Table of Contents
1 Ratings....................................................................................5
1.1 Thermal handling ratings................................................. 5
1.2 Moisture handling ratings................................................ 5
1.3 ESD handling ratings.......................................................5
1.4 Voltage and current operating ratings............................. 6
2 General................................................................................... 6
2.1 AC electrical characteristics.............................................6
2.2 Nonswitching electrical specifications..............................7
2.2.1 Voltage and current operating requirements....... 7
2.2.2 LVD and POR operating requirements................7
2.2.3 Voltage and current operating behaviors.............8
2.2.4 Power mode transition operating behaviors........ 9
2.2.5 Power consumption operating behaviors............ 10
2.2.6 EMC radiated emissions operating behaviors.....24
2.2.7 EMC Radiated Emissions Web Search
Procedure boilerplate.......................................... 25
2.2.8 Capacitance attributes.........................................25
2.3 Switching specifications...................................................25
2.3.1 Device clock specifications..................................25
2.3.2 General switching specifications......................... 26
2.4 Thermal specifications.....................................................26
2.4.1 Thermal operating requirements......................... 26
2.4.2 Thermal attributes................................................27
3 Peripheral operating requirements and behaviors.................. 27
3.1 Core modules.................................................................. 27
3.1.1 SWD electricals .................................................. 28
3.2 System modules.............................................................. 29
3.3 Clock modules................................................................. 29
3.3.1 MCG-Lite specifications.......................................29
3.3.2 Oscillator electrical specifications........................30
3.4 Memories and memory interfaces................................... 31
3.4.1 Flash electrical specifications..............................31
3.5 Security and integrity modules........................................ 33
3.6 Analog............................................................................. 33
3.6.1 ADC electrical specifications............................... 33
3.6.2 CMP and 6-bit DAC electrical specifications....... 37
3.6.3 Voltage reference electrical specifications.......... 39
3.7 Timers..............................................................................40
3.8 Communication interfaces............................................... 40
3.8.1 SPI switching specifications................................ 41
3.8.2 Inter-Integrated Circuit Interface (I2C) timing...... 45
3.8.3 UART...................................................................47
4 Dimensions............................................................................. 47
4.1 Obtaining package dimensions....................................... 47
5 Pinout......................................................................................48
5.1 KL03 signal multiplexing and pin assignments................48
5.2 KL03 pinouts....................................................................49
6 Ordering parts......................................................................... 51
6.1 Determining valid orderable parts....................................51
7 Part identification.....................................................................51
7.1 Description.......................................................................51
7.2 Format............................................................................. 52
7.3 Fields............................................................................... 52
7.4 Example...........................................................................52
8 Terminology and guidelines.................................................... 53
8.1 Definition: Operating requirement....................................53
8.2 Definition: Operating behavior......................................... 53
8.3 Definition: Attribute.......................................................... 54
8.4 Definition: Rating............................................................. 54
8.5 Result of exceeding a rating............................................ 55
8.6 Relationship between ratings and operating
requirements....................................................................55
8.7 Guidelines for ratings and operating requirements..........55
8.8 Definition: Typical value...................................................56
8.9 Typical value conditions.................................................. 57
9 Revision history.......................................................................57
4Kinetis KL03 32 KB Flash, Rev. 5.1 08/2017
NXP Semiconductors