© 2010-2011 Microchip Technology Inc. DS80511E-page 1
PIC32MX534/564/664/764
The PIC32MX534/564/664/764 family devices that you
have received conform functionally to the current Device
Data Sheet (DS61156G), except for the anomalies
described in this document.
The silicon issues discussed in the following pages are
for silicon revisions with the Device and Revision IDs
listed in Table 1. The silicon issues are summarized in
Table 2.
The errata described in this document will be addressed
in future revisions of the PIC32MX534/564/664/764
silicon.
Data Sheet clarifications and corrections start on page 7,
following the discussion of silicon issues.
The silicon revision level can be identified using the
current version of MPLAB® IDE and Microchip’s
programmers, debuggers and emulation tools, which
are available at the Microchip corporate web site
(www.microchip.com).
For example, to identify the silicon revision level
using MPLAB IDE in conjunction with the REAL
ICE™ in-circuit emulator:
1. Using the appropriate interface, connect the
device to the REAL ICE in-circuit emulator.
2. From the main menu in MPLAB IDE, select
Configure>Select Device, and then select the
target part number in the dialog box.
3. Select the MPLAB hardware tool
(Debugger>Select Tool).
4. Perform a “Connect” operation to the device
(Debugger>Connect). Depending on the devel-
opment tool used, the part number and Device
Revision ID value appear in the Output window.
The Device and Revision ID values for the various
PIC32MX534/564/664/764 silicon revisions are shown
in Table 1.
Note: This document summarizes all silicon
errata issues from all revisions of silicon,
previous as well as current. Only the
issues indicated in the last column of
Table 2 apply to the current silicon
revision (A1).
Note: If you are unable to extract the silicon
revision level, please contact your local
Microchip sales office for assistance.
TABLE 1: SILICON DEVREV VALUES
Part Number Device ID(1) Revision ID for Silicon Revision(2)
A0 A1
PIC32MX534F064H 0x4400053 0x0 0x1
PIC32MX564F064H 0x4401053 0x0 0x1
PIC32MX564F128H 0x4403053 0x0 0x1
PIC32MX664F064H 0x4405053 0x0 0x1
PIC32MX664F128H 0x4407053 0x0 0x1
PIC32MX764F128H 0x440B053 0x0 0x1
PIC32MX534F064L 0x440C053 0x0 0x1
PIC32MX564F064L 0x440D053 0x0 0x1
PIC32MX564F128L 0x440F053 0x0 0x1
PIC32MX664F064L 0x4411053 0x0 0x1
PIC32MX664F128L 0x4413053 0x0 0x1
PIC32MX764F128L 0x4417053 0x0 0x1
Note 1: The Device and Revision IDs (DEVID and DEVREV) are located at the last two implemented addresses in
program memory.
2: Refer to the “PIC32MX Flash Programming Specification” (DS61145) for detailed information on Device
and Revision IDs for your specific device.
PIC32MX534/564/664/764 Family
Silicon Errata and Data Sheet Clarification
PIC32MX534/564/664/764
DS80511E-page 2 © 2010-2011 Microchip Technology Inc.
TABLE 2: SILICON ISSUE SUMMARY
Module Feature Item
Number Issue Summary
Affected
Revisions(1)
A0 A1
JTAG 1. On 64-pin devices the TMS pin requires an external pull-up. X X
CAN 2. The TXBAT bit status may be incorrect after an abort. X X
SPI Slave Mode 3. The SPIBUSY status is incorrect after an aborted transfer. X X
SPI Slave Mode 4. A wake-up interrupt may not be clearable. X X
SPI Frame Mode 5. Recovery from an underrun requires multiple SPI clock periods. X X
SPI 6. Byte writes to the SPISTAT register are not decoded correctly. X X
UART 7. The TRMT bit is asserted before the transmission is complete. X X
UART IrDA® with
BCLK
8. TX data is corrupted when BRG values greater than 0x200 are
used.
XX
UART IrDA 9. The IrDA minimum bit time is not detected at all baud rates. X X
UART UART
Receive
Buffer
Overrun Error
Status
10. OERR bit does not get cleared on a module Reset. X X
ADC Conversion
Trigger from
INT0 Interrupt
11. The ADC module conversion triggers occur on the rising edge
of the INT0 signal even when INT0 is configured to generate an
interrupt on the falling edge.
XX
JTAG Boundary
Scan
12. Pin 100 on 100-pin packages and pin A1 on 121-pin packages
do not respond to boundary scan commands.
XX
Oscillator Clock Switch 13. Clock switch may not work if Cache is disabled and Prefetch is
enabled.
XX
DMA Suspend
Status
14. The DMABUSY status bit may not reflect the correct status if the
DMA module is suspended.
XX
Voltage
Regulator
BOR 15. Device may not exit BOR state if BOR event occurs. X X
USB OTG Mode 16. When the USB model is configured for OTG operation, it may
not properly recognize all required OTG voltage levels on VBUS
pin.
XX
Oscillator Clock Switch 17. If a Fail-Safe Clock Monitor (FSCM) event occurs when Primary
Oscillator (POSC) mode is used, firmware clock switch requests
to switch from FRC mode will fail.
XX
I2C™ Slave Mode 18. The I2C module does not respond to address 0x78 when the
STRICT and A10M bits are cleared in the I2CxCON register.
XX
USB UIDLE
Interrupt
19. UIDLE interrupts cease if the UIDLE interrupt flag is cleared. X X
Note 1: Only those issues indicated in the last column apply to the current silicon revision.
© 2010-2011 Microchip Technology Inc. DS80511E-page 3
PIC32MX534/564/664/764
Silicon Errata Issues
1. Module: JTAG
On 64-pin devices an external pull-up resistor is
required on the TMS pin for proper JTAG.
Work around
Connect a 100k-200k pull-up to the TMS pin.
Affected Silicon Revisions
2. Module: CAN
When an abort request occurs concurrently with a
successful message transmission, and additional
messages remain in the FIFO, these remaining
messages are not transmitted and the TXBAT bit
does not reflect the abort.
Work around
The actual FIFO status can be determined by the
FIFO pointers CFIFOCI and CFIFOUA.
Affected Silicon Revisions
3. Module: SPI
In Slave mode with Chip Select (CS) enabled, if
the Master deasserts CS before the SPI clock has
returned to the Idle state, the SPIBUSY bit will
remain set until the next SPI data transfer is
completed. The other SPI status bits will reflect the
actual status.
Work around
None.
Affected Silicon Revisions
4. Module: SPI
In Slave mode when entering Sleep mode after a
SPI transfer with SPI interrupts enabled, a false
interrupt may be generated waking the device.
This interrupt can be cleared; however, entering
Sleep may cause the condition to occur again.
Work around
Do not use SPI in Slave mode as a wake-up
source from Sleep.
Affected Silicon Revisions
5. Module: SPI
In Frame mode the module is not immediately
ready for further transfers after clearing the
SPITUR bit. The SPITUR bit will be cleared by
hardware before the SPI state machine is
prepared for the next operation.
Work around
Firmware must wait at least four bit times before
writing to the SPI registers after clearing the
SPITUR bit.
Affected Silicon Revisions
6. Module: SPI
Byte writes to the SPISTAT register are not
decoded correctly. A byte write to byte zero of
SPISTAT is actually performed on both byte zero
and byte one. A byte write to byte one of SPISTAT
is ignored.
Work around
Only perform word operations on the SPISTAT
register.
Affected Silicon Revisions
Note: This document summarizes all silicon
errata issues from all revisions of silicon,
previous as well as current. Only the
issues indicated by the shaded column in
the following tables apply to the current
silicon revision (A1).
A0 A1
X X
A0 A1
XX
A0 A1
X X
A0 A1
X X
A0 A1
X X
A0 A1
XX
PIC32MX534/564/664/764
DS80511E-page 4 © 2010-2011 Microchip Technology Inc.
7. Module: UART
The TRMT bit is asserted during the STOP bit
generation not after the STOP bit has been sent.
Work around
If firmware needs to be aware when the
transmission is complete, firmware should add a
half bit time delay after the TRMT bit is asserted.
Affected Silicon Revisions
8. Module: UART
In IrDA mode with baud clock output enabled, the
UART TX data is corrupted when the BRG value is
greater than 0x200.
Work around
Use the Peripheral Bus (PB) divisor to lower the
PB frequency such that the required UART BRG
value is less than 0x201.
Affected Silicon Revisions
9. Module: UART
The UART module is not fully IrDA compliant. The
module does not detect the 1.6 µs minimum bit
width at all baud rates as defined in the IrDA
specification. The module does detect the 3/16 bit
width at all baud rates.
Work around
None.
Affected Silicon Revisions
10. Module: UART
The OERR bit does not get cleared on a module
reset. If the OERR bit is set and the module is dis-
abled, the OERR bit retains its status even after
the UART module is reinitialized.
Work around
The user software must check this bit in the UART
module initialization routine and clear it if it is set.
Affected Silicon Revisions
11. Module: ADC
When the ADC module is configured to start con-
version on an external interrupt (SSRC<2:0> =
001), the start of conversion always occurs on a
rising edge detected at the INT0 pin, even when
the INT0 pin has been configured to generate an
interrupt on a falling edge (INT0EP = 0).
Work around
Generate ADC conversion triggers on the rising
edge of the INT0 signal.
Alternatively, use external circuitry to invert the sig-
nal appearing at the INT0 pin, so that a falling edge
of the input signal is detected as a rising edge by
the INT0 pin.
Affected Silicon Revisions
12. Module: JTAG
Pin 100 on 100-pin packages and pin A1 on
121-pin packages do not respond to boundary
scan commands.
Work around
None.
Affected Silicon Revisions
13. Module: Oscillator
Clock switch may not work if Cache is disabled
(DCSZ<1:0> = 00 in the CHECON register) and
Prefetch is enabled (PREFEN<1:0> not equal ‘00
in the CHECON register).
Work around
Set wait states to a value of 7 (PFMWS<2:0> =
111 in the CHECON register), perform a clock
switch, and then set waits states to the desired
value.
Affected Silicon Revisions
A0 A1
X X
A0 A1
XX
A0 A1
XX
A0 A1
XX
A0 A1
X X
A0 A1
X X
A0 A1
XX
© 2010-2011 Microchip Technology Inc. DS80511E-page 5
PIC32MX534/564/664/764
14. Module: DMA
If the DMA module is suspended by setting the
DMA Suspend bit (SUSPEND) in the DMA Con-
troller Control register (DMACON), the DMA Mod-
ule Busy Bit (DMABUSY) in the DMACON register
may continue to show a Busy status, when the
DMA module completes transaction.
Work around
Use the Channel Busy bit (CHBUSY) in the DMA
Channel Control Register (DCHxCON) to check
the status of the DMA channel.
Affected Silicon Revisions
15. Module: Voltage Regulator
Device may not exit BOR state if BOR event
occurs.
Work arounds
Work around 1:
VDD must remain within published specification
(see Parameter DC10 of the device data sheet).
Work around 2:
Reset device by providing POR condition.
Affected Silicon Revisions
16. Module: USB
When the USB model is configured for OTG
operation, it may not properly recognize all
required OTG voltage levels on VBUS pin.
Work around
Use external comparator circuit to detect OTG
specific voltage levels on VBUS pin.
FIGURE 1: EXTERNAL COMPARATOR
SCHEMATIC EXAMPLE
Affected Silicon Revisions
17. Module: Oscillator
If the Primary Oscillator (POSC) mode is
implemented and a Fail-Safe Clock Monitor
(FSCM) event occurs (failure of the external
primary clock), the internal clock source will switch
to the FRC oscillator. Subsequent firmware clock
switch requests from the FRC oscillator to other
clock sources will fail and the device will continue
to execute on the FRC oscillator. Upon repair of
the external clock source and a power-on state,
the device will resume operation with the primary
oscillator clock source.
Work around
None.
Affected Silicon Revisions
A0 A1
XX
A0 A1
X X
A0 A1
XX
A0 A1
X X
+
R1
1K
R2
+5V
VBUS
VOUT
TO PIC32 I/O
0.8V:R1 = 5.2K
1.2V:R1 = 3.1K
4.75V:R1 = 52R
PIC32MX534/564/664/764
DS80511E-page 6 © 2010-2011 Microchip Technology Inc.
18. Module: I2C™
The slave address, 0x78, is one of a group of
reserved addresses. It is used as the upper byte of
a 10-bit address when 10-bit addressing is
enabled. The I2C module control register allows
the programmer to enable both 10-bit addressing
and strict enforcement of reserved addressing,
with the A10M and STRICT bits, respectively.
When both bits are cleared, the device should
respond to the reserved address 0x78, but does
not.
Work around
None.
Affected Silicon Revisions
19. Module: USB
In the case where the bus has been idle for > 3 ms,
and the UIDLE interrupt flag is set, if software
clears the interrupt flag, and the bus remains idle,
the UIDLE interrupt flag will not be set again.
Work around
Software can leave the UIDLE bit set until it has
received some indication of bus resumption.
(Resume, Reset, SOF, or Error).
Affected Silicon Revisions
A0 A1
X X
Note: Resume and Reset are the only interrupts
that should be gotten following UIDLE
assertion. If, at any point in time, the
UIDLE bit is set, it should be okay to sus-
pend the USB module (as long as this
code is protected by the GUARD and/or
ACTPEND logic). Note that this will
require software to clear the UIDLE inter-
rupt enable bit to exit the USB ISR (if
using interrupt driven code).
A0 A1
XX
© 2010-2011 Microchip Technology Inc. DS80511E-page 7
PIC32MX534/564/664/764
Data Sheet Clarifications
The following typographic corrections and clarifications
are to be noted for the latest version of the device data
sheet (DS61156G):
1. Module: AC Characteristics: Standard
Operating Conditions
The Standard Operating conditions in the following
table shows the incorrect starting voltage range of
2.3V. The correct starting range is: 2.9V:
Table 31-35: Ethernet Module Specifications
The Standard Operating conditions in the following
tables show the incorrect starting voltage range of
2.3V. The correct starting range is: 2.5V:
Table 31-36: ADC Module Specifications
Table 31-37: 10-bit ADC Conversion Rate
Parameters
Table 31-38: Analog-to-Digital Conversion
Timing Requirements
Note: Corrections are shown in bold. Where
possible, the original bold text formatting
has been removed for clarity.
PIC32MX534/564/664/764
DS80511E-page 8 © 2010-2011 Microchip Technology Inc.
APPENDIX A: REVISION HISTORY
Rev A Document (7/2010)
Initial release of this document; issued for revision A0
silicon.
Includes silicon issues 1 (JTAG), 2 (CAN), 3-6 (SPI)
and 7-9 (UART).
Rev B Document (12/2010)
Added silicon issues 10 (UART), 11 (ADC), 12 (JTAG),
13 (Oscillator), 14 (DMA), 15 (Voltage Regulator) and
16 (USB).
Rev C Document (3/2011)
Updated the data sheet revision from “E” to “F” and
updated the current silicon revision to A1 throughout
the document.
Added data sheet clarification 1 (Pin Diagrams).
Rev D Document (5/2011)
Updated the data sheet revision from “F” to “G”
throughout the document.
Removed data sheet clarification 1.
Rev E Document (10/2011)
Added silicon issues 17 (Oscillator), 18 (I2C™), and 19
(USB).
Added data sheet clarification 1 (AC Characteristics:
Standard Operating Conditions).
© 2010-2011 Microchip Technology Inc. DS80511E-page 9
Information contained in this publication regarding device
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and may be superseded by updates. It is your responsibility to
ensure that your application meets with your specifications.
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All other trademarks mentioned herein are property of their
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© 2010-2011, Microchip Technology Incorporated, Printed in
the U.S.A., All Rights Reserved.
Printed on recycled paper.
ISBN: 978-1-61341-710-2
Note the following details of the code protection feature on Microchip devices:
Microchip products meet the specification contained in their particular Microchip Data Sheet.
Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the
intended manner and under normal conditions.
There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our
knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data
Sheets. Most likely, the person doing so is engaged in theft of intellectual property.
Microchip is willing to work with the customer who is concerned about the integrity of their code.
Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not
mean that we are guaranteeing the product as “unbreakable.”
Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our
products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts
allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.
Microchip received ISO/TS-16949:2009 certification for its worldwide
headquarters, design and wafer fabrication facilities in Chandler and
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and India. The Company’s quality system processes and procedures
are for its PIC® MCUs and dsPIC® DSCs, KEELOQ® code hopping
devices, Serial EEPROMs, microperipherals, nonvolatile memory and
analog products. In addition, Microchip’s quality system for the design
and manufacture of development systems is ISO 9001:2000 certified.
DS80511E-page 10 © 2010-2011 Microchip Technology Inc.
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