LTP5901-IPR/LTP5902-IPR
1
59012iprf
For more information www.linear.com/LTP5901-IPR or www.linear.com/LTP5902-IPR
Typical applicaTion
neTwork FeaTures DescripTion
SmartMesh IP Network Manager
2.4GHz 802.15.4e
Wireless Embedded Manager
lTp5901/2-ipr FeaTures
n Complete Radio Transceiver, Embedded Processor,
and Networking Software for Forming a Self-Healing
Mesh Network
n SmartMesh
®
Networks Incorporate:
n Time Synchronized Network-Wide Scheduling
n Per Transmission Frequency Hopping
n Redundant Spatially Diverse Topologies
n Network-Wide Reliability and Power Optimization
n NIST Certified Security
n SmartMesh Networks Deliver:
n >99.999% Network Reliability Achieved in the
Most Challenging RF Environments
n Sub 50µA Routing Nodes
n Compliant to 6LoWPAN Internet Protocol (IP) and
IEEE 802.15.4e Standards
n Manages Networks of Up to 32 Nodes (LT P 5901/2-
IPRA) or Up to 100 Nodes (LT P 5901/2-IPRB)
n Sub 1mA Average Current Consumption Enables
Battery Powered Network Management
n RF Modular Certification Include USA, Canada, EU,
Japan, Taiwan, Korea, India, Australia and New
Zealand
n PCB Assembly with Chip Antenna (LT P 5901-IPR) or
with MMCX Antenna Connector (LT P 5902-IPR)
SmartMesh IP™ wireless sensor networks are self man-
aging, low power internet protocol (IP) networks built
from wireless nodes called motes. The LT P ™5901-IPR/
LT P 5902-IPR is the IP manager product in the Eterna
®
*
family of IEEE 802.15.4e printed circuit board assembly
solutions, featuring a highly integrated, low power radio
design by Dust Networks
®
as well as an ARM Cortex-M3
32-bit microprocessor running Dust’s embedded Smart-
Mesh IP networking software.
Based on the IETF 6LoWPAN and IEEE-802.15.4e stan-
dards, the LT P 5901/2-IPR runs SmartMesh IP network
management software to monitor and manage network
performance and provide a data ingress/egress point via
a UART interface. The SmartMesh IP software provided
with the LT P 5901/2-IPR is fully tested and validated, and
is readily configured via a software application program-
ming interface. With Dust’s time-synchronized SmartMesh
IP networks, all motes in the network may route, source
or terminate data, while providing many years of battery
powered operation.
SmartMesh IP motes deliver a highly flexible network
with proven reliability and low power performance in an
easy-to-integrate platform.
L, LT , LT C , LT M , Linear Technology, Dust, Dust Networks, Eterna, SmartMesh and the
Linear logo are registered trademarks and LT P , SmartMesh IP and the Dust Networks logo are
trademarks of Linear Technology Corporation. All other trademarks are the property of their
respective owners. Protected by U.S. Patents, including 7375594, 7420980, 7529217, 7791419,
7881239, 7898322, 8222965.
* Eterna is Dust Networks’ low power radio SoC architecture.
59012IPR TA01
µCONTROLLERSENSOR
IN+
IN
SPILT C
®
2379-18
LTP5901/2-IPM
UART
UART
MOTE
EXPANDED VIEW
ANTENNA
LTP5901-IPR
HOST
APPLICATION
LTP5901-IPR/LTP5902-IPR
2
59012iprf
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Table oF conTenTs
Network Features .......................................... 1
LTP5901/2-IPR Features .................................. 1
Typical Application ........................................ 1
Description.................................................. 1
SmartMesh Network Overview ........................... 3
Absolute Maximum Ratings .............................. 4
Pin Configuration .......................................... 4
Order Information .......................................... 5
Recommended Operating Conditions ................... 5
DC Characteristics ......................................... 5
Radio Specifications ...................................... 6
Radio Receiver Characteristics .......................... 6
Radio Transmitter Characteristics ....................... 7
Digital I/O Characteristics ................................ 7
Temperature Sensor Characteristics .................... 7
System Characteristics ................................... 8
UART AC Characteristics .................................. 8
Time AC Characteristics .................................. 9
Radio_INHIBIT AC Characteristics ..................... 10
Flash AC Characteristics ................................. 10
Flash SPI Slave AC Characteristics .................... 10
External Bus AC Characteristics ........................ 11
Typical Performance Characteristics .................. 14
Pin Functions .............................................. 19
Operation................................................... 22
Power Supply ..........................................................23
Supply Monitoring and Reset ................................. 23
Precision Timing ..................................................... 23
Application Time Synchronization ..........................23
Time References ..................................................... 23
Radio ...................................................................... 24
UARTs ..................................................................... 24
API UART Protocol ................................................. 24
CLI UART ................................................................ 25
Autonomous MAC ...................................................25
Security .................................................................. 25
Temperature Sensor ...............................................25
Radio Inhibit ...........................................................25
Factory Installed Software ......................................25
Flash Data Retention ...............................................26
Networking .............................................................27
Applications Information ................................ 29
Regulatory and Standards Compliance ...................29
Soldering Information ............................................. 29
Related Documentation .................................. 29
Package Description ..................................... 30
Typical Application ....................................... 32
Related Parts .............................................. 32
LTP5901-IPR/LTP5902-IPR
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smarTmesh neTwork overview
A SmartMesh network consists of a self-forming multi-hop,
mesh of nodes, known as motes, which collect and relay
data, and a network manager that monitors and manages
network performance and security, and exchanges data
with a host application.
SmartMesh networks communicate using a time slotted
channel hopping(TSCH) link layer, pioneered by Dust
Networks. In a TSCH network, all motes in the network
are synchronized to within less than a millisecond. Time
in the network is organized into timeslots, which enables
collision-free packet exchange and per-transmission
channel-hopping. In a SmartMesh network, every device
has one or more parents (e.g. mote 3 has motes 1 and
2 as parents) that provide redundant paths to overcome
communications interruption due to interference, physical
obstruction or multi-path fading. If a packet transmission
fails on one path, the next retransmission may try on a
different path and different RF channel.
A network begins to form when the network manager
instructs its onboard access point (AP) radio to begin
sendingadvertisementspackets that contain information
that enables a device to synchronize to the network and
request to join. This message exchange is part of thesecu-
rityhandshake that establishes encrypted communications
between the manager or application, and mote. Once motes
have joined the network, they maintain synchronization
through time corrections when a packet is acknowledged.
to the network manager in packets called health reports.
The network manager uses health reports to continually
optimize the network to maintain >99.999% data reliability
even in the most challenging RF environments.
The use of TSCH allows SmartMesh devices to sleep in-
between scheduled communications and draw very little
power in this state. Motes are only active in timeslots
where they are scheduled to transmit or receive, typically
resulting in a duty cycle of < 1%. The optimization soft-
ware in the network manager coordinates this schedule
automatically. When combined with the Eterna low power
radio, every mote in a SmartMesh network—even busy
routing ones—can run on batteries for years. By default,
all motes in a network are capable of routing traffic from
other motes, which simplifies installation by avoiding the
complexity of having distinct routers vs non-routing end
nodes. Motes may be configured as non-routing to further
reduce that particular mote’s power consumption and to
support a wide variety of network topologies.
An ongoing discovery process ensures that the network
continually discovers new paths as the RF conditions
change. In addition, each mote in the network tracks per-
formance statistics (e.g. quality of used paths, and lists of
potential paths) and periodically sends that information
At the heart of SmartMesh motes and network managers
is the Eterna IEEE 802.15.4e System-on-Chip (SoC), fea-
turing Dust Networks’ highly integrated, low power radio
design, plus an ARM Cortex-M3 32-bit microprocessor
running SmartMesh networking software. The SmartMesh
networking software comes fully compiled yet is configu-
rable via a rich set of application programming interfaces
(APIs) which allows a host application to interact with
the network, e.g. to transfer information to a device, to
configure data publishing rates on one or more motes,
or to monitor network state or performance metrics. Data
publishing can be uniform or different for each device,
with motes being able to publish infrequently or faster
than once per second as needed.
HOST
APPLICATION
AP
NETWORK MANAGER
59012IPR SNO01
Mote
2
Mote
1
Mote
3
ALL NODES ARE ROUTERS.
THEY CAN TRANSMIT AND RECEIVE.
THIS NEW NODE CAN JOIN
ANYWHERE BECAUSE ALL
NODES CAN ROUTE.
59012IPR SNO02
LTP5901-IPR/LTP5902-IPR
4
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pin conFiguraTion
absoluTe maximum raTings
Supply Voltage on VSUPPLY ..................................3.76V
Input Voltage on AI_0/1/2/3 Inputs ........................1.80V
Voltage on Any Digital I/O Pin .... 0.3V to VSUPPLY + 0.3V
Input RF Level ...................................................... 10dBm
Storage Temperature Range (Note 3) ..... 55°C to 105°C
(Notes 1, 2) Operating Temperature Range
LTP5901I/LPT5902I .............................40°C to 8C
CAUTION: This part is sensitive to electrostatic discharge
(ESD). It is very important that proper ESD precautions
be observed when handling the LTP5901/LTP5902-IPR.
Pin functions shown in italics are currently not supported in software.
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
66
65
64
63
62
61
60
59
58
57
56
55
54
53
52
51
50
49
48
47
46
45
44
43
42
41
40
39
38
37
GND
RESERVED
NC
GPIO17
GPIO18
GPIO19
AI_2
AI_1
AI_3
AI_0
GND
RESERVED
NC
NC
RESETn
TDI
TDO
TMS
TCK
GND
DP4
RESERVED
RESERVED
RESERVED
EB_DATA_7
EB_DATA_6
EB_DATA_4
EB_DATA_0
NC
GND
GND
NC
RADIO_INHIBIT
TIMEn
UART_TX
UART_TX_CTSn
UART_TX_RTSn
UART_RX
UART_RX_CTSn
UART_RX_RTSn
GND
VSUPPLY
RESERVED
NC
NC
FLASH_P_ENn / EB_IO_LE1
EB_IO_OEn
EB_IO_WEn
RESERVED / UARTC1_RX
RESERVED / UARTC1_TX
EB_IO_CS0n
EB_DATA_5
EB_DATA_2
EB_DATA_3
GND
EB_ADDR_0
EB_ADDR_1
IPCS_SSn
EB_IO_LE2
GND
IPCS_MISO
UARTCO_RX / EB_DATA_1
UARTCO_TX / EB_IO_LE0
PC PACKAGE
66-LEAD PCB
IPCS_SCK
IPCS_MOSI
GND
31 32 33 34 35 36
LTP5901-IPR/LTP5902-IPR
5
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orDer inFormaTion
LEAD FREE FINISH** PART MARKING* PACKAGE DESCRIPTION TEMPERATURE RANGE
LT P 5901IPC-IPRA???#PBF LT P 5901IPC-IPRA???#PBF 66-Lead (42mm × 24mm × 5.5mm) PCB with Chip Antenna –40°C to 85°C
LT P 5901IPC-IPRB???#PBF LT P 5901IPC-IPRB???#PBF 66-Lead (42mm × 24mm × 5.5mm) PCB with Chip Antenna –40°C to 85°C
LT P 5901IPC-IPRC???#PBF LT P 5901IPC-IPRC???#PBF 66-Lead (42mm × 24mm × 5.5mm) PCB with Chip Antenna –40°C to 85°C
LT P 5902IPC-IPRA???#PBF LT P 5902IPC-IPRA???#PBF 66-Lead (37.5mm × 24mm × 5.5mm) PCB with MMCX
Connector
–40°C to 85°C
LT P 5902IPC-IPRB???#PBF LT P 5902IPC-IPRB???#PBF 66-Lead (37.5mm × 24mm × 5.5mm) PCB with MMCX
Connector
–40°C to 85°C
LT P 5902IPC-IPRC???#PBF LT P 5902IPC-IPRC???#PBF 66-Lead (37.5mm × 24mm × 5.5mm) PCB with MMCX
Connector
–40°C to 85°C
*The temperature grade is identified by a label on the shipping container.
**The sofware version is indicated by ???. For specific ordering information, go to: www.linear.com/ltp5901-ipr#orderinfo or
www.linear.com/ltp5902-ipr#orderinfo
For a description of the dash options see the IP Manager Options section.
For more information on lead free part marking, go to: http://www.linear.com/leadfree/
recommenDeD operaTing conDiTions
SYMBOL PARAMETER CONDITIONS MIN TYP MAX UNITS
VSUPPLY Supply Voltage Including Noise and Load Regulation l 2.1 3.76 V
Supply Noise 50Hz to 2MHz l250 mV
Operating Relative Humidity Non-Condensing l10 90 % RH
Temperature Ramp Rate While Operating in
Network
l–8 8 °C/min
The l denotes the specifications which apply over
the full operating temperature range, otherwise specifications are at TA = 25°C and VSUPPLY = 3.6V unless otherwise noted.
Dc characTerisTics
OPERATION/STATE CONDITIONS MIN TYP MAX UNITS
Power-On Reset During Power-On Reset, Maximum 750µs + VSUPPLY Rise Time from 1V to
1.9V
12 mA
Doze RAM on, ARM Cortex-M3, Flash, Radio, and Peripherals Off, All Data and
State Retained, 32.768kHz Reference Active
1.2 µA
Deep Sleep RAM on, ARM Cortex-M3, Flash, Radio, and Peripherals Off, All Data and
State Retained, 32.768kHz Reference Inactive
0.8 µA
In-Circuit Programming RESETn and FLASH_P_ENn Asserted, IPCS_SCK at 8MHz 20 mA
Peak Operating Current
8dBm
0dBm
System Operating at 14.7MHz, Radio Transmitting, During Flash Write.
Maximum Duration 4.33 ms.
30
26
mA
mA
Active ARM Cortex-M3, RAM and Flash Operating, Radio and All Other Peripherals
Off. Clock Frequency of CPU and Peripherals Set to 7.3728MHz, VCORE =
1.2V
1.3 mA
Flash Write Single Bank Flash Write 3.7 mA
Flash Erase Single Bank Page or Mass Erase 2.5 mA
The l denotes the specifications which apply over the full operating temperature range,
otherwise specifications are at TA = 25°C and VSUPPLY = 3.6V unless otherwise noted.
LTP5901-IPR/LTP5902-IPR
6
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OPERATION/STATE CONDITIONS MIN TYP MAX UNITS
Radio Tx
0dBm
8dBm
Current with Autonomous MAC Managing Radio Operation, CPU Inactive.
Clock Frequency of CPU and Peripherals Set to 7.3728MHz.
5.4
9.7
mA
mA
Radio Rx Current with Autonomous MAC Managing Radio Operation, CPU Inactive.
Clock Frequency of CPU and Peripherals Set to 7.3728MHz.
4.5 mA
Dc characTerisTics
The l denotes the specifications which apply over the full operating temperature range,
otherwise specifications are at TA = 25°C and VSUPPLY = 3.6V unless otherwise noted.
PARAMETER CONDITIONS MIN TYP MAX UNITS
Frequency Band l2.4000 2.4835 GHz
Number of Channels l15
Channel Separation l5 MHz
Channel Center Frequency Where k = 11 to 25, as Defined by IEEE.802.4.15 l2405 + 5*(k-11) MHz
Raw Data Rate l250 kbps
Antenna Pin ESD Protection HBM Per JEDEC JESD22-A114F (Note 2) ±6000 V
Range
Indoor
Outdoor
Free Space
25°C, 50% RH, +2dBi Omni-Directional Antenna, Antenna 2m Above
Ground
100
300
1200
m
m
m
raDio speciFicaTions
The l denotes the specifications which apply over the full operating temperature
range, otherwise specifications are at TA = 25°C and VSUPPLY = 3.6V unless otherwise noted.
PARAMETER CONDITIONS MIN TYP MAX UNITS
Receiver Sensitivity Packet Error Rate (PER) = 1% (Note 5) –93 dBm
Receiver Sensitivity PER = 50% –95 dBm
Saturation Maximum Input Level the Receiver Will
Properly Receive Packets
0 dBm
Adjacent Channel Rejection
(High Side)
Desired Signal at –82dBm, Adjacent Modulated Channel 5MHz
Above the Desired Signal, PER = 1% (Note 5)
22 dBc
Adjacent Channel Rejection
(Low Side)
Desired Signal at –82dBm, Adjacent Modulated Channel 5MHz
Below the Desired Signal, PER = 1% (Note 5)
19 dBc
Alternate Channel Rejection
(High Side)
Desired Signal at –82dBm, Alternate Modulated Channel 10MHz
Above the Desired Signal, PER = 1% (Note 5)
40 dBc
Alternate Channel Rejection
(Low Side)
Desired Signal at –82dBm, Alternate Modulated Channel 10MHz
Below the Desired Signal, PER = 1% (Note 5)
36 dBc
Second Alternate Channel
Rejection
Desired Signal at –82dBm, Second Alternate Modulated Channel
Either 15MHz Above or Below, PER = 1% (Note 5)
42 dBc
Co-Channel Rejection Desired Signal at –82dBm, Undesired Signal is an 802.15.4
Modulated Signal at the Same Frequency, PER = 1%
–6 dBc
LO Feed Through –55 dBm
Frequency Error Tolerance
(Note 6)
±50 ppm
Symbol Error Tolerance ±50 ppm
Received Signal Strength
Indicator (RSSI) Input
Range
–90 to -10 dBm
RSSI Accuracy ±6 dB
RSSI Resolution 1 dB
raDio receiver characTerisTics
The l denotes the specifications which apply over the full
operating temperature range, otherwise specifications are at TA = 25°C and VSUPPLY = 3.6V unless otherwise noted.
LTP5901-IPR/LTP5902-IPR
7
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PARAMETER CONDITIONS MIN TYP MAX UNITS
Output Power
High Calibrated Setting
Low Calibrated Setting
Delivered to a 50Ω Load
8
0
dBm
dBm
Spurious Emissions
30MHz to 1000MHz
1GHz to 12.75GHz
2.4GHz ISM Upper Band Edge (Peak)
2.4GHz ISM Upper Band Edge (Average)
2.4GHz ISM Lower Band Edge
Conducted Measurement with a 50Ω Single-Ended
Load, 8dBm Output Power. All Measurements Made
with Max Hold.
RBW = 120kHz, VBW = 100Hz
RBW = 1MHz, VBW = 3MHz
RBW = 1MHz, VBW = 3MHz
RBW = 1MHz, VBW = 10Hz
RBW = 100kHz, VBW = 100kHz
< –70
–45
–37
–49
–45
dBm
dBm
dBm
dBm
dBc
Harmonic Emissions
2nd Harmonic
3rd Harmonic
Conducted Measurement Delivered to a 50Ω Load,
Resolution Bandwidth = 1MHz, Video Bandwidth =
1MHz.
–50
–45
dBm
dBm
raDio TransmiTTer characTerisTics
The l denotes the specifications which apply over the
full operating temperature range, otherwise specifications are at TA = 25°C and VSUPPLY = 3.6V unless otherwise noted.
SYMBOL PARAMETER CONDITIONS (Note 7) MIN TYP MAX UNITS
VIL Low Level Input Voltage l–0.3 0.6 V
VIH High Level Input Voltage (Note 8) lVSUPPLY
– 0.3
VSUPPLY
+ 0.3
V
VOL Low Level Output Voltage Type 1, IOL(MAX) = 1.2mA l0.4 V
VOH High Level Output Voltage Type 1, IOH(MAX) = –0.8mA lVSUPPLY
– 0.3
VSUPPLY
+ 0.3
V
VOL Low Level Output Voltage Type 2, Low Drive, IOL(MAX) = 2.2mA l0.4 V
VOH High Level Output Voltage Type 2, Low Drive, IOH(MAX) = –1.6mA lVSUPPLY
– 0.3
VSUPPLY
+ 0.3
V
VOL Low Level Output Voltage Type 2, High Drive, IOL(MAX) = 4.5mA l0.4 V
VOH High Level Output Voltage Type 2, High Drive, IOH(MAX) = –3.2mA lVSUPPLY
– 0.3
VSUPPLY
+ 0.3
V
Input Leakage Current Input Driven to VSUPPLY or GND 50 nA
Pull-Up/Pull-Down Resistance 50
DigiTal i/o characTerisTics
The l denotes the specifications which apply over the full operating
temperature range, otherwise specifications are at TA = 25°C and VSUPPLY = 3.6V unless otherwise noted.
PARAMETER CONDITIONS MIN TYP MAX UNITS
Offset Temperature Offset Error at 25°C ±0.25 °C
Slope Error ±0.033 °C/°C
TemperaTure sensor characTerisTics
The l denotes the specifications which apply over
the full operating temperature range, otherwise specifications are at TA = 25°C and VSUPPLY = 3.6V unless otherwise noted.
LTP5901-IPR/LTP5902-IPR
8
59012iprf
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sysTem characTerisTics
The l denotes the specifications which apply over the full operating temperature
range, otherwise specifications are at TA = 25°C and VSUPPLY = 3.6V unless otherwise noted.
SYMBOL PARAMETER CONDITIONS (Note 7) MIN TYP MAX UNITS
Permitted Rx Baud Rate Error Both Application Programming Interface
(API) and Command Line Interface (CLI)
UARTs
l–2 2 %
Generated Tx Baud Rate Error Both API and CLI UARTs l–1 1 %
tRX_RTS to RX_CTS Assertion of UART_RX_RTSn to Assertion of
UART_RX_CTSn, or Negation of UART_RX_
RTSn to Negation of UART_RX_CTSn
l0 2 ms
tCTS_R to RX Assertion of UART_RX_CTSn to Start of Byte l0 20 ms
tEOP to RX_RTS End of Packet (End of the Last Stop Bit) to
Negation of UART_RX_RTSn
l0 22 ms
tBEG_TX_RTS to TX_CTS Assertion of UART_TX_RTSn to Assertion of
UART_TX_CTSn
l0 22 ms
tEND_TX_CTS to TX_RTS Negation of UART_TX_CTSn to Negation of
UART_TX_RTSn
2 Bit
Period
tTX_CTS to TX Assertion of UART_TX_CTSn to Start of Byte l0 2 Bit
Period
tEOP to TX_RTS End of Packet (End of the Last Stop Bit) to
Negation of UART_TX_RTSn
l0 1 Bit
Period
tRX_INTERBYTE Receive Inter-Byte Delay l100 ms
tTX to TX_CTS Start of Byte to Negation of UART_TX_CTSn l0 µs
uarT ac characTerisTics
The l denotes the specifications which apply over the full operating temperature
range, otherwise specifications are at TA = 25°C and VSUPPLY = 3.6V unless otherwise noted. (Note 12)
SYMBOL PARAMETER CONDITIONS (Note 7) MIN TYP MAX UNITS
Doze to Active State Transmit 5 µs
Doze to Radio Tx or Rx 1.2 ms
QCCA Charge to Sample RF Channel RSSI Charge Consumed Starting from Doze State
and Completing an RSSI Measurement
4 µC
QMAX Largest Atomic Charge Operation Flash Erase, 21ms Max Duration l200 µC
RESETn Pulse Width l125 µs
LTP5901-IPR/LTP5902-IPR
9
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Figure 1. API UART Timing
SYMBOL PARAMETER CONDITIONS (Note 7) MIN TYP MAX UNITS
tSTROBE TIMEn Signal Strobe Width l125 µs
tRESPONSE Delay from Rising Edge of TIMEn to the Start of
Time Packet on API UART
l0 100 ms
tTIME_HOLD Delay from End of Time Packet on API UART to
Falling Edge of Subsequent TIMEn
l0 ns
Timestamp Resolution (Note 9) l1 µs
Network-Wide Time Accuracy (Note 10) l±5 µs
Time ac characTerisTics
The l denotes the specifications which apply over the full operating temperature
range, otherwise specifications are at TA = 25°C and VSUPPLY = 3.6V unless otherwise noted. (Note 12)
Figure 2. Timestamp Timing
uarT ac characTerisTics
The l denotes the specifications which apply over the full operating temperature
range, otherwise specifications are at TA = 25°C and VSUPPLY = 3.6V unless otherwise noted. (Note 12)
59012IPR F01
UART_TX_RTSn
UART_TX_CTSn
UART_TX BYTE 0 BYTE 1
tBEG_TX_RTS TO TX_CTS
tEND_TX_CTS TO TX_RTS
tTX_CTS TO TX
tTX TO TX_CTS
tEOP TO TX_RTS
tEND_TX_RTS TO TX_CTS
UART_RX_RTSn
UART_RX_CTSn
tRX_RTS TO RX_CTS
UART_RX
tEOP TO RX_RTS
tRX_RTS TO RX_CTS
tRX_CTS TO RX
tRX_INTERBYTE
BYTE 0 BYTE 1
59012IPR F02
TIMEn
UART_TX
tSTROBE tTIME_HOLD
tRESPONSE
TIME INDICATION PAYLOAD
LTP5901-IPR/LTP5902-IPR
10
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Flash spi slave ac characTerisTics
The l denotes the specifications which apply over the full
operating temperature range, otherwise specifications are at TA = 25°C and VSUPPLY = 3.6V unless otherwise noted. (Note 12)
SYMBOL PARAMETER CONDITIONS (Note 7) MIN TYP MAX UNITS
tFP_EN_to_RESET Setup from Assertion of FLASH_P_ENn to
Assertion of RESETn
l0 ns
tFP_ENTER Delay from the Assertion RESETn to the First
Falling Edge of IPCS_SSn
l125 µs
tFP_EXIT Delay from the Completion of the Last Flash SPI
Slave Transaction to the Negation of RESETn
and FLASH_P_ENn
l10 µs
tSSS IPCS_SSn Setup to the Leading Edge of
IPCS_SCK
l15 ns
tSSH IPCS_SSn Hold from Trailing Edge of IPCS_SCK l15 ns
tCK IPCS_SCK Period l50 ns
tDIS IPCS_MOSI Data Setup l15 ns
tDIH IPCS_MOSI Data Hold l5 ns
tDOV IPCS_MISO Data Valid l3 ns
tOFF IPCS_MISO Data Three-State l0 30 ns
SYMBOL PARAMETER CONDITIONS (Note 7) MIN TYP MAX UNITS
tWRITE Time to Write a 32-Bit Word (Note 11) l21 ms
tPAGE_ERASE Time to Erase a 2k Byte Page (Note 11) l21 ms
tMASS_ERASE Time to Erase 256k Byte Flash Bank (Note 11) l21 ms
Data Retention 25°C
85°C
105°C
100
20
8
Years
Years
Years
Flash ac characTerisTics
The l denotes the specifications which apply over the full operating
temperature range, otherwise specifications are at TA = 25°C and VSUPPLY = 3.6V unless otherwise noted. (Note 12)
SYMBOL PARAMETER CONDITIONS (Note 7) MIN TYP MAX UNITS
tRADIO_OFF Delay from Rising Edge of RADIO_
INHIBIT to Radio Disabled
l20 ms
tRADIO_INHIBIT_STROBE Maximum RADIO_INHIBIT Strobe Width l2 s
raDio_inhibiT ac characTerisTics
The l denotes the specifications which apply over the full
operating temperature range, otherwise specifications are at TA = 25°C and VSUPPLY = 3.6V unless otherwise noted. (Note 12)
Figure 3. RADIO_INHIBIT Timing
59012IPR F03
RADIO_INHIBIT
RADIO STATE
tRADIO_OFF
tRADIO_INHIBIT_STROBE
ACTIVE/OFF ACTIVE/OFFOFF
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Figure 4. Flash Programming Interface Timing
59012IPR F04
IPCS_SCK
IPCS_MOSI
IPCS_SSn
RESETn
FLASH_P_ENn
tFP_EN_TO_RESET
tFP_ENTER
tSSS
tDIS
tDIH
tCK
tSSH
tFP_EXIT
Flash spi slave ac characTerisTics
exTernal bus ac characTerisTics
The l denotes the specifications which apply over the full
operating temperature range, otherwise specifications are at TA = 25°C and VSUPPLY = 3.6V unless otherwise noted. (Note 12)
SYMBOL PARAMETER CONDITIONS MIN TYP MAX UNITS
tLEPW EB_IO_LE0, EB_IO_LE1, EB_IO_LE2 Pulse
Width
l100 ns
tAH EB_DATA_[7:0] Address Hold from the
Rising Edge of EB_IO_LE0, EB_IO_LE1, and
EB_IO_LE2
EB_DATA_[7:0] During Address
Phase
l90 ns
tAV_to_DL EB_ADDR_[1:0] Address Valid Until
EB_DATA_[7:0] Data Latched
l90 ns
tCSn_to_OEn EB_CS0n Asserted Until EB_OEn Asserted l150 ns
tCSn_OFF EB_CS0n Negated Between External Bus
Transfers
l100 ns
tSU_to_CSn EB_ADDR_[1:0], EB_IO_WEn Setup to
EB_CSn Asserted
l50 ns
tH_from_CSn EB_ADDR_[1:0], EB_IO_WEn Hold from
EB_CSn Negated
l50 ns
The l denotes the specifications which apply over the full
operating temperature range, otherwise specifications are at TA = 25°C and VSUPPLY = 3.6V unless otherwise noted. (Note 12)
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exTernal bus ac characTerisTics
The l denotes the specifications which apply over the full
operating temperature range, otherwise specifications are at TA = 25°C and VSUPPLY = 3.6V unless otherwise noted. (Note 12)
Figure 5. External Bus Read Timing
Figure 6. External Bus Write Timing
59012IPR F06
EB_DATA_[7:0] A[25:18] A[17:10] A[9:2] D[31:24] D[23:16] D[7:0] D[15:8]X X
EB_IO_LE2
EB_IO_LE1
EB_IO_LE0
tLEPW
tLEPW
tLEPW
tH_from_CSn
tSU_to_CSn
tCSn tCSn_OFF
EB_ADDR_[1:0]
tAH tAH tAH
EB_IO_WEn
EB_IO_CS0n
11XX 10 01 0000
59012IPR F05
EB_DATA_[7:0] A[25:18] A[17:10] A[9:2] D[31:24] D[23:16] D[7:0] D[15:8]X X
EB_IO_LE2
EB_IO_LE1
EB_IO_LE0
tLEPW
tLEPW
tLEPW
tCSn_OFF
tAV_to_DL
tCSn_to_OEn
EB_ADDR_[1:0]
tAH tAH tAH
EB_IO_CS0n
EB_IO_OEn
11XX 10 01 00
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Note 1: Stresses beyond those listed under Absolute Maximum Ratings
may cause permanent damage to the device. Exposure to any Absolute
Maximum Rating condition for extended periods may affect device
reliability and lifetime.
Note 2: ESD (electrostatic discharge) sensitive device. ESD protection
devices are used extensively internal to Eterna. However, high electrostatic
discharge can damage or degrade the device. Use proper ESD handling
precautions.
Note 3: Extended storage at high temperature is discouraged, as this
negatively affects the data retention of Eterna’s calibration data. See
FLASH Data Retention section for details.
Note 4: Actual RF range is subject to a number of installation-specific
variables including, but not restricted to ambient temperature, relative
humidity, presence of active interference sources, line-of-sight obstacles,
and near-presence of objects (for example, trees, walls, signage, and so
on) that may induce multipath fading. As a result, range varies.
Note 5: As specified by IEEE Std. 802.15.4-2006: Wireless Medium
Access Control (MAC) and Physical Layer (PHY) specifications for Low-
Rate Wireless Personal Area Networks (LR-WPANs) http://standards.ieee.
org/findstds/standard/802.15.4-2011.html.
Note 6: IEEE Std. 802.15.4-2006 requires transmitters to maintain a
frequency tolerance of better than ±40ppm.
Note 7: Per pin I/O types are provided in the Pin Functions section.
Note 8: VIH maximum voltage input must respect the VSUPPLY maximum
voltage specification.
Note 9: See the SmartMesh IP Manager API Guide for the time indication
notification definition.
Note 10: Network time accuracy is a statistical measure and varies over
the temperature range, reporting rate and the location of the device relative
to the manager in the network. See Typical Performance Characteristics
section for a more detailed description.
Note 11: Code execution from flash banks being written or erased is
suspended until completion of the flash operation.
Note 12: Guaranteed by design. Not production tested.
exTernal bus ac characTerisTics
The l denotes the specifications which apply over the full
operating temperature range, otherwise specifications are at TA = 25°C and VSUPPLY = 3.6V unless otherwise noted. (Note 12)
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Typical perFormance characTerisTics
In mesh networks data can propagate from the manager
to the nodes, downstream, or from the motes to the man-
ager, upstream, via a sequence of transmissions from one
device to the next. As shown in Figure 8, data originating
from mote P1 may propagate to the manager directly or
through P2. As mote P1 may directly communicate with
the manager, mote P1 is referred to as a 1-hop mote. Data
originating from mote D1, must propagate through at least
one other mote, P2 or P1, and as a result is referred to as
a 2-hop mote. The fewest number of hops from a mote to
the manager determines the hop depth.
As described in the Application Time Synchronization section,
Eterna provides two mechanisms for applications to
maintain a time base across a network. The synchroniza-
tion performance plots that follow were generated using
the more precise TIMEn input. Publishing rate is the rate
a mote application sends upstream data. Synchroniza-
tion improves as the publishing rate increases. Baseline
synchronization performance is provided for a network
operating with a publishing rate of zero. Actual performance
for applications in network will improve as publishing
rates increase. All synchronization testing was performed
with the 1-hop mote inside a temperature chamber. Tim-
ing errors due to temperature changes and temperature
differences both between the manager and this mote and
between this mote and its descendents therefore propa-
gated down through the network. The synchronization
of the 3-hop and 5-hop motes to the manager was thus
affected by the temperature ramps even though they were
at room temperature. ForC/minute testing the tempera-
ture chamber was cycled between –40°C and 85°C at this
rate for 24 hours. ForC/minute testing, the temperature
chamber was rapidly cycled between 85°C and 45°C for
eight hours, followed by rapid cycling between –5°C and
45°C for eight hours, and lastly, rapid cycling between
–40°C and 15°C for eight hours.
Figure 8. Example Network Graph
Figure 7a. Supply Current vs Packet Rate
Figure 7b. Packet Latency vs Reporting Interval
PACKET RATE (PACKETS/s)
0
0
SUPPLY CURRENT (mA)
0.8
1.0
1.2
2.0
59012IPR F07a
0.6
0.4
0.2
1.6
1.8
1.4
30
5 10 15 20 25
REPORTING INTERVAL (s)
0
0
MEDIAN LATENCY (s)
1.0
1.5
2.5
59012IPR F07b
0.5
2.0
30
5 10 15 20 25
5 HOPS
4 HOPS
3 HOPS
2 HOPS
1 Hop
MANAGER
1 HOP
2 HOP
3 HOP
5800IPM F08
P1
P2
P3
D1
D2
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Typical perFormance characTerisTics
TIMEn Synchronization Error
0 Packet/s Publishing Rate,
1 Hop, Room Temperature
TIMEn Synchronization Error
0 Packet/s Publishing Rate,
1 Hop, 2°C/Min.
TIMEn Synchronization Error
0 Packet/s Publishing Rate,
1 Hop, 8°C/Min.
TIMEn Synchronization Error
0 Packet/s Publishing Rate,
3 Hops, Room Temperature
TIMEn Synchronization Error
0 Packet/s Publishing Rate,
3 Hops, 2°C/Min.
TIMEn Synchronization Error
0 Packet/s Publishing Rate,
3 Hops, 8°C/Min.
TIMEn Synchronization Error
0 Packet/s Publishing Rate,
5 Hops, Room Temperature
TIMEn Synchronization Error
0 Packet/s Publishing Rate,
5 Hops, 2°C/Min.
TIMEn Synchronization Error
0 Packet/s Publishing Rate,
5 Hops, 8°C/Min.
SYNCHRONIZATION ERROR (µs)
–40
NORMALIZED FREQUENCY OF OCCURANCE (%)
30
40
–10 40
59012IPR G01
20
10
0–30 –20 0 10 20 30
50
60 µ = 0.0
σ = 0.9
N = 89700
SYNCHRONIZATION ERROR (µs)
–40
NORMALIZED FREQUENCY OF OCCURANCE (%)
15
20
–10 40
59012IPR G02
10
5
0–30 –20 0 10 20 30
25
30 µ = –0.2
σ = 1.7
N = 89699
SYNCHRONIZATION ERROR (µs)
–40
NORMALIZED FREQUENCY OF OCCURANCE (%)
8
10
–10 40
59012IPR G03
6
4
2
0–30 –20 0 10 20 30
12
14 µ = –0.2
σ = 3.6
N = 89698
SYNCHRONIZATION ERROR (µs)
–40
NORMALIZED FREQUENCY OF OCCURANCE (%)
10
15
–10 40
59012IPR G04
5
0–30 –20 0 10 20 30
20 µ = 1.5
σ = 3.3
N = 93812
SYNCHRONIZATION ERROR (µs)
–40
NORMALIZED FREQUENCY OF OCCURANCE (%)
8
10
–10 40
59012IPR G05
6
4
2
0–30 –20 0 10 20 30
12
14 µ = 0.9
σ = 3.9
N = 93846
SYNCHRONIZATION ERROR (µs)
–40
NORMALIZED FREQUENCY OF OCCURANCE (%)
4
5
–10 40
59012IPR G06
3
2
1
0–30 –20 0 10 20 30
6
7µ = 1.0
σ = 7.7
N = 93845
SYNCHRONIZATION ERROR (µs)
–40
NORMALIZED FREQUENCY OF OCCURANCE (%)
8
–10 40
59012IPR G07
6
4
2
0–30 –20 0 10 20 30
10
12 µ = 3.6
σ = 5.0
N = 88144
SYNCHRONIZATION ERROR (µs)
–40
NORMALIZED FREQUENCY OF OCCURANCE (%)
8
–10 40
59012IPR G08
6
4
2
0–30 –20 0 10 20 30
10
14
12
µ = 1.1
σ = 3.8
N = 88179
SYNCHRONIZATION ERROR (µs)
–40
NORMALIZED FREQUENCY OF OCCURANCE (%)
4
–10 40
59012IPR G09
3
2
1
0–30 –20 0 10 20 30
5
7
6
µ = 1.0
σ = 7.4
N = 88178
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Typical perFormance characTerisTics
SYNCHRONIZATION ERROR (µs)
–40
NORMALIZED FREQUENCY OF OCCURANCE (%)
40
–10 40
59012IPR G10
30
20
10
0–30 –20 0 10 20 30
50
60
µ = 0.0
σ = 1.2
N = 22753
SYNCHRONIZATION ERROR (µs)
–40
NORMALIZED FREQUENCY OF OCCURANCE (%)
40
–10 40
59012IPR G11
30
20
10
00 –30 –20 0 10 20 30
50
60
µ = –0.2
σ = 1.2
N = 17008
SYNCHRONIZATION ERROR (µs)
–40
NORMALIZED FREQUENCY OF OCCURANCE (%)
40
–10 40
59012IPR G12
30
20
10
0–30 –20 0 10 20 30
50 µ = –0.2
σ = 1.2
N = 17007
SYNCHRONIZATION ERROR (µs)
–40
NORMALIZED FREQUENCY OF OCCURANCE (%)
20
25
–10 40
59012IPR G13
15
10
5
0–30 –20 0 10 20 30
30
35 µ = 0.5
σ = 1.9
N = 85860
SYNCHRONIZATION ERROR (µs)
–40
NORMALIZED FREQUENCY OF OCCURANCE (%)
30
35
–10 40
59012IPR G13
10
5
25
20
15
0–30 –20 0 10 20 30
40
45 µ = 0.1
σ = 1.5
N = 85858
SYNCHRONIZATION ERROR (µs)
–40
NORMALIZED FREQUENCY OF OCCURANCE (%)
35
–10 40
59012IPR G15
15
10
5
30
25
20
0–30 –20 0 10 20 30
µ = 0.1
σ = 1.5
N = 85855
SYNCHRONIZATION ERROR (µs)
–40
NORMALIZED FREQUENCY OF OCCURANCE (%)
60
–10 40
59012IPR G16
20
10
50
40
30
0–30 –20 0 10 20 30
µ = 0.2
σ = 1.4
N = 33932
SYNCHRONIZATION ERROR (µs)
–40
NORMALIZED FREQUENCY OF OCCURANCE (%)
60
–10 40
59012IPR G17
20
10
50
40
30
0–30 –20 0 10 20 30
µ = 0.0
σ = 1.3
N = 33930
SYNCHRONIZATION ERROR (µs)
–40
NORMALIZED FREQUENCY OF OCCURANCE (%)
–10 40
59012IPR G18
20
10
50
40
30
0–30 –20 0 10 20 30
µ = –1.0
σ = 1.3
N = 33929
TIMEn Synchronization Error
1 Packet/s Publishing Rate,
1 Hop, Room Temperature
TIMEn Synchronization Error
1 Packet/s Publishing Rate,
1 Hop, 2°C/Min.
TIMEn Synchronization Error
1 Packet/s Publishing Rate,
1 Hop, 8°C/Min.
TIMEn Synchronization Error
1 Packet/s Publishing Rate,
3 Hops, Room Temperature
TIMEn Synchronization Error
1 Packet/s Publishing Rate,
3 Hops, 2°C/Min.
TIMEn Synchronization Error
1 Packet/s Publishing Rate,
3 Hops, 8°C/Min.
TIMEn Synchronization Error
1 Packet/s Publishing Rate,
5 Hops, Room Temperature
TIMEn Synchronization Error
1 Packet/s Publishing Rate,
5 Hops, 2°C/Min.
TIMEn Synchronization Error
1 Packet/s Publishing Rate,
5 Hops, 8°C/Min.
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Typical perFormance characTerisTics
As described in the SmartMesh Network Overview sec-
tion, devices in network spend the vast majority of their
time inactive in their lowest power state (Doze). On a
synchronous schedule a mote will wake to communicate
with another mote. Regularly occurring sequences which
wake, perform a significant function and return to sleep
are considered atomic. These operations are considered
atomic as the sequence of events can not be separated
into smaller events while performing a useful function.
For example, transmission of a packet over the radio is an
atomic operation. Atomic operations may be characterized
in either charge or energy. In a time slot where a mote
successfully sends a packet, an atomic transmit includes
setup prior to sending the message, sending the message,
receiving the acknowledgment and the post processing
needed as a result of the message being sent. Similarly
in a time slot when a mote successfully receives a packet,
an atomic receive includes setup prior to listening, listen-
ing until the start of the packet transition, receiving the
packet, sending the acknowledge and the post processing
required due to the arrival of the packet.
To ensure reliability each mote in the network is provided
multiple time slots for each packet it nominally will send
and forward. The time slots are assigned to communicate
upstream with at least two different motes. When combined
with frequency hopping this provides temporal, spatial
and spectral redundancy. Given this approach a mote will
often listen for a message that it will never receive, since
the time slot is not being used by the transmitting mote.
It has already successfully transmitted the packet. Since
typically three timeslots are scheduled for every one packet
to be sent or forwarded, motes will perform more of these
atomic idle listens than atomic transmit or atomic receive
sequences. Examples of transmit, receive and idle listen
atomic operations are shown below.
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Typical perFormance characTerisTics
Figure 9.
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pin FuncTions
NO POWER SUPPLY TYPE I/O PULL DESCRIPTION
1 GND Power - - Ground Connection
11 GND Power - - Ground Connection
20 GND Power - - Ground Connection
30 GND Power - - Ground Connection
34 GND Power - - Ground Connection
37 GND Power - - Ground Connection
42 GND Power - - Ground Connection
56 GND Power - - Ground Connection
66 GND Power - - Ground Connection
55 VSUPPLY Power - - Power Supply Input to Eterna
The following table organizes the pins by functional
groups. For those I/O with multiple functions the alternate
functions are shown on the second and third line in their
respective row. The No column provides the pin number.
The second column lists the function. The Type column
lists the I/O type. The I/O column lists the direction of the
signal relative to Eterna. The Pull column shows which
signals have a fixed passive pull-up or pull-down. The
Description column provides a brief signal description.
NO RADIO TYPE I/O PULL DESCRIPTION
64 RADIO_INHIBIT
GPIO15
1 (Note 13) I
I/O
-
-
Radio Inhibit
General Purpose Digital I/O
4GPIO17 1 I/O -General Purpose Digital I/O
5GPIO18 1 I/O -General Purpose Digital I/O
6GPIO19 1 I/O -General Purpose Digital I/O
- ANTENNA N/A N/A - Chip Antenna (LT P 5901) or MMCX Connector (LPT5902)
NO ANALOG TYPE I/O PULL DESCRIPTION
7AI_2 Analog I - Analog Input 2
8AI_1 Analog I - Analog Input 1
9AI_3 Analog I - Analog Input 3
10 AI_0 Analog I - Analog Input 0
NO RESET TYPE I/O PULL DESCRIPTION
15 RESETn 1 I UP Reset Input, Active Low
NO JTAG TYPE I/O PULL DESCRIPTION
16 TDI 1 I UP JTAG Test Data In
17 TDO 1 O - JTAG Test Data Out
18 TMS 1 I UP JTAG Test Mode Select
19 TCK 1 I DOWN JTAG Test Clock
Pin functions shown in italics are currently not supported in software.
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pin FuncTions
NO SPECIAL PURPOSE TYPE I/O PULL DESCRIPTION
63 TIMEn 1 (Note 13) I - Time Capture Request, Active Low
NO CLI AND EXTERNAL MEMORY TYPE I/O PULL DESCRIPTION
25 EB_DATA_7 1 I/O - External Bus Data Bit 7
26 EB_DATA_6 1 I/O - External Bus Data Bit 6
27 EB_DATA_4 1 I/O - External Bus Data Bit 4
28 EB_DATA_0 1 I/O - External Bus Data Bit 0
31 UARTC0_TX
EB_IO_LE0
2 O
O
- CLI UART 0 T
ransmit
External Bus I/O Latch Enable 0 for External Address Bits A[9:2]
32 UARTC0_RX
EB_DATA_1
1 I
I/O
- CLI UART 0 Receive
External Bus Data Bit 1
38 EB_IO_LE2 1 O - External Bus I/O Latch Enable 2 for External Address Bits A[25:18]
40 EB_ADDR_1 2 O - External Bus Address Bit 1
41 EB_ADDR_0 2 O - External Bus Address Bit 0
43 EB_DATA_3 1 I/O - External Bus Data Bit 3
44 EB_DATA_2 1 I/O - External Bus Data Bit 2
45 EB_DATA_5 1 I/O - External Bus Data Bit 5
46 EB_IO_CS0n 2 O - External Bus Chip Select 0
47 UARTC1_TX 2 O - CLI UART 1 Transmit
48 UARTC1_RX 1 I - CLI UART 1 Receive
49 EB_IO_WEn 2 O - External Bus Write Enable Strobe
50 EB_IO_OEn 2 O - External Bus Output Enable Strobe
NO IPCS SPI/FLASH PROGRAMMING (NOTE 14) TYPE I/O PULL DESCRIPTION
33 IPCS_MISO 2 O - SPI Flash Emulation (MISO) Master in Slave Out Port
35 IPCS_MOSI 1 I - SPI Flash Emulation (MOSI) Master Out Slave in Port
36 IPCS_SCK 1 I - SPI Flash Emulation (SCK) Serial Clock Port
39 IPCS_SSn 1 I - SPI Flash Emulation Slave Select, Active Low
51 FLASH_P_ENn
EB_IO_LE1
1 I
O
UP
UP
Flash Program Enable, Active Low
External Bus I/O Latch Enable 1
NO API UART TYPE I/O PULL DESCRIPTION
57 UART_RX_RTSn 1 (Note 13) I - UART Receive (RTS) Request to Send, Active Low
58 UART_RX_CTSn 1 O - UART Receive (CTS) Clear to Send, Active Low
59 UART_RX 1 (Note 13) I - UART Receive
60 UART_TX_RTSn 1 O - UART Transmit (RTS) Request to Send, Active Low
61 UART_TX_CTSn 1 (Note 13) I - UART Transmit (CTS) Clear to Send, Active Low
62 UART_TX 2 O - UART Transmit
Note 13: These inputs are always enabled and must be driven or pulled to
a valid state to avoid leakage.
Note 14: Embedded programming over the IPCS SPI bus is only available
when RESETn is asserted.
Pin functions shown in italics are currently not supported in software.
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pin FuncTions
VSUPPLY: System and I/O Power Supply. Provides power
to the module. The digital-interface I/O voltages are also
set by this voltage.
ANTENNA: Multiplexed Receiver Input and Transmitter
Output Pin. The impedance presented to the MMCX connec-
tor should be 50Ω, single-ended with respect to ground.
RESETn: The asynchronous reset signal is internally pulled
up. Resetting Eterna will result in the ARM Cortex-M3
rebooting and loss of network connectivity. Use of this
signal for resetting Eterna is not recommended, except
during power-on and in-circuit programming.
RADIO_INHIBIT: RADIO_INHIBIT provides a mechanism
for an external device to temporarily disable radio operation.
Failure to observe the timing requirements defined in the
RADIO_INHIBIT AC Characteristics section, may result
in unreliable netowrk operation. In designs where the
RADIO_INHIBIT function is not needed the input must
either be tied, pulled or actively driven low to avoid excess
leakage.
TMS, TCK, TDI, TDO: JTAG port supporting software
debug and boundary scan.
SLEEPn: The SLEEPn function is not currently supported
in software. The SLEEPn input must either be tied, pulled
or actively driven high to avoid excess leakage.
UART_RX, UART_RX_RTSn, UART_RX_CTSn, UART_TX,
UART_TX_RTSn, UART_TX_CTSn: The API UART interface
includes bi-directional wake up and flow control. Unused
input signals must be driven or pulled to their inactive state.
TIMEn: Strobing the TIMEn input is the most accurate meth-
od to acquire the network time maintained by Eterna. Eterna
latches the network timestamp with sub-microsecond
resolution on the rising edge of the TIMEn signal and
produces a packet on the API serial port containing the
timing information.
UARTC0_RX, UARTC0_TX, UARTC1_RX, UARTC1_TX:
The CLI UART provides a mechanism for monitoring,
configuration and control of Eterna during operation. On
the LT P 5901/2-IPR CLI UART 0 is used when Eterna is not
configured to support external RAM and CLI UART 1 is
used when Eterna is configured to support external RAM.
For a complete description of the supported commands
see the SmartMesh IP Manager CLI Guide.
EB_DATA_0 through EB_DATA_7, EB_ADDR_0, EB_
ADDR_1, EB_IO_LE1 through EB_IO_LE2, EB_IO_CS0n,
EB_IO_WEn, EB_IO_ENn: The external bus provides a
multiplexed address data bus enabling the Cortex-M3
direct access of external byte wide RAM. The additional
RAM is used by network management software enabling
the support of a larger network of motes with higher packet
throughput. To support the addressing needed, each
latch signal, EB_IO_LE0, EB_IO_LE1, and EB_IO_LE2 will
strobe to latch 8-bits of address from the EB_DATA[7:0]
bus. EB_IO_LE0, EB_IO_LE1, and EB_IO_LE2 correspond
to addres bits [9:2], [17:10] and [25:18] respectively.
EB_ADDR_0 and EB_ADDR_1 correspond to the lower
two bits of address. For systems with 256k bytes or less
EB_IO_LE2 can be ignored. EB_IO_CS0n, EB_IO_WEn and
EB_IO_OEn provide chip select, write enable and output
enable control of the external RAM.
FLASH_P_ENn, IPCS_SSn, IPCS_SCK, IPCS_MISO,
IPCS_SSn: The In-circuit programming control system
(IPCS) bus enables in-circuit programming of Eterna’s flash
memory. IPCS_SCK is a clock and should be terminated
appropriately for the driving source to prevent overshoot
and ringing.
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operaTion
The LT P 5901/LT P 5902 is the world’s most energy-efficient
IEEE 802.15.4 compliant platform, enabling battery and
energy harvested applications. With a powerful 32-bit ARM
Cortex-M3, best-in-class radio, flash, RAM and purpose-
built peripherals, Eterna provides a flexible, scalable and
robust networking solution for applications demanding
minimal energy consumption and data reliability in even
the most challenging RF environments.
Shown in Figure 10, Eterna integrates purpose-built pe-
ripherals that excel in both low operating-energy consump-
tion and the ability to rapidly and precisely cycle between
operating and low power states. Items in the gray shaded
region labeled analog core correspond to the analog/RF
components.
Figure 10. Eterna Block Diagram
4-BIT
DAC
VGA
BPF PPF
AGC
LPF
ADC
DAC
10-BIT
ADC
PLL
RSSI
LNA
PA
20MHz
32kHz
32kHz, 20MHz
PTAT
59012IPR F10
BAT
LOAD
LIMITER
VOLTAGE REFERENCE
ANALOG COREDIGITAL CORE
CORE REGULATOR
CLOCK REGULATOR
ANALOG REGULATOR
PA
DC/DC
CONVERTER
PRIMARY
DC/DC
CONVERTER
RELAXATION
OSCILLATOR
PoR
TIMERS
SCHED
SRAM
72kB
FLASH
512kB
FLASH
CONTROLLER
CODE
AES
AUTO
MAC
802.15.4
MOD
802.15.4
FRAMING
DMA
IPCS
SPI
SLAVE
CLI
UART
(2 PIN)
API
UART
(6 PIN)
ADC
CTRL
802.15.4
DEMOD
SYSTEM
PMU/
CLOCK
CONTROL
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operaTion
POWER SUPPLY
Eterna is powered from a single pin, VSUPPLY, which
powers the I/O cells and is also used to generate internal
supplies. Eterna’s two on-chip DC/DC converters minimize
Eterna’s energy consumption while the device is awake. To
conserve power the DC/DC converters are disabled when
the device is in low power state. Eterna’s integrated power
supply conditioning architecture, including the two inte-
grated DC/DC converters and three integrated low dropout
regulators, provides excellent rejection of supply noise.
Eterna’s operating supply voltage range is high enough
to support direct connection to lithium-thionyl chloride,
Li-SOCl2, sources and wide enough to support battery
operation over a broad temperature range.
SUPPLY MONITORING AND RESET
Eterna integrates a power-on reset (PoR) circuit. As the
RESETn input pin is nominally configured with an internal
pull-up resistor, no connection is required. For a graceful
shutdown, the software and the networking layers should
be cleanly halted via API commands prior to assertion of
the RESETn pin. See the SmartMesh IP Manager API Guide
for details on the disconnect and reset commands. Eterna
includes a soft brown-out monitor that fully protects the
flash from corruption in the event that power is removed
while writing to flash. Integrated flash supervisory func-
tionality, in conjunction with a fault tolerant file system,
yields a robust non-volatile storage solution.
PRECISION TIMING
A major feature of Eterna over competing 802.15.4 prod-
uct offerings is its low power dedicated timing hardware
and timing algorithms. This functionality provides timing
precision two to three orders of magnitude better than
any other low power solution available at the time of
publication. Improved timing accuracy allows motes to
minimize the amount of radio listening time required to
ensure packet reception thereby lowering even further
the power consumed by SmartMesh networks. Eterna’s
patented timing hardware and timing algorithms provide
superior performance over rapid temperature changes,
further differentiating Eterna’s reliability when compared
with other wireless products. In addition, precise timing
enables networks to reduce spectral dead time, increasing
total network throughput.
APPLICATION TIME SYNCHRONIZATION
In addition to coordinating timeslots across the network,
which is transparent to the user, Eterna’s timing manage-
ment is used to support two mechanisms to share network
time. Having an accurate, shared, network-wide time base
enables events to be accurately time stamped or tasks to
be performed in a synchronized fashion across a network.
Eterna will send a time packet through its serial interface
when one of the following occurs:
• Eterna receives an API request to read time
• The TIMEn signal is asserted
The use of TIMEn has the advantage of being more accurate.
The value of the timestamp is captured in hardware relative
to the rising edge of TIMEn. If an API request is used, due
to packet processing, the value of the timestamp may be
captured several milliseconds after receipt of the packet due
to packet processing. See section TIMEn AC Characteristics,
for the time function’s definition and specifications.
TIME REFERENCES
Eterna includes three clock sources: an internal relaxation
oscillator, a low power oscillator designed for a 32.768kHz
crystal, and the radio reference oscillator designed for a
20MHz crystal.
Relaxation Oscillator
The relaxation oscillator is the primary clock source for
Eterna, providing the clock for the CPU, memory subsys-
tems, and all peripherals. The internal relaxation oscillator
is dynamically calibrated to 7.3728MHz. The internal re-
laxation oscillator typically starts up in a few μs, providing
an expedient, low energy method for duty cycling between
active and low power states. Quick start-up from the doze
state, defined in the State Diagram section, allows Eterna to
wake up and receive data over the UART and SPI interfaces
by simply detecting activity on the appropriate signals.
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operaTion
32.768kHz Crystal
Once Eterna is powered up and the 32.768kHz crystal
source has begun oscillating, the 32.768kHz crystal re-
mains operational while in the active state, and is used as
the timing basis when in doze state. See the State Diagram
section, for a description of Eterna’s operational states.
20MHz Crystal
The 20MHz crystal source provides a frequency reference
for the radio, and is automatically enabled and disabled
by Eterna as needed.
RADIO
Eterna includes the lowest power commercially available
2.4GHz IEEE 802.15.4e radio by a substantial margin.
(Please refer to section Radio Specifications, for power
consumption numbers). Eterna’s integrated power ampli-
fier is calibrated and temperature-compensated to con-
sistently provide power at a limit suitable for worldwide
radio certifications. Additionally, Eterna uniquely includes
a hardware-based autonomous MAC that handles precise
sequencing of peripherals, including the transmitter, the
receiver, and advanced encryption standard (AES) pe-
ripherals. The hardware-based autonomous media access
controller (MAC) minimizes CPU activity, thereby further
decreasing power consumption.
UARTS
The principal network interface is through the application
programming interface (API) UART. A command-line
interface (CLI) is also provided for support of test and
debug functions. Both UARTs sense activity continuously,
consuming virtually no power until data is transferred over
the port and then automatically returning to their lowest
power state after the conclusion of a transfer. The defini-
tion for packet encoding on the API UART interface can
be found in the SmartMesh IP Manager API Guide and the
CLI command definitions can be found in the SmartMesh
IP Manager CLI Guide.
API UART PROTOCOL
The API UART protocol was created with the goal of
supporting a wide range of companion multipoint control
units (MCUs) while reducing power consumption of the
system. The receive half of the API UART protocol includes
two additional signals in addition to UART_RX: UART_RX_
RTSn and UART_RX_CTSn. The transmit half of the API
UART protocol includes two additional signals in addition
to UART_TX: UART_TX_RTSn and UART_TX_CTSn. The
API UART protocol is referred to as Mode 4.
In the figures accompanying the protocol descriptions,
signals driven by the companion processor are drawn
in black and signals driven by Eterna are drawn in blue.
UART Mode 4
UART Mode 4 incorporates level-sensitive flow control
on the TX channel and requires no flow control on the
RX channel, supporting 115200 baud. The use of level-
sensitive flow control signals enables higher data rates
with the option of using a reduced set of the flow control
signals; however, with the companion processor must
negate UART_TX_CTSn prior to the end of the packet and
waiting at least tRX_RTS to RX_CTS between packets, see
the UART AC Characteristics section for complete timing
specifications. Packets are HDLC encoded with one stop
bit and no parity bit. The use of the RX flow control signals
(UART_RX_RTSn and UART_RX_CTSn) for Mode 4 are
optional. The flow control signals for the TX channel are
shown in Figure 11 UART Mode 4 Transmit Flow Control.
Transfers are initiated by Eterna asserting UART_TX_RTSn.
The UART_TX_CTSn signal may be actively driven by the
companion processor when ready to receive a packet
or UART_TX_CTSn may be tied low if the companion
processor is always ready to receive a packet. After
detecting a logic ‘0’ on UART_TX_CTSn Eterna sends the
entire packet. Following the transmission of the final byte
in the packet Eterna negates UART_TX_RTSn and waits for
a minimum period defined in the UART AC Characteristics
section before asserting UART_TX_RTSn again.
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Figure 11. UART Mode 4 Transmit Flow Control
operaTion
For details on the timing of the UART protocol, see the
UART AC Characteristics section.
curity protocols is significant in terms of both engineering
effort and market value in an OEM product. Eterna system
solutions provide a FIPS-197 validated encryption scheme
that includes authentication and encryption at the MAC
and network layers with separate keys for each mote.
This not only yields end-to-end security, but if a mote is
somehow compromised, communication from other motes
is still secure. A mechanism for secure key exchange al-
lows keys to be kept fresh. To prevent physical attacks,
Eterna includes hardware support for electronically locking
devices, thereby preventing access to Eterna’s flash and
RAM memory and thus the keys and code stored therein.
TEMPERATURE SENSOR
Eterna includes a calibrated temperature sensor on chip.
The temperature readings are available locally through
Eterna’s serial API, in addition to being available via the
network manager. The performance characteristics of
the temperature sensor can be found in the Temperature
Sensor Characteristics section.
RADIO INHIBIT
The RADIO_INHIBIT input enables an external controller
to temporarily disable the radio software drivers (for
example, to take a sensor reading that is susceptible to
radio interference). When RADIO_INHIBIT is asserted
the software radio drivers will disallow radio operations
including clear channel assessment, packet transmits,
or packet receipts. If the radio is active in the current
timeslot when RADIO_INHIBIT is asserted the radio will be
diabled after the present operation completes. For details
on the timing associated with RADIO_INHIBIT, see the
RADIO_INHIBIT AC Characteristics section.
FACTORY INSTALLED SOFTWARE
This product is provided with software programmed into
the device. Devices can be configured via either the CLI
or API ports. Configuration commands and settings are
defined in SmartMesh IP Manager API Guide and Smart-
Mesh IP Manager CLI Guide.
CLI UART
The command line interface (CLI) UART port is a two
wire protocol (TX and RX) that operates at a fixed 9600
baud rate with one stop bit and no parity. The CLI UART
interface is intended to support command line instructions
and response activity.
AUTONOMOUS MAC
Eterna was designed as a system solution to provide a
reliable, ultralow power, and secure network. A reliable
network capable of dynamically optimizing operation
over changing environments requires solutions that are
far too complex to completely support through hardware
acceleration alone. As described in the Precision Timing
section, proper time management is essential for optimizing
a solution that is both low power and reliable. To address
these requirements Eterna includes the autonomous MAC,
which incorporates a co-processor for controlling all of
the time-critical radio operations. The autonomous MAC
provides two benefits: first, preventing variable software
latency from affecting network timing and second, greatly
reducing system power consumption by allowing the CPU
to remain inactive during the majority of the radio activity.
The autonomous MAC, provides software-independent
timing control of the radio and radio-related functions,
resulting in superior reliability and exceptionally low power.
SECURITY
Network security is an often overlooked component of a
complete network solution. Proper implementation of se-
59012IPR F11
UART_TX BYTE 0 BYTE 1
UART_TX_CTSn
UART_TX_RTSn
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operaTion
Figure 12. Eterna State Diagram
FLASH DATA RETENTION
Eterna contains internal flash (non-volatile memory) to
store calibration results, unique ID, configuration settings
and software images. Flash retention is specified over the
operating temperature range. See Electrical Characteristics
and Absolute Maximum Ratings sections.
Non destructive storage above the operating temperature
range of –40°C to 85°C is possible; although, this may
result in a degradation of retention characteristics.
The degradation in flash retention for temperatures >85°C
can be approximated by calculating the dimensionless
acceleration factor using the following equation.
AF =e
Ea
k
1
TUSE+273 1
TSTRESS+273
SERIAL FLASH
EMULATION
LOAD FUSE
SETTINGS
RESETn LOW AND
FLASH_P_ENn HIGH
RESETn HIGH
AND
FLASH_P_ENn
HIGH
RESET
DEASSERT
RESETn
CPU AND
PERIPHERALS
INACTIVE
HW OR PMU EVENT
BOOT
START-UP
OPERATION INACTIVE
DOZE DEEP SLEEP
LOW POWER SLEEP
COMMAND
59012IPR F12
ASSERT RESETn
ASSERT RESETnASSERT RESETn
CPU
ACTIVE
CPU
INACTIVE
POWER-ON
RESET
RESETn LOW AND
FLASH_P_ENn LOW
SET RESETn HIGH AND
FLASH_P_ENn HIGH
FOR 125µs, THEN
SET RESETn LOW
VSUPPLY > PoR
ACTIVE
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operaTion
key advantages of SmartMesh networking solutions is the
network manager is aware of and tracking the success
or failure of every packet transaction, so not only can the
network be optimized, but the solution can be rigorously
tested to produce a system solution with better than
99.999% reliability.
Deterministic Power Management
Deterministic power management balances traffic in the
network by diverting traffic around heavily loaded motes
(for example, motes with high reporting rates). In do-
ing so, it reduces power consumption for these motes
and balances power consumption across the network.
Deterministic power management provides predictable
maintenance schedules to prevent down time and lower
the cost of network ownership. When combined with field
devices using Eterna’s industry-leading low power radio
technology, deterministic power management enables
over a decade of battery life for network motes.
Intelligent Routing
Intelligent routing provides each packet with an optimal
path through the network. The shortest distance between
two points is a straight line, but in RF the quickest path is
not always the one with the fewest hops. Intelligent routing
finds optimal paths by considering the link quality (one
path may lose more packets than another) and the retry
schedule, in addition to the number of hops. The result
is reduced network power consumption, elimination of
in-network collisions, and unmatched network scalability
and reliability.
Configurable Bandwidth Allocation
Smartmesh networks provide configurations that enable
users to make bandwidth and latency versus power trade-
offs both network-wide and on a per device basis. This
flexibly enables solutions that tailored to the application
requirements, such as request/response, fast file trans-
fer, and alerting. Relevant configuration parameters are
described in the SmartMesh IP Users Guide. The design
trade-offs between network performance and current
consumption are supported via the SmartMesh Power
and Performance Estimator.
Where:
AF = acceleration factor
Ea = activation energy = 0.6eV
k=8.625•10–5eV/°K
TUSE = is the specified temperature retention in °C
TSTRESS = actual storage temperature in °C
Example: Calculate the effect on retention when storing
at a temperature of 105°C.
TSTRESS = 105°C
TUSE = 85°C
AF = 2.8
So the overall retention of the flash would be degraded
by a factor of 2.8, reducing data retention from 20 years
at 85°C to 7.1 years at 105°C.
NETWORKING
The LT P 5901-IPR/LT P 5902-IPR network manager pro-
vides the ingress/egress point for at the wired to wireless
mesh network boundary, via the API UART interface. The
complexity of the mesh network management is handled
entirely within the embedded software, which provides
dynamic network optimization, deterministic power man-
agement, intelligent routing, and configurable bandwidth
allocation while achieving carrier class data reliability and
low power operation.
Dynamic Network Optimization
Dynamic network optimization allows Eterna to address the
changing RF requirements in harsh industrial environments
resulting in a network that is continuously self-monitoring
and self-adjusting. The manager performs dynamic network
optimization based upon periodic reports on network health
and link quality that it receives from the network motes.
The manager uses this information to provide performance
statistics to the application layer and proactively solve
problems in the network. Dynamic network optimization
not only maintains network health, but also allows Eterna
to deliver deterministic power management. One of the
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IP Manager Options
The IP manager is offered in three different dash code
options, the -IPRA, -IPRB and -IPRC. The -IPRA option
supports managing networks of 32 motes or less with a
packet throughput of 24 packets per second.The -IPRB
option supports managing networks of 100 motes or
less with a packet throughput of 36 packets per second.
The -IPRC option supports managing networks of 32
motes or less with a packet throughput of 36 packets
per second. The -IPRA option does not support the use
of external SRAM. The -IPRB and -IPRC options require
the use of external SRAM, as described in the LT P 5901
and LT P 5902 Integration Guide. -IPRC managers can be
upgraded to support managing networks of up to 100
motes by purchasing a software license key as described
in the SmartMesh IP Users Guide.
State Diagram
In order to provide capabilities and flexibility in addition
to ultra low power, Eterna operates in various states, as
shown in Figure 10 Eterna State Diagram and described
in this section. State transitions shown in red are not
recommended.
Start-Up
Start-up occurs as a result of either crossing the power-on
reset threshold or asserting RESETn. After the completion
of power-on reset or the falling edge of an internally
synchronized RESETn, Eterna loads its fuse table which,
as described in the previous section, includes setting
I/O direction. In this state, Eterna checks the state of
the FLASH_P_ENn and RESETn and enters the serial
flash emulation mode if both signals are asserted. If the
FLASH_P_ENn pin is not asserted but RESETn is asserted,
Eterna automatically reduces its energy consumption to
a minimum until RESETn is released. Once RESETn is
de-asserted, Eterna goes through a boot sequence, and
then enters the active state.
Serial Flash Emulation
When both RESETn and FLASH_P_ENn are asserted,
Eterna disables normal operation and enters a mode to
emulate the operation of a serial flash. In this mode, its
flash can be programmed.
Operation
Once Eterna has completed start-up, Eterna transitions to
the operational group of states (active/CPU active, active/
CPU inactive, and Doze). There, Eterna cycles between the
various states, automatically selecting the lowest pos-
sible power state while fulfilling the demands of network
operation.
Active State
In the active state, Eterna’s relaxation oscillator is running
and peripherals are enabled as needed. The ARM Cortex-
M3 cycles between CPU-active and CPU-inactive (referred
to in the ARM Cortex-M3 literature as sleep now mode).
Eterna’s extensive use of DMA and intelligent peripherals
that independently move Eterna between active state and
doze state minimizes the time the CPU is active, signifi-
cantly reducing Eterna’s energy consumption.
Doze State
The doze state consumes orders of magnitude less cur-
rent than the active state and is entered when all of the
peripherals and the CPU are inactive. In the Doze state
Eterna’s full state is retained, timing is maintained, and
Eterna is configured to detect, wake, and rapidly respond
to activity on I/Os (such as UART signals and the TIMEn
pin). In the doze state the 32.768kHz oscillator and as-
sociated timers are active.
operaTion
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REGULATORY AND STANDARDS COMPLIANCE
Radio Certification
The LT P 5901 and LT P 5902 have been certified under a
single modular certification, with the module name of
ETERNA2. Following the regulatory requirements provided
in the ETERNA2 Users Guide can enable customers to
ship products in the supported geographies, by simply
completing an unintentional radiator scan of the finished
product(s). The ETERNA2 Users Guide also provides the
technical information needed to enable customers to fur-
ther certify either the modules or products based upon the
modules in geographies that have not or do not support
modular certification.
Compliance to Restriction of Hazardous Substances
(RoHS)
Restriction of hazardous substances 2(RoHS 2) is a
directive that places maximum concentration limits on
the use of certain hazardous substances in electrical and
electronic equipment. Linear Technology is committed to
meeting the requirements of the European Community
directive 2011/65/EU.
This product has been specifically designed to utilize
RoHS-compliant materials and to eliminate or reduce the
use of restricted materials to comply with 2011/65/EU.
applicaTions inFormaTion
The RoHS-compliant design features include:
• RoHS-compliant solder for solder joints
• RoHS-compliant base metal alloys
• RoHS-compliant precious metal plating
• RoHS-compliant cable assemblies and connector
choices
• Halogen-free mold compound
• RoHS-compliant and 245°C re-flow compatible
Note: Customers may elect to use certain types of lead-
free solder alloys in accordance with the European Com-
munity directive 2011/65/EU. Depending on the type of
solder paste chosen, a corresponding process change to
optimize reflow temperatures may be required.
SOLDERING INFORMATION
The LT P 5901 and LT P 5902 are suitable for both eutectic
PbSn and RoHS-6 reflow. The maximum reflow solder-
ing temperature is 260°C. A more detailed description of
layout recommendations, assembly procedures and design
considerations is included in the LT P 5901 and LT P 5902
Hardware Integration Guide.
relaTeD DocumenTaTion
TITLE LOCATION DESCRIPTION
SmartMesh IP Users Guide http://www.linear.com/docs/41880 Theory of operation for SmartMesh IP networks and motes
SmartMesh IP Manager API Guide http://www.linear.com/docs/41883 Definitions of the applications interface commands available over
the API UART
SmartMesh IP Manager CLI Guide http://www.linear.com/docs/41882 Definitions of the command line interface commands available
over the CLI UART
LT P 5901 and LT P 5902 Hardware
Integration Guide
http://www.linear.com/docs/41877 Recommended practices for designing with the LT P 5901 and
LT P 5902
ETERNA2 Users Guide http://www.linear.com/docs/42916 The ETERNA2 module user’s guide covering certification
requirements for certified geographies and support
documentation enabling customer certification in additional
geographies for the LT P 5901 and LT P 5902
SmartMesh IP Tools Guide http://www.linear.com/docs/42453 The user’s guide for all IP related tools, and specifically the
definition for the on-chip Application Protocol (OAP)
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package DescripTion
Please refer to http://www.linear.com/designtools/packaging/ for the most recent package drawings.
Figure 12. LT P 5901 Mechanical Drawing
R.010
0.25
TYP
.039
1.00
TYP
.039
1.00
4X
.035
0.90
.039 1.00
00.00
.08
2.00
.157 4.00
.197 5.00
.236 6.00
.344 8.74
.444 11.28
.551 14.00
.591 15.00
.630 16.00
.87 22.00
.728 18.50
.394 10.00
00.00
.08 2.00
.039 1.00
.039 1.00
.079 2.00
1.102 28.00
1.063 27.00
1.031 26.20
1.122 28.50
1.213 30.80
1.57
40.00
.039
1.00
1.654
42.00
.100
2.54
.039
1.00
.945
24.00
59012IPR F12
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Information furnished by Linear Technology Corporation is believed to be accurate and reliable.
However, no responsibility is assumed for its use. Linear Technology Corporation makes no representa-
tion that the interconnection of its circuits as described herein will not infringe on existing patent rights.
package DescripTion
Please refer to http://www.linear.com/designtools/packaging/ for the most recent package drawings.
Figure 13. LT P 5902 Mechanical Drawing
.039
1.00
TYP
R.010
0.25
TYP
.039
1.00
.039 1.00
4X
.035
0.90
00.00
.078 2.0
.157 4.00
.197 5.00
.236 6.00
.344 8.73
.444 11.28
.866 22.00
.394 10.00
00.00
.079 2.01
.039 1.00
.039 1.00
.079 2.00
1.031 26.20
1.213 30.80
1.40 35.50
1.122 28.50
1.102 28.00
1.272 32.30
1.063 27.00
.071 1.80
.728 18.50
.551 14.00
.591 15.00
.630 16.00
1.476
37.50
.039
1.00
.029
0.73
.100
2.54
.039
1.00
.177
4.50
.945
24.00
59012IPR F13
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LINEAR TECHNOLOGY CORPORATION 2014
LT 0614 • PRINTED IN USA
Linear Technology Corporation
1630 McCarthy Blvd., Milpitas, CA 95035-7417
(408) 432-1900 FAX: (408) 434-0507 www.linear.com/LTP5901-IPR or www.linear.com/LTP5902-IPR
Power over Ethernet Network Manager
relaTeD parTs
Typical applicaTion
PART NUMBER DESCRIPTION COMMENTS
LTC5800-IPRA IP Wireless Mesh 32 Mote Manager Manages Networks of Up to 32 SmartMesh IP Nodes.
LTC5800-IPRB IP Wireless Mesh 100 Mote Manager Manages Networks of Up to 100 SmartMesh IP Nodes.
LT P 5901-IPM IP Wireless Mesh Mote PCB Module
with Chip Antenna
Includes Modular Radio Certification in the United States, Canada, Europe, Japan, South
Korea, Taiwan, India, Australia and New Zealand
LT P 5902-IPM IP Wireless Mesh Mote PCB Module
with MMCX Antenna Connector
Includes Modular Radio Certification in the United States, Canada, Europe, Japan, South
Korea, Taiwan, India, Australia and New Zealand
LTC2379-18 18-Bit,1.6Msps/1Msps/500ksps/
250ksps Serial, Low Power ADC
2.5V Supply, Differential Input, 101.2dB SNR, ±5V Input Range, DGC
LTC3388-1/
LTC3388-3
20V High Efficiency Nanopower
Step-Down Regulator
860nA IQ in Sleep, 2.7V to 20V Input, VOUT: 1.2V to 5.0V, Enable and Standby Pins
LTC3588-1 Piezoelectric Energy Generator with
Integrated High Efficiency Buck
Converter
VIN: 2.7V to 20V; VOUT(MIN): Fixed to 1.8V, 2.5V, 3.3V, 3.6V; IQ = 0.95μA; 3mm × 3mm
DFN-10 and MSOP-10E Packages
LTC3108-1 Ultralow Voltage Step-Up Converter and
Power Manager
VIN: 0.02V to 1V; VOUT = 2.5V, 3V, 3.7V, 4.5V Fixed; IQ = 6μA; 3mm × 4mm DFN-12 and
SSOP-16 Packages
LTC3459 Micropower Synchronous Boost
Converter
VIN: 1.5V to 5.5V; VOUT(MAX) = 10V; IQ = 10μA; 2mm × 2mm DFN, 2mm × 3mm DFN or
SOT-23 Package
LTC4265 IEEE 802.3at High Power PD Interface
Controller with 2-Event Classification
2-Event Classification Recognition, 100mA Inrush Current, Single-Class Programming
Resistor, Full Compliance to 802.3at
LT8300 100V Micropower Isolated Flyback
Converter with 150V/260mA Switch
6V ≤ VIN ≤ 100V, No Opto Flyback , 5-Lead TSOT-23 Package
59012IPR TA02
RJ45
TX+
1
2
3
6
4
5
7
8
14 1
12
13
10
11
9
3
2
5
4
6
TX
RX+
RX
COILCRAFT
ETHI - 230LD
0.1µF
100V
SMAJ58A
TVS
LT4265
(PoE PD
INTERFACE
CONTROLLER)
LT8300
(ISOLATED
FLYBACK
CONVERTER) 3.3V
RXM
RXP
MII
SMSC 8710A
(10/100 PHY)
TXM
TXP
UART
MII
ATMEL SAM4E
PWM
UART
LTP5902-IPR
TIMEn
ANTENNA