T4-LDS-0300-1, Rev. 1 (6/6/13) ©2013 Microsemi Corporation Page 1 of 5
1N5913BUR-1 – 1N5956BUR-1
(aka CDLL5913 –
CDLL5956)
Available Metallurgically Bonded Glass Surface Mount
1.5 Watt Zener Diodes
Screening in
reference to
MIL-PRF-19500
available
DESCRIPTION
This surface mountable 1.5 W Zener diode series in the JEDEC DO-213AB package is similar
in electrical features to the JEDEC registered 1N5913B through 1N5956 B ax ial-leaded
package for 3.3 to 200 V. It is an ideal selection for applications of high density and low
parasitic requirements. Due to its glass hermetic qualities and metallurgically enhanced
internal contacts, it may also be used for high reliability applications when required by a source
control drawing (SCD) or screening in accordance with MIL-PRF-19500 as described in
Features below.
DO-213AB MELF
Package
Also available in:
DO-41 package
(glass axial-leaded)
1N5913BG – 1N5956BG
SMB package
(tabbed surface mount)
SMBG(J)5913B –
SMBG(J)5956B
SMAJ package
(tabbed surface mount)
SMAJ5913B –
SMAJ5956B
Powermite package
(tabbed surface mount)
1PMT5913B –
1PMT5956B
Important: For the latest information, visit our website http://www.microsemi.com.
FEATURES
• Surface mount equivalent of JEDEC registered 1N5913B TO 1N5956B number series.
• Zener voltage available 3.3 V to 200 V.
• Voltage tolerances of 10%, 5%, 2% and 1% are available.
• Screening in ref ere nce to M IL-PRF-19500 is available.
(See part nomenclature for all available options.)
• RoHS compliant versions are available.
APPLICATIONS / BENEFITS
• Regulates voltage over a broad rang es of oper at ion current and temper atur e.
• Leadless package ideal for high-density s urf a ce mount ing .
• Metallurgically enhanced internal contact design for greater reliability and lower thermal resistance.
• Hermetically sealed glass package.
• Non-sensitive to ESD per MIL-STD-750 method 1020.
• Specified capacitance (see figure 2).
• Inherently radiation hard as described in Microsemi MicroNote 050.
MAXIMUM RATINGS @ TA= 25 oC unles s otherwis e s pecif ied
MSC – Lawrence
6 Lake Street,
Lawrence, MA 01841
Tel: 1-800-446-1158 or
(978) 620-2600
Fax: (978) 689-0803
MSC – Ireland
Gort Road Business Park,
Ennis, Co. Clare, Ireland
Tel: +353 (0) 65 6840044
Fax: +353 (0) 65 6822298
Website:
www.microsemi.com
Parameters/Test Conditions
Symbol
Value
Unit
Junction and Storage Temperature
TJ & TSTG
-65 to +175
oC
Thermal Resistance Juncti on-to-End Cap
RӨJEC
40
oC/W
Thermal Resi stan ce Jun cti on-to-Ambient (1)
RӨJA
120
oC/W
Steady State Power Dissipation
@ T
EC
≤ 115 ºC
@ TA = 25 ºC
(1)
P
D
1.5
1.25
W
Rated Average Power Dissipation (also see figure 1 )
PM(AV)
1.5
W
Forward Voltage
@ 200 mA
VF
1.2
V
Solder Temperature @ 10 s
TSP
260
oC
Notes: 1. When mounted on FR4 PC board (1 oz Cu) with recomm ended foot pri nt (see last page).
T4-LDS-0300-1, Rev. 1 (6/6/13) ©2013 Microsemi Corporation Page 2 of 5
1N5913BUR-1 – 1N5956BUR-1
(aka CDLL5913 –
CDLL5956)
MECHANICAL and PACKAGING
• CASE: Hermetically sealed vo idle ss hard gla ss with tungsten sl ugs.
• TERMINALS: Tin/lead or RoHS compliant matte/tin plating over copper. Solderable per MIL-STD-750, method 2026.
• MARKING: Cathode band only .
• POLARITY: Cathode indicated by band. Diode to be operated with the banded end positive with respect to the opposite end for
Zener regulation.
• TAPE & REEL option: Standard per EIA-481-B with 12mm tape (add TR suffix to part number). Consult factory for quantities.
• WEIGHT: Approximately 0.05 grams.
• See package dimensions on last page.
PART NOMENCLATURE
MQ 1N5913 B UR -1 (e3)
Reliability Level
MQ
MX
MV
MSP
Blank = Commercial
*(refer to MicroNote 129)
JEDEC type number
(See Electrical Characteristics
table)
RoHS Compli ance
e3 = RoHS compliant
Blank = non-RoHS compliant
Metallurgically Bonded
MELF Surface Mount
Tolerance Level
A = 10 %
B = 5 %
C = 2 %
D = 1%
SYMBOLS & DEFINITIONS
Symbol
Definition
VZ Zener Voltage: The Zener voltage the device will exhibit at a specified current (IZ) in its breakdown region.
IZ, IZT, IZK Regulator Current: The dc regulator current (IZ), at a specified test point (IZT), near breakdown knee (IZK).
ZZT or ZZK
Regulator Impedance: The small signal impedance of the diode when biased to operate in its breakdown region with
IZT applied at IZ or IZK respectively. This has also been known as Zener or dynamic impedance (ZZT or ZZK).
VF Forward Voltage: The positive dc anode-cathode voltage the device will exhibit at a specified forward current.
IR Reverse Current: The dc current flowing from the external circuit into the cathode terminal at the specified voltage VR.
IZM Maximum Regulator (Zener) Current: The maximum rated dc current for the specified power rating.
T4-LDS-0300-1, Rev. 1 (6/6/13) ©2013 Microsemi Corporation Page 3 of 5
1N5913BUR-1 – 1N5956BUR-1
(aka CDLL5913 –
CDLL5956)
ELECTRICAL CHARACTERISTICS @ TEC = 25 ºC unless otherwise noted
PART
NUMBER
(Note 3)
ZENER
VOLTAGE
VZ
(Note 1)
TEST
CURRENT
IZT
DYNAMIC
IMPEDANCE
ZZT
(Note 2)
KNEE
CURRENT
IZK
KNEE
IMPEDANCE
ZZK
(Note 2)
REVERSE
CURRENT
IR
REVERSE
VOLTAGE
VR
MAX. DC
CURRENT
IZM
Volts
mA
Ohms
mA
Ohms
µA
Volts
mA
1N5913BUR-1
1N5914BUR-1
1N5915BUR-1
1N5916BUR-1
3.3
3.6
3.9
4.3
113.6
104.2
96.1
87.2
10
9.0
7.5
6.0
1.0
1.0
1.0
1.0
500
500
500
500
100
75
25
5.0
1.0
1.0
1.0
1.0
454
416
384
348
1N5917BUR-1
1N5918BUR-1
1N5919BUR-1
1N5920BUR-1
4.7
5.1
5.6
6.2
79.8
73.5
66.9
60.5
5.0
4.0
2.0
2.0
1.0
1.0
1.0
1.0
500
350
250
200
5.0
5.0
5.0
5.0
1.5
2.0
3.0
4.0
319
294
267
241
1N5921BUR-1
1N5922BUR-1
1N5923BUR-1
1N5924BUR-1
6.8
7.5
8.2
9.1
55.1
50.0
45.7
41.2
2.5
3.0
3.5
4.0
1.0
0.5
0.5
0.5
200
400
400
500
5.0
5.0
5.0
5.0
5.2
6.0
6.5
7.0
220
200
182
164
1N5925BUR-1
1N5926BUR-1
1N5927BUR-1
1N5928BUR-1
10
11
12
13
37.5
34.1
31.2
28.8
4.5
5.5
6.5
7.0
0.25
0.25
0.25
0.25
500
550
550
550
5.0
1.0
1.0
1.0
8.0
8.4
9.1
9.9
150
136
125
115
1N5929BUR-1
1N5930BUR-1
1N5931BUR-1
1N5932BUR-1
15
16
18
20
25.0
23.4
20.8
18.7
9.0
10
12
14
0.25
0.25
0.25
0.25
600
600
650
650
1.0
1.0
1.0
1.0
11.4
12.2
13.7
15.2
100
93
83
75
1N5933BUR-1
1N5934BUR-1
1N5935BUR-1
1N5936BUR-1
22
24
27
30
17.0
15.6
13.9
12.5
17.5
19
23
28
0.25
0.25
0.25
0.25
650
700
700
750
1.0
1.0
1.0
1.0
16.7
18.2
20.6
22.8
68
62
55
50
1N5937BUR-1
1N5938BUR-1
1N5939BUR-1
1N5940BUR-1
33
36
39
43
11.4
10.4
9.6
8.7
33
38
45
53
0.25
0.25
0.25
0.25
800
850
900
950
1.0
1.0
1.0
1.0
25.1
27.4
29.7
32.7
45
41
38
34
1N5941BUR-1
1N5942BUR-1
1N5943BUR-1
1N5944BUR-1
47
51
56
62
8.0
7.3
6.7
6.0
67
70
86
100
0.25
0.25
0.25
0.25
1000
1100
1300
1500
1.0
1.0
1.0
1.0
35.8
38.8
42.6
47.1
31
29
26
24
1N5945BUR-1
1N5946BUR-1
1N5947BUR-1
1N5948BUR-1
68
75
82
91
5.5
5.0
4.6
4.1
120
140
160
200
0.25
0.25
0.25
0.25
1700
2000
2500
3000
1.0
1.0
1.0
1.0
51.2
56.0
62.2
69.2
22
20
18
16
1N5949BUR-1
1N5950BUR-1
1N5951BUR-1
1N5952BUR-1
100
110
120
130
3.7
3.4
3.1
2.9
250
300
380
450
0.25
0.25
0.25
0.25
3100
4000
4500
5000
1.0
1.0
1.0
1.0
76.0
83.6
91.2
98.9
15
13
12
11
1N5953BUR-1
1N5954BUR-1
1N5955BUR-1
1N5956BUR-1
150
160
180
200
2.5
2.3
2.1
1.9
600
700
900
1200
0.25
0.25
0.25
0.25
6000
6500
7000
8000
1.0
1.0
1.0
1.0
114.0
121.6
136.8
152.0
10
9
8
7
* TEC Maintained at 30 oC, VF = 1.2 V max @ IF = 200 mA (all types).
NOTES:
1. Zener voltage (VZ) is measured at end cap temperatures TEC = 30 oC. Voltage measurement to be performed 90 seconds after
applicat i on of dc current.
2. The Zener im pedance is derived from the 60 Hz ac voltage, which results when an ac current having an rms value equal to
10% of the dc Zener current (IZT or IZK) is superimposed on IZT or IZK.
3. This product s eri es has also been previously identified as t he CDLL5913B thr ough CDLL5956B series that i ncluded the
enhanced metallurgical bond. This alternate name may still be used.
T4-LDS-0300-1, Rev. 1 (6/6/13) ©2013 Microsemi Corporation Page 4 of 5
1N5913BUR-1 – 1N5956BUR-1
(aka CDLL5913 –
CDLL5956)
GRAPHS
Temperature (oC)
TEC End Cap temp (ºC), or TA on FR4 PC Board
FIGURE 1 – Power Derating Curve
VZ – Zener Vo ltag e – Volts
FIGURE 2 – Capacitance vs Zener Voltage
C – Capacitance - Picofarads
P
D
, Maximum Power Dissipation (Watts)
T4-LDS-0300-1, Rev. 1 (6/6/13) ©2013 Microsemi Corporation Page 5 of 5
1N5913BUR-1 – 1N5956BUR-1
(aka CDLL5913 –
CDLL5956)
PACKAGE DIMENSIONS
Symbol
Dimensions
Inch
Millimeters
Min
Max
Min
Max
BD
0.094
0.105
2.39
2.67
BL
0.189
0.205
4.80
5.21
ECT
0.014
0.022
0.360
0.560
S
0.001 min
0.03 min
NOTES:
1. Dimensions are in inches. Millimeters are given for general information only.
2. Gap not controlled, shape of body and gap not controlled.
3. In accordance with ASME Y14.5M, diameters are equivalent to Φx symbology.
PAD LAYOUT
Ltr
Inch
mm
A
0.276
7.00
B
0.070
1.8
C
0.110
2.8
