MIC5209
500mA Low-Noise LDO Regulator
Intel is a registered trademark of Intel Corporation.
Micrel Inc. • 2180 Fortune Drive • San Jose, CA 95131 • US A • tel +1 (408) 944-0800 • fax + 1 (408) 474-1000 • http://www.micrel.com
May 1
9, 2015
Revision 4.1
General Description
The MIC5209 is an efficient linear voltage regulator with
very low dr opout voltage, t ypic ally 10mV at l ight loads and
less than 500mV at full load, with better than 1% output
voltage accuracy
Designed especially for hand-held, battery-powered
devices, the MIC5209 features low ground current to help
prolong battery life. An enable/shutdown pin on SO-8 and
TO-263-5 versions can further improve battery life with
near-zero shutdown current.
Key features include reversed-battery protection, current
limiting, overtemperature shutdown, ultra-low-noise
capability (SO-8 and TO-263-5 versions), and availability
in thermally-efficient packaging. The MIC5209 is available
in adjustable or fixed output voltages.
Datasheets and support documentation are available on
Micrel’s web site at: www.micrel.com.
Features
Output voltage range: 1.8V 15V
Meets Intel® Slot 1 and Slot 2 requirements
Guaranteed 500mA output over the full operating
temperature range
Low 500mV maximum dropout voltage at full load
Extremely tight load and line regulation
Thermally-efficient surface-mount package
Low temperature coefficient
Current and thermal limiting
Reversed-battery protection
No-load stability
1% output accuracy
Ultra-low-noise capability in SO-8 and TO-263-5
Ultra-small 3mm × 3mm DFN package
Applications
Pentium II Slot 1 and Slot 2 support circuits
Laptop, notebook, and palmtop computers
Cellular telephones
Consumer and personal electronics
SMPS pos t-regulator/DC-to-DC modules
High-efficiency linear power supplies
Typical Applic ation
3.3V Nominal Input Slot 1 Power Supply
Ultra-Low Noise 5V Regulator
Micrel, Inc.
MIC5209
May 1
9, 2015 2 Revision 4.1
Ordering Information
Part Number Voltage Junction Temperature Range Package Pb-Free
MIC5209-2.5YS 2.5V 40°C to +125°C SOT-223 X
MIC5209-3.0YS 3.0V 40°C to +125°C SOT-223 X
MIC5209-3.3YS 3.3V 40°C to +125°C SOT-223 X
MIC5209-3.6YS 3.6V 40°C to +125°C SOT-223 X
MIC5209-4.2YS 4.2V 40°C to +125°C SOT-223 X
MIC5209-5.0YS 5.0V 40°C to +125°C SOT-223 X
MIC5209-1.8YM(1) 1.8V 0°C to +125°C SOIC-8 X
MIC5209-2.5YM 2.5V 40°C to +125°C SOIC-8 X
MIC5209-3.0YM 3.0V 40°C to +125°C SOIC-8 X
MIC5209-3.3YM 3.3V 40°C to +125°C SOIC-8 X
MIC5209-3.6YM 3.6V 40°C to +125°C SOIC-8 X
MIC5209-5.0YM 5.0V 40°C to +125°C SOIC-8 X
MIC5209YM Adjustable (2.5V 15.0V) 40°C to +125°C SOIC-8 X
Adjustable (1.8V 2.5V) 0°C to +125°C
MIC5209-1.8YU
1.8V 0°C to +125°C TO-263-5 X
MIC5209-2.5YU 2.5V 40°C to +125°C TO-263-5 X
MIC5209-3.0YU 3.0V 40°C to +125°C TO-263-5 X
MIC5209-3.3YU 3.3V 40°C to +125°C TO-263-5 X
MIC5209-3.6YU 3.6V 40°C to +125°C TO-263-5 X
MIC5209-5.0YU 5.0V 40°C to +125°C TO-263-5 X
MIC5209YU Adjustable (2.5V 15.0V) 40°C to +125°C TO-263-5 X
Adjustable (1.8V 2.5V) 0°C to +125°C
MIC5209YML Adjustable (2.5V 15.0V) 40°C to +125°C 8-Pin DFN X
Adjustable (1.8V 2.5V) 0°C to +125°C
Note:
1. Contact Mic rel for availabi l ity.
Micrel, Inc.
MIC5209
May 1
9, 2015 3 Revision 4.1
Pin Configuration
MIC5209-x.xYS
SOT-223
Fixed Voltages
MIC5209YML
8-Pin 3mm × 3mm DFN
Adjustable Voltages
MIC5209-x.xYM
SO-8
Fixed Voltages
MIC5209-x.xYU
TO-263-5
Fixed Voltages
MIC5209YM
SO-8
Adjustable Voltages
MIC5209YU
TO-263-5
Adjustable Voltages
Micrel, Inc.
MIC5209
May 1
9, 2015 4 Revision 4.1
Pin Description
Pin Number
8-Pin DFN Pin Number
SOT-223 Pin Number
SO-8 Pin Number
TO-263-5 Pin Name Pin Function
1, 2 1 2 2 IN Supply Input.
7 2, TAB 5 8 3, TAB GND Ground: SOT-223 Pin 2 and TAB are
internally connected. SO-8 Pins 5 through 8
are internally connected.
3, 4 3 3 4 OUT Regulator Output: Pins 3 and 4 must be tied
together.
5 NC Not Connected.
8 1 1 EN Enable (Input): CMOS-compatible cont rol
input. Logic High = Enable; Logic Low =
Shutdown.
4 (Fixed) 5 (Fixed) BYP
Reference Bypass: Connect external 470pF
capacitor to GND to reduce output noise. Can
be left open. For 1.8V or 2.5V operation, see
Application Information.
6 4 (Adjustable) 5 (Adjustable) ADJ Adjust (Input): Feedback input. Connect to
resistive voltage-div ider network.
EP ePad Exposed Thermal Pad: Connect to GND for
best thermal perfo rma nce .
Micrel, Inc.
MIC5209
May 1
9, 2015 5 Revision 4.1
Absolute Maximum Ratings(2)
Supply Voltage (VIN) ....................................... 20V to +20V
Power Dissipation (PD). .......................... Interna ll y Lim ited(4)
Junction Temperature (TJ)
All Except 1.8V ................................... 40°C to +125°C
1.8V Only ................................................ 0°C to +125°C
Lead Temperature (soldering, 5s) .............................. 260°C
Storage Temperature (TS) ......................... 65°C to +150°C
ESD Rating
SOT-223 ........................................ 2kV HBM/300V MM
DFN, SOIC-8 ................................. 5kV HBM/100V MM
Operating Ratings(3)
Supply Voltage (VIN) ...................................... +2.5V to +16V
Adjustable Output Voltage (VOUT) Range ..... +1.8V to 15.0V
Junction Temperature (TJ)
2.5V 15.0V ....................................... 40°C to +125°C
1.8V VOUT < 2.5V .................................. 0°C to +125°C
Package Thermal Resistance .................................... Note 4
Electrical Characteristics
VIN = VOUT + 1V, COUT = 4.7µF, IOUT = 100µA; TJ = 25°C, bold values indicate40°C TJ +125°C, except 0°C TJ +125°C
for 1.8V VOUT < 2.5V, unless noted.
Symbol Parameter Condition Min. Typ. Max. Units
VOUT Output Voltage Accuracy Variation from nominal VOUT 1 1 %
2 2
VOUT/T Output Voltage Temperature Co-Efficient Note 5 40 ppm/°C
VOUT/ VOUT
Line Regulation VIN = VOUT + 1V to 16V 0.009 0.05 %/V
0.1
Load Regulation IOUT = 100µA to 500mA(6) 0.05 0.5 %
0.7
VIN VOUT Dropout Voltage(7)
IOUT = 100µA 10 60
mV
80
IOUT = 50mA 115 175
250
IOUT = 150mA 165 300
400
IOUT = 500mA 350 500
600
Notes:
2. Exceeding the absolute maximum ratings m ay damage the device.
3. The device is not guarant eed to function outside its operat i ng ratings.
4. The maximum allowable power dissipation at any TA (ambient temperature) is calculated using: PD(MAX) = (TJ(MAX) – TA) θJA. Exceeding the maximum
allowable power dissi pation will res ul t in excessi ve di e temperat ure, and the regulat or will go into thermal shutdown. See Tabl e 1 and the Thermal
Considerationssub-section i n Application Information for details.
5. Output voltage temperature coefficient is the worst case voltage change divided by the total temperature range.
6. Regulation is m easured at constant j unct i on temperature using low duty cycle pulse testing. Parts are tested for load regulation in the load range
from 100µA to 500mA. Changes in output voltage due to heating effects are covered by the thermal regulation specification.
7. Dropout voltage is defined as the input to output differential at which the output volt age drops 2% below its nominal value measured at 1V
differential.
8. Ground pin current is t he regulator quiescent current plus pass trans istor base current. The total current drawn from the supply is the sum of the load
current pl us the ground pin current.
9. VEN is the voltage externally applied to devic es with t he EN (enable) input pi n. [SO-8 (M) and TO-263-5 (U) packages only.]
Micrel, Inc.
MIC5209
May 1
9, 2015 6 Revision 4.1
Electrical Characteristics (Continued)
VIN = VOUT + 1V, COUT = 4.7µF, IOUT = 100µA; TJ = 25°C, bold values indicate40°C TJ +125°C, except 0°C TJ +125°C
for 1.8V VOUT < 2.5V, unless noted.
Symbol Parameter Condition Min. Typ. Max. Units
IGND Ground Pin Current(8, 9)
VEN 3.0V, IOUT = 100µA 80 130
µA
170
VEN 3.0V, IOUT = 50mA 350 650
900
VEN 3.0V, IOUT = 150mA 1.8 2.5
mA
3.0
VEN 3.0V, IOUT = 500mA 8 20
25
IGND Ground Pin Quiescent Current(9) VEN 0.4V (Shutdown) 0.05 3 µA
VEN 0.18V (Shutdown) 0.10 8
PSRR Ripple Rejection f = 120Hz 75 dB
ILIMIT Current Limit VOUT = 0V 700 900 mA
1000
VOUT/PD Thermal Regulation Note 10 0.05 %/W
eNO Output Noise(11)
VOUT = 2.5V, IOUT = 50m A
COUT = 2.2µF, CBYP = 0 500 nV Hz
IOUT = 50mA, COUT = 2.2µF
CBYP = 470pF 300
VENL Enable Input Logic-Low Voltage
VEN = Logic Low
(Regulator Shutdown) 0.4
V
0.18
VEN = Logic High
(Regulator Enabled) 2.0
IENL Enable Input Current VENL 0.4V 0.01 1 µA
VENL 0.18V 0.01
2
IENH
VENH 2.0V 5 20
µA
25
VENH 16V 30
50
Notes:
10. Therm al regulat i on is the change in output voltage at a time “t” after a change in power dissipation is applied, excluding load or line regulati on
effects. Specifications are for a 500mA load pulse at VIN = 16V for t = 10ms.
11. CBYP is an optional, external bypass capacitor connected to devices wi th a BYP (bypass) or ADJ (adjust) pin. [SO-8 (M) and TO-263-5 (U) packages
only].
Micrel, Inc.
MIC5209
May 1
9, 2015 7 Revision 4.1
Block Diagrams
Low-Noise Fixed Regulator (SOT-223 Version Only)
Ultra-Low-Noise Fixed Regulator
Ultra-Low-Noise Adjustabl e Regul ator
Micrel, Inc.
MIC5209
May 1
9, 2015 8 Revision 4.1
Typical Characteristics
Micrel, Inc.
MIC5209
May 1
9, 2015 9 Revision 4.1
Typical Characteristics (Continued)
Micrel, Inc.
MIC5209
May 1
9, 2015 10 Revision 4.1
Application Information
Enable Shutdown
Enable is not available on devices in the SOT-223 (S)
package.
Forcing EN (enable/shutdown) high (> 2V) enables the
regulator. EN is compatible with CMOS logic. If the
enable/shutdown feature is not required, connect EN to
IN (supply input).
Input Capacitor
A 1µF capacit or shoul d be place d from IN to GND if there
is more than 1 0 inches of wir e between the input and the
AC filter capacitor or if a battery is used as the input.
Output Capacitor
An output capacitor is required between OUT and GND
to prevent oscillation. The minimum size of the output
capacitor is de pendent upon whether a reference bypass
capacitor is used. 1µF minimum is recommended when
CBYP is not used (see Figure 1). 2.2µF minimum is
recommended when CBYP is 470pF (see Figure 2).
Larger values improve the regulator’s transient response.
The output capacitor should have an ESR (equivalent
series resistance) of about and a resonant frequency
above 1MH z. Ultra-low-ESR and ceram ic capacitors can
cause a low amplitude oscillation on the output and/or
underdamped transient response. Most tantalum or
aluminum electrolytic capacitors are adequate; film types
will work , but are m ore expensive. Sinc e many alum inum
electrol ytics have electrol ytes that freeze at about 30°C,
solid tantalums are recommended for operation below
25°C.
At lower values of ou tput c ur rent, les s o utput cap acita nce
is needed for output stability. The capacitor can be
reduced to 0.47µF for current below 10mA or 0.33µF for
currents below 1mA.
No-Load Stability
The MIC52 09 will rem ain stable and in regulation with no
load (other than the internal voltage divider) unlike many
other voltage regulators. This is especially important in
CMOS RAM keep-alive applications.
Reference Bypass Capacitor
BYP (reference bypass) is available only on devices in
SO-8 and TO-263-5 packages.
BYP is connected to the internal voltage reference. A
470pF capacitor (CBYP) connected from BYP to GND
quiets this reference, providing a significant reduction in
output no ise ( ultra-low-noise per f orm anc e) . Becaus e C BYP
reduces the ph as e margin, the out put c apacitor shou ld be
increased to at least 2.2µF to maintain stability.
The start-up speed of the MIC5209 is inversely
proportional to the size of the reference bypass capacitor.
Applications requiring a slow ramp-up of output voltage
should consider larger values of CBYP. Likewise, if rapid
turn-on is necessary, consider omitting CBYP.
If output noise is not critical, omit CBYP and leave BYP
open.
Thermal Considerations
The SOT-223 has a ground tab which allows it to
dissipate more power than the SO-8 (refer to the “Slot-1
Power Supply sub-section for details). At 25°C ambient,
it will operate reliably at 2W dissipation with “worst-case”
mounting (no ground plane, minimum trace widths, and
FR4 printed circuit board).
Thermal resistance values for the SO-8 represent typical
mounting on a 1”-squ are, copper-clad, FR4 circuit board.
For greater power dissipation, SO-8 versions of the
MIC5209 feature a fused internal lead frame and die
bonding arrangement that reduces thermal resistance
when compared to standard SO-8 packages.
Table 1. MIC5209 Thermal Resistance
Package
θ
JA
θ
JC
SOT-223 (S) 50°C/W 8°C/W
SO-8 (M) 50°C/W 20°C/W
TO-263-5 (U) 2°C/W
3mm × 3mm DFN (ML) 63°C/W 2°C/W
Multilayer boards with a ground plane, wide traces near
the pads, and large supply-bus lines will have better
thermal conductivity and will also allow additional power
dissipation.
For additional heat sink characteristics, refer to Micrel
Application Hint 17, Designing P.C. Board Heat Sinks,
included in Micrel’s Databook. For a full discussion of
heat sinking and thermal effects on voltage regulators,
refer to the Regulator Thermals section of Micrel’s
Designing with Low-Dropout Voltage Regulators
handbook.
Low-Voltage Operation
The MIC5209-1.8 and MIC5209-2.5 require special
consideration when used in voltage-sensitive systems.
They may momentarily overshoot their nominal output
voltages unless appropriate output and bypass capacitor
values are chosen.
During regulator power up, the pass transistor is fully
saturated for a short time, while the error amplifier and
voltage reference ar e being powered u p more slowl y from
the output (see Block Diagrams).
Micrel, Inc.
MIC5209
May 1
9, 2015 11 Revision 4.1
Selecting larger output and bypass capacitors allows
additional time for the error amplifier and reference to
turn on and prevent overshoot.
To ensure that no overshoot is present when starting up
into a li ght load (100µ A), use a 4.7µF output capac itance
and 470pF bypass capacitance. This slows the turn-on
enough to allow the regulator to react and keep the
output voltage from exceeding its nominal value. At
heavier lo ads, us e a 10µF outp ut capac itance a nd 470pF
bypass capacitance. Lower values of output and bypass
capacitance can be used, depending on the sensitivity of
the system.
Applications that can withstand some overshoot on the
output of the regulator can reduce the output capacitor
and/or reduce or eliminate the bypass capacitor.
Applications that are not sensitive to overshoot due to
power-on reset dela ys can us e norm al output and b ypass
capacitor configurations.
Please note the junction temperature range of the
regulator with an output less than 2.5V (fixed and
adjustable) is 0°C to +125°C.
Fixed Regulator Circuits
Figure 1 shows a basic MIC5209-x.xYM (SO-8) fixed-
voltage regulator circuit. See Figure 5 for a similar
configuration using the more thermally-efficient MIC5209-
x.xYS (SOT-223). A 1µF minimum output capacitor is
required for basic fixed- vo l tage app lica tio ns .
Figure 1. Low-Noise Fixed Voltage Regulator
Figure 2 includes the optional 470pF noise bypass
capacitor between BYP and GND to reduce output noise.
Note that the minimum value of COUT must be increased
when the bypass capac itor is used.
Figure 2. Ultra-Low-Noise Fixed Voltage Regulator
Adjustable Regulator Circuits
The MIC5209 YM, MIC5 209 YU, and MIC5 209YM L can be
adjusted to a specific output voltage by using two
external resistors (Figure 3). The resistors set the output
voltage based on the equation:
+= 1R2R
1V242.1VOUT
Eq. 1
This equation is correct due to the configuration of the
bandgap reference. The bandgap voltage is relative to
the output, as seen in the block diagram. Traditional
regulators normall y have th e reference volta ge relative to
ground; therefore, their equations are different from the
equation for the MIC5209Y.
Although ADJ is a high-impedance input and, for best
performance, R2 should not exceed 470kΩ.
Figure 3. Low-Noise Adjustable Voltage Regulator
Figure 4 includes the optional 470pF bypass capacitor
from ADJ to GND to reduce output noise.
Figure 4. Ultra-Low-Noise Adjustable Application
Micrel, Inc.
MIC5209
May 1
9, 2015 12 Revision 4.1
Slot-1 Power Supply
Intel’s Pentium II processors have a requirement for a
2.5V ±5% power supply for a clock synthesizer and its
associated loads. The current requirement for the 2.5V
suppl y is depe ndent u pon t he cl ock s ynthesizer use d, the
number of clock outputs, and the type of level shifter
(from core logic levels to 2.5V levels). Intel estimates a
“worst-case” load of 320mA.
The MIC5209 was designed to provide the 2.5V power
requirement for Slot-1 applications. Its guaranteed
performance of 2.5V ±3% at 500mA allows adequate
margin for all s ystems , and the dr opo ut vol tage of 500m V
means that it operates from a “worst-case” 3.3V supply
where the voltage can be as low as 3.0V.
Figure 5. Slot-1 Power Supply
A Slot-1 power supply (Figure 5) is easy to implement.
Only two capacitors are necessary, and their values are
not critical. CIN b ypasses the internal circuitry and should
be at least 0.1µF. COUT provides output filtering,
improves transient response, and compensates the
internal r egulat or contr ol lo op. Its value sh ou ld be at l east
22µF. CIN and COUT can be increased as much as
desired.
Slot-1 Power Supply Power Dissipation
Powered from a 3.3V supply, the Slot-1 power supply
illustrate d in Figure 5 has a nominal efficiency of 75%. At
the maximum anticipated Slot-1 load (320mA), the
nominal power dissipation is only 256mW.
The SOT-223 package has sufficient thermal
character istic s f or wide design margins when mounted on
a single-layer copper-clad printed circuit board. The
power dissipation of the MIC5209 is calculated using the
voltage drop across the device outp ut current p lus suppl y
voltage ground current.
Considering “worst-case” tolerances, the power
dissipatio n cou ld be as high as:
(VIN(MAX) VOUT(MAX)) × IOUT + VIN(MAX) × IGND
[(3.6V 2.375V) × 320mA] + (3.6V × 4mA)
PD = 407mW
Using the m aximum j unction temperatur e of 125°C and a
θJC of 8°C/W for the SOT-223, 25°C/W for the SO-8, or
2°C/W for the TO-263 package, the following worst-case
heat-sink thermal resistance (θSA) requirements are:
JC
JA
SA
D
A
)MAX
(J
JA
PT
T
θ=
θ
=
θ
=θ
Table 2 and Figure 6 show that the Slot-1 power supply
application can be implemented with a m inimum f ootprint
layout.
Table 2. Maximum Allowable Thermal Resistance
TA 40
°
C 50
°
C 60
°
C 75
°
C
θJA (Limit) 209°C/W 184°C/W 160°C/W 123°C/W
θSA SOT-223 201°C/W 176°C/W 152°C/W 115°C/W
θSA SO-8 184°C/W 159°C/W 135°C/W 98°C/W
θSA TO-263-5 207°C/W 182°C/W 158°C/W 121°C/W
Figure 6 shows the necessary copper pad area to obtain
specif ic heatsink ther mal resistanc e (θSA) values. T he θSA
values highlighted in Table 2 require much less than
500mm2 of copper and, per Figure 6, can be easily
accomplished with the minimum footprint.
Figure 6. PCB Heatsink Thermal Resistance
Micrel, Inc.
MIC5209
May 1
9, 2015 13 Revision 4.1
Package Information and Recommended Land Patterns(12)
SOT-223 (S)
Note:
12. Package information is correct as of the publication date. For updates and most current information, go to www.micrel.com.
Micrel, Inc.
MIC5209
May 1
9, 2015 14 Revision 4.1
Package Information and Recommended Land Patterns(12) (Continued)
8-Pin SOIC (M)
Micrel, Inc.
MIC5209
May 1
9, 2015 15 Revision 4.1
Package Information and Recommended Land Patterns(12) (Continued)
TO-263-5 (U)
Micrel, Inc.
MIC5209
May 1
9, 2015 16 Revision 4.1
Package Information and Recommended Land Patterns(12) (Continued)
8-Pin 3mm × 3mm DFN (ML)
Micrel, Inc.
MIC5209
May 1
9, 2015 17 Revision 4.1
MICREL, INC. 2180 FORTUNE DRIVE SAN JOSE, CA 95131 USA
TEL +1 (408) 944-0800 FAX +1 (408) 474-1000 WEB http://www.micrel.com
Micrel, Inc. is a leading gl obal manufacturer of IC s olutions for the worldwide high
-
perform ance linear and power, LAN, and t iming & communicat ions
markets. The Company’s products include advanced
mixed-signal, analog & power semiconductors; high-
performance communication, clock
management,
MEMs-based clock oscillators & crystal-less clock generators, Ethernet switches, and physical layer transceiver ICs.
Company
customers include leading manufact
urers of enterprise, consumer, industrial, mobile, telecommunications, automotive, and computer products.
Corporation headquarters and state
-of-the-
art wafer fabrication facilities are located in San Jose, CA, with regional sales and support offices and
advanced technol ogy design centers s ituated throughout the Americas, Europe, and Asia.
Additionally, the Company maintains an extensive network
of distribut ors and reps worldwide.
Micrel makes no representations or warranties with respect to the accuracy
or completeness of the information furnished in this data
sheet. This
information is not intended as a warranty and Micrel does not assume responsibility for its use.
Micrel reserves the right to change circuitry,
specifications and descriptions at any ti
me without notice.
No license, whether express, implied, arising by estoppel or otherwise, to any intellectual
property rights
is granted by this document. Except as provided in Micrel’s t erms and condi tions of sale for such produc ts, Mic rel assumes no li
ability
whatsoever, and Micrel disclaims any express or implied warranty relating to the sale and/or use of Micrel products including
liability or warranties
relating to fitness for a partic ular purpose, merchant abi lit y, or inf ri ngem ent of any patent, copy
right, or other intellectual property right.
Micrel Products are not designed or authorized for use as components in life support appliances, devices or systems where malfunction of a product
can reasonably be expected to result in personal injury. Life support devices or systems are devices or systems that (a) are intended for surgical
implant i nto t he body or (b) support or sustain life, and whose fai l ure t o perform can be reasonably expect ed t o resul t in a si gni f icant injury to the user. A
Purchaser’s u
se or sale of Micrel Produc ts f or use i n l ife s upport appliances, devices or s yst ems is a Purc haser’s own risk and Purchaser
agrees to ful l y
indemnify Mic rel for any damages resulting from such use or sale.
© 2014 Micrel, Incorporated.