© Semiconductor Components Industries, LLC, 2006
October, 2006 − Rev. 9
1Publication Order Number:
MC74AC00/D
MC74AC00, MC74ACT00
Quad 2−Input NAND Gate
High−Performance Silicon−Gate CMOS
Features
•Output Drive Capability: $24 mA
•Operating Voltage Range: 2 to 6 V AC00; 4.5 to 5.5 ACT00
•Low Input Current: 1.0 mA
•High Noise Immunity Characteristic of CMOS Devices
•In Compliance With the JEDEC Standard No. 7A Requirements
•Chip Complexity: 32 FETs
•Pb−Free Packages are Available
3Y1
1
A1
PIN 14 = VCC
PIN 7 = GND
Figure 1. Logic Diagram
2
B1
6Y2
4
A2
5
B2
8Y3
9
A3
10
B3
11 Y4
12
A4
13
B4
Y = AB
Figure 2. Pinout: 14−Lead Packages (Top View)
1314 12 11 10 9 8
21 34567
VCC B4 A4 Y4 B3 A3 Y3
A1 B1 Y1 A2 B2 Y2 GND
MARKING
DIAGRAMS
xxx = AC or ACT
A = Assembly Location
WL or L = Wafer Lot
YY or Y = Year
WW or W = Work Week
G= Pb−Free Package
TSSOP−14
DT SUFFIX
CASE 948G
xxx
00
ALYWG
G
1
14
PDIP−14
N SUFFIX
CASE 646
SOIC−14
D SUFFIX
CASE 751A
SOEIAJ−14
M SUFFIX
CASE 965
1
14
74xxx00
ALYWG
1
14
1
14
1
14
1
14
See detailed ordering and shipping information in the package
dimensions section on page 6 of this data sheet.
ORDERING INFORMATION
L
L
H
H
L
H
L
H
FUNCTION TABLE
Inputs Output
AB
H
H
H
L
Y
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MC74xxx00N
AWLYYWWG
1
14
xxx00
AWLYWWG
1
14
MC74AC00, MC74ACT00
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2
MAXIMUM RATINGS
Symbol Parameter Value Unit
VCC DC Supply Voltage *0.5 to )7.0 V
VIDC Input Voltage *0.5 v VI v VCC )0.5 V
VODC Output Voltage (Note 1) *0.5 v VO v VCC )0.5 V
IIK DC Input Diode Current $20 mA
IOK DC Output Diode Current $50 mA
IODC Output Sink/Source Current $50 mA
ICC DC Supply Current per Output Pin $50 mA
IGND DC Ground Current per Output Pin $50 mA
TSTG Storage Temperature Range *65 to )150 °C
TLLead temperature, 1 mm from Case for 10 Seconds 260 °C
TJJunction temperature under Bias )150 °C
qJA Thermal resistance PDIP
SOIC
TSSOP
78
125
170
°C/W
PDPower Dissipation in Still Air at 85°C PDIP
SOIC
TSSOP
78
125
170
mW
MSL Moisture Sensitivity Level 1
FRFlammability Rating Oxygen Index: 30% − 35% UL 94 V−0 @ 0.125 in
VESD ESD Withstand Voltage Human Body Model (Note 2)
Machine Model (Note 3)
Charged Device Model (Note 4)
> 2000
> 200
> 1000
V
ILatch−Up Latch−Up Performance Above VCC and Below GND at 85°C (Note 5) $100 mA
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
1. IO absolute maximum rating must be observed.
2. Tested to EIA/JESD22−A114−A.
3. Tested to EIA/JESD22−A115−A.
4. Tested to JESD22−C101−A.
5. Tested to EIA/JESD78.
RECOMMENDED OPERATING CONDITIONS
Symbol Parameter Min Typ Max Unit
VCC Supply Voltage MC74AC00
MC74ACT00
2.0
4.5
5.0
5.0
6.0
5.5
V
Vin, Vout DC Input Voltage, Output Voltage (Ref. to GND) 0−VCC V
tr, tfInput Rise and Fall Time (Note 6) VCC @ 3.0 V
MC74AC00 VCC @ 4.5 V
VCC @ 5.5 V
−
−
−
150
40
25
−
−
−
ns/V
tr, tfInput Rise and Fall Time (Note 7) VCC @ 4.5 V
MC74ACT00 VCC @ 5.5 V
−
−
10
8.0
−
−
ns/V
TJJunction Temperature − − 150 °C
TAOperating Ambient Temperature Range −55 25 125 °C
IOH Output Current − High − − −24 mA
IOL Output Current − Low − − 24 mA
6. Vin from 30% to 70% VCC.
7. Vin from 0.8 V to 2.0 V.
MC74AC00, MC74ACT00
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3
DC CHARACTERISTICS
Symbol Parameter
VCC
(V)
MC74AC00
Unit Conditions
TA = +255C TA = −405C to +855C TA = −555C + 1255C
Typ Guaranteed Limits
VIH Minimum High Level
Input Voltage
3.0
4.5
5.5
1.5
2.25
2.75
2.1
3.15
3.85
2.1
3.15
3.85
2.1
3.15
3.85
V VOUT = 0.1 V
or VCC − 0.1 V
VIL Maximum Low Level
Input Voltage
3.0
4.5
5.5
1.5
2.25
2.75
0.9
1.35
1.65
0.9
1.35
1.65
0.9
1.35
1.65
V VOUT = 0.1 V
or VCC − 0.1 V
VOH Minimum High Level
Output Voltage
3.0
4.5
5.5
2.99
4.49
5.49
2.9
4.4
5.4
2.9
4.4
5.4
2.9
4.4
5.4
VIOUT = −50 mA
3.0
4.5
5.5
−
−
−
2.56
3.86
4.86
2.46
3.76
4.76
2.4
3.7
4.7
V *VIN = VIL or VIH
−12 mA
IOH −24 mA
−24 mA
VOL Maximum Low Level
Output Voltage
3.0
4.5
5.5
0.002
0.001
0.001
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
VIOUT = 50 mA
3.0
4.5
5.5
−
−
−
0.36
0.36
0.36
0.44
0.44
0.44
0.5
0.5
0.5
V *VIN = VIL or VIH
12 mA
IOL 24 mA
24 mA
IIN Maximum Input
Leakage Current
5.5 −$0.
1
$1.0 $1.0 mAVI = VCC, GND
IOLD †Minimum Dynamic
Output Current
5.5 − − 75 50 mA VOLD = 1.65 V Max
IOHD 5.5 − − −75 −50 mA VOHD = 3.85 V Min
ICC Maximum Quiescent
Supply Current
5.5 −4.0 40 40 mAVIN = VCC or GND
*All outputs loaded; thresholds on input associated with output under test.
†Maximum test duration 2.0 ms, one output loaded at a time.
NOTE: IIN and ICC @ 3.0 V are guaranteed to be less than or equal to the respective limit @ 5.5 V VCC.
AC CHARACTERISTICS (tr = tf = 3.0 nS; CL = 50 pF; see Figures 3 and 4 for Waveforms)
Symbol Parameter
VCC*
(V)
MC74AC00
Unit
TA = +255C TA = −405C to +855C TA = −555C to + 1255C
Min Typ Max Min Max Min Max
tPLH Propagation Delay 3.3
5.0
2.0
1.5
7.0
6.0
9.5
8.0
2.0
1.5
10.0
8.5
1.0
1.0
11.0
8.5
ns
tPHL Propagation Delay 3.3
5.0
1.5
1.5
5.5
4.5
8.0
6.5
1.0
1.0
8.5
7.0
1.0
1.0
9.0
7.0
ns
*Voltage Range 3.3 V is 3.3 V $0.3 V.
Voltage Range 5.0 V is 5.0 V $0.5 V.
MC74AC00, MC74ACT00
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4
DC CHARACTERISTICS
Symbol Parameter
VCC
(V)
MC74ACT00
Unit Conditions
TA = +255C TA = −405C to +855C TA = −555C to + 1255C
Typ Guaranteed Limits
VIH Minimum High Level
Input Voltage
4.5
5.5
1.5
1.5
2.0
2.0
2.0
2.0
2.0
2.0
V VOUT = 0.1 V
or VCC − 0.1 V
VIL Maximum Low Level
Input Voltage
4.5
5.5
1.5
1.5
0.8
0.8
0.8
0.8
0.8
0.8
V VOUT = 0.1 V
or VCC − 0.1 V
VOH Minimum High Level
Output Voltage
4.5
5.5
4.49
5.49
4.4
5.4
4.4
5.4
4.4
5.4
VIOUT = −50 mA
4.5
5.5
−
−
3.86
4.86
3.76
4.76
3.7
4.7
V *VIN = VIL or VIH
IOH −24 mA
−24 mA
VOL Maximum Low Level
Output Voltage
4.5
5.5
0.001
0.001
0.1
0.1
0.1
0.1
0.1
0.1
VIOUT = 50 mA
4.5
5.5
−
−
0.36
0.36
0.44
0.44
0.5
0.5
V *VIN = VIL or VIH
IOL 24 mA
24 mA
IIN Maximum Input
Leakage Current
5.5 −$0.1 $1.0 $1.0 mAVI = VCC, GND
DICCT Additional Max. ICC/Input 5.5 0.6 −1.5 1.6 mA VI = VCC −2.1 V
IOLD †Minimum Dynamic
Output Current
5.5 − − 75 50 mA VOLD = 1.65 V Max
IOHD 5.5 − − −75 −50 mA VOHD = 3.85 V Min
ICC Maximum Quiescent
Supply Current
5.5 −4.0 40 40 mAVIN = VCC or GND
*All outputs loaded; thresholds on input associated with output under test.
†Maximum test duration 2.0 ms, one output loaded at a time.
AC CHARACTERISTICS (tr = tf = 3.0 nS; CL = 50 pF; see Figures 3 and 4 for Waveforms)
Symbol Parameter
VCC*
(V)
MC74ACT00
Unit
TA = +255C TA = −405C to +855C TA = −555C to +1255C
Min Typ Max Min Max Min Max
tPLH Propagation Delay 5.0 1.5 5.5 9.0 1.0 9.5 1.0 9.5 ns
tPHL Propagation Delay 5.0 1.5 4.0 7.0 1.0 8.0 1.0 8.0 ns
*Voltage Range 5.0 V is 5.0 V $0.5 V.
CAPACITANCE
Symbol Parameter
Value
Typ Test Conditions Unit
CIN Input Capacitance 4.5 VCC = 5.0 V pF
CPD Power Dissipation Capacitance 30 VCC = 5.0 V pF
MC74AC00, MC74ACT00
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5
Figure 3. Switching Waveforms
GND
VCC
OUTPUT Y
INPUT
A OR B
CL*
*Includes all probe and jig capacitance
50%
DEVICE
UNDER
TEST
OUTPUT
Figure 4. Test Circuit
90%
Vmi
10%
tPLH tPHL
tftr
50 W Scope
Test Point
450 W
INPUT
Vmi = 50% for MC74AC00
= 1.5 V for MC74ACT00
MC74AC00, MC74ACT00
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6
ORDER INFORMATION
Device Package Shipping†
MC74AC00D SOIC−14
55 Units / Rail
MC74AC00DG SOIC−14
(Pb−Free)
MC74AC00N PDIP−14
25 Units / Rail
MC74AC00NG PDIP−14
(Pb−Free)
MC74AC00DR2 SOIC−14
2500 / Tape and Reel
MC74AC00DR2G SOIC−14
(Pb−Free)
MC74AC00DTR2 TSSOP−14*
MC74AC00DTR2G TSSOP−14*
MC74AC00MEL SOEIAJ−14
2000 / Tape and Reel
MC74AC00MELG SOEIAJ−14
(Pb−Free)
MC74ACT00N PDIP−14
25 Units / Rail
MC74ACT00NG PDIP−14
(Pb−Free)
MC74ACT00D SOIC−14
55 Units / Rail
MC74ACT00DG SOIC−14
(Pb−Free)
MC74ACT00DR2 SOIC−14
2500 / Tape and Reel
MC74ACT00DR2G SOIC−14
(Pb−Free)
MC74ACT00DTR2 TSSOP−14*
MC74ACT00DTR2G TSSOP−14*
MC74ACT00MEL SOEIAJ−14
2000 / Tape and Reel
MC74ACT00MELG SOEIAJ−14
(Pb−Free)
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
*This package is inherently Pb−Free.
MC74AC00, MC74ACT00
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7
PACKAGE DIMENSIONS
SOIC−14
CASE 751A−03
ISSUE H
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS A AND B DO NOT INCLUDE
MOLD PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006)
PER SIDE.
5. DIMENSION D DOES NOT INCLUDE
DAMBAR PROTRUSION. ALLOWABLE
DAMBAR PROTRUSION SHALL BE 0.127
(0.005) TOTAL IN EXCESS OF THE D
DIMENSION AT MAXIMUM MATERIAL
CONDITION.
−A−
−B−
G
P7 PL
14 8
7
1
M
0.25 (0.010) B M
S
B
M
0.25 (0.010) A S
T
−T−
F
RX 45
SEATING
PLANE D14 PL K
C
J
M
_DIM MIN MAX MIN MAX
INCHESMILLIMETERS
A8.55 8.75 0.337 0.344
B3.80 4.00 0.150 0.157
C1.35 1.75 0.054 0.068
D0.35 0.49 0.014 0.019
F0.40 1.25 0.016 0.049
G1.27 BSC 0.050 BSC
J0.19 0.25 0.008 0.009
K0.10 0.25 0.004 0.009
M0 7 0 7
P5.80 6.20 0.228 0.244
R0.25 0.50 0.010 0.019
__ __
7.04
14X
0.58
14X
1.52
1.27
DIMENSIONS: MILLIMETERS
1
PITCH
SOLDERING FOOTPRINT*
7X
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
MC74AC00, MC74ACT00
http://onsemi.com
8
PDIP−14
CASE 646−06
ISSUE P
17
14 8
B
ADIM MIN MAX MIN MAX
MILLIMETERSINCHES
A0.715 0.770 18.16 19.56
B0.240 0.260 6.10 6.60
C0.145 0.185 3.69 4.69
D0.015 0.021 0.38 0.53
F0.040 0.070 1.02 1.78
G0.100 BSC 2.54 BSC
H0.052 0.095 1.32 2.41
J0.008 0.015 0.20 0.38
K0.115 0.135 2.92 3.43
L
M−−− 10 −−− 10
N0.015 0.039 0.38 1.01
__
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEADS WHEN
FORMED PARALLEL.
4. DIMENSION B DOES NOT INCLUDE MOLD FLASH.
5. ROUNDED CORNERS OPTIONAL.
F
HG D
K
C
SEATING
PLANE
N
−T−
14 PL
M
0.13 (0.005)
L
M
J
0.290 0.310 7.37 7.87
MC74AC00, MC74ACT00
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9
PACKAGE DIMENSIONS
TSSOP−14
CASE 948G−01
ISSUE B
DIM MIN MAX MIN MAX
INCHESMILLIMETERS
A4.90 5.10 0.193 0.200
B4.30 4.50 0.169 0.177
C−−− 1.20 −−− 0.047
D0.05 0.15 0.002 0.006
F0.50 0.75 0.020 0.030
G0.65 BSC 0.026 BSC
H0.50 0.60 0.020 0.024
J0.09 0.20 0.004 0.008
J1 0.09 0.16 0.004 0.006
K0.19 0.30 0.007 0.012
K1 0.19 0.25 0.007 0.010
L6.40 BSC 0.252 BSC
M0 8 0 8
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION A DOES NOT INCLUDE MOLD
FLASH, PROTRUSIONS OR GATE BURRS.
MOLD FLASH OR GATE BURRS SHALL NOT
EXCEED 0.15 (0.006) PER SIDE.
4. DIMENSION B DOES NOT INCLUDE
INTERLEAD FLASH OR PROTRUSION.
INTERLEAD FLASH OR PROTRUSION SHALL
NOT EXCEED 0.25 (0.010) PER SIDE.
5. DIMENSION K DOES NOT INCLUDE
DAMBAR PROTRUSION. ALLOWABLE
DAMBAR PROTRUSION SHALL BE 0.08
(0.003) TOTAL IN EXCESS OF THE K
DIMENSION AT MAXIMUM MATERIAL
CONDITION.
6. TERMINAL NUMBERS ARE SHOWN FOR
REFERENCE ONLY.
7. DIMENSION A AND B ARE TO BE
DETERMINED AT DATUM PLANE −W−.
____
S
U0.15 (0.006) T
2X L/2
S
U
M
0.10 (0.004) V S
T
L−U−
SEATING
PLANE
0.10 (0.004)
−T−
ÇÇÇ
ÇÇÇ
ÇÇÇ
SECTION N−N
DETAIL E
JJ1
K
K1
ÉÉÉ
ÉÉÉ
DETAIL E
F
M
−W−
0.25 (0.010)
8
14
7
1
PIN 1
IDENT.
H
G
A
D
C
B
S
U0.15 (0.006) T
−V−
14X REFK
N
N
7.06
14X
0.36 14X
1.26
0.65
DIMENSIONS: MILLIMETERS
1
PITCH
SOLDERING FOOTPRINT*
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
MC74AC00, MC74ACT00
http://onsemi.com
10
PACKAGE DIMENSIONS
SOEIAJ−14
CASE 965−01
ISSUE A
HE
A1
DIM MIN MAX MIN MAX
INCHES
−−− 2.05 −−− 0.081
MILLIMETERS
0.05 0.20 0.002 0.008
0.35 0.50 0.014 0.020
0.10 0.20 0.004 0.008
9.90 10.50 0.390 0.413
5.10 5.45 0.201 0.215
1.27 BSC 0.050 BSC
7.40 8.20 0.291 0.323
0.50 0.85 0.020 0.033
1.10 1.50 0.043 0.059
0
0.70 0.90 0.028 0.035
−−− 1.42 −−− 0.056
A1
HE
Q1
LE
_10 _0
_10 _
LE
Q1
_
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS D AND E DO NOT INCLUDE
MOLD FLASH OR PROTRUSIONS AND ARE
MEASURED AT THE PARTING LINE. MOLD FLASH
OR PROTRUSIONS SHALL NOT EXCEED 0.15
(0.006) PER SIDE.
4. TERMINAL NUMBERS ARE SHOWN FOR
REFERENCE ONLY.
5. THE LEAD WIDTH DIMENSION (b) DOES NOT
INCLUDE DAMBAR PROTRUSION. ALLOWABLE
DAMBAR PROTRUSION SHALL BE 0.08 (0.003)
TOTAL IN EXCESS OF THE LEAD WIDTH
DIMENSION AT MAXIMUM MATERIAL CONDITION.
DAMBAR CANNOT BE LOCATED ON THE LOWER
RADIUS OR THE FOOT. MINIMUM SPACE
BETWEEN PROTRUSIONS AND ADJACENT LEAD
TO BE 0.46 ( 0.018).
0.13 (0.005) M0.10 (0.004)
D
Z
E
1
14 8
7
eA
b
VIEW P
c
L
DETAIL P
M
A
b
c
D
E
e
0.50
M
Z
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to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
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MC74AC00/D
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