ELIS-B - Photon Vision Systems, Inc.

 Photon Vision Systems, Inc. 2000

PRELIMINARY ELIS Product DATASHEET PDS0004 REV. 10/31/00 Subject to change without notice. Page 1 of 8

P.O Box 509

Cortland, NY 13045.

tel. 607.756.5200

fax 607.756.5319

www.photon-vision.com

sales@ photon-vision.com

DS0004 REV. 10/31/00

Photon Vision Systems

High Performance Linear CMOS Image Sensors

ELIS CMOS IMAGER

Description

The ELIS Linear Image Sensor consists of an array of high performance low dark current photo-diode pixels. The

device features nearly the same performance characteristics of our LIS series of linear imagers, but also adds

sample and hold capability and the ability to bin pixels together. This in effect allows the user to select the devices

resolution. The device can operate at voltages as low as 2.8 VDC. A key feature over traditional CCD

technology, is that the device can be read and reread Non-Destructively, allowing the user to maximize signal to

noise and dynamic range.

Operation is simplified by on chip logic which requires only the user to select the bin resolution, input a cloc

equal to the desired pixel read rate, selecting the reset mode, and external reset to initiate read-out when running

asynchronously.

The ELIS imager is supplied in our exclusive PHOTO-SURF™ package. The package utilizes an optically clea

window, virtually eliminating distortion over that caused by traditional 'clear' plastic packages.

The Photon Vision Systems ELIS is a family of high performance linea

image sensor designed for a wide variety of applications as a superio

CCD replacement, including:

Edge Detection

Contact Imaging

Bar Code Reading

Finger Printing

Encoding and Positioning

Text Recognition

 Photon Vision Systems, Inc. 2000

PRELIMINARY ELIS Product DATASHEET PDS0004 REV. 10/31/00 Subject to change without notice. Page 2 of 8

Key Features

• Low Cost

• Single Supply Operation

• Sample and Hold

• High Sensitivity

• High Signal to Noise

• Non-Destructive read capable

• 1.0 kHz. to 40.0 MHz Operation

• Very Low Dark Current

• Optically clear package (Packaged Version)

• Sequential or Frame Operation

• Completely integrated Timing and Control

• Replaces CCD systems, not just the sensor

• Active area is 7.988 mm x 125 microns

FUNCTIONAL BLOCK DIAGAM

1,2,4,8 Modulo Scanner

1 of 8

1 of 4

1 of 2

Pixel 1 Pixel 2 Pixel 3 Pixel 4 Pixel 5

SHT

RST

 Photon Vision Systems, Inc. 2000

PRELIMINARY ELIS Product DATASHEET PDS0004 REV. 10/31/00 Subject to change without notice. Page 3 of 8

Electro-Oprical Charactersitics

Parameter Min Typical Max Units

Supply Voltage (see note 5) 2.80 5.0 5.25 V

Supply Current (see note 1) 8 14 20 mA

Input High Logic Level 2.7 V

Input Low Logic Level 0.6 V

Clock Frequency/Pixel Read Rate (see note 3) 1.0 1000 40000 kHz

External Load 5000 Ohms

Output Voltage at Saturation (see note 5) 2.8 3.3 4.0 V

Output Voltage at Dark 0.64 0.74 0.84 V

Conversion Gain 3.2 µv/e-

Full Well 800 ke-

Dynamic Range 80 dB

Pixel Non-Uniformity Dark ±0.5 %

Linearity (see note2) 1.0 %

Output due to Dark Current (see note 4) 2 19 38 mV/s

Relative Humidity 0 90 %

Operating Temperature 0 25 50 °C

Notes 1. Including Load Resistor

2. Pixel average from 5% - 75% Saturation

3. Specs. Given at pixel read rates of 1 MHz at 24 deg. C At greater read rates, MTF and S/N begin to

degrade.

4. At 24

°C.

5. At Supply voltages less than Saturation Voltage, Vo is clipped by supply, no load applied.

6. Temporal rms noise @ 1 Mhz erc and 500khz video band width filter applied, values are typical and may

vary. Higher S/N ratios are obtainable with lower erc and bandwidths.

 Photon Vision Systems, Inc. 2000

PRELIMINARY ELIS Product DATASHEET PDS0004 REV. 10/31/00 Subject to change without notice. Page 4 of 8

OPERATION AND TIMING

Resolution selection via binning.

Select the desired resolution with the following table;

M0 M1 Resolution Effective pixel size

0 0 1024 7.8 x 125 microns

1 0 512 15.6 x 125 microns

0 1 256 31.2 x 125 microns

1 1 128 64.4 x 125 microns

The effective imager length is 7.988 mm irregardless of the selected binned resolution. Internally, the device has 1024 pixels.

When the binned resolution is set to 512, pixels 1 and 2 photo diodes are averaged and output as a single pixel, pixels 3 and 4

are averaged and output as a single value, and so on. If set to 256 resolution, then pixels 1 through 4 are averaged and output

as a single value, 5 through 8 are averaged and output as a single value, and so on.

Absolute maximum ratings, T A = 25°C unless otherwise noted, see Note 1, below. †

Supply voltage range, VDD------------------------------------------------ 0 V to 5.25 V

Digital input current range, I --------------------------------------------- –20 mA to 20 mA

Operating case temperature range, T C (see Note 2)------------------ –10°C to 70°

Operating free-air temperature range, T A -------------------------------- 0°C to 50°C

Storage temperature range ------------------------------------------------ –20°C to 85°C

Humidity range, Rh -------------------------------------------------------- 0-100%, non-condensing

Lead temperature 1.5 mm (0.06 inch) from case for 10 seconds----- 255°C

† Exceeding the ranges specified under “absolute maximum ratings” can damage the device. The values given are for stress ratings only. Operation of the

device at conditions other than those indicated under “recommended operating conditions” is not implied. Exposing the device to absolute maximum rated

conditions for extended periods may affect device reliability and performance.

NOTES: 1. Voltage values are with respect to the device GND terminal.

2. Case temperature is defined as the surface temperature of the package measured directly over the integrated circuit.

PIN DESCRIPTION – PHOTO-SURF™ (16 pin LCC) Package

1 VO Output Video Output

2 ,11 AVDD Analog Power

3, 10 AGND Analog Ground ref.

4 RM Input Reserved for Future use – tie to pin 6, DGND

5 DVDD Input Digital Power

6 DGND Input Digital Ground ref.

7 CLK Input Clock

8, 9 N/C No connection

12 DATA Input Start Readout

13 RST Input Reset

14 M0 Input Bin select bit 0

15 M1 Input Bin Select bit 1

16 SHT Input Shutter

 Photon Vision Systems, Inc. 2000

PRELIMINARY ELIS Product DATASHEET PDS0004 REV. 10/31/00 Subject to change without notice. Page 5 of 8

TIMING

The device allows the user to control the integration time. Note – be sure to tie pin 4 (RM) to DGND.

Figure 1 - Start of Frame timing diagram.

Device Reset:

The first 2.0 µs as shown above indicate how to reset the imager. Both the RST input and the SHT input must be

simultaneously high for at least 1.0 µs to properly reset the imager. The imager can be held in reset indefinitely by keeping

both inputs high.

Integration:

Once RST input goes low, the pixel begins to integrate. Integration continues until SHT goes low. The diagram shows the

pixel integrating for 10.0 µs.

Readout:

Readout will then begin on the first rising edge of CLK after the DATA input is set high. DATA must be brought low prior

to the next rising CLK edge, otherwise pixel 1 is again output.

Binning:

By setting the M0 and M1 inputs as indicated in the Binning table above, different effective resolutions can be realized,

with the effective pixel area increasing in the table above. The internal control logic takes care that only one pixel is output

per CLK period. So if the imager is binned for 256 resolution, then only 256 additional clock cycles are needed to read out

the imager once DATA is set.

NOTES TO TIMING DIAGRAMS

1. Clock duty cycle should be 50%.

2. XXX Clock cycles for the number of pixels to read, starting at the first pixel.

3. t int represents integration time.

4. RST pulse always resets internal counter, thus next pixel output is the first pixel.

tint

 Photon Vision Systems, Inc. 2000

PRELIMINARY ELIS Product DATASHEET PDS0004 REV. 10/31/00 Subject to change without notice. Page 6 of 8

QE RESPONSE

0.0000

0.2000

0.4000

0.6000

0.8000

1.0000

1.2000

300

375

450

525

600

675

750

825

900

975

1050

Wavelength

Normalized

Note: Data below 350nm not measured, but device is sensitive to 200 nm. Shown for un-encapsulated device.

 Photon Vision Systems, Inc. 2000

PRELIMINARY ELIS Product DATASHEET PDS0004 REV. 10/31/00 Subject to change without notice. Page 7 of 8

MECHANICAL DIMENSIONS –PHOTO-SURF™ PACKAGE

Figure 2 - 16 pin PHOTO-SURF™ Package. Dimensions in millimeters. FOR REFERENCE ONLY.

NOTE: Encapsolant transmission is 99% from 400 to 900 nm, 50% at 350 nm, 0% at 325nm.

Other encapsolants available to allow 75% transmission at 300nm. Contact us for details.

 Photon Vision Systems, Inc. 2000

PRELIMINARY ELIS Product DATASHEET PDS0004 REV. 10/31/00 Subject to change without notice. Page 8 of 8

ORDERING INFORMATION

These devices are offered in two package configurations, A Chip Scale Ball Grid Array and a leadlecc Chip

Carrier.

ELIS-L Leadless Chip Carrier (LCC)

ELIS-B Chip Scale (BGA)

Contact the factory or your local authorized representative for availability.

NOTICE

Photon Vision Systems, Inc. (PVS) reserves the right to make product modifications or discontinue products or

services without notice. Customers are advised to obtain latest written specifications or other relevant

information prior to ordering product or services. Information provided by Photon Vision Systems, Inc. is

believed to be accurate at time of publication release. PVS shall not be held liable for any damages,

consequential or inconsequential resulting from errors or omissions of documentation, or use of our products.

Product sales are subject to the PVS Terms and Conditions of Sale in force at the time of order

acknowledgement.

PVS assumes no liability for customer products or designs. PVS does not warrant or represent that any license,

either expressed or implied, is granted under any patent, copyright, or any other intellectual property right of

PVS for any product or process for which PVS products or services are used. PVS's does not endorse, warrant,

or approve any third party's products or service information that may be published by PVS.

PVS's products are not designed, authorized, or warranted for use in life support devices or systems, or any

other critical application which may involve death, injury, property or environmental damages. Using PVS's

products for any critical application is fully at the risk of the customer and their end users and assigns.