View)

Note: Grey area highlights exposed metal that is not to be mechanically or electrically connected to the PCB.

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Recommended PCB Footprint

Figure 11. EN5329 PCB Footprint (Top View)

The solder stencil aperture for the thermal pads (shown in blue) is based on Altera

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Package Mechanical

Figure 12. EN5329QI Package Dimensions (Bottom View)

Packing and Marking Information: www.altera.com/support/reliability/packing/rel-packing-and-marking.html

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Revision History

Rev

Date

Change(s)

A

March 2013

 Introductory production datasheet

B

Dec 2013

 Formatting changes

C

July 2015

 Updated pre-bias voltage to 1.5V

D

Oct 2015

 Updated current limit in Electrical Characteristics Table

 Updated soft-start calculation

 Modified ENABLE description

 Included minimum footprint design parameters

E

June 2016

 Modified front page to show applications schematic

 Formatting changes

Contact Information

Altera Corporation

101 Innovation Drive

San Jose, CA 95134

Phone: 408-544-7000

www.altera.com

QUARTUS and STRATIX words and logos are trademarks of Altera Corporation and registered in the U.S. Patent and Trademark Office and in other

countries. All other words and logos identified as trademarks or service marks are the property of their respective holders as described at

www.altera.com/common/legal.html. Altera warrants performance of its semiconductor products to current specifications in accordance with Altera's

standard warranty, but reserves the right to make changes to any products and services at any time without notice. Altera assumes no responsibility or

liability arising out of the application or use of any information, product, or service described herein except as expressly agreed to in writing by Altera.

Altera customers are advised to obtain the latest version of device specifications before relying on any published information and before placing orders

for products or services.

08326 June 3, 2016 Rev E