Z-PACK SLIM UHD
Backplane Connector
DATA COMMUNICATIONS /// Z-PACK SLIM UHD BACKPLANE CONNECTOR
Accommodating a broad spectrum of speeds up to 20 Gbps, TE's Z-PACK Slim UHD backplane connector
lets you design for today’s speed while planning for tomorrow’s. Designed to be the densest connector
in the smallest possible footprint, the connector frees up PCB space, giving you more room to design for
performance. Through a highly configurable design, the Z-PACK Slim UHD connector oers the flexibility
needed to design intricate communication systems.
• SpeedScalabilityandCongurability:TheZ-PACK Slim UHD connector transfers data at 12.5 Gbps,
with scalability up to 20 Gbps, allowing you to eciently increase your communication system's
speed without modifying the existing PCB footprint.
• SpaceSavings:Owing to its small size, which is about 10% smaller than similar products on the
market, the product fits into tight 15mm (0.6 inch) slot pitch applications, oering significant PCB
space savings.
• DesignFlexibility:Through a highly configurable design, multiple pin assignments can be achieved.
Applications

• Switches
• Routers
• Servers
• Other telecommunication equipment
PAGE 2PAGE 2DATA COMMUNICATIONS /// Z-PACK SLIM UHD BACKPLANE CONNECTOR
DesignFlexibility-PinAssignments
2.0 DP/Column 1.5 DP/Column Single-Ended
1.5 DP/Column 1.5 DP/Column
Example illustrating flexibility
• Below are examples of the various connector pin assignments available:
• 1.5 dierential pairs per column
• 2.0 dierential pairs per column
• Extremely high density in a fully single-ended arrangement up to 55 signal lines/cm2
For more pin assignments, please refer to application specification 114-19106 (high speed) or 114-19112
(common speed). You can also contact TE.
PAGE 3PAGE 3DATA COMMUNICATIONS /// Z-PACK SLIM UHD BACKPLANE CONNECTOR
SpeedScalability
First Generation
Signal Assignment Note: A combination of CS
and HS chicklets in one female
connector housing is available
upon customer request. Please
contact TE.
Second Generation
DP/Column DP/ColumnDP/Column
Drill Size: 0.5 mm
Finished Hole Size: 0.4 mm
Pad Size: 0.8 mm
Anti-Pad Size: 0.95 mm
• Identical board footprints on backplane and
daughter-card
• 1.45 mm routing channels available in
horizontal and vertical direction
• Footprint allows 4-6-4 MIL or 5-7-5 MIL
dierential routing
System and connector evaluation boards are
available upon request.
Row A
Row B
Row C
Row D
Row E
Row F
Row G
Row H
Horizontal
Routing
Vertical
Routing
1.25 mm
1.45 mm
1.25 mm
1.45 mm
1.25 mm
1.45 mm
1.25 mm
Row Pitch
Column Pitch
1.45 mm
SpaceSavings
PAGE 4PAGE 4DATA COMMUNICATIONS /// Z-PACK SLIM UHD BACKPLANE CONNECTOR
TypicalElectricProperties
0 1 2 3 4 5 6 7 8 910
-10
-9
-8
-7
-6
-5
-4
-3
-2
-1
0
Frequency [GHz]
Differential insertion loss [dB]
Differential insertion loss (1.1 mm thick testboards included)
Pair AB
Pair CD
Pair EF
Pair GH
47.9 48 48.1 48.248.3 48.4 48.5 48.6 48.7
70
80
90
100
110
120
130
Time [ns]
Impedance [Ohm]
Differential impedance profile (risetime: 50ps 20%-80%)
Pair AB
Pair CD
Pair EF
Pair GH
Via on
daughtercard side
Via on backplane
side
Connector
47.9 48 48.1 48.248.3 48.4 48.5 48.6 48.7
70
80
90
100
110
120
130
Time [ns]
Impedance [Ohm]
Differential impedance profile (risetime: 50ps 20%-80%)
Pair AB
Pair CD
Pair EF
Pair GH
Via on
daughtercard side
Via on backplane
side
Connector
0 1 2 3 4 5
-10
-9
-8
-7
-6
-5
-4
-3
-2
-1
0
Frequency [GHz]
Differential insertion loss [dB]
Differential insertion loss (1.1 mm thick PCB included)
Pair AB
Pair CD
Pair EF
Pair GH
00.10.20.30.40.50.
6
70
80
90
100
110
120
130
Time [ns]
Impedance [Ohm]
Differential impedance profile (risetime: 75ps 20%-80%)
Pair AB
Pair CD
Pair EF
Pair GH
Via on
daughtercardside
Via on backplane
side
Connector
00.10.20.30.40.50.
6
70
80
90
100
110
120
130
Time [ns]
Impedance [Ohm]
Differential impedance profile (risetime: 75ps 20%-80%)
Pair AB
Pair CD
Pair EF
Pair GH
Via on
daughtercardside
Via on backplane
side
Connector
* All simulation data include the footprint performance of a 1.1mm thick PCB test-board.
** All measurement data include the footprint performance of a 1.1mm thick PCB test-board.
PAGE 5PAGE 5DATA COMMUNICATIONS /// Z-PACK SLIM UHD BACKPLANE CONNECTOR
TypicalElectricProperties
0 1 2 3 4 5 6 7 8 9
10
-10
-9
-8
-7
-6
-5
-4
-3
-2
-1
0
Frequency [GHz]
Differential insertion loss [dB]
Differential insertion loss (1.1 mm thick testboards included)
Pair AB
Pair DE
Pair GH
47.9 48 48.1 48.2 48.3 48.4 48.5 48.6 48.7
70
80
90
100
110
120
130
Time [ns]
Impedance [Ohm]
Differential impedance profile (risetime: 50ps 20%-80%)
Pair AB
Pair DE
Pair GH
Via on
daughtercardside
Via on backplane
side
Connector
47.9 48 48.1 48.2 48.3 48.4 48.5 48.6
70
80
90
100
110
120
130
Time [ns]
Impedance [Ohm]
Differential impedance profile (risetime: 50ps 20%-80%)
Via on
daughtercardside
Via on backplane
side
Connector
** All measurement data include the footprint performance of a 1.1mm thick PCB test-board.
ConnectorOerings:Female Connector
High Speed Version Common Speed Version
Recommended PCB Layout
(component side shown)
PAGE 6PAGE 6DATA COMMUNICATIONS /// Z-PACK SLIM UHD BACKPLANE CONNECTOR
ConnectorOerings:Uniform Male Connector for High and Common Speeds
ReferencePartNumbers ApplicationTooling
Product
Specication Application
Specication
Female
Male Part
Number Description Instruction
Sheet
High
Speed
108-19353
108-19320 114-19106 1857657-1
1857657-2
Vertical
2042088-1
2042088-2
RightAngle
2042162-1
2042162-2
2042139-1
2042139-2
1-528508-4
528508-2
528504-2
Pin Bending Tool
Removal Tool
Insertion Tool
412-18997
412-18997
412-18984
Common
Speed
108-19354
108-19352 114-19112 1982738-1
1982738-2
Power 108-19367 114-19122 1982257-5 1982260-5 4-519564-2 Insertion Tool 412-18969
ComplementaryProducts
Right-AngleMaleConnector
• Co-planar application based on right-angle female and right-angle male
• Performance up to 20+ Gbps (in combination with female high-speed connector)
NOTE: The footprint of the male connector is identical to the footprint of the
female connector. Sequenced pins at predefined positions can be obtained
upon request. For further information, please contact TE.
PAGE 7PAGE 7DATA COMMUNICATIONS /// Z-PACK SLIM UHD BACKPLANE CONNECTOR
PowerConnector
• Envelope dimensions identical to Z-PACK Slim UHD modules
• High durability (250 cycles)
• Two sequencing levels
• Current carrying capacity >18 Amp per contact
PowerFemaleConnector:
PowerMaleConnector:
PartNo.1982260-5
For More Information
www.te.com
TE Technical Support Center
USA: +1 (800) 522-6752
Canada: +1 (905) 475-6222
Mexico: +52 (0) 55-1106-0800
Latin/S. America: +54 (0) 11-4733-2200
Germany: +49 (0) 6251-133-1999
UK: +44 (0) 800-267666
France: +33 (0) 1-3420-8686
Netherlands: +31 (0) 73-6246-999
China: +86 (0) 400-820-6015
te.com
1654261-5 DTC 1014
© 2014 TE Connectivity Ltd. family of companies. All Rights Reserved. Z-PACK Slim UHD, TE Connectivity, TE Connectivity (logo) and Every Connection
DATA COMMUNICATIONS /// Z-PACK SLIM UHD BACKPLANE CONNECTOR
GuidePins
Ø4.9
Ø7.8
28.8
5.9
6.2
4.7
M4
34.2
16.8 15.0
M3
5.5
5.4
9.7
4
Ø5.4
FemaleGuideModule
PartNo.223957-3
MaleGuidePin
PartNo.1857988-1