GE Data Sheet QHHD019A0B Hammerhead* Series; DC-DC Converter Power Modules 18Vdc -75Vdc input; 12Vdc output; 19A Output Current Features RoHS Compliant Applications Hybrid power architectures Wireless Networks Enterprise Networks including Power over Ethernet (PoE) Industrial Equipment Options 1/4th Brick heat plate with threaded inserts Compliant to RoHS II EU "Directive 2011/65/EU (-Z versions) Compliant to REACH Directive (EC) No 1907/2006 Small Size and low profile, follows industry standard DOSA 1/4th Brick footprint 58.4 mm x 36.8 mm x 10.2 mm (2.30 in x 1.45 in x 0.40 in) Ultra-wide Input Voltage Range, 18Vdc to 75Vdc No minimum load High efficiency - 93.5% at full load Constant switching frequency Low output ripple and noise Paste-in-hole reflow compliant for all versions, TH pins and heat plates Negative Remote On/Off logic Output overcurrent/voltage protection (hiccup) Over-temperature protection Output Voltage adjust: 90% to 110% of Vo,nom Suitable for cold wall cooling using heatplate version of the module ANSI/UL#60950-1-2011 and CAN/CSA C22.2 No. 60950-1-07, Second Edition + A1:2011 (MOD), dated March 19, 2011; and DIN EN 60950-1 (VDE 0805 Teil 1):2011-01; EN 60950-1:2006 + A11:2009 + A1:2010, DIN EN 60950-1/A12 (VDE 08051/A12):2011-08; EN 60950-1/A12:2011-02, IEC 609501(ed.2);am1:2009 CE mark meets 2006/95/EC directive Meets the voltage and current requirements for ETSI 300-132-2 and complies with and licensed for Basic insulation rating per EN60950-1 2250 Vdc Isolation tested in compliance with IEEE 802.3 PoE standards ISO**9001 and ISO 14001 certified manufacturing facilities Description The QHHD019A0B [HAMMERHEAD*] Series, quarter-brick, low-height power modules are isolated dc-dc converters which provide a single, precisely regulated output voltage over an ultra-wide input voltage range of 18-75Vdc. The QHHD019A0B provides 12Vdc nominal output voltage rated for 19Adc output current. The module incorporates GE's vast heritage for reliability and quality, while also using the latest in technology, and component and process standardization to achieve highly competitive cost. The open frame module construction, enable designers to develop cost and space efficient solutions. The module achieves typical full load efficiency greater than 93% at VIN=24Vdc and VIN=48Vdc. Standard features include remote On/Off, remote sense, output voltage adjustment, overvoltage, overcurrent and over temperature protection. An optional heat plate allows for external standard, quarter-brick heat sink attachment to achieve higher output current in high temperature applications. * Trademark of General Electric Company. # UL is a registered trademark of Underwriters Laboratories, Inc. CSA is a registered trademark of Canadian Standards Association. VDE is a trademark of Verband Deutscher Elektrotechniker e.V. This product is intended for integration into end-user equipment . All of the required procedures of end-use equipment should be followed. IEEE and 802 are registered trademarks of the Institute of Electrical and Electronics Engineers, Incorporated. ** ISO is a registered trademark of the International Organization of Standards November 20, 2019 (c)2016 General Electric Company. All rights reserved. Page 1 GE Data Sheet QHHD019A0B Series: DC-DC Converter Power Module 18 to 75Vdc Input; 12Vdc, 19A, 225W Output Revision History Last update: Updated Top View Dimension on Page 15 Absolute Maximum Ratings Stresses in excess of the absolute maximum ratings can cause permanent damage to the device. These are absolute stress ratings only, functional operation of the device is not implied at these or any other conditions in excess of those given in the operations sections of the technical requirement. Exposure to absolute maximum ratings for extended periods can adversely affect the device reliability. Parameter Input Voltage (Continuous) Transient (100ms) Device Symbol Min Max Unit All VIN -0.3 80 Vdc All VIN, trans -0.3 100 Vdc All TA -40 85 C Storage Temperature All Tstg -55 125 C Operating altitude (see section on thermal considerations) All I/O Isolation Voltage (100% factory Hi-Pot tested) All Operating Ambient Temperature (see Thermal Considerations section) 5000 m 2250 Vdc Electrical Specifications Unless otherwise indicated, specifications apply at VIN = 48Vdc, resistive load, and TA=25C conditions with airflow=300LFM apply over all operating input voltage, resistive load, and temperature conditions. Parameter Device Symbol Min Typ Max Unit All VIN 18 24/48 75 Vdc VIN = 24Vdc, (IO = 0, module enabled) All IIN,No load 180 mA VIN = 48Vdc, (IO = 0, module enabled) All IIN,No load 120 mA All IIN,stand-by 8 mA Operating Input Voltage Input No Load Current Input Stand-by Current (VIN = 24 to 48Vdc, module disabled) Maximum Input Current (VIN=18Vdc, IO=IO, max) Adc 12.0 VO 14 Inrush Transient All Input Reflected Ripple Current, peak-to-peak (5Hz to 20MHz, 12H source impedance; VIN=0V to 75Vdc, IO= IOmax ; see Test configuration section) All 30 mAp-p Input Ripple Rejection (120Hz) All 60 dB EMC, EN55022 I2t 0.1 A2s See EMC Considerations section CAUTION: This power module is not internally fused. An input line fuse must always be used. This power module can be used in a wide variety of applications, ranging from simple standalone operation to being part of complex power architecture. To preserve maximum flexibility, internal fusing is not included; however, to achieve maximum safety and system protection, always use an input line fuse. The safety agencies require a fast-acting fuse with a maximum rating of 25A (voltage rating 125Vac) in the ungrounded input lead. (Littelfuse Part #0456025, Surface Mount 456 Series - Nano2(R) or equivalent, see Safety Considerations section) November 20, 2019 (c)2016 General Electric Company. All rights reserved. Page 2 GE Data Sheet QHHD019A0B Series: DC-DC Converter Power Module 18 to 75Vdc Input; 12Vdc, 19A, 225W Output Electrical Specifications (continued) Parameter Output Voltage Set-point (VIN=24 to 48Vdc, IO=IO, max, TA=25C) Output Voltage (Over all operating input voltage, resistive load, and temperature conditions until end of life) Adjustment Range (*Vin>20V) Selected by external resistor Output Regulation Line (VIN=VIN, min to VIN, max) Load (IO=IO, min to IO, max) Temperature (Tref=TA, min to TA, max) Output Ripple and Noise on nominal output Measured with 10uF Tantalum||1uF ceramic (VIN=24 to 48Vdc, IO=80%IO, max, TA=25C) RMS (5Hz to 20MHz bandwidth) Peak-to-Peak (5Hz to 20MHz bandwidth) External Capacitance Device Symbol Min Typ Max Unit 12 VO VO, set 11.82 12.00 12.18 Vdc Vdc All VO -3.0 +3.0 % VO, set 12 Vo VO, adj -10 +10* % VO, set All All All 0.05 0.05 1.0 0.2 0.2 1.5 % VO, set % VO, set % VO, set 12 VO 75 160 mVrms mVpk-pk 12 VO CO, max 0 5000 F 12 VO Io 0 19.0 Adc 12 VO IO, lim 23 Adc All IO, s/c 12.0VO 93.5 % 12.0VO 93 % All fsw 250 kHz Peak Deviation All Vpk 3.0 % VO, set Settling Time (Vo<10% peak deviation) All ts 800 s Unit Output Current Output Current Limit Inception (Hiccup Mode) Output Short-Circuit Current VO 250 mV @ 25o C 1.2 Arms Efficiency VIN=24Vdc, TA=25C, IO=IO, max VIN=48Vdc, TA=25C, IO=IO, max Switching Frequency (Fixed) VIN=24 to 48Vdc and IO= IO, max Dynamic Load Response (IO/t=0.1A/s, VIN=24 to 48Vdc, TA=25C, CO =0uF) Load Change from IO= 50% to 75% or 25% to 50% of IO,max: Isolation Specifications Parameter Symbol Min Typ Max Isolation Capacitance Ciso 1000 pF Isolation Resistance Riso 10 M I/O Isolation Voltage All 2250 Vdc November 20, 2019 (c)2016 General Electric Company. All rights reserved. Page 3 GE Data Sheet QHHD019A0B Series: DC-DC Converter Power Module 18 to 75Vdc Input; 12Vdc, 19A, 225W Output General Specifications Parameter Min Calculated Reliability based upon Telcordia SR-332 Issue 2: Method I Case 3 (IO=80%IO, max, TA=40C, airflow = 200 lfm, 90% confidence) Typ FIT Max Unit 10 /Hours 128.7 MTBF 9 7,769,746 Hours Weight (open frame) 43.1 (1.52) g (oz.) Weight (Heat Plate) 58 (2.05) g (oz.) Feature Specifications Unless otherwise indicated, specifications apply over all operating input voltage, resistive load, and temperature conditions. See Feature Descriptions for additional information. Parameter Device Symbol Min Typ Max Unit Remote On/Off Signal Interface (VIN=VIN, min to VIN, max ; open collector or equivalent, Signal referenced to VIN- terminal) Negative Logic: device code suffix "1" Logic Low = module On, Logic High = module Off Logic Low = module Off, Logic High = module On Logic Low - Remote On/Off Current (Von/off = -0.7Vdc) All Ion/off 0.15 mA Logic Low - On/Off Voltage All Von/off -0.7 0.6 Vdc Logic High Voltage (Ion/off = 0Adc) All Von/off 2.5 6.7 Vdc Logic High maximum allowable leakage current All Ion/off 20 A 35 ms 35 ms 20 ms Turn-On Delay and Rise Times (IO=80% of IO, max, TA=25C) Case 1: Input power is applied for at least 1second, and then the On/Off input is set from OFF to ON (Tdelay = on/off pin transition until VO = 10% of VO, set) All Case 2: On/Off input is set to Module ON, and then input power is applied (Tdelay = VIN reaches VIN, min until VO = 10% of VO,set) All Output voltage Rise time (time for Vo to rise from 10% of Vo,set to 90% of Vo, set) All Tdelay Case1 Tdelay Case2 Trise Output Voltage Overshoot (IO=80% of IO, max, VIN= 24 to 48Vdc, TA=25C) Output Overvoltage Protection 12.0VO VO, limit 3 % VO, set Vdc 13.61 16.6 Input Undervoltage Lockout 1 Turn-on Threshold All Vuv/on 17.5 18 Vdc Turn-off Threshold All Vuv/off 15 15.5 Vdc Hysteresis All Vhyst 1.0 Vdc - OVP voltages lower than 13.6Vin for 18-20Vin November 20, 2019 (c)2016 General Electric Company. All rights reserved. Page 4 GE Data Sheet QHHD019A0B Series: DC-DC Converter Power Module 18 to 75Vdc Input; 12Vdc, 19A, 225W Output Characteristic Curves OUTPUT CURRENT Io(A) (5A/div) EFFICIENCY, (%) OUTPUT VOLTAGE VO (V) (200mV/div) The following figures provide typical characteristics for the QHHD019A0B (12V, 19A) at 25 OC. OUTPUT CURRENT, IO (A) TIME, t (200s/div) 18Vin 24Vin 48Vin On/Off VOLTAGE VOn/Off (V) (2V/div) OUTPUT VOLTAGE VO (V) (100mV/div) Figure 4. Transient Response to 0.1A/S Dynamic Load Change from 50% to 75% to 50% of full load, Vin=48V. OUTPUT VOLTAGE VO (V) (5V/div) Figure 1. Converter Efficiency versus Output Current. 75Vin TIME, t (10ms/div) TIME, t (2s/div) Figure 5. Typical Start-up Using Remote On/Off, negative logic version shown (VIN = 48V, Io = Io,max). InTPUT VOLTAGE VIN (V) (20V/div) OUTPUT CURRENT Io(A) (5A/div) OUTPUT VOLTAGE VO (V) (200mV/div) OUTPUT VOLTAGE VO (V) (5V/div) Figure 2. Typical output ripple and noise (Io = Io,max). TIME, t (200s/div) TIME, t (20ms/div) Figure 3. Transient Response to 0.1A/S Dynamic Load Change from 50% to 75% to 50% of full load, Vin=24V November 20, 2019 Figure 6. Typical Start-up Using Input Voltage (VIN = 48V, Io = Io,max). (c)2016 General Electric Company. All rights reserved. Page 5 GE Data Sheet QHHD019A0B Series: DC-DC Converter Power Module 18 to 75Vdc Input; 12Vdc, 19A, 225W Output Test Configurations Design Considerations Input Source Impedance The power module should be connected to a low ac-impedance source. Highly inductive source impedance can affect the stability of the power module. For the test configuration in Figure 7, a 220F electrolytic capacitor Cin (ESR<0.7 at 100kHz), mounted close to the power module helps ensure the stability of the unit. Consult the factory for further application guidelines. Cin Safety Considerations Figure 7. Input Reflected Ripple Current Test Setup. COPPER STR IP V O (+) RESISTIVE LOAD SCOPE For safety-agency approval of the system in which the power module is used, the power module must be installed in compliance with the spacing and separation requirements of the end-use safety agency standard, i.e., UL 60950-1-3, CSA C22.2 No. 60950-00, and VDE 0805 (IEC60950, 3rd Edition). If the input source is non-SELV (ELV or a hazardous voltage greater than 60 Vdc and less than or equal to 75Vdc), for the module's output to be considered as meeting the requirements for safety extra-low voltage (SELV), all of the following must be true: The input source is to be provided with reinforced insulation from any other hazardous voltages, including the ac mains. One VIN pin and one VOUT pin are to be grounded, or both the input and output pins are to be kept floating. The input pins of the module are not operator accessible. Another SELV reliability test is conducted on the whole system (combination of supply source and subject module), as required by the safety agencies, to verify that under a single fault, hazardous voltages do not appear at the module's output. V O (- ) 1uF 10uF GROUND PLANE NOTE: All voltage measurements to be taken at the module terminals, as shown above. If sockets are used then Kelvin connections are required at the module terminals to avoid measurement errors due to socket contact resistance. Figure 8. Output Ripple and Noise Test Setup. Rdistribution Rcontact Rcontact Vin+ RLOAD VO VIN Rdistribution Rcontact Rcontact Vin- Rdistribution Vout+ Rdistribution Vout- NOTE: All voltage measurements to be taken at the module terminals, as shown above. If sockets are used then Kelvin connections are required at the module terminals to avoid measurement errors due to socket contact resistance. Figure 9. Output Voltage and Efficiency Test Setup. VO. IO Efficiency = November 20, 2019 VIN. IIN x 100 % Note: Do not ground either of the input pins of the module without grounding one of the output pins. This may allow a non-SELV voltage to appear between the output pins and ground. The power module has extra-low voltage (ELV) outputs when all inputs are ELV. For input voltages exceeding -60 Vdc but less than or equal to -75 Vdc, these converters have been evaluated to the applicable requirements of BASIC INSULATION between secondary DC MAINS DISTRIBUTION input (classified as TNV-2 in Europe) and unearthed SELV outputs. The input to these units is to be provided with a fast-acting fuse with a maximum rating of 25A (voltage rating 125Vac) in the ungrounded input lead. (Littelfuse Part #0456025, Surface Mount 456 Series Nano2(R) or equivalent). (c)2016 General Electric Company. All rights reserved. Page 6 GE Data Sheet QHHD019A0B Series: DC-DC Converter Power Module 18 to 75Vdc Input; 12Vdc, 19A, 225W Output Feature Description Remote On/Off Negative logic remote on/off, device code suffix "1", turns the module off during a logic high and on during a logic low. Vin+ Vout+ The amount of power delivered by the module is defined as the voltage at the output terminals multiplied by the output current. When using remote sense and trim, the output voltage of the module can be increased, which at the same output current would increase the power output of the module. Care should be taken to ensure that the maximum output power of the module remains at or below the maximum rated power (Maximum rated power = Vo,set x Io,max). SENSE(+) Ion/off SENSE( -) ON/OFF TRIM SUPPLY Von/off V I(+) VO(+) V I(-) V O(-) II CONTAC T RESISTANCE Vin- IO LOAD CONTACT AND DISTRIBUTION LOSSES Vout- Figure 11. Circuit Configuration for remote sense. Figure 10. Circuit configuration for using Remote On/Off Implementation. To turn the power module on and off, the user must supply a switch (open collector or equivalent) to control the voltage (Von/off) between the ON/OFF terminal and the VIN(-) terminal. Logic low is 0V Von/off 0.6V. The maximum Ion/off during a logic low is 0.15mA, the switch should be maintain a logic low level whilst sinking this current. During a logic high, the typical Von/off generated by the module is 5V, and the maximum allowable leakage current at Von/off = 5V is 1A. If not using the remote on/off feature: For negative logic, short the ON/OFF pin to VIN(-). Remote Sense Remote sense minimizes the effects of distribution losses by regulating the voltage at the remote-sense connections (See Figure 11). The voltage between the remote-sense pins and the output terminals must not exceed the output voltage sense range given in the Feature Specifications table: [VO(+) - VO(-)] - [SENSE(+) - SENSE(-)] 0.5 V Although the output voltage can be increased by both the remote sense and by the trim, the maximum increase for the output voltage is not the sum of both. The maximum increase is the larger of either the remote sense or the trim. Overcurrent Protection To provide protection in a fault (output overload) condition, the unit is equipped with internal current-limiting circuitry and can endure current limiting continuously. At the point of current-limit inception, the unit enters hiccup mode. If the unit is not configured with auto-restart, then it will latch off following the over current condition. The module can be restarted by cycling the dc input power for at least one second or by toggling the remote on/off signal for at least one second. If the unit is configured with the auto-restart option (4), it will remain in the hiccup mode as long as the overcurrent condition exists; it operates normally, once the output current is brought back into its specified range. The average output current during hiccup is 10% IO, max. Overtemperature Protection To provide protection under certain fault conditions, the unit is equipped with a thermal shutdown circuit. The unit will shutdown if the thermal reference point Tref (Figure 13), exceeds 135oC (typical), but the thermal shutdown is not intended as a guarantee that the unit will survive temperatures beyond its rating. The module will automatically restart upon cool-down to a safe temperature. Input Undervoltage Lockout At input voltages below the input undervoltage lockout limit, the module operation is disabled. The module will only begin to operate once the input voltage is raised above the undervoltage lockout turn-on threshold, VUV/ON. Once operating, the module will continue to operate until the input voltage is taken below the undervoltage turn-off threshold, VUV/OFF. Output Over Voltage Protection The output over voltage protection scheme of the modules has an independent over voltage loop to prevent single point of failure. This protection feature latches in the event of over voltage across the output. Cycling the on/off pin or input voltage resets the latching protection feature. If the auto- November 20, 2019 (c)2016 General Electric Company. All rights reserved. Page 7 GE Data Sheet QHHD019A0B Series: DC-DC Converter Power Module 18 to 75Vdc Input; 12Vdc, 19A, 225W Output restart option (4) is ordered, the module will automatically restart upon an internally programmed time elapsing. Output Voltage Programming Trimming allows the output voltage set point to be increased or decreased from the default value; this is accomplished by connecting an external resistor between the TRIM pin and either the VO(+) pin or the VO(-) pin. VIN(+) VO(+) Rtrim-up ON/OFF LOAD VOTRIM Rtrim-down VIN(-) VO(-) Figure 12. Circuit Configuration to Trim Output Voltage. Connecting an external resistor (Rtrim-down) between the TRIM pin and the VO(-) (or Sense(-)) pin decreases the output voltage set point. To maintain set point accuracy, the trim resistor tolerance should be 1.0%. Thermal Considerations The power modules operate in a variety of thermal environments; however, sufficient cooling should be provided to help ensure reliable operation. Considerations include ambient temperature, airflow, module power dissipation, and the need for increased reliability. A reduction in the operating temperature of the module will result in an increase in reliability. The thermal data presented here is based on physical measurements taken in a wind tunnel, using automated thermo-couple instrumentation to monitor key component temperatures: FETs, diodes, control ICs, magnetic cores, ceramic capacitors, opto-isolators, and module pwb conductors, while controlling the ambient airflow rate and temperature. For a given airflow and ambient temperature, the module output power is increased, until one (or more) of the components reaches its maximum derated operating temperature, as defined in IPC-9592. This procedure is then repeated for a different airflow or ambient temperature until a family of module output derating curves is obtained. The following equation determines the required external resistor value to obtain a percentage output voltage change of % 511 10 .22 Rtrim down % Where % 12 . 0V V desired 100 12 . 0V Connecting an external resistor (Rtrim-up) between the TRIM pin and the VO(+) (or Sense (+)) pin increases the output voltage set point. The following equation determines the required external resistor value to obtain a percentage output voltage change of %: 5.11 12.0 (100 %) 511 R trim up 10.22 1 . 225 % % Where % V desired 12 . 0 100 12 . 0 The voltage between the VO(+) and VO(-) terminals must not exceed the minimum output overvoltage protection value shown in the Feature Specifications table. This limit includes any increase in voltage due to remote-sense compensation and output voltage set-point adjustment trim. Although the output voltage can be increased by both the remote sense and by the trim, the maximum increase for the output voltage is not the sum of both. The maximum increase is the larger of either the remote sense or the trim. The amount of power delivered by the module is defined as the voltage at the output terminals multiplied by the output current. When using remote sense and trim, the output voltage of the module can be increased, which at the same output current would increase the power output of the module. Care should be taken to ensure that the maximum output power of the module remains at or below the maximum rated power (Maximum rated power = VO,set x IO,max). November 20, 2019 The thermal reference points, Tref1, and Tref2 used in the specifications for open frame modules are shown in Figure 13. For reliable operation these temperatures should not exceed 124 OC & 124 OC respectively. For altitude adjustment the following equations should be applied: Talt = Tsea + T where: Tsea is the comp. / Tref temperature at sea level measurement Tamb is the temperature at the operating altitude sea is the density of air at sea level, alt is the density of air at the chosen altitude (c)2016 General Electric Company. All rights reserved. Page 8 GE Data Sheet QHHD019A0B Series: DC-DC Converter Power Module 18 to 75Vdc Input; 12Vdc, 19A, 225W Output Air Figure 13. Tref Temperature Measurement Location for open frame version. The thermal reference point, Tref used in the specifications is shown in Figure 14. For reliable operation these temperatures should not exceed 105 OC Figure 15. Tref Temperature Measurement Location for coldwall applications version. Heat Transfer via Convection Increased airflow over the module enhances the heat transfer via convection. Derating figures showing the maximum output current that can be delivered by each module versus local ambient temperature (TA) for natural convection and up to 3m/s (600 ft./min) are shown in in Figures 16 - 22. Please refer to the Application Note "Thermal Characterization Process For Open-Frame Board-Mounted Power Modules" for a detailed discussion of thermal aspects including maximum device temperatures. Figure 14. Tref Temperature Measurement Location for heat plate version. The thermal reference points, Tref1, and Tref2 used in the specifications is shown in Figure 15. For reliable operation these temperatures should not exceed 100 OC & 125 OC respectively. OUTPUT CURRENT, IO (A) 19 16 13 NC 0.5m/s (100LFM) 10 1m/s (200LFM) 7 3m/s (600LFM) 2m/s (400LFM) 4 1 30 35 40 45 50 55 60 65 70 75 80 85 90 AMBIENT TEMEPERATURE, TA (oC) Figure 16. Output Current Derating for the Open Frame Module; Airflow in the Transverse Direction from Vout(+) to Vout(-); VIN =48V, VO=12V. OUTPUT CURRENT, IO (A) 19 16 13 10 7 NC 0.5m/s (100LFM) 1m/s (200LFM) 2m/s (400LFM) 4 3m/s (600LFM) 1 25 30 35 40 45 50 55 60 65 70 75 80 85 90 AMBIENT TEMEPERATURE, TA (oC) November 20, 2019 (c)2016 General Electric Company. All rights reserved. Page 9 GE Data Sheet QHHD019A0B Series: DC-DC Converter Power Module 18 to 75Vdc Input; 12Vdc, 19A, 225W Output Figure 17. Output Current Derating for the Module with Heatplate; Airflow in the Transverse Direction from Vout(+) to Vout(-);VIN =48V, VO=12V 20 18 16 16 NC 13 10 OUTPUT CURRENT, Io(A) OUTPUT CURRENT, IO (A) 19 0.5m/s (100LFM) 1m/s (200LFM) 3m/s (600LFM) 7 2m/s (400LFM) 4 8 6 4 2 40 50 60 70 80 90 100 COLDPLATE TEMPERATURE, Tc(oC) AMBIENT TEMEPERATURE, T ( C) A o Figure 18. Output Current Derating for the Open Frame Module; Airflow in the Transverse Direction from Vout(+) to Vout(-); VIN =24V, VO=12V. 19 OUTPUT CURRENT, IO (A) 10 30 25 30 35 40 45 50 55 60 65 70 75 80 85 90 13 12 0 1 16 14 NC 0.5m/s (100LFM) 10 1m/s (200LFM) 7 2m/s (400LFM) 4 3m/s (600LFM) 1 25 30 35 40 45 50 55 60 65 70 75 80 85 90 AMBIENT TEMEPERATURE, TA (oC) Figure 19. Output Current Derating for the Module with Heatplate; Airflow in the Transverse Direction from Vout(+) to Vout(-);VIN =24V, VO=12V. Heat Transfer via Conduction The module can also be used in a sealed environment with cooling via conduction from the module's top surface through a heat plate to a cold wall, as shown in Figure 20. The output current derating versus cold wall temperature, when using thermal pad/grease is shown in Figure 21. Figure 20. Cold Wall Mounting November 20, 2019 Figure 21. Derated Output Current versus Cold Wall Temperature with local ambient temperature around module at 75C; VIN =24V or 48V. Through-Hole Soldering Information Lead-Free Soldering The RoHS-compliant (Z codes) through-hole products use the SAC (Sn/Ag/Cu) Pb-free solder and RoHS-compliant components. They are designed to be processed through single or dual wave soldering machines or reflow soldering processes. The pins have an RoHS-compliant finish that is compatible with both Pb and Pb-free wave soldering processes. A maximum preheat rate of 3C/s is suggested. The wave preheat process should be such that the temperature of the power module board is kept below 210C. For Pb solder, the recommended pot temperature is 260C, while the Pb-free solder pot is 270C max. If additional information is needed, please consult with your GE Energy representative for more details. Paste-in-Hole Soldering The QHHD019A0Bxx and the QHHD019A0B xx-HZ module is compatible with reflow paste-in-hole soldering processes shown in Figures 22-23. Please contact your GE Sales Representative for further information. MSL Rating The QHHD_225W series modules have a MSL rating of 2a. Tin Lead Soldering The QHHD019A0B power modules are lead free modules and can be soldered either in a lead-free solder process or in a conventional Tin/Lead (Sn/Pb) process. It is recommended that the customer review data sheets in order to customize the solder reflow profile for each application board assembly. The following instructions must be observed when soldering these units. Failure to observe these instructions may result in the failure of or cause damage to the modules, and can adversely affect long-term reliability. In a conventional Tin/Lead (Sn/Pb) solder process peak reflow temperatures are limited to less than 235C. Typically, the eutectic solder melts at 183C, wets the land, and subsequently wicks the device connection. Sufficient time must be allowed to fuse the plating on the connection to ensure a reliable solder joint. For reliable soldering the solder reflow profile should be (c)2016 General Electric Company. All rights reserved. Page 10 GE Data Sheet QHHD019A0B Series: DC-DC Converter Power Module 18 to 75Vdc Input; 12Vdc, 19A, 225W Output established by accurately measuring the modules CP connector temperatures. For additional layout guide-lines, refer to the FLT012A0 data sheet. Lead Free Soldering The -Z version of the QHHD019A0B modules are lead-free (Pb-free) and RoHS compliant and are both forward and backward compatible in a Pb-free and a SnPb soldering process. Failure to observe the instructions below may result in the failure of or cause damage to the modules and can adversely affect long-term reliability. 300 P eak Temp 235oC REFLOW TEMP (C) 250 Co o ling zo ne 1-4oCs -1 Heat zo ne max 4oCs -1 200 150 So ak zo ne 30-240s 100 50 Tlim above 205oC P reheat zo ne max 4oCs -1 0 REFLOW TIME (S) Figure 22. Reflow Profile for Tin/Lead (Sn/Pb) process. 240 MAX TEMP SOLDER (C) 235 230 225 220 215 210 205 200 0 10 20 30 40 50 60 Figure 23. Time Limit Curve Above 205oC for Tin/Lead (Sn/Pb) process Post Solder Cleaning and Drying Considerations Post solder cleaning is usually the final circuit-board assembly process prior to electrical board testing. The result of inadequate cleaning and drying can affect both the reliability of a power module and the testability of the finished circuit-board assembly. For guidance on appropriate soldering, cleaning and drying procedures, refer to GE Board Mounted Power Modules: Soldering and Cleaning Application Note (AN04-001). Layout Considerations The QHHD_225W power module series are low profile in order to be used in fine pitch system card architectures. As such, component clearance between the bottom of the power module and the mounting board is limited. Avoid placing copper areas on the outer layer directly underneath the power module. Also avoid placing via interconnects underneath the power module. November 20, 2019 (c)2016 General Electric Company. All rights reserved. Page 11 GE Data Sheet QHHD019A0B Series: DC-DC Converter Power Module 18 to 75Vdc Input; 12Vdc, 19A, 225W Output EMC Requirements Figure 24 shows a maximum filter configuration to meet the conducted emission limits of EN55022 Class A. Notes: C1 is a low impedance 100V SMT ceramics. C4 and C5 are low impedance >1500V ceramics. Figure 24. Suggested Configuration for EN55022 Class A. For further information on designing for EMC compliance, please refer to the FLT012A0Z data sheet VIN = 48V, Io = Io,max, L Line November 20, 2019 VIN = 48V, Io = Io,max, N Line (c)2016 General Electric Company. All rights reserved. Page 12 GE Data Sheet QHHD019A0B Series: DC-DC Converter Power Module 18 to 75Vdc Input; 12Vdc, 19A, 225W Output EMC Requirements Figure 25 shows a maximum filter configuration to meet the conducted emission limits of EN55022 Class B. Notes: C1, C2, C3, C4 are low impedance 100V SMT ceramics. C5 and C6 are low impedance >1500V ceramics. Figure 25. Suggested Configuration for EN55022 Class B. VIN = 48V, Io = Io,max, L Line November 20, 2019 VIN = 48V, Io = Io,max, N Line (c)2016 General Electric Company. All rights reserved. Page 13 GE Data Sheet QHHD019A0B Series: DC-DC Converter Power Module 18 to 75Vdc Input; 12Vdc, 19A, 225W Output Mechanical Outline for Through-Hole Module (Open Frame) Dimensions are in millimeters and [inches]. Tolerances: x.x mm 0.5 mm [x.xx in. 0.02 in.] (Unless otherwise indicated) x.xx mm 0.25 mm [x.xxx in 0.010 in.] November 20, 2019 (c)2016 General Electric Company. All rights reserved. Page 14 GE Data Sheet QHHD019A0B Series: DC-DC Converter Power Module 18 to 75Vdc Input; 12Vdc, 19A, 225W Output Mechanical Outline for Through Hole Module with heat plate (-H, Option) Dimensions are in millimeters and (inches). Tolerances: x.x mm 0.5 mm (x.xx in. 0.02 in.) [Unless otherwise indicated] x.xx mm 0.25 mm (x.xxx in 0.010 in.) November 20, 2019 (c)2016 General Electric Company. All rights reserved. Page 15 GE Data Sheet QHHD019A0B Series: DC-DC Converter Power Module 18 to 75Vdc Input; 12Vdc, 19A, 225W Output Recommended Pad Layout for Through Hole Module Dimensions are in millimeters and (inches). Tolerances: x.x mm 0.5 mm (x.xx in. 0.02 in.) [Unless otherwise indicated] x.xx mm 0.25 mm (x.xxx in 0.010 in.) Hole and Pad diameter recommendations Pin Number Hole Dia (mm) Pad Dia (mm) 1-3, 5-7 1.6 2.1 4, 8 2.2 3.2 November 20, 2019 (c)2016 General Electric Company. All rights reserved. Page 16 GE Data Sheet QHHD019A0B Series: DC-DC Converter Power Module 18 to 75Vdc Input; 12Vdc, 19A, 225W Output Packaging Details Min order quantity The open frame versions of the QHHD019A0B are supplied as standard in the plastic trays shown in Figure 26. Each tray contains a total of 12 power modules. The trays are self-stacking and each shipping box the QHHD019A0B through hole module will contain 2 full trays plus one empty hold down tray giving a total number of 24 power Tray Specification Material Max surface resistivity Color Capacity PET (1mm) 109-1011/sq Clear 12 power modules 24 pcs (1 box of 2 full trays + 1 empty top tray) Figure 26. Open Frame Through Hole Packaging Tray November 20, 2019 (c)2016 General Electric Company. All rights reserved. Page 17 GE Data Sheet QHHD019A0B Series: DC-DC Converter Power Module 18 to 75Vdc Input; 12Vdc, 19A, 225W Output Packaging Details The Heat Plate versions of the QHHD019A0B (suffix -H) are supplied as standard in the plastic trays shown in Figure 27. Tray Specification Material Each tray contains a total of 12 power modules. The trays are self-stacking and each shipping box the QHHD019A0B (suffix -H) through hole module will contain 2 full trays plus one empty hold down tray giving a total number of 24 power PET(1mm) Max surface resistivity 109-1011/sq Color Clear Capacity 12 power modules Min order quantity 24 pcs (1 box of 2 full trays + 1 empty top tray) Figure 27. Heat Plate version Packaging Tray November 20, 2019 (c)2016 General Electric Company. All rights reserved. Page 18 GE Data Sheet QHHD019A0B Series: DC-DC Converter Power Module 18 to 75Vdc Input; 12Vdc, 19A, 225W Output Ordering Information Please contact your GE Energy Sales Representative for pricing, availability and optional features. Table 1. Device Codes QHHD019A0B41Z 24V/48V (18-75Vdc) Output Current 19.0A QHHD019A0B41-HZ 24V/48V (18-75Vdc) 19.0A 12.0V Negative Through hole 150030812 QHHD019A0B641-HZ 24V/48V (18-75Vdc) 19.0A 12.0V Negative Through hole 150037357 Product codes Input Voltage Output Voltage 12.0V Remote On/Off Logic Negative Connector Type Through hole 150029667 Comcodes Ratings Table 2. Device Options Characteristic Form Factor Family Designator Input Voltage Output Current Output Voltage Pin Length Action following Protective Shutdown Options On/Off Logic Customer Specific Mechanical Features RoHS Character and Position Q HH D 019A0 B Definition Q = 1 /4th Brick HH = HammerheadTM Series D = UltraWide Range, 18V-75V 019A0 = 019.0 Amps Maximum Output Current B =12V Nominal Omit = Default Pin Length shown in Mechanical Outline Figures 6 = Pin Length: 3.68 mm 0.25mm , (0.145 in. 0.010 in.) 8 = Pin Length: 2.79 mm 0.25mm , (0.110 in. 0.010 in.) 6 8 4 = Auto-restart following shutdown (Overcurrent/Overvoltage) Must be ordered 4 Omit = Positive Logic 1 = Negative Logic 1 XY XY = Customer Specific Modified Code, Omit for Standard Code Omit = Standard open Frame Module H = 1/4th Brick size heat plate, for use with heat sinks (not available H with -S option) 18H 18H = 1/4th Brick size heat plate with unthreaded inserts for use in coldwall applications (not available with -S option) S S = Surface Mount connections Omit = RoHS 5/6, Lead Based Solder Used Z Z = RoHS 6/6 Compliant, Lead free Contact Us For more information, call us at USA/Canada: +1 877 546 3243, or +1 972 244 9288 Asia-Pacific: +86.021.54279977*808 Europe, Middle-East and Africa: +49.89.878067-280 www.gecriticalpower.com GE Critical Power reserves the right to make changes to the product(s) or information contained herein without notice, and no liability is assumed as a result of their use or application. No rights under any patent accompany the sale of any such product(s) or information. November 20, 2019 (c)2016 General Electric Company. All International rights reserved. Version 1.5