EMCL13J2J-100.000M RoHS Pb EMCL13 J 2 J -100.000M Series RoHS Compliant (Pb-free) 3.3V 6 Pad 5mm x 7mm Plastic SMD LVPECL MEMS Oscillator Nominal Frequency 100.000MHz Frequency Tolerance/Stability 25ppm Maximum over -40C to +85C Logic Control / Additional Output Standby (ST) and Complementary Output Duty Cycle 50 5(%) ELECTRICAL SPECIFICATIONS Nominal Frequency 100.000MHz Frequency Tolerance/Stability 25ppm Maximum over -40C to +85C (Inclusive of all conditions: Calibration Tolerance at 25C, Frequency Stability over the Operating Temperature Range, Supply Voltage Change, Output Load Change, 1st Year Aging at 25C, Reflow, Shock, and Vibration) Aging at 25C 1ppm First Year Maximum Supply Voltage +3.3Vdc 0.3Vdc Input Current 80mA Maximum (Excluding Load Termination Current) Output Voltage Logic High (Voh) 2.35Vdc Typical, Vcc-1.025Vdc Minimum Output Voltage Logic Low (Vol) 1.6Vdc Typical, Vcc-1.62Vdc Maximum Rise/Fall Time 150pSec Typical, 300pSec Maximum (Measured over 20% to 80% of waveform) Duty Cycle 50 5(%) (Measured at 50% of waveform) Load Drive Capability 50 Ohms into Vcc-2.0Vdc Output Logic Type LVPECL Logic Control / Additional Output Standby (ST) and Complementary Output Output Control Input Voltage Vih of 70% of Vcc Minimum or No Connect to Enable Output and Complementary Output, Vil of 30% of Vcc Maximum to Disable Output and Complementary Output (High Impedance) Standby Current 30A Maximum (ST) Without Load Period Jitter (Deterministic) 0.2pSec Typical Period Jitter (Random) 2.0pSec Typical Period Jitter (RMS) 1.5pSec Typical, 3.0pSec Maximum Period Jitter (pk-pk) 20pSec Typical, 25pSec Maximum RMS Phase Jitter (Fj = 637kHz to 10MHz; Random) 1.7pSec Typical RMS Phase Jitter (Fj = 1MHz to 20MHz; Random) 1.4pSec Typical RMS Phase Jitter (Fj = 1.875MHz to 20MHz; Random) 1.1pSec Typical Start Up Time 10mSec Maximum Storage Temperature Range -55C to +125C ENVIRONMENTAL & MECHANICAL SPECIFICATIONS ESD Susceptibility MIL-STD-883, Method 3015, Class 2, HBM 2000V Flammability UL94-V0 Mechanical Shock MIL-STD-883, Method 2002, Condition G, 30,000G Moisture Resistance MIL-STD-883, Method 1004 Moisture Sensitivity Level J-STD-020, MSL 1 Resistance to Soldering Heat MIL-STD-202, Method 210, Condition K Resistance to Solvents MIL-STD-202, Method 215 Solderability MIL-STD-883, Method 2003 (Six I/O Pads on bottom of package only) Temperature Cycling MIL-STD-883, Method 1010, Condition B Thermal Shock MIL-STD-883, Method 1011, Condition B Vibration MIL-STD-883, Method 2007, Condition A, 20G www.ecliptek.com | Specification Subject to Change Without Notice | Rev C 8/13/2010 | Page 1 of 5 EMCL13J2J-100.000M MECHANICAL DIMENSIONS (all dimensions in millimeters) 0.85 0.15 5.00 0.15 1.20 0.10 (x4) 0.08 MAX 1.47 3 7.00 0.15 5.08 0.10 2 4 A 5 2.30 PIN CONNECTION 1 Standby (ST) 2 No Connect 3 Case Ground 4 Output 5 Complementary Output 6 Supply Voltage LINE MARKING 1 1 2.54 TYP 2.60 0.15 6 XXXX or XXXXX XXXX or XXXXX=Ecliptek Manufacturing Lot Code 1.40 0.10 (x4) Note A: Center paddle is connected internally to oscillator ground (Pad 3). Suggested Solder Pad Layout All Dimensions in Millimeters 1.80 (X6) 2.00 (X6) 0.54 (X4) 2.39 (X3) Solder Land (X6) All Tolerances are 0.1 www.ecliptek.com | Specification Subject to Change Without Notice | Rev C 8/13/2010 | Page 2 of 5 EMCL13J2J-100.000M CLOCK OUTPUTS TRI-STATE INPUT OUTPUT WAVEFORM & TIMING DIAGRAM VIH VIL VOH 80% Q OUTPUT STANDBY (HIGH IMPEDANCE STATE) 50% 20% VOL Q tPLZ Fall Time Rise Time tPZL TW T Duty Cycle (%) = TW/T x 100 Test Circuit for Tri-State and Complementary Output 50 Ohms Pin Connections 1 Tri-State 2 No Connect 3 Ground 4 Output 5 Complementary Output 6 Supply Voltage (VDD) Frequency Counter Oscilloscope Power Supply Probe 2 (Note 2) Supply Voltage (VDD) Output Current Meter Switch 0.01F (Note 1) 0.1F (Note 1) Probe 1 (Note 2) 50 Ohms Complementary Output Ground Power Supply Voltage Meter Power Supply Tri-State No Connect Power Supply Note 1: An external 0.01F ceramic bypass capacitor in parallel with a 0.1F high frequency ceramic bypass capacitor close (less than 2mm) to the package ground and supply voltage pin is required. Note 2: A low capacitance (<12pF), 10X attenuation factor, high impedance (>10Mohms), and high bandwidth (>500MHz) passive probe is recommended. Note 3: Test circuit PCB traces need to be designed for a characteristic line impedance of 50 ohms. www.ecliptek.com | Specification Subject to Change Without Notice | Rev C 8/13/2010 | Page 3 of 5 EMCL13J2J-100.000M Recommended Solder Reflow Methods Critical Zone TL to T P Temperature (T) TP Ramp-up Ramp-down TL TS Max TS Min tL t S Preheat t 25C to Peak tP Time (t) High Temperature Infrared/Convection TS MAX to TL (Ramp-up Rate) Preheat - Temperature Minimum (TS MIN) - Temperature Typical (TS TYP) - Temperature Maximum (TS MAX) - Time (tS MIN) Ramp-up Rate (TL to TP) Time Maintained Above: - Temperature (TL) - Time (tL) Peak Temperature (TP) Target Peak Temperature (TP Target) Time within 5C of actual peak (tp) Ramp-down Rate Time 25C to Peak Temperature (t) Moisture Sensitivity Level 3C/second Maximum 150C 175C 200C 60 - 180 Seconds 3C/second Maximum 217C 60 - 150 Seconds 260C Maximum for 10 Seconds Maximum 250C +0/-5C 20 - 40 seconds 6C/second Maximum 8 minutes Maximum Level 1 www.ecliptek.com | Specification Subject to Change Without Notice | Rev C 8/13/2010 | Page 4 of 5 EMCL13J2J-100.000M Recommended Solder Reflow Methods Critical Zone TL to T P Temperature (T) TP Ramp-up Ramp-down TL TS Max TS Min tL t S Preheat t 25C to Peak tP Time (t) Low Temperature Infrared/Convection 240C TS MAX to TL (Ramp-up Rate) Preheat - Temperature Minimum (TS MIN) - Temperature Typical (TS TYP) - Temperature Maximum (TS MAX) - Time (tS MIN) Ramp-up Rate (TL to TP) Time Maintained Above: - Temperature (TL) - Time (tL) Peak Temperature (TP) Target Peak Temperature (TP Target) Time within 5C of actual peak (tp) Ramp-down Rate Time 25C to Peak Temperature (t) Moisture Sensitivity Level 5C/second Maximum N/A 150C N/A 60 - 120 Seconds 5C/second Maximum 150C 200 Seconds Maximum 240C Maximum 240C Maximum 1 Time / 230C Maximum 2 Times 10 seconds Maximum 2 Times / 80 seconds Maximum 1 Time 5C/second Maximum N/A Level 1 Low Temperature Manual Soldering 185C Maximum for 10 seconds Maximum, 2 times Maximum. High Temperature Manual Soldering 260C Maximum for 5 seconds Maximum, 2 times Maximum. www.ecliptek.com | Specification Subject to Change Without Notice | Rev C 8/13/2010 | Page 5 of 5