© Semiconductor Components Industries, LLC, 2010
October, 2010 Rev. 0
1Publication Order Number:
NTVB058NS/D
NTVB Series
Thyristor Surge Protectors
High Voltage Bidirectional
NTVB Series Thyristor Surge Protector Devices (TSPD) protect
telecommunication circuits such as central office, access, and
customer premises equipment from overvoltage conditions. These are
bidirectional devices so they are able to have functionality of 2 devices
in one package, saving valuable space on board layout.
These devices will act as a crowbar when overvoltage occurs and will
divert the energy away from circuit or device that is being protected.
Use of the NTVB Series in equipment will help meet various
regulatory requirements including: GR1089CORE, IEC
6100045, ITU K.20/21/45, IEC 60950, TIA968A, FCC Part 68,
EN 60950, UL 1950.
ELECTRICAL PARAMETERS
Device
VDRM V(BO) VTIDRM I(BO) ITIH
V V V mAmA A mA
NTVB058NSxL 58 77 4 5 800 2.2 150
NTVB065NSxL 65 88 4 5 800 2.2 150
NTVB090NSxL 90 130 4 5 800 2.2 150
NTVB170SxL 170 265 4 5 800 2.2 150
NTVB170NSxL 170 220 4 5 800 2.2 150
NTVB180SxL 170 240 4 5 800 2.2 150
NTVB200SxL 200 320 4 5 800 2.2 150
NTVB220NSxL 220 300 4 5 800 2.2 150
NTVB270SxL 270 365 4 5 800 2.2 150
NTVB275NSxL 275 350 4 5 800 2.2 150
NTVB300SxL 300 400 4 5 800 2.2 150
SURGE DATA RATINGS
Specification
Waveform x = series ratings
Unit
Voltage
ms
Current
msA B C
GR1089CORE 2x10 2x10 150 250 500 A(pk)
TIA968A 10x160 10x160 90 150 200
GR1089CORE 10x360 10x360 75 125 175
TIA968A 10x560 10x560 50 100 150
ITUT K.20/21 10x700 5x310 75 100 200
GR1089CORE 10x1000 10x1000 50 80 100
* Recognized Components
BIDIRECTIONAL SURFACE
MOUNT THYRISTOR
64 350 VOLTS
MT1 MT2
SMB
JEDEC DO214AA
CASE 403C
XXXX = Specific Device Code
Y = Year
WW = Work Week
G= PbFree Package
(Note: Microdot may be in either location)
MARKING DIAGRAM
AYWW
XXXXG
G
http://onsemi.com
See detailed ordering and shipping information on page 4 of
this data sheet.
ORDERING INFORMATION
NTVB Series
http://onsemi.com
2
ELECTRICAL CHARACTERISTICS (TA = 25°C unless otherwise noted)
Characteristics (Notes 1, 2, 3) Symbol Min Typ Max Unit
Breakover Voltage (Both Polarities)
NTVB058NSxL
NTVB065NSxL
NTVB090NSxL
NTVB170SxL
NTVB170NSxL
NTVB180SxL
NTVB200SxL
NTVB220NSxL
NTVB270SxL
NTVB275NSxL
NTVB300SxL
V(BO) 77
88
130
265
220
240
320
300
365
350
400
V
OffState Voltage (Both Polarities)
NTVB058NSxL
NTVB065NSxL
NTVB090NSxL
NTVB170SxL
NTVB170NSxL
NTVB180SxL
NTVB200SxL
NTVB220NSxL
NTVB270SxL
NTVB275NSxL
NTVB300SxL
VDRM 58
65
90
170
170
170
200
220
270
275
300
V
Off State Current ( VD1 = 50 V ) Both Polarities
( VD2 = VDRM ) Both Polarities
IDRM1
IDRM2
2.0
5.0
mA
mA
Holding Current (Both Polarities) (Note 3) VS = 500 V; IT = 2.2 A IH150 250 mA
OnState Voltage IT = 1.0 A(pk) (PW = 300 mSec, DC = 2%) VT 4.0 V
Maximum NonRepetitive Rate of Change of OnState Current (Note 1)
(Haefely test method, 1.0 pk < 100 A)
di/dt 500 A/mSec
Critical Rate of Rise of OffState Voltage
(Linear Waveform, VD = 0.8 VDRM, TJ = 25°C)
dv/dt 5.0 kV/mSec
CAPACITANCE
Characteristics Symbol
Typ
Unit
A B C
(f=1.0 MHz, 1.0 Vrms, 2 Vdc bias)
NTVB058NSxL
NTVB065NSxL
NTVB090NSxL
NTVB170SxL
NTVB170NSxL
NTVB180SxL
NTVB200SxL
NTVB220NSxL
NTVB270SxL
NTVB275NSxL
NTVB300SxL
Co84
79
58
39
39
37
36
33
31
28
28
129
123
95
150
59
59
56
52
47
44
44
222
198
154
195
99
97
110
81
76
97
71
pF
1. Electrical parameters are based on pulsed test methods.
2. Measured under pulsed conditions to reduce heating
3. Allow cooling before testing second polarity.
NTVB Series
http://onsemi.com
3
SURGE RATINGS
Characteristics Symbol A B C Unit
Nominal Pulse
Surge Short Circuit Current Non – Repetitive
Double Exponential Decay Waveform (Notes 4, 5 and 6)
2 x 10 mSec
10 x 160 mSec
10 x 360 mSec
10 x 560 mSec
10 x 700 mSec
10 x 1000 mSec
IPPS1
IPPS3
IPPS4
IPPS5
IPPS6
IPPS7
150
90
75
50
75
50
250
150
125
100
100
80
500
200
150
150
200
100
A(pk)
4. Allow cooling before testing second polarity.
5. Measured under pulse conditions to reduce heating.
6. Nominal values may not represent the maximum capability of a device.
THERMAL CHARACTERISTICS
Symbol Rating Value Unit
TSTG Storage Temperature Range 65 to +150 °C
TJOperating Temperature Range 40 to +150 °C
R0JA Thermal Resistance: JunctiontoAmbient Per EIA/JESD513, PCB = FR4 3”x4.5”x0.06”
Fan out in a 3x3 inch pattern, 2 oz copper track.
90 °C/W
Figure 1. Exponential Decay Pulse Waveform
TIME (ms)
0
50
0
Ipp - PEAK PULSE CURRENT - %Ipp
100
tr = rise time to peak value
tf = decay time to half value
trtf
Peak
Value
Half Value +VoltageVoltage
I
+I
VTVDRM V(BO)
IT
I(BO)
IH
Figure 2. Voltage Current Characteristics of TSPD
Symbol Parameter
VDRM Peak Off State Voltage
V(BO) Breakover Voltage
I(BO) Breakover Current
IHHolding Current
VTOn State Voltage
ITOn State Current
NTVB Series
http://onsemi.com
4
ORDERING INFORMATION
Part Number Marking Case Shipping
NTVB058NSBL 58NB
SMB
(PbFree) 2500 / Tape and Reel
NTVB058NSCL 58NC
NTVB065NSAL 65NA
NTVB065NSCL 65NC
NTVB090NSAL 90NA
NTVB170SAL 170A
NTVB170SCL 170C
NTVB170NSCL 17NC
NTVB180SAL 180A
NTVB200SAL 200A
NTVB200SBL 200B
NTVB200SCL 200C
NTVB220NSCL 22NC
NTVB270SAL 270A
NTVB270SBL 270B
NTVB270SCL 270C
NTVB275NSCL 27NC
NTVB300SAL 300A
NTVB300SBL 300B
NTVB300SCL 300C
For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
NTVB Series
http://onsemi.com
5
PACKAGE DIMENSIONS
A
S
DB
J
P
K
C
H
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. D DIMENSION SHALL BE MEASURED WITHIN
DIMENSION P.
DIM MIN MAX MIN MAX
MILLIMETERSINCHES
A0.160 0.180 4.06 4.57
B0.130 0.150 3.30 3.81
C0.075 0.095 1.90 2.41
D0.077 0.083 1.96 2.11
H0.0020 0.0060 0.051 0.152
J0.006 0.012 0.15 0.30
K0.030 0.050 0.76 1.27
P0.020 REF 0.51 REF
S0.205 0.220 5.21 5.59
SMB
CASE 403C01
ISSUE A
*For additional information on our PbFree strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
SOLDERING FOOTPRINT*
ǒmm
inchesǓ
SCALE 8:1
2.743
0.108
2.159
0.085
2.261
0.089
ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications
intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should
Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates,
and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death
associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal
Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
PUBLICATION ORDERING INFORMATION
N. American Technical Support: 8002829855 Toll Free
USA/Canada
Europe, Middle East and Africa Technical Support:
Phone: 421 33 790 2910
Japan Customer Focus Center
Phone: 81357733850
NP0640S/D
LITERATURE FULFILLMENT:
Literature Distribution Center for ON Semiconductor
P.O. Box 5163, Denver, Colorado 80217 USA
Phone: 3036752175 or 8003443860 Toll Free USA/Canada
Fax: 3036752176 or 8003443867 Toll Free USA/Canada
Email: orderlit@onsemi.com
ON Semiconductor Website: www.onsemi.com
Order Literature: http://www.onsemi.com/orderlit
For additional information, please contact your local
Sales Representative