To all our customers Regarding the change of names mentioned in the document, such as Hitachi Electric and Hitachi XX, to Renesas Technology Corp. The semiconductor operations of Mitsubishi Electric and Hitachi were transferred to Renesas Technology Corporation on April 1st 2003. These operations include microcomputer, logic, analog and discrete devices, and memory chips other than DRAMs (flash memory, SRAMs etc.) Accordingly, although Hitachi, Hitachi, Ltd., Hitachi Semiconductors, and other Hitachi brand names are mentioned in the document, these names have in fact all been changed to Renesas Technology Corp. Thank you for your understanding. Except for our corporate trademark, logo and corporate statement, no changes whatsoever have been made to the contents of the document, and these changes do not constitute any alteration to the contents of the document itself. Renesas Technology Home Page: http://www.renesas.com Renesas Technology Corp. Customer Support Dept. April 1, 2003 Cautions Keep safety first in your circuit designs! 1. Renesas Technology Corporation puts the maximum effort into making semiconductor products better and more reliable, but there is always the possibility that trouble may occur with them. Trouble with semiconductors may lead to personal injury, fire or property damage. Remember to give due consideration to safety when making your circuit designs, with appropriate measures such as (i) placement of substitutive, auxiliary circuits, (ii) use of nonflammable material or (iii) prevention against any malfunction or mishap. Notes regarding these materials 1. These materials are intended as a reference to assist our customers in the selection of the Renesas Technology Corporation product best suited to the customer's application; they do not convey any license under any intellectual property rights, or any other rights, belonging to Renesas Technology Corporation or a third party. 2. Renesas Technology Corporation assumes no responsibility for any damage, or infringement of any third-party's rights, originating in the use of any product data, diagrams, charts, programs, algorithms, or circuit application examples contained in these materials. 3. All information contained in these materials, including product data, diagrams, charts, programs and algorithms represents information on products at the time of publication of these materials, and are subject to change by Renesas Technology Corporation without notice due to product improvements or other reasons. It is therefore recommended that customers contact Renesas Technology Corporation or an authorized Renesas Technology Corporation product distributor for the latest product information before purchasing a product listed herein. The information described here may contain technical inaccuracies or typographical errors. Renesas Technology Corporation assumes no responsibility for any damage, liability, or other loss rising from these inaccuracies or errors. Please also pay attention to information published by Renesas Technology Corporation by various means, including the Renesas Technology Corporation Semiconductor home page (http://www.renesas.com). 4. When using any or all of the information contained in these materials, including product data, diagrams, charts, programs, and algorithms, please be sure to evaluate all information as a total system before making a final decision on the applicability of the information and products. Renesas Technology Corporation assumes no responsibility for any damage, liability or other loss resulting from the information contained herein. 5. Renesas Technology Corporation semiconductors are not designed or manufactured for use in a device or system that is used under circumstances in which human life is potentially at stake. Please contact Renesas Technology Corporation or an authorized Renesas Technology Corporation product distributor when considering the use of a product contained herein for any specific purposes, such as apparatus or systems for transportation, vehicular, medical, aerospace, nuclear, or undersea repeater use. 6. The prior written approval of Renesas Technology Corporation is necessary to reprint or reproduce in whole or in part these materials. 7. If these products or technologies are subject to the Japanese export control restrictions, they must be exported under a license from the Japanese government and cannot be imported into a country other than the approved destination. Any diversion or reexport contrary to the export control laws and regulations of Japan and/or the country of destination is prohibited. 8. Please contact Renesas Technology Corporation for further details on these materials or the products contained therein. HD74HC4051 8-Channel Analog Multiplexer Demultiplexer ADE-205-535 (Z) 1st. Edition Sep. 2000 Description This device connects together the outputs of 8 switches, thus achieving an 8 Channel Multiplexer. The binary code placed on the A, B, and C select lines determine which one of the eight switches in "on", and connects one of the eight inputs to the common output. Features * High Speed Operation * Wide Operating Voltage * Low Quiescent Supply Current Function Table Control Inputs Inhibit C B A ON Switch L L L L X0 L L L H X1 L L H L X2 L L H H X3 L H L L X4 L H L H X5 L H H L X6 L H H H X7 H X X X -- X : Don't Care HD74HC4051 Pin Arrangement 16 VCC X4 1 X6 2 X6 X2 15 X2 X 3 X X1 14 X1 X7 4 X7 X0 13 X0 X5 5 X5 X3 12 X3 Inhibit 6 Inhibit A 11 A VEE 7 B 10 B X4 C GND 9 8 C (Top View) Block Diagram VCC Inhibit Control A Level B Converter Binary to 1-of-8 Decoder With inhibit C GND X0 VEE X1 X2 Switch In/Out X3 X4 X5 X6 X7 2 Common Out/In X HD74HC4051 Absolute Maximum Ratings Item Symbol Rating Unit Supply voltage VCC -0.5 to +7.0 V VCC - VEE -0.5 to +7.0 V Control input voltage VIN GND - 0.5 to VCC + 0.5 V Switch I/O voltage VI/O VEE - 0.5 to V CC + 0.5 V (VCC) I CC +50 mA (GND) I GND -50 mA Switch I/O current (per pin) I I/O 25 mA Control input diode current I IK 20 mA Switch I/O diode current I IOK 20 mA Power dissipation PT 500 mW Storage temperature range Tstg -65 to +150 C Supply current Recommended Operating Range Item Symbol Min Typ Max Unit Supply voltage VCC - VEE 2 -- 6 V GND - VEE -4 -- 0 V Control input voltage VIN 0 -- VCC V Switch I/O voltage VI/O VEE -- VCC V Operating temperature Topr -40 -- +85 C t r, t f 0 -- 1000 ns VCC = 4.5 V 0 -- 500 ns VCC = 6.0 V 0 -- 400 ns Input rise/fall time VCC = 2.0 V 3 HD74HC4051 DC Characteristics (VEE = GND) Ta = -40 to +85C Ta = 25C VCC (V) Min Typ Max Min Max Unit 2.0 1.5 -- -- 1.5 -- V 4.5 3.15 -- -- 3.15 -- 6.0 4.2 -- -- 4.2 -- 2.0 -- -- 0.5 -- 0.5 4.5 -- -- 1.35 -- 1.35 6.0 -- -- 1.8 -- 1.8 2.0 -- 2000 5000 -- 6250 VINH = VIL 4.5 -- 120 180 -- 225 VI/O = VCC to VEE 6.0 -- 100 170 -- 210 I I/O 2 mA 2.0 -- 200 800 -- 1000 VINH = VIL 4.5 -- 80 150 -- 190 VI/O = VCC to VEE 6.0 -- 70 140 -- 175 VI/O 2 mA 2.0 -- 50 -- -- -- between any two 4.5 -- 13 40 -- 50 VI/O = VCC to VEE channels 6.0 -- 10 20 -- 25 I I/O 2 mA Item Symbol Control input voltage VIH VIL ON resistance ON resistance RON RON Test Conditions V VINH = VIL OFF channel leakage current (switch off) I S (OFF) 6.0 -- -- 0.1 -- 1.0 A VINH = VIL OFF channel leakage current (switch on) I S (ON) 6.0 -- -- 0.1 -- 1.0 A VINH = VIL Control input current Iin 6.0 -- -- 0.1 -- 1.0 A Vin = VCC or GND Quiescent supply current 6.0 -- -- 4.0 -- 40 A Vin = VCC or GND 4 I CC HD74HC4051 AC Characteristics (CL = 50 pF, Input tr = tf = 6 ns, VEE = GND) Ta = -40 to +85C Ta = 25C Item Symbol VCC (V) Min Typ Max Min Max Unit Test Conditions Propagation delay t PLH 2.0 -- 25 60 -- 75 ns RL = 10 k 4.5 -- 6 12 -- 15 Switch input to 6.0 -- 5 10 -- 13 switch output 2.0 -- 25 60 -- 75 4.5 -- 6 12 -- 15 6.0 -- 5 10 -- 13 2.0 -- 50 153 -- 191 4.5 -- 16 30 -- 38 Control input to 6.0 -- 14 26 -- 33 switch output 2.0 -- 50 153 -- 191 4.5 -- 16 30 -- 38 6.0 -- 14 26 -- 33 2.0 -- 50 153 -- 191 4.5 -- 14 30 -- 38 6.0 -- 12 26 -- 33 2.0 -- 50 153 -- 191 4.5 -- 14 30 -- 38 6.0 -- 12 26 -- 33 2.0 -- 40 153 -- 191 4.5 -- 17 30 -- 38 6.0 -- 14 26 -- 33 2.0 -- 40 153 -- 191 4.5 -- 17 30 -- 38 6.0 -- 14 26 -- 33 time t PHL Propagation delay t PLH time t PHL Output enable t ZH time t ZL Output disable t HZ time t LZ ns ns RL = 10 k ns ns RL = 1 k ns ns RL = 1 k ns Control input capacitance Cin -- -- 5 10 -- 10 pF Switch input capacitance Cin 5.0 -- 5 -- -- -- pF Output capacitance (Common pin) Cout 5.0 -- 22 -- -- -- pF Feed through capacitance Cin-out 5.0 -- 0.7 -- -- -- pF Power dissipation capacitance CPD 5.0 -- 22.0 -- -- -- pF 5 HD74HC4051 AC Characteristics (CL = 50 pF, Input tr = tf = 6 ns, VEE = GND) (cont) Ta = -40 to +85C Ta = 25C VCC (V) Min Typ Max Min Max Unit Test Conditions Sine wave distortion 4.5 -- 0.1 -- -- -- % f in = 1 kHz, Vin = 4 VP-P RL = 10 k, C L = 50 pF Frequency response channel "ON" (Sine wave input) 4.5 -- 95 -- -- -- MHz f in = 1 MHz, 20 log 10 V OS/VIS = -3 dB RL = 50 , CL = 10 pF Feed through attenuation 4.5 -- -50 -- -- -- dB RL = 600 , CL = 50 pF, f in = 1 MHz Cross talk between 2.0 -- 25 -- -- -- mV RL = 600 , CL = 15 pF, any two switches 4.5 -- 60 -- -- -- 6.0 -- 75 -- -- -- Maximum control 2.0 -- 20 -- -- -- frequency 4.5 -- 30 -- -- -- 6.0 -- 30 -- -- -- Item Symbol f in = 1 MHz MHz RL = 1 k, C L = 15 pF Vout = 1/2 (VCC) AC Characteristics Test Circuit Maximum Control Frequency VC VC 0V VCC Vin * VCC VEE 6 VCC VCC GND Vout RL= 1k CL= 15pF Vout Vcc/2 HD74HC4051 Cross talk (Control Input to Switch Output) tr VCC VC VCC Vin Rin= 600 VEE tf VCC 90% VSS 10% (f=1MHz) Vout RL= 600 GND VCC/2 CL= 50pF VCC/2 tr=tr=6ns Feed through Attenuation VCC Vin (Sine Wave) 0.1F VCC (OFF) Vin fin Rin= 600 VEE Vout RL= 600 GND VCC/2 (Vin=0dBm,f=1MHz) CL= 50pF VCC/2 Sine Wave Distortion VCC Vin (Sine Wave) fin VCC (ON) Vin 10F VEE GND Vout RL= 10k CL= 50pF (Vin=4Vp-p,f=1kHz) VCC/2 7 HD74HC4051 Cin, Cout, Cin-out (Input, Output, and Feed through Capacitance) Cin-out 5V VCC Signal Input Pin Commom Pin (OFF) VEE GND VSS Cin Cout Frequency Response Channel ON VCC fin (Sine Wave) fin VCC (ON) Vin 0.1F VEE Vout GND RL= 50 CL= 10pF (Vout=0dBm,f=1MHz) RON: ON Resistance VCC Vin VCC (ON) I/O VEE O/I GND V 8 VI-O Vout HD74HC4051 IS (OFF): OFF Channel Leakage Current (Switch OFF) VCC VCC I/O A Vin=VCC or GND Vout=VSS or VCC (OFF) VEE GND IS (ON): OFF Channel Leakage Current (Switch ON) VCC VCC I/O A Vin=VCC or GND Vout OPEN (ON) VEE GND tPLH, tPHL: Propagation Delay Time (Switch Input to Switch Output) tr tf VCC VCC VCC (ON) Vin VEE GND 90% Vin Vout RL= 10k 50% GND CL= 50pF tPLH 10% tPHL VOH 50% Vout VOL tPLH, tPHL: Propagation Delay Time (Control Input to Switch Output) VCC VC=Vin VCC VC VCC or GND Switch input pin GND or VCC VCC Vout (Common Pin) VEE GND RL= 10k CL= 50pF 50% GND tPLH tPHL VOH Vout 50% VOL 9 HD74HC4051 tZH, tZL/tHZ, tLZ: Output Enable and Disable Time tf VCC VCC VINH =Vin VINH 50% Vout GND RL= 1k 10% tZH tHZ VOH CL= 50pF 90% Vout VCC GND 50% VOL GND VCC VOH tZL tLZ 50% Vout VOL 10 90% GND VCC VEE tr 10% HD74HC4051 Package Dimensions Unit: mm 19.20 20.00 Max 6.30 9 1 7.40 Max 16 8 1.3 0.48 0.10 7.62 2.54 Min 5.06 Max 2.54 0.25 0.51 Min 1.11 Max + 0.13 0.25 - 0.05 0 - 15 Hitachi Code JEDEC EIAJ Mass (reference value) DP-16 Conforms Conforms 1.07 g Unit: mm 10.06 10.5 Max 9 1 8 1.27 *0.42 0.08 0.40 0.06 0.10 0.10 0.80 Max *0.22 0.05 0.20 0.04 2.20 Max 5.5 16 0.20 7.80 +- 0.30 1.15 0 - 8 0.70 0.20 0.15 0.12 M *Dimension including the plating thickness Base material dimension Hitachi Code JEDEC EIAJ Mass (reference value) FP-16DA -- Conforms 0.24 g 11 HD74HC4051 Unit: mm 9.9 10.3 Max 9 1 8 *0.42 0.08 0.40 0.06 0.15 *0.22 0.03 0.20 0.03 0.635 Max + 0.11 1.27 0.14 - 0.04 1.75 Max 3.95 16 + 0.10 6.10 - 0.30 1.08 0 - 8 0.67 0.60 +- 0.20 0.25 M *Dimension including the plating thickness Base material dimension 12 Hitachi Code JEDEC EIAJ Mass (reference value) FP-16DN Conforms Conforms 0.15 g HD74HC4051 Cautions 1. Hitachi neither warrants nor grants licenses of any rights of Hitachi's or any third party's patent, copyright, trademark, or other intellectual property rights for information contained in this document. Hitachi bears no responsibility for problems that may arise with third party's rights, including intellectual property rights, in connection with use of the information contained in this document. 2. Products and product specifications may be subject to change without notice. Confirm that you have received the latest product standards or specifications before final design, purchase or use. 3. Hitachi makes every attempt to ensure that its products are of high quality and reliability. However, contact Hitachi's sales office before using the product in an application that demands especially high quality and reliability or where its failure or malfunction may directly threaten human life or cause risk of bodily injury, such as aerospace, aeronautics, nuclear power, combustion control, transportation, traffic, safety equipment or medical equipment for life support. 4. Design your application so that the product is used within the ranges guaranteed by Hitachi particularly for maximum rating, operating supply voltage range, heat radiation characteristics, installation conditions and other characteristics. Hitachi bears no responsibility for failure or damage when used beyond the guaranteed ranges. Even within the guaranteed ranges, consider normally foreseeable failure rates or failure modes in semiconductor devices and employ systemic measures such as failsafes, so that the equipment incorporating Hitachi product does not cause bodily injury, fire or other consequential damage due to operation of the Hitachi product. 5. This product is not designed to be radiation resistant. 6. No one is permitted to reproduce or duplicate, in any form, the whole or part of this document without written approval from Hitachi. 7. Contact Hitachi's sales office for any questions regarding this document or Hitachi semiconductor products. Hitachi, Ltd. Semiconductor & Integrated Circuits. Nippon Bldg., 2-6-2, Ohte-machi, Chiyoda-ku, Tokyo 100-0004, Japan Tel: Tokyo (03) 3270-2111 Fax: (03) 3270-5109 URL NorthAmerica Europe Asia Japan : : : : http://semiconductor.hitachi.com/ http://www.hitachi-eu.com/hel/ecg http://sicapac.hitachi-asia.com http://www.hitachi.co.jp/Sicd/indx.htm For further information write to: Hitachi Semiconductor (America) Inc. 179 East Tasman Drive, San Jose,CA 95134 Tel: <1> (408) 433-1990 Fax: <1>(408) 433-0223 Hitachi Europe GmbH Electronic Components Group Dornacher Strae 3 D-85622 Feldkirchen, Munich Germany Tel: <49> (89) 9 9180-0 Fax: <49> (89) 9 29 30 00 Hitachi Asia Ltd. Hitachi Tower 16 Collyer Quay #20-00, Singapore 049318 Tel : <65>-538-6533/538-8577 Fax : <65>-538-6933/538-3877 URL : http://www.hitachi.com.sg Hitachi Europe Ltd. Electronic Components Group. Whitebrook Park Lower Cookham Road Maidenhead Berkshire SL6 8YA, United Kingdom Tel: <44> (1628) 585000 Fax: <44> (1628) 585160 Hitachi Asia Ltd. (Taipei Branch Office) 4/F, No. 167, Tun Hwa North Road, Hung-Kuo Building, Taipei (105), Taiwan Tel : <886>-(2)-2718-3666 Fax : <886>-(2)-2718-8180 Telex : 23222 HAS-TP URL : http://www.hitachi.com.tw Hitachi Asia (Hong Kong) Ltd. Group III (Electronic Components) 7/F., North Tower, World Finance Centre, Harbour City, Canton Road Tsim Sha Tsui, Kowloon, Hong Kong Tel : <852>-(2)-735-9218 Fax : <852>-(2)-730-0281 URL : http://www.hitachi.com.hk Copyright Hitachi, Ltd., 2000. All rights reserved. Printed in Japan. Colophon 2.0 13