DATA SH EET
Product data sheet
Supersedes data of 1999 Apr 15
2004 Jan 16
DISCRETE SEMICONDUCTORS
BCX70 series
NPN general purpose transistors
2004 Jan 16 2
NXP Semiconductors Product data sheet
NPN general purpose transistors BCX70 series
FEATURES
Low current (ma x. 10 0 mA)
Low voltage (max. 45 V).
APPLICATIONS
General purpose switc hing and amplification.
DESCRIPTION
NPN transistor in a SOT23 plastic package.
PNP complements: BCX71 series.
MARKING
Note
1. * = p : Made in Hong Kong .
* = t : Made in Malaysia.
* = W : Made in China.
PINNING
TYPE NUMBER MARKING CODE(1)
BCX70G AG*
BCX70H AH*
BCX70J AJ*
BCX70K AK*
PIN DESCRIPTION
1base
2emitter
3collector
Fig.1 Simplified outline (SOT23 ) and symbo l .
handbook, halfpage
21
3
MAM255
Top view
2
3
1
ORDERING INFORMATION
TYPE
NUMBER PACKAGE
NAME DESCRIPTION VERSION
BCX70G plastic surface mounted p a ckage; 3 leads SOT23
BCX70H
BCX70J
BCX70K
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NXP Semiconductors Pr oduct data shee t
NPN general purpose transistors BCX70 series
LIMITING VALUES
In accordance with the A bsolute Maxi mum Rating System (IEC 60134).
THERMAL CHARACTE RISTICS
Note
1. Transistor mounted on an FR4 printed- circuit board.
SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT
VCBO collector-base volta ge open emitter 45 V
VCEO collector-emitter voltage open base 45 V
VEBO emitter-base vo ltage open collector 5 V
ICcollector current (DC) 100 mA
ICM peak collector current 200 mA
IBM peak base current 200 mA
Ptot total power dissipation Tamb 25 °C250 mW
Tstg storage temperature 65 +150 °C
Tjjunction temperature 150 °C
Tamb operating ambient temperature 65 +150 °C
SYMBOL PARAMETER CONDITIONS VALUE UNIT
Rth(j-a) thermal resistance from junction to ambient note 1 500 K/W
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NXP Semiconductors Pr oduct data shee t
NPN general purpose transistors BCX70 series
CHARACTERISTICS
Tamb = 25 °C unless otherwise specified.
Note
1. Pulse test: tp 300 μs; δ 0.02.
SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
ICBO collector cut-off current IE = 0; VCB = 45 V 20 nA
IE = 0; VCB = 45 V; Tamb = 150 °C 20 μA
IEBO emitter cut-off current IC = 0; VEB = 4 V 20 nA
hFE DC current gain IC = 10 μA; VCE = 5 V
BCX70G
BCX70H 40
BCX70J 30
BCX70K 100
DC current gain IC = 2 mA; VCE = 5 V
BCX70G 120 220
BCX70H 180 310
BCX70J 250 460
BCX70K 380 630
DC current gain IC = 50 mA; VCE = 1 V
BCX70G 50
BCX70H 70
BCX70J 90
BCX70K 100
VCEsat collector-emitter saturation
voltage IC = 10 mA; IB = 0.25 mA 50 350 mV
IC = 50 mA; IB = 1.25 mA 100 550 mV
VBEsat base-emitt er saturatio n voltage IC = 10 mA; IB = 0.25 mA 600 850 mV
IC = 50 mA; IB = 1.25 mA 700 1 050 mV
VBE base-emitter vo ltage IC = 10 μA; VCE = 5 V 520 mV
IC = 2 mA; VCE = 5 V 550 650 750 mV
IC = 50 mA; VCE = 1 V 780 mV
Cccollector capacitance IE = ie = 0; VCB = 10 V; f = 1 MHz 1.7 pF
Ceemitter cap a citance IC = ic = 0; VEB = 0.5 V; f = 1 MHz 11 pF
fTtransition freque ncy IC = 10 mA; VCE = 5 V; f = 100 MHz;
note 1 100 250 MHz
Fnoise figure IC = 200 μA; VCE = 5 V; RS = 2 kΩ;
f = 1 kHz; B = 200 Hz 26dB
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NXP Semiconductors Pr oduct data shee t
NPN general purpose transistors BCX70 series
PACKAGE OUTLINE
UNIT A
1
max. b
p
cDE e
1
H
E
L
p
Qwv
REFERENCES
OUTLINE
VERSION EUROPEAN
PROJECTION ISSUE DATE
04-11-04
06-03-16
IEC JEDEC JEITA
mm 0.1 0.48
0.38 0.15
0.09 3.0
2.8 1.4
1.2 0.95
e
1.9 2.5
2.1 0.55
0.45 0.1
0.2
DIMENSIONS (mm are the original dimensions)
0.45
0.15
SOT23 TO-236AB
bp
D
e1
e
A
A1
Lp
Q
detail X
HE
E
w
M
v
M
A
B
AB
0 1 2 mm
scale
A
1.1
0.9
c
X
12
3
Plastic surface-mounted package; 3 leads SOT2
3
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NXP Semiconductors Pr oduct data shee t
NPN general purpose transistors BCX70 series
DATA SHEET STATUS
Notes
1. Please consult the most recently issued document before initiating or completing a design.
2. The product s ta tus of device(s) described in this document may have changed since this docu ment was published
and may differ in case of multiple devices. The latest product status information is available on th e Internet at
URL http://www.nxp.com.
DOCUMENT
STATUS(1) PRODUCT
STATUS(2) DEFINITION
Objective data sheet Development This document contains data from the objective specification for pro duct
development.
Preliminary data sheet Qualification This document contains data from the preliminary specification.
Product data sheet Production T his document contains the product specification.
DISCLAIMERS
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published in this doc ument, including without limitation
specifications and product descriptions, at any time and
without notice. This document supersedes and replaces all
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of an NXP Semiconductors product can reason ably be
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accepts no liability for inclusion and/or use of NXP
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Applications Applications that are described herein for
any of these products are for illustrative purposes only.
NXP Semiconductors makes no representation or
warranty that such applications will be suitable for the
specified use witho ut fu rth e r testing or modification .
Limiting values Stress above one or more limiting
values (as defined in the Absolute Maximum Ratings
System of IEC 60134) may cause permanent damage to
the device. Limiting values are stress ratin gs only and
operation of the device at these or any other cond itions
above those given in the Characteristics sections of this
document is not implied. Exposure to limiting values for
extended periods may affect device reliability.
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regulations. Export might require a prior authorization from
national author ities.
Quick refer ence data The Quick reference data is an
extract of th e product data given in the Limiting values an d
Characteristics sections of this document, and as such is
not complete, exhaus tive or legally binding.
NXP Semiconductors
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Customer notification
This data sheet was changed to reflect the new company name NXP Semiconductors, including new legal
definitions and disclaimer s. No changes were made to the technical content, except for package outline
drawings which were updated to the latest version.
Printed in The Netherlands R75/04/pp7 Date of release: 2004 Jan 16 Document orde r number: 9397 750 12408