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1. Product profile
1.1 General description
NPN single switching transistor in a leadless ultra small SOT883B Surface-Mounted
Device (SMD) plastic package.
PNP complement: PMBT3906MB.
1.2 Features and benefits
Single general-purpose switching transistor
AEC-Q101 qualified
Ultra small SMD plastic package
Board-space reduction
Low package height of 0.37 mm
1.3 Applications
General-purpose switching and amplification
Mobile applications
1.4 Quick reference data
2. Pinning information
PMBT3904MB
40 V, 200 mA NPN switching transistor
Rev. 1 — 7 March 2012 Product data sheet
SOT883B
Table 1. Quick reference data
Symbol Parameter Conditions Min Typ Max Unit
VCEO collector-emitter voltage open base - - 40 V
ICcollector current - - 200 mA
hFE DC current gain VCE =1V;
IC=10mA 100 180 300
Table 2. Pinning
Pin Description Simplified outline Graphic symbol
1base
2emitter
3 collector
3
1
2
Transparent
top view
sym021
3
2
1
PMBT3904MB_1 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2012. All rights reserved.
Product data sheet Rev. 1 — 7 March 2012 2 of 13
NXP Semiconductors PMBT3904MB
40 V, 200 mA NPN switching tran si st o r
3. Ordering information
4. Marking
[1] For SOT883B binary marking code description see Figure 1.
4.1 Binary marking code description
Tabl e 3. Ordering i nfo rmation
Type number Package
Name Description Version
PMBT3904MB leadless ultra small plastic package; 3 solder lands;
body 1.0 0.6 0.37 mm SOT883B
Table 4. Marking codes
Type number Marking code[1]
PMBT3904MB 0100 0111
Fig 1. SOT883B binary marking code desc ription
MARKING CODE
(EXAMPLE)
PIN 1 INDICATION READING DIRECTION
READING DIRECTION
READING EXAMPLE:
0111
1011
006aac673
PMBT3904MB_1 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2012. All rights reserved.
Product data sheet Rev. 1 — 7 March 2012 3 of 13
NXP Semiconductors PMBT3904MB
40 V, 200 mA NPN switching tran si st o r
5. Limiting values
[1] Reflow soldering is the only recommended soldering method.
[2] Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated and standard
footprint.
[3] Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for collector 1 cm2.
Table 5. Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol Parameter Conditions Min Max Unit
VCBO collector-base voltage open emitter - 60 V
VCEO collector-emitter voltage open base - 40 V
VEBO emitter-base voltage open collector - 6 V
ICcollector current - 200 mA
ICM peak collector current single pulse;
tp1ms -200mA
IBM peak base current single pulse;
tp1ms -100mA
Ptot total power dissipation Tamb 25 C[1][2] -250mW
[1][3] -590mW
Tjjunction temperature - 150 C
Tamb ambient temperature 55 +150 C
Tstg storage temperature 65 +150 C
PMBT3904MB_1 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2012. All rights reserved.
Product data sheet Rev. 1 — 7 March 2012 4 of 13
NXP Semiconductors PMBT3904MB
40 V, 200 mA NPN switching tran si st o r
6. Thermal characteristics
[1] Reflow soldering is the only recommended soldering method.
[2] Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint.
[3] Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for collector 1 cm2.
Table 6. Thermal characteristics
Symbol Parameter Conditions Min Typ Max Unit
Rth(j-a) thermal resistance from
junction to ambient in free air [1][2] - - 500 K/W
[1][3] - - 212 K/W
FR4 PCB, standard footprint
Fig 2. Transient thermal impedance from junc tio n to ambient as a function of pulse duration; typical values
006aab603
10
−5
1010
−2
10
−4
10
2
10
−1
t
p
(s)
10
−3
10
3
1
10
2
10
10
3
Z
th(j-a)
(K/W)
1
duty cycle =
10.75
0.5 0.33
0.2
0.1
0.05 0.02
0.01
0
PMBT3904MB_1 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2012. All rights reserved.
Product data sheet Rev. 1 — 7 March 2012 5 of 13
NXP Semiconductors PMBT3904MB
40 V, 200 mA NPN switching tran si st o r
7. Characteristics
[1] Pulse test: tp300 s; 0.02.
Table 7. Characteristics
Tamb =25
C unless otherwise specified.
Symbol Parameter Conditions Min Typ Max Unit
ICBO collector-base cut-off
current VCB =30V; I
E=0A - - 50 nA
IEBO emitter-base cut-of f
current VEB =6V; I
C=0A - - 50 nA
hFE DC current gain VCE =1V
IC= 0.1 mA 60 180 -
IC= 1 mA 80 180 -
IC= 10 mA 100 180 300
IC= 50 mA 60 105 -
IC= 100 mA [1] 30 50 -
VCEsat collector-emitter
saturation voltage IC=10mA; I
B= 1 mA - 75 200 mV
IC=50mA; I
B= 5 mA - 120 300 mV
VBEsat base-emitter
saturation voltage IC=10mA; I
B= 1 mA 650 750 850 mV
IC=50mA; I
B= 5 mA - 850 950 mV
tddelay time VCC =3V; I
C=10mA;
IBon =1mA;
IBoff =1mA
--35ns
trrise time - - 35 ns
ton turn-on time - - 70 ns
tsstorage time - - 200 ns
tffall time - - 50 ns
toff turn-off time - - 250 ns
Cccollector capacitance VCB =5V; I
E=i
e=0A;
f=1MHz --4pF
Ceemitter capacitance VEB = 500 mV;
IC=i
c=0A; f=1MHz --8pF
fTtransition frequency VCE =20V; I
C=10mA;
f = 100 MHz 300 - - MHz
NF noise figure VCE =5V; I
C=100A;
RS=1k;
f = 10 Hz to 15.7 kHz
--5dB
PMBT3904MB_1 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2012. All rights reserved.
Product data sheet Rev. 1 — 7 March 2012 6 of 13
NXP Semiconductors PMBT3904MB
40 V, 200 mA NPN switching tran si st o r
VCE =1V
(1) Tamb = 150 C
(2) Tamb =25C
(3) Tamb =55 C
Tamb =25C
Fig 3. DC current gain as a function of collector
current; typical values Fig 4. Collector current as a function of
collector-emitter voltage; typical values
006aab115
200
400
600
h
FE
0
I
C
(mA)
10
−1
10
3
10
2
110
(1)
(2)
(3)
VCE (V)
0108462
006aab116
0.10
0.05
0.15
0.20
IC
(A)
0.0
IB (mA) = 5.0 4.5
3.5
3.0 2.5
2.0 1.5
1.0
0.5
4.0
PMBT3904MB_1 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2012. All rights reserved.
Product data sheet Rev. 1 — 7 March 2012 7 of 13
NXP Semiconductors PMBT3904MB
40 V, 200 mA NPN switching tran si st o r
VCE =1V
(1) Tamb =55 C
(2) Tamb =25C
(3) Tamb = 150 C
IC/IB=10
(1) Tamb =55 C
(2) Tamb =25C
(3) Tamb = 150 C
Fig 5. Base-emitter voltage as a function of collector
current; typical values Fig 6. Base-emitter saturation voltage as a function
of collector current; typica l values
IC/IB=10
(1) Tamb = 150 C
(2) Tamb =25C
(3) Tamb =55 C
Fig 7. Collector-emitter saturation voltage as a function of collector current; typical values
006aab117
0.4
0.8
1.2
V
BE
(V)
0
I
C
(mA)
10
−1
10
3
10
2
110
(1)
(2)
(3)
006aab118
IC (mA)
10−1103
102
110
0.5
0.9
1.3
VBEsat
(V)
0.1
(1)
(2)
(3)
006aab119
IC (mA)
10−1103
102
110
10−1
1
VCEsat
(V)
10−2
(1)
(3)
(2)
PMBT3904MB_1 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2012. All rights reserved.
Product data sheet Rev. 1 — 7 March 2012 8 of 13
NXP Semiconductors PMBT3904MB
40 V, 200 mA NPN switching tran si st o r
8. Test information
8.1 Quality information
This product has been qualified in accordance with the Automotive Electronics Council
(AEC) standard Q101 - Stress test qualification for discrete semiconductors, and is
suitable for use in automotive applications.
9. Package outline
VI= 5 V; t = 600 s; tp=10s; tr=t
f3ns
R1 = 56 ; R2 = 2.5 k; RB=3.9k; RC= 270
VBB =1.9 V; VCC =3V
Oscilloscope: input impedance Zi=50
Fig 8. Test circuit for switching times
Fig 9. Package outline SOT883B
11-11-02Dimensions in mm
2
3
0.55
0.47
0.30
0.22
1
0.40
0.34
0.30
0.22
0.20
0.12
0.65
0.04 max
0.35
0.65
0.55
1.05
0.95
PMBT3904MB_1 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2012. All rights reserved.
Product data sheet Rev. 1 — 7 March 2012 9 of 13
NXP Semiconductors PMBT3904MB
40 V, 200 mA NPN switching tran si st o r
10. Packing information
[1] For further information and the availability of packing methods, see Section 14.
11. Soldering
Table 8. Packing methods
The indicated -xxx are the last thre e digits of the 12NC ordering code.[1]
Type number Package Description Packing quantity
10000
PMBT3904MB SOT883B 2 mm pitch, 8 mm tape and reel -315
Reflow soldering is the only recommended soldering method.
Fig 10. Reflow soldering footprint SOT883B
1.3
0.3
0.6 0.7
0.4
0.9
0.3
(2x)
0.4
(2x)
0.25
(2x)
R0.05 (8x)
0.7
Footprint information for reflow soldering SOT883B
sot883b_fr
occupied area
solder land
solder resist
solder land plus solder paste
solder paste deposit
Dimensions in mm
PMBT3904MB_1 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2012. All rights reserved.
Product data sheet Rev. 1 — 7 March 2012 10 of 13
NXP Semiconductors PMBT3904MB
40 V, 200 mA NPN switching tran si st o r
12. Revision history
Table 9. Revision history
Document ID Release da te Data sheet status Change notice Supersedes
PMBT3904MB v.1 20120307 Product data sheet - -
PMBT3904MB_1 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2012. All rights reserved.
Product data sheet Rev. 1 — 7 March 2012 11 of 13
NXP Semiconductors PMBT3904MB
40 V, 200 mA NPN switching tran si st o r
13. Legal information
13.1 Data sheet status
[1] Please consult the most recently issued document before initiating or completing a design.
[2] The term ‘short data sheet’ is explained in section “Definitions”.
[3] The product status of device (s) descr ibed in th is docume nt may have cha nged since this docume nt was publis hed and ma y dif fer in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nxp.com.
13.2 Definitions
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liab ility for the consequences of
use of such information.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and tit le. A short data sh eet is intended
for quick reference only and shou ld not be rel ied u pon to cont ain det ailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conf lict with the short data sheet, the
full data sheet shall pre vail.
Product specificat io n — The information and data provided in a Product
data sheet shall define the specification of the product as agreed between
NXP Semiconductors and its customer, unless NXP Semiconductors and
customer have explicitly agreed otherwise in writing. In no event however,
shall an agreement be valid in which the NXP Semiconductors product is
deemed to off er functions and qualities beyond those described in the
Product data sheet.
13.3 Disclaimers
Limited warr a nty and liability — Information in this document is believed to
be accurate and reliable. However, NXP Semiconductors does not give any
representations or warranties, expressed or implied, as to the accuracy or
completeness of such information and shall have no liability for the
consequences of use of such information. NXP Se miconductors takes no
responsibility for the content in this document if provided by an inf ormation
source outside of NXP Semiconductors.
In no event shall NXP Semiconductors be liable for any indirect, incidental ,
punitive, special or consequ ential damages (including - wit hout limitatio n - lost
profits, lost savings, business interruption, costs related to the removal or
replacement of any products or rework charges) whether or not such
damages are based on tort (including negligence), warranty, breach of
contract or any other legal theory.
Notwithstanding any damages that customer might incur for any reason
whatsoever, NXP Semiconductors’ ag gregate and cumulative l iability toward s
customer for the products described herein shall be limited in accordance
with the Terms and conditions of commercial sale of NXP Semicondu ctors.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all informa tion supplied prior
to the publication hereof .
Suitability for use — NXP Semiconductors products are not designed,
authorized or warranted to be suitable for use in life support, life-critical or
safety-critical systems or equipment, nor in applications where failure or
malfunction of an NXP Semiconductors pro duct can reasonably be expected
to result in perso nal injury, death or severe propert y or environmental
damage. NXP Semiconductors and its suppliers accept no liability for
inclusion and/or use of NXP Semiconducto rs products in such equipment or
applications and ther efore such inclu sion and/or use is at the cu stomer’s own
risk.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty tha t such application s will be suitable for the
specified use without further testing or modification.
Customers are responsible for the design and ope ration of their applications
and products using NXP Semiconductors product s, and NXP Semiconductors
accepts no liability for any assistance with applications or customer product
design. It is customer’s sole responsibility to determine whether the NXP
Semiconductors product is suit able and fit for the custome r’s applications and
products planned, as well as fo r the planned application and use of
customer’s third party customer(s). Customers should provide appropriate
design and operating safeguards to minimize the risks associated with their
applications and products.
NXP Semiconductors does not accept any liabili ty related to any default,
damage, costs or problem which is based on any weakness or default in the
customer’s applications or products, or the application or use by customer’s
third party customer(s). Customer is responsible for doing all necessa ry
testing for th e customer’s applications and pro ducts using NXP
Semiconductors products in order to avoid a default of the applications and
the products or of the application or use by cust omer’s third party
customer(s). NXP does not accept any liability in this respect.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) will cause permanent
damage to the device. Limiting values are stress ratings only and (proper)
operation of the device at these or any other conditions above those given in
the Recommended operating conditions section (if present) or the
Characteristics sections of this document is not warranted. Constant or
repeated exposure to limiting values will permanent ly and irreversibly affect
the quality and reliability of the device.
Terms and conditions of commercial sale — NXP Semiconductors
products are sold subject to the general terms and conditions of commercial
sale, as published at http://www.nxp.com/profile/terms, unless otherwise
agreed in a valid written individua l agreement. In case an individual
agreement is concluded only the ter ms and conditions of the respective
agreement shall apply. NXP Semiconductors hereby expressly objects to
applying the customer’s general terms and conditions with regard to the
purchase of NXP Semiconductors products by customer.
No offer to sell or license — Nothing i n this document may be interpreted or
construed as an of fer t o sell product s that is open for accept ance or t he grant,
conveyance or implication of any license under any copyrights, patents or
other industrial or intellectual property rights.
Document status[1][2] Product status[3] Definition
Objective [short] data sheet Development This document contains data from the obj ective specification for product development.
Preliminary [short] dat a sheet Qualification This document contains data from the preliminary specification.
Product [short] dat a sheet Production This document contains the product specification.
PMBT3904MB_1 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2012. All rights reserved.
Product data sheet Rev. 1 — 7 March 2012 12 of 13
NXP Semiconductors PMBT3904MB
40 V, 200 mA NPN switching tran si st o r
Export control — This document as well as the item(s) described herein
may be subject to export control regulations. Export might require a prior
authorization from competent authorities.
Quick reference data — The Quick reference data is an extract of the
product data given in the Limiting values and Characteristics sections of this
document, and as such is not complete, exhaustive or legally binding.
13.4 Trademarks
Notice: All referenced b rands, produc t names, service names and trademarks
are the property of their respect i ve ow ners.
14. Contact information
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
NXP Semiconductors PMBT3904MB
40 V, 200 mA NPN switching tran si st o r
© NXP B.V. 2012. All rights reserved.
For more information, please visit: http://www.nxp.co m
For sales office addresses, please send an email to: salesaddresses@nxp.com
Date of rele ase: 7 March 2012
Document identifier: PMBT3904MB_1
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
15. Contents
1 Product profile. . . . . . . . . . . . . . . . . . . . . . . . . . 1
1.1 General description . . . . . . . . . . . . . . . . . . . . . 1
1.2 Features and benefits. . . . . . . . . . . . . . . . . . . . 1
1.3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
1.4 Quick reference data . . . . . . . . . . . . . . . . . . . . 1
2 Pinning information. . . . . . . . . . . . . . . . . . . . . . 1
3 Ordering information. . . . . . . . . . . . . . . . . . . . . 2
4 Marking. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
4.1 Binary marking code description. . . . . . . . . . . . 2
5 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 3
6 Thermal characteristics . . . . . . . . . . . . . . . . . . 4
7 Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . 5
8 Test information. . . . . . . . . . . . . . . . . . . . . . . . . 8
9 Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 8
10 Packing information . . . . . . . . . . . . . . . . . . . . . 9
11 Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
12 Revision history. . . . . . . . . . . . . . . . . . . . . . . . 10
13 Legal information. . . . . . . . . . . . . . . . . . . . . . . 11
13.1 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 11
13.2 Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
13.3 Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . 11
13.4 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 12
14 Contact information. . . . . . . . . . . . . . . . . . . . . 12
15 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13