BC817-16/-25/-40 45V NPN SMALL SIGNAL TRANSISTOR IN SOT23 Features Mechanical Data Ideally Suited for Automatic Insertion Epitaxial Planar Die Construction Complementary PNP Types Available (BC807) For switching and AF Amplifier Applications Totally Lead-Free & Fully RoHS Compliant (Notes 1 & 2) Halogen and Antimony Free. "Green" Device (Note 3) Qualified to AEC-Q101 Standards for High Reliability Automotive-Compliant Parts Are Available Under Separate Datasheet (BC817-16Q_40Q) Case: SOT23 Case Material: Molded Plastic, "Green" Molding Compound; UL Flammability Classification Rating 94V-0 Moisture Sensitivity: Level 1 per J-STD-020 Terminals: Finish - Matte Tin Plated Leads, Solderable per MIL-STD-202, Method 208 Weight 0.008 grams (Approximate) SOT23 Top View Top View Pin-Out Device Symbol Ordering Information (Note 4) Product BC817-16-7-F BC817-25-7-F BC817-40-7-F Notes: Compliance AEC-Q101 AEC-Q101 AEC-Q101 Marking K6A K6B K6C Reel Size (inches) 7 7 7 Tape Width (mm) 8 8 8 Quantity Per Reel 3,000 3,000 3,000 1. No purposely added lead. Fully EU Directive 2002/95/EC (RoHS) & 2011/65/EU (RoHS 2) compliant. 2. See http://www.diodes.com/quality/lead_free.html for more information about Diodes Incorporated's definitions of Halogen- and Antimony-free, "Green" and Lead-free. 3. Halogen- and Antimony-free "Green" products are defined as those which contain <900ppm bromine, <900ppm chlorine (<1500ppm total Br + Cl) and <1000ppm antimony compounds. 4. For packaging details, go to our website at http://www.diodes.com/products/packages.html. Marking Information SOT23 XXX = Product Type Marking Code (See Table Above) YM = Date Code Marking Y = Year (ex: C = 2015) M = Month (ex: 9 = September) Date Code Key Year Code Month Code 2015 C 2016 D 2017 E 2018 F 2019 G 2020 H 2021 I 2022 J 2023 K 2024 L 2025 M 2026 N Jan Feb Mar Apr May Jun Jul 1 2 3 4 5 6 7 Aug 8 Sep 9 Oct O Nov N Dec D BC817-16/ -25/ -40 Document number: DS11107 Rev. 21 - 2 1 of 7 www.diodes.com June 2016 (c) Diodes Incorporated BC817-16/-25/-40 Absolute Maximum Ratings (@TA = +25C, unless otherwise specified.) Characteristic Symbol VCBO VCEO VEBO IC ICM IBM Collector-Base Voltage Collector-Emitter Voltage Emitter-Base Voltage Collector Current Peak Collector Current Peak Base Current Value 50 45 5.0 0.5 1.0 200 Unit V V V A A mA Value 310 350 403 357 350 -65 to +150 Unit Thermal Characteristics (@TA = +25C, unless otherwise specified.) Characteristic Power Dissipation Thermal Resistance, Junction to Ambient Thermal Resistance, Junction to Leads Operating and Storage Temperature Range Symbol (Note 5) (Note 6) (Note 5) (Note 6) (Note 7) PD RJA RJL TJ, TSTG mW C/W C/W C ESD Ratings (Note 8) Characteristic Electrostatic Discharge - Human Body Model Symbol ESD HBM Value 8,000 Unit V Electrostatic Discharge - Machine Model ESD MM 400 V Notes: JEDEC Class 3B C 5. For a device mounted on minimum recommended pad layout FR-4 PCB with high coverage of single sided 1oz copper; device is measured under still air conditions whilst operating in a steady-state. 6. Same as Note 5, except mounted on 15mm x 15mm 1oz copper. 7. Thermal resistance from junction to solder-point (at the end of the collector lead). 8. Refer to JEDEC specification JESD22-A114 and JESD22-A115. BC817-16/ -25/ -40 Document number: DS11107 Rev. 21 - 2 2 of 7 www.diodes.com June 2016 (c) Diodes Incorporated BC817-16/-25/-40 0.4 400 350 o Thermal Resistance ( C/W) Max Power Dissipation (W) Thermal Characteristics and Derating Information 0.3 0.2 0.1 0.0 0 25 50 75 100 125 150 300 250 200 150 100 D=0.1 Single Pulse D=0.2 50 D=0.05 0 100 100 o Max Power Dissipation (W) D=0.5 1m 10m 100m 1 10 100 Temperature ( C) Pulse Width (s) Derating Curve Transient Thermal Impedance 1k 10 o Single Pulse. T amb=25 C 1 0.1 10m 100m 1 10 100 1k Pulse Width (s) Pulse Power Dissipation BC817-16/ -25/ -40 Document number: DS11107 Rev. 21 - 2 3 of 7 www.diodes.com June 2016 (c) Diodes Incorporated BC817-16/-25/-40 Electrical Characteristics (@TA = +25C, unless otherwise specified.) Symbol Min Typ Max Unit Collector-Base Breakdown Voltage Characteristic BVCBO 50 -- -- V IC = 100A Collector-Emitter Breakdown Voltage BVCEO 45 -- -- V IC = 10mA Emitter-Base Breakdown Voltage BVEBO 5 -- -- V IC = 100A -- -- 100 5.0 nA A VCE = 45V VCE = 25V, TJ = +150C -- -- 100 nA VEB = 5.0V Collector-Emitter Cut-Off Current ICES Emitter-Base Cut-Off Current DC Current Gain (Note 9) Collector-Emitter Saturation Voltage (Note 9) Base-Emitter Voltage (Note 9) Gain Bandwidth Product Collector-Base Capacitance Note: IEBO BC817-16 BC817-25 BC817-40 BC817-16 BC817-25 BC817-40 hFE 100 160 250 60 100 170 -- 250 400 600 Test Condition VCE = 1.0V, IC = 100mA -- -- VCE = 1.0V, IC = 300mA VCE(SAT) -- -- 0.7 V IC = 500mA, IB = 50mA VBE -- -- 1.2 V VCE = 1.0V, IC = 300mA fT 100 -- -- MHz VCE = 5.0V, IC = 10mA, f = 50MHz CCBO -- -- 12 pF VCB = 10V, f = 1.0MHz 9. Measured under pulsed conditions. Pulse width 300s. Duty cycle 2%. BC817-16/ -25/ -40 Document number: DS11107 Rev. 21 - 2 4 of 7 www.diodes.com June 2016 (c) Diodes Incorporated BC817-16/-25/-40 Typical Electrical Characteristics (@TA = +25C, unless otherwise specified.) 100 IC, COLLECTOR CURRENT (mA) IC, COLLECTOR CURRENT (mA) 500 400 300 200 100 0 1 2 VCE, COLLECTOR-EMITTER VOLTAGE (V) Figure 1 Typical Collector Current vs. Collector-Emitter Voltage 40 20 10 20 VCE, COLLECTOR-EMITTER VOLTAGE (V) Figure 2 Typical Collector Current vs. Collector-Emitter Voltage 0 0.5 VCE = 1V VCE(SAT), COLLECTOR-EMITTER SATURATION VOLTAGE (V) hFE, DC CURRENT GAIN 60 0 0 1,000 80 150C TA = 25C -50C 100 0.4 IC / IB = 10 0.3 0.2 25 C 0.1 150C 10 0 1 10 100 1,000 IC, COLLECTOR CURRENT (mA) Figure 3 Typical DC Current Gain vs. Collector Current 0.1 1,000 fT, GAIN-BANDWIDTH PRODUCT (MHz) -50C 0.1 100 1,000 1 10 IC, COLLECTOR CURRENT (mA) Figure 4 Typical Collector-Emitter Saturation Voltage vs. Collector Current 100 10 1 10 100 1,000 IC, COLLECTOR CURRENT (mA) Figure 5 Gain-Bandwidth Product vs. Collector Current BC817-16/ -25/ -40 Document number: DS11107 Rev. 21 - 2 5 of 7 www.diodes.com June 2016 (c) Diodes Incorporated BC817-16/-25/-40 Package Outline Dimensions Please see AP02001 at http://www.diodes.com/_files/datasheets/ap02001.pdf for the latest version. All 7 H K1 J K SOT23 Dim Min Max Typ A 0.37 0.51 0.40 B 1.20 1.40 1.30 C 2.30 2.50 2.40 D 0.89 1.03 0.915 F 0.45 0.60 0.535 G 1.78 2.05 1.83 H 2.80 3.00 2.90 J 0.013 0.10 0.05 K 0.890 1.00 0.975 K1 0.903 1.10 1.025 L 0.45 0.61 0.55 L1 0.25 0.55 0.40 M 0.085 0.150 0.110 a 0 8 -All Dimensions in mm GAUGE PLANE 0.25 a M A L C L1 B D G F Suggested Pad Layout Please see AP02001 at http://www.diodes.com/_files/datasheets/ap02001.pdf for the latest version. Y C Y1 X BC817-16/ -25/ -40 Document number: DS11107 Rev. 21 - 2 Dimensions C X X1 Y Y1 Value (in mm) 2.0 0.8 1.35 0.9 2.9 X1 6 of 7 www.diodes.com June 2016 (c) Diodes Incorporated BC817-16/-25/-40 IMPORTANT NOTICE DIODES INCORPORATED MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARDS TO THIS DOCUMENT, INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION). Diodes Incorporated and its subsidiaries reserve the right to make modifications, enhancements, improvements, corrections or other changes without further notice to this document and any product described herein. Diodes Incorporated does not assume any liability arising out of the application or use of this document or any product described herein; neither does Diodes Incorporated convey any license under its patent or trademark rights, nor the rights of others. Any Customer or user of this document or products described herein in such applications shall assume all risks of such use and will agree to hold Diodes Incorporated and all the companies whose products are represented on Diodes Incorporated website, harmless against all damages. Diodes Incorporated does not warrant or accept any liability whatsoever in respect of any products purchased through unauthorized sales channel. 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LIFE SUPPORT Diodes Incorporated products are specifically not authorized for use as critical components in life support devices or systems without the express written approval of the Chief Executive Officer of Diodes Incorporated. As used herein: A. Life support devices or systems are devices or systems which: 1. are intended to implant into the body, or 2. support or sustain life and whose failure to perform when properly used in accordance with instructions for use provided in the labeling can be reasonably expected to result in significant injury to the user. B. A critical component is any component in a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or to affect its safety or effectiveness. Customers represent that they have all necessary expertise in the safety and regulatory ramifications of their life support devices or systems, and acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any use of Diodes Incorporated products in such safety-critical, life support devices or systems, notwithstanding any devices- or systems-related information or support that may be provided by Diodes Incorporated. Further, Customers must fully indemnify Diodes Incorporated and its representatives against any damages arising out of the use of Diodes Incorporated products in such safety-critical, life support devices or systems. Copyright (c) 2016, Diodes Incorporated www.diodes.com BC817-16/ -25/ -40 Document number: DS11107 Rev. 21 - 2 7 of 7 www.diodes.com June 2016 (c) Diodes Incorporated