MSMBG5.0A - MXLSMBG170CAe3, MSMBJ5.0A - MXLSMBJ170CAe3 Screening in reference to MIL-PRF-19500 available 600 Watt Surface Mount Transient Voltage Suppressor Available DESCRIPTION The MSMB 5.0A - MSMB 170CA series of surface mount 600 watt transient voltage suppressors provide a selection of standoff voltages (Vwm) from 5.0 to 170 V. These high-reliability devices are available in either unidirectional or bidirectional versions. The SMBG Gull-wing design in the DO215AA package is ideal for visible solder connections. The SMBJ J-bend design in the DO214AA package allows for greater PC board mounting density. It is available with SnPb or RoHS compliant matte-tin plating. DO-215AA Gull-wing Package Important: For the latest information, visit our website http://www.microsemi.com. FEATURES * * * * * * High reliability devices with wafer fabrication and assembly lot traceability. All devices 100% surge tested. Enhanced reliability screening in reference to MIL-PRF-19500 is also available. Refer to High Reliability Up-Screened Plastic Products Portfolio for more details on the screening options. (See part nomenclature for all options.) Moisture classification is Level 1 with no dry pack required per IPC/JEDEC J-STD-020B. 3 lot norm screening performed on standby current (I D ). RoHS compliant versions available. APPLICATIONS / BENEFITS * * * * * DO-214AA J-bend Package NOTE: All SMB series are equivalent to prior SMS package identifications. Protects sensitive components such as IC's, CMOS, Bipolar, BiCMOS, ECL, DTL, T2L, etc. Protection from switching transients & RF induced voltage pulses. Also available in: Protection from ESD and EFT per IEC 61000-4-2 and IEC 61000-4-4. Secondary lightning protection per IEC61000-4-5 with 42 ohms source impedance: Class 1: MSB 5.0A to MSMB 120CA Class 2: MSMB 5.0A to MSMB 60CA Class 3: MSMB 5.0A to MSMB 30CA Class 4: MSMB 5.0A to MSMB 15CA Secondary lightning protection per IEC61000-4-5 with 12 ohms source impedance: Class 1: MSMB 5.0A to MSMB 36CA Class 2: MSMB 5.0A to MSMB 18CA Commercial Grade SMBJ5.0A - SMBJ170CAe3 T-18 package (axial-leaded) P6KE6.8A - P6KE200CAe3 MAXIMUM RATINGS @ 25 C unless otherwise stated Parameters/Test Conditions Junction and Storage Temperature Thermal Resistance, Junction to Lead (1) Thermal Resistance, Junction to Ambient (2) Peak Pulse Power Dissipation 10/1000us (1) Rated Average Power Dissipation @ TL < 25 C @ TA = 25 C Unidirectional Tclamping (0 volts to V (BR) min) Bidirectional (3) Forward Surge Current Solder Temperature @ 10 s Symbol Value TJ and TSTG R JL R JA P PP P M(AV) -65 to +150 I FS TSP 25 90 600 5 1.38 < 100 <5 100 260 Unit o C o C/W C/W W W o ps ns A (pk) o C Notes: 1. When mounted on FR4 PC board (1oz Cu) with recommended footprint (see pad layout on last page). 2. With impulse repetition rate (duty factor) of 0.01 % or less (also Figure 1 and 4). 3. Peak impulse of 8.3 ms half-sine wave (unidirectional only). RF01000, Rev. C (1/4/13) (c)2013 Microsemi Corporation MSC - Lawrence 6 Lake Street, Lawrence, MA 01841 Tel: 1-800-446-1158 or (978) 620-2600 Fax: (978) 689-0803 MSC - Ireland Gort Road Business Park, Ennis, Co. Clare, Ireland Tel: +353 (0) 65 6840044 Fax: +353 (0) 65 6822298 Website: www.microsemi.com Page 1 of 7 MSMBG5.0A - MXLSMBG170CAe3, MSMBJ5.0A - MXLSMBJ170CAe3 MECHANICAL and PACKAGING * * * * * * * CASE: Void-free transfer molded thermosetting epoxy body meeting UL94V-0 requirements. TERMINALS: Tin-lead or RoHS compliant annealed matte-tin plating readily solderable per MIL- STD-750, method 2026. MARKING: Part number. POLARITY: Cathode end banded. TAPE & REEL option: Standard per EIA-481-1-A (add "TR" suffix to part number). Consult factory for quantities. WEIGHT: Approximately 0.1 grams. See Package Dimensions on last page. PART NOMENCLATURE M SM B G 5.0 C A Reliability Level* M MA MX MXL *(see High Reliability UpScreened Plastic Products Portfolio) e3 RoHS Compliance e3 = RoHS Compliant Blank = non-RoHS Compliant +/- 5% Tolerance Level Polarity C = bidirectional Blank = unidirectional Surface Mount Package Stand-Off Voltage (V WM ) (see Electrical Characteristics table) 600 W Power Level Lead Form G = Gull-Wing J = J-Bend SYMBOLS & DEFINITIONS Definition Symbol VW M PPP V (BR) ID IPP VC IBR Working Peak (Standoff) Voltage - The maximum peak voltage that can be applied over the operating temperature range. This is also referred to as standoff voltage. Peak Pulse Power - Rated random recurring peak impulse power dissipation. Breakdown Voltage - The minimum voltage the device will exhibit at a specified current. Standby Current - The current at the rated standoff voltage (V WM ). Peak Pulse Current - The peak current during the impulse. Clamping Voltage - Clamping voltage at I PP (peak pulse current) at the specified pulse conditions (typically shown as maximum value). Breakdown Current - The current used for measuring breakdown voltage V (BR) . RF01000, Rev. C (1/4/13) (c)2013 Microsemi Corporation Page 2 of 7 MSMBG5.0A - MXLSMBG170CAe3, MSMBJ5.0A - MXLSMBJ170CAe3 ELECTRICAL CHARACTERISTICS @ 25 C PART NUMBER Gull-Wing MSMBG5.0A MSMBG6.0A MSMBG6.5A MSMBG7.0A MSMBG7.5A MSMBG8.0A MSMBG8.5A MSMBG9.0A MSMBG10A MSMBG11A MSMBG12A MSMBG13A MSMBG14A MSMBG15A MSMBG16A MSMBG17A MSMBG18A MSMBG20A MSMBG22A MSMBG24A MSMBG26A MSMBG28A MSMBG30A MSMBG33A MSMBG36A MSMBG40A MSMBG43A MSMBG45A MSMBG48A MSMBG51A MSMBG54A MSMBG58A MSMBG60A MSMBG64A MSMBG70A MSMBG75A MSMBG78A MSMBG85A MSMBG90A MSMBG100A MSMBG110A MSMBG120A MSMBG130A MSMBG150A MSMBG160A MSMBG170A RF01000, Rev. C (1/4/13) J-Bend MSMBJ5.0A MSMBJ6.0A MSMBJ6.5A MSMBJ7.0A MSMBJ7.5A MSMBJ8.0A MSMBJ8.5A MSMBJ9.0A MSMBJ10A MSMBJ11A MSMBJ12A MSMBJ13A MSMBJ14A MSMBJ15A MSMBJ16A MSMBJ17A MSMBJ18A MSMBJ20A MSMBJ22A MSMBJ24A MSMBJ26A MSMBJ28A MSMBJ30A MSMBJ33A MSMBJ36A MSMBJ40A MSMBJ43A MSMBJ45A MSMBJ48A MSMBJ51A MSMBJ54A MSMBJ58A MSMBJ60A MSMBJ64A MSMBJ70A MSMBJ75A MSMBJ78A MSMBJ85A MSMBJ90A MSMBJ100A MSMBJ110A MSMBJ120A MSMBJ130A MSMBJ150A MSMBJ160A MSMBJ170A REVERSE STAND-OFF VOLTAGE VWM V 5 6 6.5 7 7.5 8 8.5 9 10 11 12 13 14 15 16 17 18 20 22 24 26 28 30 33 36 40 43 45 48 51 54 58 60 64 70 75 78 85 90 100 110 120 130 150 160 170 I( BR) MAXIMUM CLAMPING VOLTAGE VC @ IPP PEAK PULSE CURRENT (see Fig. 2) IPP MAXIMUM STANDBY CURRENT ID @ VWM mA 10 10 10 10 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 V 9.2 10.3 11.2 12 12.9 13.6 14.4 15.4 17 18.2 19.9 21.5 23.2 24.4 26 27.6 29.2 32.4 35.5 38.9 42.1 45.4 48.4 53.3 58.1 64.5 69.4 72.7 77.4 82.4 87.1 93.6 96.8 103 113 121 126 137 146 162 177 193 209 243 259 275 A 65.2 58.3 53.6 50 46.5 44.1 41.7 39 35.3 33 30.2 27.9 25.8 24 23.1 21.7 20.5 18.5 16.9 15.4 14.2 13.2 12.4 11.3 10.3 9.3 8.6 8.3 7.7 7.3 6.9 6.4 6.2 5.8 5.3 4.9 4.7 4.4 4.1 3.7 3.4 3.1 2.9 2.5 2.3 2.2 A 800 800 500 200 100 50 10 5 5 5 5 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 BREAKDOWN VOLTAGE V(BR) V 6.40 - 7.00 6.67 - 7.37 7.22 - 7.98 7.78 - 8.60 8.33 - 9.21 8.89 - 9.83 9.44 - 10.4 10.0 - 11.1 11.1 - 12.3 12.2 - 13.5 13.3 - 14.7 14.4 - 15.9 15.6 - 17.2 16.7 - 18.5 17.8 - 19.7 18.9 - 20.9 20.0 - 22.1 22.2 - 24.5 24.4 - 26.9 26.7 - 29.5 28.9 - 31.9 31.1 - 34.4 33.3 - 36.8 36.7 - 40.6 40.0 - 44.2 44.4 - 49.1 47.8 - 52.8 50.0 - 55.3 53.3 - 58.9 56.7 - 62.7 60.0 - 66.3 64.4 - 71.2 66.7 - 73.7 71.1 - 78.6 77.8 - 86.0 83.3 - 92.1 86.7 - 95.8 94.4 - 104 100 - 111 111 - 123 122 - 135 133 - 147 144 - 159 167 - 185 178 - 197 189 - 209 @ (c)2013 Microsemi Corporation Page 3 of 7 MSMBG5.0A - MXLSMBG170CAe3, MSMBJ5.0A - MXLSMBJ170CAe3 PPP - Peak Pulse Power - kW GRAPHS tw - Pulse Width s Pulse Current in Percent of IPP FIGURE 1 Peak Pulse Power vs Pulse Time t - Time - ms Test waveform parameters: tr=10 s, tp=1000s FIGURE 2 Pulse Waveform for 10/1000 Exponential Surge RF01000, Rev. C (1/4/13) (c)2013 Microsemi Corporation Page 4 of 7 MSMBG5.0A - MXLSMBG170CAe3, MSMBJ5.0A - MXLSMBJ170CAe3 Peak Pulse Power (PPP) or continuous Power in Percent of 25C Rating GRAPHS (continued) T L Lead Temperature C C - Capacitance - Picofarads FIGURE 3 Derating Curve V (BR) - Breakdown Voltage - Volts FIGURE 4 Typical Capacitance vs. Breakdown Voltage NOTE: Bidirectional capacitance is half that shown at zero volts. RF01000, Rev. C (1/4/13) (c)2013 Microsemi Corporation Page 5 of 7 MSMBG5.0A - MXLSMBG170CAe3, MSMBJ5.0A - MXLSMBJ170CAe3 PACKAGE DIMENSIONS SMBG (DO-215AA) Ltr A B C E F K Dimensions Inch Millimeters Min Max Min Max .077 .083 1.96 2.10 .160 .180 4.06 4.57 .130 .155 3.30 3.94 .077 .104 1.95 2.65 .235 .255 5.97 6.48 .015 .030 .381 .762 SMBJ (DO-214AA) Ltr A B C D E L Dimensions Inch Millimeters Min Max Min Max .077 .083 1.96 2.10 .160 .180 4.06 4.57 .130 .155 3.30 3.94 .205 .220 5.21 5.59 .077 .104 1.95 2.65 .030 .060 .760 1.52 See pad layout on next page. RF01000, Rev. C (1/4/13) (c)2013 Microsemi Corporation Page 6 of 7 MSMBG5.0A - MXLSMBG170CAe3, MSMBJ5.0A - MXLSMBJ170CAe3 PAD LAYOUT RF01000, Rev. C (1/4/13) Ltr A B C SMBG (DO-215AA) Inch Millimeters 0.320 8.13 0.085 2.16 0.110 2.79 Ltr A B C SMBJ (DO-214AA) Inch Millimeters 0.260 6.60 0.085 2.16 0.110 2.79 (c)2013 Microsemi Corporation Page 7 of 7