31412 SY 201 20127-S00001 No.A2034-1/5
Semiconductor Components Industries, LLC, 2013
February, 2018 – Rev. 1
LA6583MC
Overview
The LA6583MC is a low-saturation BTL output linear driving motor driver for single-phase bipolar fan motors. It
features quite, low power, high efficiency drive that suppresses reactive current. It is optimal for use in applications
that require miniaturization and low noise, such as CPU cooling fan motors and 5 to 12V electronic game products.
Features
• Single-phase full-wa ve linear drive with BTL output (gain resistance 1K-360K)
: Most appropriate for consumer appliances power supply and car audio system, namely equipment that requires
silence because this has no switching noise.
• Low-voltage operation possible, with wide operable voltage range (2.8 to 13.8V)
• Low saturation output (Upper + lower saturatio n voltage: VO sat (total) = 1.1Vtyp, IO = 200mA)
: High coil efficiency with low c urrent drain. IC itself does not generate mu c h heat.
• Lock protectio n and auto return circuits built-in
• Lock protection signal output (L during rotation, H at stop; open collector output)
• FG output (rotation speed detection output: open collector output)
• Hall bias built-i n (VHB = 1.3V)
• Heat protection circuit (Design guarantee)
: When the la rge current flows because of outp ut short-circuit, raising the IC chip temperature above 180°C, the
heat prot ectio n circui t suppresses t he dri ve curr ent, preve nting IC burn and brea kdown.
• Compact and high heat capacity package
Ordering number : ENA2034
Monolithic Linear IC
Fan Motor Driver
BTL Driver Single
-Phase Full-Wave
http://onsemi.com
LA6583MC
No.A2034-2/5
Specifications
Maximum Ratings at Ta = 25°C
Parameter Symbol Conditions Ratings Unit
Supply volt ag e V
CC
max 15 V
Output cur re nt I
OUT
max 0.8 A
Output withstand voltage V
OUT
max 15 V
RD/FG output wit hs t an d VRD/FG max 15 V
RD/FG output current IRD/FG max 5 mA
HB output current IB max 10 mA
Allowable dissipation Pd max Mounted on a specified board *1 800 mW
Operating temperature Topr *2 -30 to +100 °C
Storage temperature
Tstg
-55 to +150
°
C
*1: Mounted on a specified board: 114.3mm × 76.1mm × 1.6mm glass epoxy
*2: Tj = 150°C Use this IC within a range where the chip temperature does not exceed Tj = 150C during operation.
Caution 1) Absolute maximum ratings represent the value which cannot be exceeded for any length of time.
Caution 2) Even when the device is used within the range of absolute maximum ratings, as a result of continuous usage under high temperature, high
current, high voltage, or drastic temperature change, the reliability of the IC may be degraded. Please contact us for the further details.
Recommended Operating Conditions at Ta = 25°C
Parameter Symbol Conditions Ratings Unit
Supply voltage V
CC
2.8 to 14.0 V
Common-phase input voltage range of Hall input
VICM
0 to VCC-1.5
V
Electrical Characteristics at T a = 25°C, VCC = 12.0V, unless especially specified.
Parameter Symbol Conditions Ratings Unit
min typ max
Circuit Current I
CC
1 During drive (CT=L) 4 6 9 mA
I
CC
2 At lock protection (CT=H) 2 4 6 mA
Lock detection capacitor charge current ICT1 2.0 2.8 3.5 µA
Capacitor discharge current
ICT2
0.15
0.23
0.30
µ
A
Capacitor charge/discharge current ratio RCT RCT=ICT1/ICT2 9 12 15 -
CT charge voltage VCT1 1.6 1.7 1.8 V
CT discharge voltage VCT2 0.6 0.7 0.8 V
OUT output L saturation voltage V
OL
I
O
=200mA 0.2 0.3 V
OUT output H saturation voltage V
OH
I
O
=200mA 0.9 1.2 V
Hall input sensitivity VHN Zero peak value
(Including offset and hysteresis)
7 15 mV
RD/FG output pin L voltage
VRD/FG
IRD/FG=5mA
0.1
0.2
V
RD/FG output pin leak current IRD/FGL VRD/FG=15V 1 30 µA
HB output voltage VHB IHB=5mA 1.3 1.5 1.7 V
Thermal protection circuit TSD Design target value *3 150 180 210 °C
*3: Thi s is a des ign gua rantee value and no mea surement with an independent unit is made.
Thermal prote c tion circuit is b uilt in this IC for the pr e ven tion of burnout of IC a nd thermal destr uctio n.
But, since the operation is outside the guarantee temperature range, thermal design must be made so that the thermal
protection circuit is not activat e d during normal fan op e ration.
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating
Conditions is not implied. Extended exposure to stresses above the Recommended Operating C onditions may affect device reliability.
LA6583MC
No.A2034-3/5
Package Dimensions
unit : mm (typ)
3420
Truth Table
IN- IN+ CT OUT1 OUT2 FG RD Mode
H
L
L
H
L
L
L During rotation
L H L H H
- - H OFF OFF - H Lock protection
Pin Assignment
SANYO : MFP10SK(225mil)
1
10
2
0.8 MAX
1.55
1.0 0.35
5.0
0.15
6.2
(1.5)
0.05 4.4
0.5
LA6583MC
No.A2034-4/5
Sample Application Circuit
*1: When Di to prevent breakdown in case of reverse connection is used, it is necessary to insert a capacitor Cr to
secure the regenerative current route. Similarly, Cr is necessary to enhance the reliability when there is no capacitor
near the fan power line.
*2: When the Hall bias is taken from the HB pin, const ant-voltage bias is made with about 1.3V.
Therefore, the Hall output becomes the stable amplitude voltage satisfactory in temperature characteristics.
By inserting R2 to obtain the Hall bias from both VCC and HB, as shown in the figure, heat generat ion of IC can be
suppressed.
*3: In this IC, t he Hall output amplitude is amplified to produce the drive waveform.
Therefore, the switching time of the current application direction is determined by the Hall output, causing change
in the characteristics of motor . If the Hall element output amplitude is large, the start-up performance and efficiency
of the IC are improved. On the other hand, if the Hall element outpu t amplitude is smal l, low-noise drive is e nsured.
Adjust the Hall element output amplitude b y R1.
*4: Keep this open when this is not used.
*5: When the wiring from the Hall output to IC Hall input is long, noise may be carried thr ough the wiring.
In this case, insert the capacitor as shown in the figure.
LA6583MC
No.A2034-5/5
Internal Equivalent Circuit Diagram
ORDERING INFORMATION
Device Package Wire bond Shipping (Qty / Pack i ng)
LA6583MC-AH MFP10SK (225mil) Au-wire 90 / Fan-Fold
LA6583MC-W-AH MFP10SK (225mil)
Cu-wire 90 / Fan-Fold
PS
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