© Semiconductor Components Industries, LLC, 2006
March, 2006 Rev. 4
1Publication Order Number:
P2N2907A/D
P2N2907A
Amplifier Transistor
PNP Silicon
Features
PbFree Packages are Available*
MAXIMUM RATINGS
Rating Symbol Value Unit
CollectorEmitter Voltage VCEO 60 Vdc
CollectorBase Voltage VCBO 60 Vdc
EmitterBase Voltage VEBO 5.0 Vdc
Collector Current Continuous IC600 mAdc
Total Device Dissipation @ TA = 25°C
Derate above 25°C
PD625
5.0
mW
mW/°C
Total Device Dissipation @ TC = 25°C
Derate above 25°C
PD1.5
12
W
mW/°C
Operating and Storage Junction
Temperature Range
TJ, Tstg 55 to
+150
°C
THERMAL CHARACTERISTICS
Characteristic Symbol Max Unit
Thermal Resistance, Junction to Ambient RqJA 200 °C/W
Thermal Resistance, Junction to Case RqJC 83.3 °C/W
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
*For additional information on our PbFree strategy and soldering details, please
download the ON Semiconductor Soldering and Mounting Techniques
Reference Manual, SOLDERRM/D.
TO92
(T0226AA)
CASE 2911
STYLE 17
MARKING
DIAGRAM
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(Note: Microdot may be in either location)
123
P2N2
907A
AYWW G
G
P2N2 = Device Code
907A = Specific Device
A = Assembly Location
Y = Year
WW = Work Week
G= PbFree Package
P2N2907ARL1 TO92
5000 Units / Bulk
P2N2907ARL1G TO92
(PbFree)
5000 Units / Bulk
Device Package Shipping
P2N2907A TO92
2000 / Tape & Ammo
P2N2907AG TO92
(PbFree)
2000 / Tape & Ammo
ORDERING INFORMATION
COLLECTOR
1
2
BASE
3
EMITTER
P2N2907AZL1 TO92
P2N2907AZL1G TO92
(PbFree)
2000 / Tape & Reel
For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.
2000 / Tape & Reel
P2N2907A
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2
ELECTRICAL CHARACTERISTICS (TA = 25°C unless otherwise noted)
Characteristic Symbol Min Max Unit
OFF CHARACTERISTICS
CollectorEmitter Breakdown Voltage (Note 1)
(IC = 10 mAdc, IB = 0)
V(BR)CEO 60 Vdc
CollectorBase Breakdown Voltage
(IC = 10 mAdc, IE = 0)
V(BR)CBO 60 Vdc
EmitterBase Breakdown Voltage
(IE = 10 mAdc, IC = 0)
V(BR)EBO 5.0 Vdc
Collector Cutoff Current
(VCE = 30 Vdc, VEB(off) = 0.5 Vdc)
ICEX 50 nAdc
Collector Cutoff Current
(VCB = 50 Vdc, IE = 0)
(VCB = 50 Vdc, IE = 0, TA = 150°C)
ICBO
0.01
10
mAdc
Emitter Cutoff Current
(VEB = 3.0 Vdc)
IEBO 10 nAdc
Collector Cutoff Current
(VCE = 10 V)
ICEO 10 nAdc
Base Cutoff Current
(VCE = 30 Vdc, VEB(off) = 0.5 Vdc)
IBEX 50 nAdc
ON CHARACTERISTICS
DC Current Gain
(IC = 0.1 mAdc, VCE = 10 Vdc)
(IC = 1.0 mAdc, VCE = 10 Vdc)
(IC = 10 mAdc, VCE = 10 Vdc)
(IC = 150 mAdc, VCE = 10 Vdc) (Note 1)
(IC = 500 mAdc, VCE = 10 Vdc) (Note 1)
hFE 75
100
100
100
50
300
CollectorEmitter Saturation Voltage (Note 1)
(IC = 150 mAdc, IB = 15 mAdc)
(IC = 500 mAdc, IB = 50 mAdc)
VCE(sat)
0.4
1.6
Vdc
BaseEmitter Saturation Voltage (Note 1)
(IC = 150 mAdc, IB = 15 mAdc)
(IC = 500 mAdc, IB = 50 mAdc)
VBE(sat)
1.3
2.6
Vdc
SMALLSIGNAL CHARACTERISTICS
CurrentGain Bandwidth Product (Notes 1 and 2)
(IC = 50 mAdc, VCE = 20 Vdc, f = 100 MHz)
fT200 MHz
Output Capacitance
(VCB = 10 Vdc, IE = 0, f = 1.0 MHz)
Cobo 8.0 pF
Input Capacitance
(VEB = 2.0 Vdc, IC = 0, f = 1.0 MHz)
Cibo 30 pF
SWITCHING CHARACTERISTICS
TurnOn Time
(VCC = 30 Vdc, IC = 150 mAdc,
IB1 = 15 mAdc) (Figures 1 and 5)
ton 50 ns
Delay Time td10 ns
Rise Time tr40 ns
TurnOff Time
(VCC = 6.0 Vdc, IC = 150 mAdc,
IB1 = IB2 = 15 mAdc) (Figure 2)
toff 110 ns
Storage Time ts80 ns
Fall Time tf30 ns
1. Pulse Test: Pulse Width v 300 ms, Duty Cycle v 2.0%.
2. fT is defined as the frequency at which |hfe| extrapolates to unity.
P2N2907A
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3
00
−16 V
200 ns
50
1.0 k
200
−30 V
TO OSCILLOSCOPE
RISE TIME 5.0 ns
+15 V −6.0 V
1.0 k 37
50 1N916
1.0 k
200 ns
−30 V
TO OSCILLOSCOPE
RISE TIME 5.0 ns
INPUT
Zo = 50 W
PRF = 150 PPS
RISE TIME 2.0 ns
P.W. < 200 ns
INPUT
Zo = 50 W
PRF = 150 PPS
RISE TIME 2.0 ns
P.W. < 200 ns
Figure 1. Delay and Rise Time Test Circuit Figure 2. Storage and Fall Time Test Circuit
P2N2907A
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4
TYPICAL CHARACTERISTICS
Figure 3. DC Current Gain
IC, COLLECTOR CURRENT (mA)
0.3
0.5
0.7
1.0
3.0
0.2
−0.1
TJ = 125°C
25°C
−55 °C
VCE = −1.0 V
VCE = −10 V
hFE, NORMALIZED CURRENT GAIN
2.0
−0.2 −0.3 −0.5 −0.7 −1.0 −2.0 −3.0 −5.0 −7.0 −10 −20 −30 −50 −70 −100 −200 −300 −500
Figure 4. Collector Saturation Region
IB, BASE CURRENT (mA)
−0.4
−0.6
−0.8
−1.0
−0.2
V , COLLECTOR−EMITTER VOLTAGE (VOLTS)
0
CE
IC = −1.0 mA
−0.005
−10 mA
−0.01
−100 mA −500 mA
−0.02 −0.03 −0.05 −0.07 −0.1 −0.2 −0.3 −0.5 −0.7 −1.0 −2.0 −3.0 −5.0 −7.0 −10 −20 −30 −50
Figure 5. TurnOn Time
IC, COLLECTOR CURRENT
300
−5.0
Figure 6. TurnOff Time
IC, COLLECTOR CURRENT (mA)
−5.0
t, TIME (ns)
t, TIME (ns)
200
100
70
50
30
20
10
7.0
5.0
3.0
−7.0 −10 −20 −30 −50 −70 −100 −200 −300 −500
tr
2.0 V
td @ VBE(off) = 0 V
VCC = −30 V
IC/IB = 10
TJ = 25°C
500
300
100
70
50
30
20
10
7.0
5.0
−7.0 −10 −20 −30 −50 −70 −100 −200 −300 −500
200
tf
ts = ts − 1/8 tf
VCC = −30 V
IC/IB = 10
IB1 = IB2
TJ = 25°C
P2N2907A
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5
TYPICAL SMALLSIGNAL CHARACTERISTICS
NOISE FIGURE
VCE = 10 Vdc, TA = 25°C
Figure 7. Frequency Effects
f, FREQUENCY (kHz)
10
0.01
Figure 8. Source Resistance Effects
Rs, SOURCE RESISTANCE (OHMS)
NF, NOISE FIGURE (dB)
NF, NOISE FIGURE (dB)
f = 1.0 kHz
IC = −50 mA
−100 mA
−500 mA
−1.0 mA
Rs = OPTIMUM SOURCE RESISTANCE
8.0
6.0
4.0
2.0
0
0.02 0.05 0.1 0.2 0.5 1.0 2.0 5.0 10 20 50 100
10
8.0
6.0
4.0
2.0
050 100 200 500 1.0 k 2.0 k 5.0 k 10 k 20 k 50 k
IC = −1.0 mA, Rs = 430 W
−500 mA, Rs = 560 W
−50 mA, Rs = 2.7 kW
−100 mA, Rs = 1.6 kW
Figure 9. Capacitances
REVERSE VOLTAGE (VOLTS)
30
Figure 10. CurrentGain Bandwidth Product
IC, COLLECTOR CURRENT (mA)
C, CAPACITANCE (pF)
−0.1
2.0
Figure 11. “On” Voltage
IC, COLLECTOR CURRENT (mA)
−1.0
Figure 12. Temperature Coefficients
IC, COLLECTOR CURRENT (mA)
V, VOLTAGE (VOLTS)
TJ = 25°C
VBE(sat) @ IC/IB = 10
VCE(sat) @ IC/IB = 10
VBE(on) @ VCE = −10 V
RqVC for VCE(sat)
fT, CURRENT−GAIN  BANDWIDTH PRODUCT (MHz)
COEFFICIENT (mV/ °C)
20
10
7.0
5.0
3.0
−0.2 −0.3 −0.5 −1.0 −2.0 −3.0 −5.0 −10 −20−30
400
300
200
100
80
60
40
30
20
−1.0 −2.0 −5.0 −10 −20 −50 −100 −200 −500 −1000
−0.8
−0.6
−0.4
−0.2
0
−0.1 −0.2 −0.5 −1.0 −2.0 −5.0 −10 −20 −50 −100 −200 −500
+0.5
0
−0.5
−1.0
−1.5
−2.0
−2.5
−0.1 −0.2 −0.5 −1.0 −2.0 −5.0 −10 −20 −50 −100 −200 −500
Ceb
Ccb
VCE = −20 V
TJ = 25°C
RqVB for VBE
P2N2907A
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6
PACKAGE DIMENSIONS
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. CONTOUR OF PACKAGE BEYOND DIMENSION R
IS UNCONTROLLED.
4. LEAD DIMENSION IS UNCONTROLLED IN P AND
BEYOND DIMENSION K MINIMUM.
STYLE 17:
PIN 1. COLLECTOR
2. BASE
3. EMITTER
R
A
P
J
L
B
K
G
H
SECTION XX
C
V
D
N
N
XX
SEATING
PLANE
DIM MIN MAX MIN MAX
MILLIMETERSINCHES
A0.175 0.205 4.45 5.20
B0.170 0.210 4.32 5.33
C0.125 0.165 3.18 4.19
D0.016 0.021 0.407 0.533
G0.045 0.055 1.15 1.39
H0.095 0.105 2.42 2.66
J0.015 0.020 0.39 0.50
K0.500 −−− 12.70 −−−
L0.250 −−− 6.35 −−−
N0.080 0.105 2.04 2.66
P−−− 0.100 −−− 2.54
R0.115 −−− 2.93 −−−
V0.135 −−− 3.43 −−−
1
TO92 (TO226)
CASE 2911
ISSUE AL
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P2N2907A/D
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