1N5550US thru 1N5554US Available on commercial versions VOIDLESS HERMETICALLY SEALED SURFACE MOUNT STANDARD RECOVERY GLASS RECTIFIERS Qualified Levels: JAN, JANTX, JANTXV and JANS Qualified to MIL-PRF-19500/420 DESCRIPTION This "standard recovery" surface mount rectifier diode series is military qualified and is ideal for high-reliability applications where a failure cannot be tolerated. These industry-recognized 5.0 Amp rated rectifiers for working peak reverse voltages from 200 to 1000 volts are hermetically sealed with voidless-glass construction using an internal "Category 1" metallurgical bond. These devices are also available in axial-leaded packages for thru-hole mounting. Microsemi also offers numerous other rectifier products to meet higher and lower current ratings with various recovery time speeds. Important: For the latest information, visit our website http://www.microsemi.com. FEATURES * Surface mount equivalent of JEDEC registered 1N5550 thru 1N5554 series. * * * * * Voidless hermetically sealed glass package. Extremely robust construction. Quadruple-layer passivation. Internal "Category 1" Metallurgical bonds. JAN, JANTX, JANTXV and JANS qualified versions available per MIL-PRF-19500/420. * RoHS compliant versions available (commercial grade only). "B" MELF (D-5B) Package Also available in: "B" Package (axial-leaded) 1N5550 - 1N5554 APPLICATIONS / BENEFITS * * * * * * * * Standard recovery 5 Amp rectifiers series 200 to 1000 V. Military and other high-reliability applications. General rectifier applications including bridges, half-bridges, catch diodes, etc. High forward surge current capability. Low thermal resistance. Controlled avalanche with peak reverse power capability. Extremely robust construction. Inherently radiation hard as described in Microsemi "MicroNote 050". MAXIMUM RATINGS @ T A = 25 oC unless otherwise noted. Parameters/Test Conditions Junction and Storage Temperature Thermal Resistance Junction-to-End Cap (1) Thermal Impedance @ 10 ms heating time Maximum Forward Surge Current (8.3 ms half sine) (2) o Average Rectified Forward Current @ TEC = 130 C (3) o Average Rectified Forward Current @ TA = 55 C o @ TA = 100 C Working Peak Reverse Voltage 1N5550US 1N5551US 1N5552US 1N5553US 1N5554US Solder Temperature @ 10 s Symbol Value TJ and TSTG R JEC Z JX I FSM I O(L) (2) I O2 (4) I O3 V RWM -65 to +175 6.5 1.5 100 5 3 2 200 400 600 800 1000 260 TSP o C C/W o C/W A A A A V o O C MSC - Lawrence 6 Lake Street, Lawrence, MA 01841 1-800-446-1158 (978) 620-2600 Fax: (978) 689-0803 MSC - Ireland Gort Road Business Park, Ennis, Co. Clare, Ireland Tel: +353 (0) 65 6840044 Fax: +353 (0) 65 6822298 Website: www.microsemi.com See notes on next page. T4-LDS-0230-1, Rev. 1 (111901) Unit (c)2011 Microsemi Corporation Page 1 of 5 1N5550US thru 1N5554US MAXIMUM RATINGS Notes: 1. Derate linearly at 66.6 mA/C above T EC = 100 C. An I O of up to 6 Amps is allowable provided that appropriate heat sinking or forced air cooling maintains the junction temperature at or below +200 oC. 2. Derate linearly at 22.2 mA/C from +55 C to +100 oC. 3. These I O ratings are for a thermally (PC boards or other) mounting methods where the lead or end-cap temperatures cannot be maintained and where thermal resistance from mounting point to ambient is still sufficiently controlled where T J(MAX) does not exceed 175 oC. This equates to R JX 47 C/W. 4. Derate linearly at 26.7 mA/C above T A = +100 C to +175 C ambient. MECHANICAL and PACKAGING * * * * * * * CASE: Hermetically sealed voidless hard glass with Tungsten slugs. TERMINALS: End caps are Copper with Tin/Lead (Sn/Pb) finish. RoHS compliant matte-Tin is available for commercial only. MARKING: Cathode band only. POLARITY: Cathode indicated by band. TAPE & REEL option: Standard per EIA-481-B. Consult factory for quantities. WEIGHT: 539 milligrams. See Package Dimensions and recommended Pad Layout on last page. PART NOMENCLATURE JAN 1N5550 US (e3) Reliability Level JAN = JAN Level JANTX = JANTX Level JANTXV = JANTXV Level JANS = JANS Level Blank = Commercial RoHS Compliance e3 = RoHS compliant (available on commercial grade only) Blank = non-RoHS compliant MELF Package JEDEC type number See Electrical Characteristics table SYMBOLS & DEFINITIONS Definition Symbol V BR V RWM IO VF IR t rr Minimum Breakdown Voltage: The minimum voltage the device will exhibit at a specified current. Working Peak Reverse Voltage: The maximum peak voltage that can be applied over the operating temperature range excluding all transient voltages (ref JESD282-B). Average Rectified Output Current: The Output Current averaged over a full cycle with a 50 Hz or 60 Hz sine-wave input and a 180 degree conduction angle. Maximum Forward Voltage: The maximum forward voltage the device will exhibit at a specified current. Maximum Reverse Current: The maximum reverse (leakage) current that will flow at the specified voltage and temperature. Reverse Recovery Time: The time interval between the instant the current passes through zero when changing from the forward direction to the reverse direction and a specified decay point after a peak reverse current occurs. T4-LDS-0230-1, Rev. 1 (111901) (c)2011 Microsemi Corporation Page 2 of 5 1N5550US thru 1N5554US ELECTRICAL CHARACTERISTICS @ TA = 25 oC unless otherwise noted. TYPE MINIMUM BREAKDOWN VOLTAGE V BR I R @ 50 A Volts 1N5550US 1N5551US 1N5552US 1N5553US 1N5554US 220 440 660 880 1100 FORWARD VOLTAGE V F @ 9 A (pk) MIN. Volts 0.6 V (pk) 0.6 V (pk) 0.6 V (pk) 0.6 V (pk) 0.6 V (pk) MAX. Volts 1.2 V (pk) 1.2 V (pk) 1.2 V (pk) 1.3 V (pk) 1.3 V (pk) MAXIMUM REVERSE CURRENT I R @ V RWM REVERSE RECOVERY t rr (Note 1) A s 2.0 2.0 2.0 2.0 2.0 1.0 1.0 1.0 1.0 1.0 NOTE 1: I F = 0.5 A, I RM = 1.0 A, I R(REC) = .250 A. T4-LDS-0230-1, Rev. 1 (111901) (c)2011 Microsemi Corporation Page 3 of 5 1N5550US thru 1N5554US o ZJX ( C/Watt) GRAPHS tH Heating Time (seconds) IF - FORWARD CURRENT (A) FIGURE 1 Maximum Thermal Impedance V F - FORWARD VOLTAGE (V) FIGURE 4 Typical Forward Voltage vs. Forward Current T4-LDS-0230-1, Rev. 1 (111901) (c)2011 Microsemi Corporation Page 4 of 5 1N5550US thru 1N5554US PACKAGE DIMENSIONS Ltr INCH MILLIMETERS MIN MAX MIN BL .200 .275 5.08 MAX 6.99 BD .137 .186 3.48 4.72 ECT .019 .034 0.48 0.86 S .003 --- 0.08 --- NOTES: 1. Dimensions are in inches. 2. Millimeters are given for general information only. 3. Dimensions are pre-solder dip. 4. Minimum clearance of glass body to mounting surface on all orientations. 5. In accordance with ASME Y14.5M, diameters are equivalent to x symbology. 6. This package outline has also previously been identified as "D5B". PAD LAYOUT INCH MILLIMETERS A 0.288 7.32 B 0.070 1.78 C 0.155 3.94 Note: If mounting requires adhesive separate from the solder, an additional 0.080 inch diameter contact may be placed in the center between the pads as an optional spot for cement. T4-LDS-0230-1, Rev. 1 (111901) (c)2011 Microsemi Corporation Page 5 of 5