MBRD1035CTLG - ON Semiconductor

 Semiconductor Components Industries, LLC, 2012

January, 2012 − Rev. 8

1Publication Order Number:

MBRD1035CTL/D

MBRD1035CTLG,

MBRD1035CTLT4G,

NRVBD1035CTLT4G,

SBRD81035CTLT4G

SWITCHMODE

Schottky Power Rectifier

DPAK Power Surface Mount Package

The MBRD1035CTL employs the Schottky Barrier principle in a

large area metal−to−silicon power diode. State of the art geometry

features epitaxial construction with oxide passivation and metal

overlay contact. Ideally suited for low voltage, high frequency

switching power supplies, free wheeling diode and polarity protection

diodes.

Features

Highly Stable Oxide Passivated Junction

Guardring for Stress Protection

Matched Dual Die Construction −

May be Paralleled for High Current Output

High dv/dt Capability

Short Heat Sink Tap Manufactured − Not Sheared

Very Low Forward Voltage Drop

Epoxy Meets UL 94 V−0 @ 0.125 in

AEC−Q101 Qualified and PPAP Capable

NRVB and SBRD8 Prefixes for Automotive and Other Applications

Requiring Unique Site and Control Change Requirements

Pb−Free Packages*

Mechanical Characteristics:

Case: Epoxy, Molded

Weight: 0.4 Gram (Approximately)

Finish: All External Surfaces Corrosion Resistant and Terminal

Leads are Readily Solderable

Lead and Mounting Surface Temperature for Soldering Purposes:

260C Max. for 10 Seconds

ESD Rating:

Human Body Model = 3B (> 8 kV)

Machine Model = C (> 400 V)

*For additional information on our Pb−Free strategy and soldering details, please

download the ON Semiconductor Soldering and Mounting Techniques

Reference Manual, SOLDERRM/D.

SCHOTTKY BARRIER

RECTIFIER

10 AMPERES

35 VOLTS

DPAK

CASE 369C

MARKING DIAGRAM

http://onsemi.com

YWW

B10

35CLG

Y = Year

WW = Work Week

B1035CL = Device Code

G = Pb−Free Package

See detailed ordering and shipping information in the package

dimensions section on page 3 of this data sheet.

ORDERING INFORMATION

MBRD1035CTLG, MBRD1035CTLT4G, NRVBD1035CTLT4G, SBRD81035CTLT4G

http://onsemi.com

MAXIMUM RATINGS

Rating Symbol Value Unit

Peak Repetitive Reverse Voltage

Working Peak Reverse Voltage

DC Blocking Voltage

VRRM

VRWM

35 V

Average Rectified Forward Current

(At Rated VR, TC = 115C)

Per Leg

Per Package

5.0

Peak Repetitive Forward Current

(At Rated VR, Square Wave, 20 kHz, TC = 115C)

Per Leg

IFRM

Non−Repetitive Peak Surge Current

(Surge applied at rated load conditions, halfwave, single phase, 60 Hz)

Per Package

IFSM

Storage / Operating Case Temperature Tstg, Tc−55 to +150 C

Operating Junction Temperature (Note 1) TJ−55 to +150 C

Voltage Rate of Change (Rated VR, TJ = 25C) dv/dt 10,000 V/ms

Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the

Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect

device reliability.

1. The heat generated must be less than the thermal conductivity from Junction−to−Ambient: dPD/dTJ < 1/RqJA.

THERMAL CHARACTERISTICS

Rating Symbol Value Unit

Thermal Resistance, Junction−to−Case

Per Leg

RqJC 3.0

C/W

Thermal Resistance, Junction−to−Ambient (Note 2)

Per Leg

RqJA 137

C/W

2. Rating applies when using minimum pad size, FR4 PC Board

ELECTRICAL CHARACTERISTICS

Rating Symbol Value Unit

Maximum Instantaneous Forward Voltage (Note 3) (See Figure 2)

Per Leg

(IF = 5 Amps, TJ = 25C)

(IF = 5 Amps, TJ = 100C)

(IF = 10 Amps, TJ = 25C)

(IF = 10 Amps, TJ = 100C)

0.47

0.41

0.56

0.55

Maximum Instantaneous Reverse Current (Note 3) (See Figure 4)

Per Leg

(VR = 35 V, TJ = 25C)

(VR = 35 V, TJ = 100C)

(VR = 17.5 V, TJ = 25C)

(VR = 17.5 V, TJ = 100C)

2.0

0.20

5.0

3. Pulse Test: Pulse Width  250 ms, Duty Cycle  2.0%

MBRD1035CTLG, MBRD1035CTLT4G, NRVBD1035CTLT4G, SBRD81035CTLT4G

http://onsemi.com

ORDERING INFORMATION

Device Package Shipping†

MBRD1035CTLG DPAK

(Pb−Free)

75 Units / Rail

MBRD1035CTLT4G DPAK

(Pb−Free)

2,500 Units / Tape & Reel

NRVBD1035CTLT4G DPAK

(Pb−Free)

2,500 Units / Tape & Reel

SBRD81035CTLT4G DPAK

(Pb−Free)

2,500 Units / Tape & Reel

†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging

Specifications Brochure, BRD8011/D.

TYPICAL CHARACTERISTICS

Figure 1. Typical Forward Voltage Per Leg Figure 2. Maximum Forward Voltage Per Leg

Figure 3. Typical Reverse Current Per Leg

1.100.10

VF, INSTANTANEOUS FORWARD VOLTAGE (VOLTS)

100

VR, REVERSE VOLTAGE (VOLTS)

350

100E-6

1E-6

IF, INSTANTANEOUS FORWARD CURRENT (AMPS)

1.0

0.500.30 0.70 0.90

10 20 30

10E-3

100E-3

0.1

, REVERSE CURRENT (AMPS)

1E-3

10E-6

TJ = 25C

TJ = 100C

TJ = 125C

TJ = - 40C

TJ = 125C

Figure 4. Maximum Reverse Current Per Leg

1.100.10

VF, MAXIMUM INSTANTANEOUS FORWARD VOLTAGE (VOLTS)

100

IF, INSTANTANEOUS FORWARD CURRENT (AMPS)

1.0

0.500.30 0.70 0.90

0.1

TJ = 25C

TJ = 100C

TJ = 125C

1E+0

TJ = 100C

TJ = 25C

VR, REVERSE VOLTAGE (VOLTS)

350

100E-6

1E-6 10 20 30

10E-3

100E-3

1E-3

10E-6

TJ = 125C

1E+0

TJ = 100C

TJ = 25C

I , MAXIMUM REVERSE CURRENT (AMPS)

MBRD1035CTLG, MBRD1035CTLT4G, NRVBD1035CTLT4G, SBRD81035CTLT4G

http://onsemi.com

Figure 5. Current Derating Per Leg Figure 6. Forward Power Dissipation Per Leg

Figure 7. Capacitance Per Leg

1200

TL, LEAD TEMPERATURE (C)

8.0

7.0

5.0

6.0

4.0

VR, DC REVERSE VOLTAGE (VOLTS)

250

105

VR, REVERSE VOLTAGE (VOLTS)

100

IO, AVERAGE FORWARD CURRENT (AMPS)C, CAPACITANCE (pF)

3.0

2.0

1.0

6020 40 80 100 140

30 355101520

115

125

510152025

TJ, DERATED OPERATING TEMPERATURE ( C)

1000

TJ = 25C

freq = 20 kHz

Ipk/Io = p

Ipk/Io = 20

SQUARE WAVE

(50% DUTY CYCLE)

IO, AVERAGE FORWARD CURRENT (AMPS)

1.00

4.0

3.0

2.0

1.0

2.0

PFO, AVERAGE POWER DISSIPATION (WATTS)

3.0 4.0 5.0 6.0 7.0 8.0

3.5

2.5

1.5

0.5

Ipk/Io = 20

SQUARE WAVE

(50% DUTY CYCLE) dc

Figure 8. Typical Operating Temperature

Derating Per Leg *

Ipk/Io = 10

Ipk/Io = 5 Ipk/Io = 10

Ipk/Io = 5

Ipk/Io = p



RqJA = 84C/W

RqJA = 67.5C/W

RqJA = 48C/W

RqJA = 25C/W

RqJA = 2.43C/W

* Reverse power dissipation and the possibility of thermal runaway must be considered when operating this device under any re-

verse voltage conditions. Calculations of TJ therefore must include forward and reverse power effects. The allowable operating

TJ may be calculated from the equation: TJ = TJmax − r(t)(Pf + Pr) where

r(t) = thermal impedance under given conditions,

Pf = forward power dissipation, and

Pr = reverse power dissipation

This graph displays the derated allowable TJ due to reverse bias under DC conditions only and is calculated as TJ = TJmax − r(t)Pr,

where r(t) = Rthja. For other power applications further calculations must be performed.

MBRD1035CTLG, MBRD1035CTLT4G, NRVBD1035CTLT4G, SBRD81035CTLT4G

http://onsemi.com

Figure 9. Thermal Response Junction to Case (Per Leg)

Figure 10. Thermal Response Junction to Ambient (Per Leg)

0.10.00001

t, TIME (s)

1.0

0.1

0.01

0.0001 0.001 0.01

, TRANSIENT THERMAL RESISTANCE (NORMALIZED)

(t)

1.0 10 100 1000

50%(DUTY CYCLE)

20%

10%

5.0%

2.0%

1.0%

Rtjl(t) = Rtjl  r(t)

0.10.00001

t, TIME (s)

1.0E+00

1.0E-01

1.0E-02

1.0E-03

1.0E-04

0.0001 0.001 0.01 1.0 10 100 10000

50% (DUTY CYCLE)

20%

10%

5.0%

2.0%

1.0%

SINGLE PULSE

r , TRANSIENT THERMAL RESISTANCE (NORMALIZED)

(t)

1000

SINGLE PULSE

Rtjl(t) = Rtjl  r(t)

MBRD1035CTLG, MBRD1035CTLT4G, NRVBD1035CTLT4G, SBRD81035CTLT4G

http://onsemi.com

PACKAGE DIMENSIONS

DPAK (SINGLE GAUGE)

CASE 369C−01

ISSUE D

0.005 (0.13) C

DIM MIN MAX MIN MAX

MILLIMETERSINCHES

D0.235 0.245 5.97 6.22

E0.250 0.265 6.35 6.73

A0.086 0.094 2.18 2.38

b0.025 0.035 0.63 0.89

c2 0.018 0.024 0.46 0.61

b2 0.030 0.045 0.76 1.14

c0.018 0.024 0.46 0.61

e0.090 BSC 2.29 BSC

b3 0.180 0.215 4.57 5.46

L4 −−− 0.040 −−− 1.01

L0.055 0.070 1.40 1.78

L3 0.035 0.050 0.89 1.27

Z0.155 −−− 3.93 −−−

NOTES:

1. DIMENSIONING AND TOLERANCING PER ASME

Y14.5M, 1994.

2. CONTROLLING DIMENSION: INCHES.

3. THERMAL PAD CONTOUR OPTIONAL WITHIN DI-

MENSIONS b3, L3 and Z.

4. DIMENSIONS D AND E DO NOT INCLUDE MOLD

FLASH, PROTRUSIONS, OR BURRS. MOLD

FLASH, PROTRUSIONS, OR GATE BURRS SHALL

NOT EXCEED 0.006 INCHES PER SIDE.

5. DIMENSIONS D AND E ARE DETERMINED AT THE

OUTERMOST EXTREMES OF THE PLASTIC BODY.

6. DATUMS A AND B ARE DETERMINED AT DATUM

PLANE H.

12 3

5.80

0.228

2.58

0.102

1.60

0.063

6.20

0.244

3.00

0.118

6.17

0.243

ǒmm

inchesǓ

SCALE 3:1

*For additional information on our Pb−Free strategy and soldering

details, please download the ON Semiconductor Soldering and

Mounting Techniques Reference Manual, SOLDERRM/D.

SOLDERING FOOTPRINT*

H0.370 0.410 9.40 10.41

A1 0.000 0.005 0.00 0.13

L1 0.108 REF 2.74 REF

L2 0.020 BSC 0.51 BSC

DETAIL A

SEATING

PLANE

L2 GAUGE

PLANE

DETAIL A

ROTATED 90 CW5

ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice

to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability

arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.

“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All

operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights

nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications

intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should

Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates,

and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death

associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal

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PUBLICATION ORDERING INFORMATION

N. American Technical Support: 800−282−9855 Toll Free

USA/Canada

Europe, Middle East and Africa Technical Support:

Phone: 421 33 790 2910

Japan Customer Focus Center

Phone: 81−3−5817−1050

MBRD1035CTL/D

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