0
50
100
150
200
250
300
350
400
450
500
-40 -25 -10 5 20 35 50 65 80 95 110 125
TA– Temperature – °C
(VIN – VOUT) – Dropout Voltage – mV
RL= 100 µA
RL= 100 m A
IL
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LP295x Adjustable Micropower Voltage Regulators with Shutdown
1 Features 2 Applications
1• Wide Input Range: Up to 30 V • Applications with High-Voltage Input
• Rated Output Current of 100 mA • Power Supplies
• Low Dropout: 380 mV (Typ) at 100 mA 3 Description
• Low Quiescent Current: 75 μA (Typ) The LP2950 and LP2951 devices are bipolar, low-
• Tight Line Regulation: 0.03% (Typ) dropout voltage regulators that can accommodate a
• Tight Load Regulation: 0.04% (Typ) wide input supply-voltage range of up to 30 V. The
easy-to-use, 3-pin LP2950 is available in fixed-output
• High VOAccuracy voltages of 5 V, 3.3 V, and 3 V. However, the 8-pin
– 1.4% at 25°C LP2951 is able to output either a fixed or adjustable
– 2% Over Temperature output from the same device. By tying the OUTPUT
• Can Be Used as a Regulator or Reference and SENSE pins together, and the FEEDBACK and
VTAP pins together, the LP2951 outputs a fixed 5 V,
• Stable With Low ESR (>12 mΩ) Capacitors 3.3 V, or 3 V (depending on the version).
• Current- and Thermal-Limiting Features Alternatively, by leaving the SENSE and VTAP pins
• LP2950 Only (3-Pin Package) open and connecting FEEDBACK to an external
resistor divider, the output can be set to any value
– Fixed-Output Voltages of 5 V, 3.3 V, and 3 V between 1.235 V to 30 V.
• LP2951 Only (8-Pin Package)
– Fixed- or Adjustable-Output Voltages: Device Information(1)
5 V/ADJ, 3.3 V/ADJ, and 3 V/ADJ PART NUMBER PACKAGE BODY SIZE (NOM)
– Low-Voltage Error Signal on Falling Output LP2950 TO-92 (3) 4.83 mm x 4.83 mm
– Shutdown Capability SOIC (8) 4.90 mm x 3.90 mm
LP2951
– Remote Sense Capability for Optimal Output SON (8) 3.00 mm x 3.00 mm
Regulation and Accuracy (1) For all available packages, see the orderable addendum at
the end of the data sheet.
Dropout Voltage vs Temperature
1
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
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Table of Contents
7.3 LP2951 Functional Block Diagram.......................... 13
1 Features.................................................................. 17.4 Feature Description................................................. 14
2 Applications ........................................................... 17.5 Device Functional Modes........................................ 15
3 Description............................................................. 18 Application and Implementation ........................ 16
4 Revision History..................................................... 28.1 Application Information............................................ 16
5 Pin Configuration and Functions......................... 38.2 Typical Application ................................................. 16
6 Specifications......................................................... 49 Power Supply Recommendations...................... 19
6.1 Absolute Maximum Ratings ...................................... 410 Layout................................................................... 19
6.2 Handling Ratings ...................................................... 410.1 Layout Guidelines ................................................. 19
6.3 Recommended Operating Conditions....................... 410.2 Layout Example .................................................... 19
6.4 Thermal Information.................................................. 411 Device and Documentation Support................. 19
6.5 Electrical Characteristics........................................... 511.1 Trademarks........................................................... 19
6.6 Typical Characteristics.............................................. 711.2 Electrostatic Discharge Caution............................ 19
7 Detailed Description............................................ 12 11.3 Glossary................................................................ 19
7.1 Overview................................................................. 12 12 Mechanical, Packaging, and Orderable
7.2 LP2950 Functional Block Diagram.......................... 12 Information ........................................................... 19
4 Revision History
Changes from Revision H (March 2012) to Revision I Page
• Added Applications,Device Information table, Handling Ratings table, Feature Description section, Device
Functional Modes,Application and Implementation section, Power Supply Recommendations section, Layout
section, Device and Documentation Support section, and Mechanical, Packaging, and Orderable Information section...... 1
• Removed Ordering Information table. .................................................................................................................................... 1
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1
2
3
4
8
7
6
5
INPUT
FEEDBACK
VTAP
ERROR
OUTPUT
SENSE
SHUTDOWN
GND
LP2951
D OR P PACKAGE
(TOP VIEW)
OUTPUT
GND
INPUT
LP2950
LP PACKAGE
(BOTTOM VIEW)
LP2951
DRG PACKAGE
(TOP VIEW)
1
2
3
4
8
7
6
5
INPUT
FEEDBACK
VTAP
ERROR
OUTPUT
SENSE
SHUTDOWN
GND
Thermal
Pad
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5 Pin Configuration and Functions
Pin Functions
PIN TYPE DESCRIPTION
NAME LP2950 LP2951
Active-low open-collector error output. Goes low when VOUT drops by 6% of its
ERROR — 5 O nominal value.
Determines the output voltage. Connect to VTAP (with OUTPUT tied to SENSE)
FEEDBACK — 7 I to output the fixed voltage corresponding to the part version, or connect to a
resistor divider to adjust the output voltage.
GND 2 4 — Ground
INPUT 3 8 I Supply input
OUTPUT 1 1 O Voltage output.
Senses the output voltage. Connect to OUTPUT (with FEEDBACK tied to VTAP)
SENSE — 2 I to output the voltage corresponding to the part version.
SHUTDOWN — 3 I Active-high input. Shuts down the device.
VTAP — 6 O Tie to FEEDBACK to output the fixed voltage corresponding to the part version.
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6 Specifications
6.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted) (1)
MIN MAX UNIT
VIN Continuous input voltage range –0.3 30 V
VSHDN SHUTDOWN input voltage range –1.5 30 V
VERROR ERROR comparator output voltage range(2) –1.5 30 V
VFDBK FEEDBACK input voltage range(2) (3) –1.5 30 V
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) May exceed input supply voltage
(3) If load is returned to a negative power supply, the output must be diode clamped to GND.
6.2 Handling Ratings MIN MAX UNIT
Tstg Storage temperature range –65 150 °C
Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, all 0 2500
pins(1)
V(ESD) Electrostatic discharge V
Charged device model (CDM), per JEDEC specification 0 1000
JESD22-C101, all pins(2)
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
6.3 Recommended Operating Conditions MIN MAX UNIT
VIN Supply input voltage See (1) 30 V
TJOperating virtual junction temperature –40 125 °C
(1) Minimum VIN is the greater of:
(a) 2 V (25°C), 2.3 V (over temperature), or
(b) VOUT(MAX) + Dropout (Max) at rated IL
6.4 Thermal Information LP2950 LP2951
THERMAL METRIC(1) LP D P DRG UNIT
3 PINS 8 PINS
RθJA Junction-to-ambient thermal resistance 140 97 84.6 52.44 °C/W
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report (SPRA953).
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6.5 Electrical Characteristics
VIN = VOUT (nominal) + 1 V, IL= 100 μA, CL= 1 μF (5-V versions) or CL= 2.2 μF (3-V and 3.3-V versions),
8-pin version: FEEDBACK tied to VTAP, OUTPUT tied to SENSE, VSHUTDOWN ≤0.7 V
PARAMETER TEST CONDITIONS TJMIN TYP MAX UNIT
3-V VERSION (LP295x-30)
25°C 2.970 3 3.030
VOUT Output voltage IL= 100 μA V
–40°C to 125°C 2.940 3 3.060
3.3-V VERSION (LP295x-33)
25°C 3.267 3.3 3.333
VOUT Output voltage IL= 100 μA V
–40°C to 125°C 3.234 3.3 3.366
5-V VERSION (LP295x-50)
25°C 4.950 5 5.050
VOUT Output voltage IL= 100 μA V
–40°C to 125°C 4.900 5 5.100
ALL VOLTAGE OPTIONS
Output voltage temperature IL= 100 μA –40°C to 125°C 20 100 ppm/°C
coefficient(1)
25°C 0.03 0.2
Line regulation(2) VIN = [VOUT(NOM) + 1 V] to 30 V %/V
–40°C to 125°C 0.4
25°C 0.04% 0.2%
Load regulation(2) IL= 100 μA to 100 mA —
–40°C to 125°C 0.3%
25°C 50 80
IL= 100 μA–40°C to 125°C 150
VIN – VOUT Dropout voltage(3) mV
25°C 380 450
IL= 100 mA –40°C to 125°C 600
25°C 75 120
IL= 100 μAμA
–40°C to 125°C 140
IGND GND current 25°C 8 12
IL= 100 mA mA
–40°C to 125°C 14
25°C 110 170
VIN = VOUT(NOM) – 0.5 V,
Dropout ground current μA
IL= 100 μA–40°C to 125°C 200
25°C 160 200
Current limit VOUT = 0 V mA
–40°C to 125°C 220
Thermal regulation(4) IL= 100 μA 25°C 0.05 0.2 %/W
CL= 1 μF (5 V only) 430
CL= 200 μF 160
Output noise (RMS), 25°C μV
LP2951-50: CL= 3.3 μF,
10 Hz to 100 kHz CBypass = 0.01 μF between 100
pins 1 and 7
(1) Output or reference voltage temperature coefficient is defined as the worst-case voltage change divided by the total temperature range.
(2) Regulation is measured at constant junction temperature, using pulse testing with a low duty cycle. Changes in output voltage due to
heating effects are covered under the specification for thermal regulation.
(3) Dropout voltage is defined as the input-to-output differential at which the output voltage drops 100 mV, below the value measured at 1-V
differential. The minimum input supply voltage of 2 V (2.3 V over temperature) must be observed.
(4) Thermal regulation is defined as the change in output voltage at a time (T) after a change in power dissipation is applied, excluding load
or line regulation effects. Specifications are for a 50-mA load pulse at VIN = 30 V, VOUT = 5 V (1.25-W pulse) for t = 10 ms.
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Electrical Characteristics (continued)
VIN = VOUT (nominal) + 1 V, IL= 100 μA, CL= 1 μF (5-V versions) or CL= 2.2 μF (3-V and 3.3-V versions),
8-pin version: FEEDBACK tied to VTAP, OUTPUT tied to SENSE, VSHUTDOWN ≤0.7 V
PARAMETER TEST CONDITIONS TJMIN TYP MAX UNIT
(LP2951-xx) 8-PIN VERSION ONLY ADJ
25°C 1.218 1.235 1.252
–40°C to 125°C 1.212 1.257
Reference voltage V
VOUT = VREF to (VIN – 1 V),
VIN = 2.3 V to 30 V, –40°C to 125°C 1.200 1.272
IL= 100 μA to 100 mA
Reference voltage 25°C 20 ppm/°C
temperature coefficient(1)
25°C 20 40
FEEDBACK bias current nA
–40°C to 125°C 60
FEEDBACK bias current 25°C 0.1 nA/°C
temperature coefficient
ERROR COMPARATOR
25°C 0.01 1
Output leakage current VOUT = 30 V μA
–40°C to 125°C 2
25°C 150 250
VIN = VOUT(NOM) – 0.5 V,
Output low voltage mV
IOL = 400 μA–40°C to 125°C 400
25°C 40 60
Upper threshold voltage mV
(ERROR output high)(5) –40°C to 125°C 25
25°C 75 95
Lower threshold voltage mV
(ERROR output low)(5) –40°C to 125°C 140
Hysteresis(5) 25°C 15 mV
SHUTDOWN INPUT
Low (regulator ON) 0.7
Input logic voltage –40°C to 125°C V
High (regulator OFF) 2
25°C 30 50
SHUTDOWN = 2.4 V –40°C to 125°C 100
SHUTDOWN input current μA
25°C 450 600
SHUTDOWN = 30 V –40°C to 125°C 750
VSHUTDOWN ≥2 V, 25°C 3 10
Regulator output current VIN ≤30 V, VOUT = 0, μA
in shutdown –40°C to 125°C 20
FEEDBACK tied to VTAP
(5) Comparator thresholds are expressed in terms of a voltage differential equal to the nominal reference voltage (measured at
VIN – VOUT = 1 V) minus FEEDBACK terminal voltage. To express these thresholds in terms of output voltage change, multiply by the
error amplifier gain = VOUT/VREF = (R1 + R2)/R2. For example, at a programmed output voltage of 5 V, the ERROR output is specified to
go low when the output drops by 95 mV × 5 V/1.235 V = 384 mV. Thresholds remain constant as a percentage of VOUT (as VOUT is
varied), with the low-output warning occurring at 6% below nominal (typ) and 7.7% (max).
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4.900
4.925
4.950
4.975
5.000
5.025
5.050
5.075
5.100
-40 -25 -10 5 20 35 50 65 80 95 110 125
TA– Temperature – °C
VOUT – Output Voltage – V
IL= 100 µA
IL= 100 mA
IL= 0
0
20
40
60
80
100
120
140
160
180
200
0 1 2 3 4 5 6 7 8 9 10
VIN – Input Voltage – V
Input Current – µA
R = 50 k
LΩ
0
10
20
30
40
50
60
70
80
90
100
110
120
0 1 2 3 4 5 6 7 8 9 10
VIN – Input Voltage – V
Input Current – mA
R = 50
LΩ
0
10
20
30
40
50
60
70
80
90
100
0 1 2 3 4 5 6 7 8 9 10
VIN – Input Voltage – V
Input Current – µA
R =
L∞
0.01
0.1
1
10
0.0001 0.001 0.01 0.1
IL– Load Curre nt – A
Quiescent Current – mA
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6.6 Typical Characteristics
Figure 1. Quiescent Current vs Load Current Figure 2. Input Current vs Input Voltage (RL= OPEN)
Figure 4. Input Current vs Input Voltage (RL= 50 Ω)
Figure 3. Input Current vs Input Voltage (RL= 50 kΩ)
Figure 5. Output Voltage vs Temperature Figure 6. Quiescent Current vs Input Voltage (IL= 0)
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50
75
100
125
150
175
200
225
250
-40 -25 -10 5 20 35 50 65 80 95 110 125
TA– Temperature – °C
Short-Circuit Current – mA
0
50
100
150
200
250
300
350
400
450
500
-40 -25 -10 5 20 35 50 65 80 95 110 125
TA– Temperature – °C
(VIN – VOUT) – Dropout Voltage – mV
RL= 100 µA
RL= 100 m A
IL
I
5
5.5
6
6.5
7
7.5
8
8.5
9
9.5
10
-40 -25 -10 5 20 35 50 65 80 95 110 125
TA– Temperature – °C
Quiescent Current – mA
IL= 100 m A
VIN = 6 V
50
55
60
65
70
75
80
85
90
95
100
-40 -25 -10 5 20 35 50 65 80 95 110 125
TA– Temperature – °C
Quiescent Current – µA
IL= 100 µA
VIN = 6 V
0
10
20
30
40
50
60
70
80
90
100
110
120
0 1 2 3 4 5 6 7 8
VIN – Input Voltage – V
Quiescent Current – µA
IL= 1 mA
0
1
2
3
4
5
6
7
8
0 1 2 3 4 5 6 7 8
VIN – Input Voltage – V
Quiescent Current – mA
IL= 100 mA
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Typical Characteristics (continued)
Figure 8. Quiescent Current vs Input Voltage (IL= 100 mA)
Figure 7. Quiescent Current vs Input Voltage (IL= 1 mA)
Figure 10. Quiescent Current vs Temperature (IL= 100 µA)
Figure 9. Quiescent Current vs Temperature (IL= 100 mA)
Figure 12. Dropout Voltage vs Temperature
Figure 11. Short-circuit Current vs Temperature
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0
0.25
0.5
0.75
1
1.25
1.5
1.75
2
0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9
VOL – Output Low Voltage – V
ISINK – Sink Current – mA
T = 125
A
T = 25
A
T = –40
A
Input Voltage
2 V/div
Output Voltage
80 mV/div
-20
-15
-10
-5
0
5
10
15
20
25
30
-55 -30 -5 20 45 70 95 120 145
TA– Temperature – °C
FEEDBACK Bias Current – nA
0
1
2
3
4
5
6
7
8
0 1 2 3 4 5 6 7 8
VIN – Input Voltage – V
ERROR Output – V
50-k resistorto
external5-Vsupply
W
50-k resistor
toV
W
OUT
1.6
1.65
1.7
1.75
1.8
1.85
1.9
1.95
2
-40 -25 -10 5 20 35 50 65 80 95 110 125
TA– Temperature – °C
Minimum Operating Voltage – V
0
50
100
150
200
250
300
350
400
0.0001 0.001 0.01 0.1
IO– Output Current – A
(VIN – VOUT) – Dropout Voltage – mV
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Typical Characteristics (continued)
Figure 13. Dropout Voltage vs Dropout Current Figure 14. LP2951 Minimum Operating Voltage vs
Temperature
Figure 16. LP2951 ERROR Comparator Output vs
Figure 15. LP2951 FEEDBACK Bias Current vs Temperature Input Voltage
Figure 18. Line Transient Response vs Time
Figure 17. LP2951 ERROR Comparator Sink Current vs
Output Low Voltage
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20
30
40
50
60
70
80
90
1.E+01 1.E+02 1.E+03 1.E+04 1.E+05 1.E+06
f – Frequency – Hz
Power-Supply Ripple Rejection – dB
IL= 100 µA
IL= 0
VIN = 6 V
CL= 1 µF
10 100 1k 10k 100k 1M
10
20
30
40
50
60
70
80
90
100
1.E+01 1.E+02 1.E+03 1.E+04 1.E+05 1.E+06
f – Frequency – Hz
Power-Supply Ripple Rejection – dB
IL= 10 mA
IL= 1 mA
VIN = 6 V
CL= 1 µF
10 100 1k 10k 100k 1M
0.01
0.1
1
10
100
1.E+01 1.E+02 1.E+03 1.E+04 1.E+05 1.E+06
f – Frequency – Hz
Output Impedance – Ohm
IL= 1 m A
IL= 100 mA
IL= 100 µA
10 100 1k 10k 100k 1M
Ω
Output Load
100 mA/div
Output Voltage
100 mV/div
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Typical Characteristics (continued)
Figure 19. Load Transient Response vs Figure 20. Enable Transient Response vs
Time (VOUT = 5 V, CL= 10 µF) Time (IL= 1 mA, CL= 1 µF)
Figure 21. Enable Transient Response vs
Time (IL= 1 mA, CL= 10 µF) Figure 22. Output Impedance vs Frequency
Figure 24. Output Impedance vs Frequency
Figure 23. Ripple Rejection vs Frequency
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0.8
0.9
1
1.1
1.2
1.3
1.4
1.5
1.6
1.7
-40 -25 -10 5 20 35 50 65 80 95 110 125
TA– Temperature – °C
Input Logic Voltage (ON to OFF) – V
-2
-1
0
1
2
3
4
5
6
0 5 10 15 20 25 30
VIN – Input Voltage – V
Output Voltage Change – mV
0
50
100
150
200
250
300
350
400
-40 -25 -10 5 20 35 50 65 80 95 110 125
TA– Temperature – °C
RP2P4 – Pin 2 to Pin 4 Resistance – k
kW
0.8
0.9
1
1.1
1.2
1.3
1.4
1.5
1.6
1.7
-40 -25 -10 5 20 35 50 65 80 95 110 125
TA– Temperature – °C
Input Logic Voltage (OFF to ON) – V
10
20
30
40
50
60
70
80
90
100
1.E+01 1.E+02 1.E+03 1.E+04 1.E+05 1.E+06
f – Frequency – Hz
Power-Supply Ripple Rejection – dB
IL= 100 mA
IL= 50 mA
VIN = 6 V
CL= 1 µF
10 100 1k 10k 100k 1M
0
1
2
3
4
5
6
1.E+01 1.E+02 1.E+03 1.E+04 1.E+05
f – Frequency – Hz
Output Noise – µV
CL= 1 µF
CL= 3.3 µF
CL= 200 µF
10 100 1k 10k 100k
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Typical Characteristics (continued)
Figure 26. LP2951 Output Noise vs Frequency
Figure 25. Output Impedance vs Frequency
Figure 28. Shutdown Threshold Voltage (Off to On) vs
Temperature
Figure 27. LP2951 Divider Resistance vs Temperature
Figure 30. Line Regulation vs Input Voltage
Figure 29. Shutdown Threshold Voltage (On to Off) vs
Temperature
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1.23-V Reference
Error
Amplifier
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7 Detailed Description
7.1 Overview
The LP2950 and LP2951 devices are bipolar, low-dropout voltage regulators that can accommodate a wide input
supply-voltage range of up to 30 V. The easy-to-use, 3-pin LP2950 is available in fixed-output voltages of 5 V,
3.3 V, and 3 V. However, the 8-pin LP2951 device is able to output either a fixed or adjustable output from the
same device. By tying the OUTPUT and SENSE pins together, and the FEEDBACK and VTAP pins together, the
LP2951 device outputs a fixed 5 V, 3.3 V, or 3 V (depending on the version). Alternatively, by leaving the SENSE
and VTAP pins open and connecting FEEDBACK to an external resistor divider, the output can be set to any
value between 1.235 V to 30 V.
The 8-pin LP2951 device also offers additional functionality that makes it particularly suitable for battery-powered
applications. For example, a logic-compatible shutdown feature allows the regulator to be put in standby mode
for power savings. In addition, there is a built-in supervisor reset function in which the ERROR output goes low
when VOUT drops by 6% of its nominal value for whatever reasons – due to a drop in VIN, current limiting, or
thermal shutdown.
The LP2950 and LP2951 devices are designed to minimize all error contributions to the output voltage. With a
tight output tolerance (0.5% at 25°C), a very low output voltage temperature coefficient (20 ppm typical),
extremely good line and load regulation (0.3% and 0.4% typical), and remote sensing capability, the parts can be
used as either low-power voltage references or 100-mA regulators.
7.2 LP2950 Functional Block Diagram
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+
60 mV
1.235-V Reference
Error
Amplifier
SENSE
VTAP
ERROR
GND
OUTPUTINPUTFEEDBACK
SHUTDOWN
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7.3 LP2951 Functional Block Diagram
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1.3 V
Input
Voltage
Output
Voltage
ERROR
4.75 V
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7.4 Feature Description
7.4.1 ERROR Function (LP2951 Only)
The LP2951 device has a low-voltage detection comparator that outputs a logic low when the output voltage
drops by ≈6% from its nominal value, and outputs a logic high when VOUT has reached ≈95% of its nominal
value. This 95% of nominal figure is obtained by dividing the built-in offset of ≈60 mV by the 1.235-V bandgap
reference, and remains independent of the programmed output voltage. For example, the trip-point threshold
(ERROR output goes high) typically is 4.75 V for a 5-V output and 11.4 V for a 12-V output. Typically, there is a
hysteresis of 15 mV between the thresholds for high and low ERROR output.
A timing diagram is shown in Figure 31 for ERROR vs VOUT (5 V), as VIN is ramped up and down. ERROR
becomes valid (low) when VIN ≈1.3 V. When VIN ≈5 V, VOUT = 4.75 V, causing ERROR to go high. Because the
dropout voltage is load dependent, the output trip-point threshold is reached at different values of VIN, depending
on the load current. For instance, at higher load current, ERROR goes high at a slightly higher value of VIN, and
vice versa for lower load current. The output-voltage trip point remains at ~4.75 V, regardless of the load. Note
that when VIN ≤1.3 V, the ERROR comparator output is turned off and pulled high to its pullup voltage. If VOUT is
used as the pullup voltage, rather than an external 5-V source, ERROR typically is ~1.2 V. In this condition, an
equal resistor divider (10 kΩis suitable) can be tied to ERROR to divide down the voltage to a valid logic low
during any fault condition, while still enabling a logic high during normal operation.
Figure 31. ERROR Output Timing
Because the ERROR comparator has an open-collector output, an external pullup resistor is required to pull the
output up to VOUT or another supply voltage (up to 30 V). The output of the comparator is rated to sink up to
400 μA. A suitable range of values for the pullup resistor is from 100 kΩto 1 MΩ. If ERROR is not used, it can
be left open.
14 Submit Documentation Feedback Copyright © 2006–2014, Texas Instruments Incorporated
Product Folder Links: LP2950 LP2951
R1
R2
FEEDBACK
VOUT
æ ö
= ´ + -
ç ÷
è ø
OUT REF FB 1
R1
V V 1 I R
R2
LP2950
,
LP2951
www.ti.com
SLVS582I –APRIL 2006–REVISED NOVEMBER 2014
Feature Description (continued)
7.4.2 Programming Output Voltage (LP2951 Only)
A unique feature of the LP2951 device is its ability to output either a fixed voltage or an adjustable voltage,
depending on the external pin connections. To output the internally programmed fixed voltage, tie the SENSE pin
to the OUTPUT pin and the FEEDBACK pin to the VTAP pin. Alternatively, a user-programmable voltage ranging
from the internal 1.235-V reference to a 30-V max can be set by using an external resistor divider pair. The
resistor divider is tied to VOUT, and the divided-down voltage is tied directly to FEEDBACK for comparison against
the internal 1.235-V reference. To satisfy the steady-state condition in which its two inputs are equal, the error
amplifier drives the output to equal Equation 1:
(1)
Where:
VREF = 1.235 V applied across R2 (see Figure 32)
IFB = FEEDBACK bias current, typically 20 nA
A minimum regulator output current of 1 μA must be maintained. Thus, in an application where a no-load
condition is expected (for example, CMOS circuits in standby), this 1-μA minimum current must be provided by
the resistor pair, effectively imposing a maximum value of R2 = 1.2 MΩ(1.235 V/1.2 MΩ≉1μA).
IFB = 20 nA introduces an error of ≉0.02% in VOUT. This can be offset by trimming R1. Alternatively, increasing
the divider current makes IFB less significant, thus, reducing its error contribution. For instance, using
R2 = 100 kΩreduces the error contribution of IFB to 0.17% by increasing the divider current to ≉12 μA. This
increase in the divider current still is small compared to the 600-μA typical quiescent current of the LP2951 under
no load.
Figure 32. Adjusting the Feedback on the LP2951
7.5 Device Functional Modes
7.5.1 Shutdown Mode
These devices can be placed in shutdown mode with a logic high at the SHUTDOWN pin. Return the logic level
low to restore operation or tie SHUTDOWN to ground if the feature is not being used.
Copyright © 2006–2014, Texas Instruments Incorporated Submit Documentation Feedback 15
Product Folder Links: LP2950 LP2951
LP2951-50
1
2
3
4
8
7
6
5
V
OUT
SENSE
SHUTDOWN
GND
FEEDBACK
VTAP
1 PF
VOUT = 5 V
330 kȍ
ERROR
V
IN
1 PF
VIN = 12 V
LP2950
,
LP2951
SLVS582I –APRIL 2006–REVISED NOVEMBER 2014
www.ti.com
8 Application and Implementation
NOTE
Information in the following applications sections is not part of the TI component
specification, and TI does not warrant its accuracy or completeness. TI’s customers are
responsible for determining suitability of components for their purposes. Customers should
validate and test their design implementation to confirm system functionality.
8.1 Application Information
The LP295x devices are used as low-dropout regulators with a wide range of input voltages.
8.2 Typical Application
Figure 33. 12-V to 5-V Converter
8.2.1 Design Requirements
8.2.1.1 Input Capacitor (CIN)
A 1-μF (tantalum, ceramic, or aluminum) electrolytic capacitor should be placed locally at the input of the LP2950
or LP2951 device if there is, or will be, significant impedance between the ac filter capacitor and the input; for
example, if a battery is used as the input or if the ac filter capacitor is located more than 10 in away. There are
no ESR requirements for this capacitor, and the capacitance can be increased without limit.
8.2.1.2 Output Capacitor (COUT)
As with most PNP LDOs, stability conditions require the output capacitor to have a minimum capacitance and an
ESR that falls within a certain range.
16 Submit Documentation Feedback Copyright © 2006–2014, Texas Instruments Incorporated
Product Folder Links: LP2950 LP2951
® =
p ´ ´
;
(CBYPASS) (BYPASS)
1
f 200 Hz C 2 R1 200 Hz
LP2950
,
LP2951
www.ti.com
SLVS582I –APRIL 2006–REVISED NOVEMBER 2014
Typical Application (continued)
8.2.2 Detailed Design Procedure
8.2.2.1 Capacitance Value
For VOUT ≥5 V, a minimum of 1 μF is required. For lower VOUT, the regulator’s loop gain is running closer to unity
gain and, thus, has lower phase margins. Consequently, a larger capacitance is needed for stability.
For VOUT = 3 V or 3.3 V, a minimum of 2.2 μF is recommended. For worst case, VOUT = 1.23 V (using the ADJ
version), a minimum of 3.3 μF is recommended. COUT can be increased without limit and only improves the
regulator stability and transient response. Regardless of its value, the output capacitor should have a resonant
frequency greater than 500 kHz.
The minimum capacitance values given above are for maximum load current of 100 mA. If the maximum
expected load current is less than 100 mA, then lower values of COUT can be used. For instance, if IOUT < 10 mA,
then only 0.33 μF is required for COUT. For IOUT < 1 mA, 0.1 μF is sufficient for stability requirements. Thus, for a
worst-case condition of 100-mA load and VOUT = VREF = 1.235 V (representing the highest load current and
lowest loop gain), a minimum COUT of 3.3 μF is recommended.
For the LP2950/51, no load stability is inherent in the design — a desirable feature in CMOS circuits that are put
in standby (such as RAM keep-alive applications). If the LP2951 is used with external resistors to set the output
voltage, a minimum load current of 1 μA is recommended through the resistor divider.
8.2.2.2 Capacitor Types
Most tantalum or aluminum electrolytics are suitable for use at the input. Film-type capacitors also work but at
higher cost. When operating at low temperature, care should be taken with aluminum electrolytics, as their
electrolytes often freeze at –30°C. For this reason, solid tantalum capacitors should be used at temperatures
below –25°C.
Ceramic capacitors can be used, but due to their low ESR (as low as 5 mΩto 10 mΩ), they may not meet the
minimum ESR requirement previously discussed. If a ceramic capacitor is used, a series resistor between
0.1 Ωto 2 Ωmust be added to meet the minimum ESR requirement. In addition, ceramic capacitors have one
glaring disadvantage that must be taken into account — a poor temperature coefficient, where the capacitance
can vary significantly with temperature. For instance, a large-value ceramic capacitor (≥2.2 μF) can lose more
than half of its capacitance as temperature rises from 25°C to 85°C. Thus, a 2.2-μF capacitor at 25°C drops well
below the minimum COUT required for stability as ambient temperature rises. For this reason, select an output
capacitor that maintains the minimum 2.2 μF required for stability for the entire operating temperature range.
8.2.2.3 CBYPASS: Noise and Stability Improvement
In the LP2951 device, an external FEEDBACK pin directly connected to the error amplifier noninverting input can
allow stray capacitance to cause instability by shunting the error amplifier feedback to GND, especially at high
frequencies. This is worsened if high-value external resistors are used to set the output voltage, because a high
resistance allows the stray capacitance to play a more significant role; i.e., a larger RC time delay is introduced
between the output of the error amplifier and its FEEDBACK input, leading to more phase shift and lower phase
margin. A solution is to add a 100-pF bypass capacitor (CBYPASS) between OUTPUT and FEEDBACK; because
CBYPASS is in parallel with R1, it lowers the impedance seen at FEEDBACK at high frequencies, in effect
offsetting the effect of the parasitic capacitance by providing more feedback at higher frequencies. More
feedback forces the error amplifier to work at a lower loop gain, so COUT should be increased to a minimum of
3.3 μF to improve the regulator’s phase margin.
CBYPASS can be also used to reduce output noise in the LP2951 device. This bypass capacitor reduces the
closed loop gain of the error amplifier at the high frequency, so noise no longer scales with the output voltage.
This improvement is more noticeable with higher output voltages, where loop gain reduction is greatest. A
suitable CBYPASS is calculated as shown in Equation 2:
(2)
On the 3-pin LP2950 device, noise reduction can be achieved by increasing the output capacitor, which causes
the regulator bandwidth to be reduced, thus eliminating high-frequency noise. However, this method is relatively
inefficient, as increasing COUT from 1 μF to 220 μF only reduces the regulator’s output noise from
430 μV to 160 μV (over a 100-kHz bandwidth).
Copyright © 2006–2014, Texas Instruments Incorporated Submit Documentation Feedback 17
Product Folder Links: LP2950 LP2951
Output Load
100 mA/div
Output Voltage
100 mV/div
LP2950
,
LP2951
SLVS582I –APRIL 2006–REVISED NOVEMBER 2014
www.ti.com
Typical Application (continued)
8.2.2.4 ESR Range
The regulator control loop relies on the ESR of the output capacitor to provide a zero to add sufficient phase
margin to ensure unconditional regulator stability; this requires the closed-loop gain to intersect the open-loop
response in a region where the open-loop gain rolls off at 20 dB/decade. This ensures that the phase is always
less than 180° (phase margin greater than 0°) at unity gain. Thus, a minimum-maximum range for the ESR must
be observed.
The upper limit of this ESR range is established by the fact that an ESR that is too high could result in the zero
occurring too soon, causing the gain to roll off too slowly. This, in turn, allows a third pole to appear before unity
gain and introduces enough phase shift to cause instability. This typically limits the maximum ESR to
approximately 5 Ω.
Conversely, the lower limit of the ESR range is tied to the fact that an ESR that is too low shifts the zero too far
out, past unity gain, which allows the gain to roll off at 40 dB/decade at unity gain, resulting in a phase shift of
greater than 180°. Typically, this limits the minimum ESR to approximately 20 mΩto 30 mΩ.
For specific ESR requirements, see Typical Characteristics.
8.2.3 Application Curves
Figure 34. Load Transient Response vs Time (VOUT = 5 V, CL= 1 µF)
18 Submit Documentation Feedback Copyright © 2006–2014, Texas Instruments Incorporated
Product Folder Links: LP2950 LP2951
LP2951-50
1
2
3
4
8
7
6
5
1 PF1 PF
ERROR can be left floating
if not used
LP2950
,
LP2951
www.ti.com
SLVS582I –APRIL 2006–REVISED NOVEMBER 2014
9 Power Supply Recommendations
Maximum input voltage should be limited to 30 V for proper operation. Place input and output capacitors as close
to the device as possible to take advantage of their high frequency noise filtering properties.
10 Layout
10.1 Layout Guidelines
• Make sure that traces on the input and outputs of the device are wide enough to handle the desired currents.
For this device, the output trace will need to be larger in order to accommodate the larger available current.
• Place input and output capacitors as close to the device as possible to take advantage of their high frequency
noise filtering properties.
10.2 Layout Example
Figure 35. LP2951 Layout Example (D or P Package)
11 Device and Documentation Support
11.1 Trademarks
All trademarks are the property of their respective owners.
11.2 Electrostatic Discharge Caution
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
11.3 Glossary
SLYZ022 —TI Glossary.
This glossary lists and explains terms, acronyms, and definitions.
12 Mechanical, Packaging, and Orderable Information
The following pages include mechanical, packaging, and orderable information. This information is the most
current data available for the designated devices. This data is subject to change without notice and revision of
this document. For browser-based versions of this data sheet, refer to the left-hand navigation.
Copyright © 2006–2014, Texas Instruments Incorporated Submit Documentation Feedback 19
Product Folder Links: LP2950 LP2951
PACKAGE OPTION ADDENDUM
www.ti.com 16-Oct-2014
Addendum-Page 1
PACKAGING INFORMATION
Orderable Device Status
(1)
Package Type Package
Drawing Pins Package
Qty Eco Plan
(2)
Lead/Ball Finish
(6)
MSL Peak Temp
(3)
Op Temp (°C) Device Marking
(4/5)
Samples
LP2950-30LP ACTIVE TO-92 LP 3 1000 Pb-Free
(RoHS) CU SN N / A for Pkg Type -40 to 125 KY5030
LP2950-30LPR ACTIVE TO-92 LP 3 2000 Pb-Free
(RoHS) CU SN N / A for Pkg Type -40 to 125 KY5030
LP2950-30LPRE3 ACTIVE TO-92 LP 3 2000 Pb-Free
(RoHS) CU SN N / A for Pkg Type -40 to 125 KY5030
LP2950-33LPE3 ACTIVE TO-92 LP 3 1000 Pb-Free
(RoHS) CU SN N / A for Pkg Type -40 to 125 KY5033
LP2950-33LPRE3 ACTIVE TO-92 LP 3 2000 Pb-Free
(RoHS) CU SN N / A for Pkg Type 0 to 0 KY5033
LP2950-50LPRE3 ACTIVE TO-92 LP 3 2000 Pb-Free
(RoHS) CU SN N / A for Pkg Type -40 to 125 KY5050
LP2951-30D ACTIVE SOIC D 8 75 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 125 KY5130
LP2951-30DR ACTIVE SOIC D 8 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 125 KY5130
LP2951-30DRG4 ACTIVE SOIC D 8 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 125 KY5130
LP2951-30DRGR ACTIVE SON DRG 8 3000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR -40 to 125 ZUD
LP2951-33D ACTIVE SOIC D 8 75 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 125 KY5133
LP2951-33DR ACTIVE SOIC D 8 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 125 KY5133
LP2951-33DRG4 ACTIVE SOIC D 8 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 125 KY5133
LP2951-33DRGR ACTIVE SON DRG 8 3000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR -40 to 125 ZUE
LP2951-50D ACTIVE SOIC D 8 75 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 125 KY5150
LP2951-50DR ACTIVE SOIC D 8 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 125 KY5150
LP2951-50DRG4 ACTIVE SOIC D 8 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 125 KY5150
PACKAGE OPTION ADDENDUM
www.ti.com 16-Oct-2014
Addendum-Page 2
Orderable Device Status
(1)
Package Type Package
Drawing Pins Package
Qty Eco Plan
(2)
Lead/Ball Finish
(6)
MSL Peak Temp
(3)
Op Temp (°C) Device Marking
(4/5)
Samples
LP2951-50DRGR ACTIVE SON DRG 8 3000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR -40 to 125 ZUF
LP2951D ACTIVE SOIC D 8 75 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 125 LP2951
LP2951DR ACTIVE SOIC D 8 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 125 LP2951
LP2951DRG4 ACTIVE SOIC D 8 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 125 LP2951
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
PACKAGE OPTION ADDENDUM
www.ti.com 16-Oct-2014
Addendum-Page 3
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
OTHER QUALIFIED VERSIONS OF LP2951-33, LP2951-50 :
•Automotive: LP2951-33-Q1, LP2951-50-Q1
NOTE: Qualified Version Definitions:
•Automotive - Q100 devices qualified for high-reliability automotive applications targeting zero defects
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device Package
Type Package
Drawing Pins SPQ Reel
Diameter
(mm)
Reel
Width
W1 (mm)
A0
(mm) B0
(mm) K0
(mm) P1
(mm) W
(mm) Pin1
Quadrant
LP2951-30DR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1
LP2951-30DRGR SON DRG 8 3000 330.0 12.4 3.3 3.3 1.1 8.0 12.0 Q2
LP2951-33DR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1
LP2951-33DRGR SON DRG 8 3000 330.0 12.4 3.3 3.3 1.1 8.0 12.0 Q2
LP2951-50DR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1
LP2951-50DRGR SON DRG 8 3000 330.0 12.4 3.3 3.3 1.1 8.0 12.0 Q2
LP2951DR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1
PACKAGE MATERIALS INFORMATION
www.ti.com 3-Jul-2015
Pack Materials-Page 1
*All dimensions are nominal
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
LP2951-30DR SOIC D 8 2500 340.5 338.1 20.6
LP2951-30DRGR SON DRG 8 3000 367.0 367.0 35.0
LP2951-33DR SOIC D 8 2500 340.5 338.1 20.6
LP2951-33DRGR SON DRG 8 3000 367.0 367.0 35.0
LP2951-50DR SOIC D 8 2500 340.5 338.1 20.6
LP2951-50DRGR SON DRG 8 3000 367.0 367.0 35.0
LP2951DR SOIC D 8 2500 340.5 338.1 20.6
PACKAGE MATERIALS INFORMATION
www.ti.com 3-Jul-2015
Pack Materials-Page 2
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