Ordering number : ENA2034 LA6583MC Monolithic Linear IC Fan Motor Driver BTL Driver Single-Phase Full-Wave http://onsemi.com Overview The LA6583MC is a low-saturation BTL output linear driving motor driver for single-phase bipolar fan motors. It features quite, low power, high efficiency drive that suppresses reactive current. It is optimal for use in applications that require miniaturization and low noise, such as CPU cooling fan motors and 5 to 12V electronic game products. Features * Single-phase full-wave linear drive with BTL output (gain resistance 1K-360K) : Most appropriate for consumer appliances power supply and car audio system, namely equipment that requires silence because this has no switching noise. * Low-voltage operation possible, with wide operable voltage range (2.8 to 13.8V) * Low saturation output (Upper + lower saturation voltage: VO sat (total) = 1.1Vtyp, IO = 200mA) : High coil efficiency with low current drain. IC itself does not generate much heat. * Lock protection and auto return circuits built-in * Lock protection signal output (L during rotation, H at stop; open collector output) * FG output (rotation speed detection output: open collector output) * Hall bias built-in (VHB = 1.3V) * Heat protection circuit (Design guarantee) : When the large current flows because of output short-circuit, raising the IC chip temperature above 180C, the heat protection circuit suppresses the drive current, preventing IC burn and breakdown. * Compact and high heat capacity package Semiconductor Components Industries, LLC, 2013 February, 2018 - Rev. 1 31412 SY 20120127-S00001 No.A2034-1/5 LA6583MC Specifications Maximum Ratings at Ta = 25C Parameter Supply voltage Symbol Conditions Ratings Unit VCC max 15 V Output current IOUT max 0.8 A Output withstand voltage VOUT max 15 V RD/FG output withstand VRD/FG max 15 V RD/FG output current mA IRD/FG max 5 HB output current IB max 10 mA Allowable dissipation Pd max 800 mW Operating temperature Topr Storage temperature Tstg Mounted on a specified board *1 *2 -30 to +100 C -55 to +150 C *1: Mounted on a specified board: 114.3mm x 76.1mm x 1.6mm glass epoxy *2: Tj = 150C Use this IC within a range where the chip temperature does not exceed Tj = 150C during ope ra tion. Caution 1) Absolute maximum ratings represent the value which cannot be exceeded for any length of time. Caution 2) Even when the device is used within the range of absolute maximum ratings, as a result of continuous usage under high temperature, high current, high voltage, or drastic temperature change, the reliability of the IC may be degraded. Please contact us for the further details. Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. Recommended Operating Conditions at Ta = 25C Parameter Symbol Conditions Ratings Unit Supply voltage VCC 2.8 to 14.0 V Common-phase input voltage range of Hall input VICM 0 to VCC-1.5 V Electrical Characteristics at Ta = 25C, VCC = 12.0V, unless especially specified. Ratings Parameter Symbol Conditions Unit min Circuit Current typ max ICC1 During drive (CT=L) 4 6 9 mA ICC2 At lock protection (CT=H) 2 4 6 mA Lock detection capacitor charge current ICT1 2.0 2.8 3.5 A Capacitor discharge current ICT2 0.15 0.23 0.30 A Capacitor charge/discharge current ratio RCT 9 12 15 - CT charge voltage VCT1 1.6 1.7 1.8 V CT discharge voltage VCT2 0.6 0.7 0.8 V OUT output L saturation voltage VOL IO=200mA 0.2 0.3 V OUT output H saturation voltage VOH IO=200mA Zero peak value 0.9 1.2 V 7 15 mV 0.1 0.2 V A Hall input sensitivity VHN RCT=ICT1/ICT2 (Including offset and hysteresis) RD/FG output pin L voltage VRD/FG IRD/FG=5mA RD/FG output pin leak current IRD/FGL VRD/FG=15V 1 30 HB output voltage VHB IHB=5mA 1.3 1.5 1.7 V Thermal protection circuit TSD Design target value *3 150 180 210 C *3: This is a design guarantee value and no measurement with an independent unit is made. Thermal protection circuit is built in this IC for the prevention of burnout of IC and thermal destruction. But, since the operation is outside the guarantee temperature range, thermal design must be made so that the thermal protection circuit is not activated during normal fan operation. No.A2034-2/5 LA6583MC Package Dimensions unit : mm (typ) 3420 5.0 0.5 4.4 6.2 10 1 2 1.0 0.15 0.35 0.05 (1.5) 1.55 0.8 MAX SANYO : MFP10SK(225mil) Truth Table IN- IN+ H L L H - - CT OUT1 OUT2 FG H L L L H H OFF OFF - L H RD Mode L During rotation H Lock protection Pin Assignment No.A2034-3/5 LA6583MC Sample Application Circuit *1: When Di to prevent breakdown in case of reverse connection is used, it is necessary to insert a capacitor Cr to secure the regenerative current route. Similarly, Cr is necessary to enhance the reliability when there is no capacitor near the fan power line. *2: When the Hall bias is taken from the HB pin, constant-voltage bias is made with about 1.3V. Therefore, the Hall output becomes the stable amplitude voltage satisfactory in temperature characteristics. By inserting R2 to obtain the Hall bias from both VCC and HB, as shown in the figure, heat generation of IC can be suppressed. *3: In this IC, the Hall output amplitude is amplified to produce the drive waveform. Therefore, the switching time of the current application direction is determined by the Hall output, causing change in the characteristics of motor. If the Hall element output amplitude is large, the start-up performance and efficiency of the IC are improved. On the other hand, if the Hall element output amplitude is small, low-noise drive is ensured. Adjust the Hall element output amplitude by R1. *4: Keep this open when this is not used. *5: When the wiring from the Hall output to IC Hall input is long, noise may be carried through the wiring. In this case, insert the capacitor as shown in the figure. No.A2034-4/5 LA6583MC Internal Equivalent Circuit Diagram ORDERING INFORMATION Package Wire bond Shipping (Qty / Packing) LA6583MC-AH MFP10SK (225mil) Au-wire 90 / Fan-Fold LA6583MC-W-AH MFP10SK (225mil) Cu-wire 90 / Fan-Fold Device ON Semiconductor and the ON logo are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of SCILLC's product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent-Marking.pdf. SCILLC reserves the right to make changes without further notice to any products herein. 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