www.vishay.com
116
SOMC
Vishay Dale
Document Number 31508
Revision 05-Aug-02
For Technical Questions, contact: ff2aresistors@vishay.com
FEATURES
14,16 or 20 terminal package
Isolated, bussed or TTL-terminator circuits
Molded case construction
Highly stable thick film elements
Reflow solderable
Compatible with automatic surface mounting equipment
Reduces total assembly costs
For wave flow soldering contact factory
Thick Film, Dual-in-Line Resistor Networks
MODEL ELEMENT PACKAGE POWER RATING CIRCUIT LIMITING ELEMENT TEMPERATURE TOL. RESISTANCE E-SERIES
P70°CP70°C W VOLTAGE MAX. COEFFICIENT1) RANGE
W141620 V ppm/°C%
SOMC 0.08 1.05 1.20 1.52 01 1, 2, 5
0.16 1.125 1.28 1.60 03 50 100 1, 2, 5 10R – 1M 24
0.08 1.05 1.20 1.52 05 1, 2, 5
STANDARD ELECTRICAL SPECIFICATIONS
1)Temperature Range: - 55°C to + 125°C
Power rating depends on the max. temperature at the solder point, the component placement density and the substrate material
Jumper: Zero-Ohm-Resistor on request (100m)
Packaging: according to EIA; see appropriate catalog or web page
PARAMETER UNIT 01 CIRCUIT 03 CIRCUIT 05 CIRCUIT
Rated Dissipation at 70°C per Element W 0.08 0.16 0.08
Limiting Element Voltage 2) V 50
Voltage Coefficient ppm/V < 50
Insulation Voltage (1min) Vdc/ac peak 200
Category Temperature Range °C - 55 / + 150
Insulation Resistance > 10 10
TC Tracking (- 55°C to + 125°C) ppm/°C50
TECHNICAL CHARACTERISTICS
2)Rated voltage: PxR
05
SCHEMATIC
16
20
NUMBER OF
LEADS
01
03
SCHEMATIC
SOMC
MODEL
05 Schematic
G
TOLERANCE
F=± 1%
G= ± 2%
J=± 5%
xxx
or
xxxx
R2 VALUE
xxx
or
xxxx
R1 VALUE
First 2 digits (3 for F tolerance) are
significant figures. Last digit
specifies number of zeros to follow.
SOMC
MODEL
F=± 1%
G= ± 2%
J=± 5%
G
TOLERANCE
First 2 digits (3 for F tolerance) are
significant figures. Last digit
specifies number of zeros to follow.
xxx or xxxx
R1 VALUE
16
20
NUMBER OF
LEADS
01, 03 Schematic
ORDERING INFORMATION
www.vishay.com
117
SOMC
Vishay Dale
Document Number 31508
Revision 05-Aug-02
For Technical Questions, contact: ff2aresistors@vishay.com
SOLDER PAD DIMENSIONS [in millimeters]
ab c l p w
WAVE 0.64 1.91 5.34 9.53 1.27 9.15
REFLOW 0.64 1.91 5.34 9.53 1.27 9.15
16-TERMINAL DEVICE
CIRCUIT SCHEMATICS
01 Circuit 03 Circuit 05 Circuit
The dimensions shown are for 16 pin part. For parts with different
pin numbers use the same pitch and add or substract pads as
required.
Note: Maximum solder reflow temperature + 255ºC
TEST CONDITIONS OF TEST TEST RESULTS
Power Conditioning MIL STD-202 ± 0.5%
Load Life at 70°C MIL STD-202 ± 0.5%
Short Time Overload MIL STD-202 ± 0.25%
Thermal Shock MIL STD-202 ± 0.5%
Moisure Resistance MIL STD-202 ± 0.5%
Resistance to Soldering Heat MIL STD-202 ± 0.25%
Low Temperature Operation MIL STD-202 ± 0.25%
Vibration MIL STD-202 ± 0.25%
Shock MIL STD-202 ± 0.25%
Terminal Strength MIL STD-202 ± 0.25%
DIMENSIONS [in millimeters]
PIN NO# L W B E F G H K R S T
14 9.91 7.62 7.62 6.20 5.59 2.16 2.03 0.914 0.457 1.27 1.14
16 11.18 7.62 8.89 6.20 5.59 2.16 2.03 0.914 0.457 1.27 1.14
20 13.72 7.62 11.43 6.20 5.59 2.16 2.03 0.914 0.457 1.27 1.14
Tol ± 0.254 ± 0.381 ± 0.254 ± 0.381 ± 0.127 ± 0.127 ± 0.127 ± 0.254
Pin 1
Thick Film, Dual-in-Line Resistor Networks
PERFORMANCE
14 pin 16 20 pin
pin
14 pin 16 pin 20 pin
R1
R1
R1
R1
R1
R1
R1
R1
R1
R1
R1
R1
R2
R2
R2
R2
R2
R2
R2
R2
R2
R2
R2
R2
14 pin
Pin 1
Pin 1