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74LV541
Octal buffer/line driver (3-State)
Product specification
Supersedes data of 1997 Mar 04
IC24 Data Handbook
1997 Jun 10
INTEGRATED CIRCUITS
Philips Semiconductors Product specification
74LV541Octal buffer/line driver (3-State)
2
1998 Jun 10 853–1937 19545
FEATURES
Optimized for Low V oltage applications: 1.0 to 3.6V
Accepts TTL input levels between VCC = 2.7V and VCC = 3.6V
Typical VOLP (output ground bounce) 0.8V @ VCC = 3.3V,
Tamb = 25°C
Typical VOHV (output VOH undershoot) 2V @ VCC = 3.3V,
Tamb = 25°C
Non-inverting outputs
Output capability: bus driver
ICC category: MSI
DESCRIPTION
The 74LV541 is a low–voltage CMOS device and is pin and function
compatible with 74HC/HCT541.
The 74LV541 is an octal non-inverting buffer/line driver with 3-State
outputs. The 3-State outputs are controlled by the output enable
inputs OE1 and OE2.
A HIGH on OEn causes the outputs to assume a high impedance
OFF–state.
QUICK REFERENCE DATA
GND = 0V ; Tamb = 25°C; tr = tf 2.5 ns
SYMBOL PARAMETER CONDITIONS TYPICAL UNIT
tPHL/tPLH Propagation delay
An to YnCL = 15pF
VCC = 3.3V 10 ns
CIInput capacitance 3.5 pF
CPD Power dissipation capacitance per buffer VI = GND to VCC 137 pF
NOTES:
1. CPD is used to determine the dynamic power dissipation (PD in µW)
PD = CPD VCC2 fi (CL VCC2 fo) where:
fi = input frequency in MHz; CL = output load capacity in pF;
fo = output frequency in MHz; VCC = supply voltage in V ;
(CL VCC2 fo) = sum of the outputs.
ORDERING INFORMATION
PACKAGES TEMPERATURE RANGE OUTSIDE NORTH AMERICA NORTH AMERICA PKG. DWG. #
20-Pin Plastic DIL –40°C to +125°C74LV541 N 74LV541 N SOT146-1
20-Pin Plastic SO –40°C to +125°C74LV541 D 74L541 D SOT163-1
20-Pin Plastic SSOP Type II –40°C to +125°C74LV541 DB 74LV541 DB SOT339-1
20-Pin Plastic TSSOP Type I –40°C to +125°C74LV541 PW 74LV541PW DH SOT360-1
PIN DESCRIPTION
PIN
NUMBER SYMBOL FUNCTION
1, 19 OE1, OE2Output enable input (active-LOW)
2, 3, 4, 5,
6, 7, 8, 9 A0 to A7Data inputs
10 GND Ground (0V)
18, 17, 16, 15,
14, 13, 12, 11 Y0 to Y7Bus outputs
20 VCC Positive supply voltage
FUNCTION TABLE
INPUTS OUTPUT
OE1OE2nA nY
L L L L
L L H H
X H X Z
H X X Z
H = HIGH voltage level
L = LOW voltage level
X = Don’t care
Z = High impedance OFF-state
Philips Semiconductors Product specification
74LV541Octal buffer/line driver (3-State)
1998 Jun 10 3
PIN CONFIGURATION
SV00680
1
2
3
4
5
6
7
8
9
10
20
19
18
17
16
15
14
13
12
11
OE1
A0
A1
A2
A3
A4
A5
A6
A7
GND Y7
Y6
Y5
Y4
Y3
Y2
Y1
Y0
OE2
VCC
LOGIC SYMBOL
SV00681
Y414
Y513
Y612
Y711
6
7
8
9
19
1OE1
OE2
A4
A5
A6
A7
A2
A1
A0
A3
Y216
Y315
4
5
Y018
Y117
2
3
LOGIC SYMBOL (IEEE/IEC)
SV00682
18
17
16
15
14
13
&EN
2
3
4
5
19
1
6
7
911
12
8
FUNCTIONAL DIAGRAM
SV00683
Y4
Y5
Y6
Y7
OE1
OE2
A4
A5
A6
A7
A2
A1
A0
A3
Y2
Y3
Y0
Y1
14
13
12
11
16
15
18
17
6
7
8
9
19
1
4
5
2
3
Philips Semiconductors Product specification
74LV541Octal buffer/line driver (3-State)
1998 Jun 10 4
RECOMMENDED OPERATING CONDITIONS
SYMBOL PARAMETER CONDITIONS MIN TYP MAX UNIT
VCC DC supply voltage See Note 1 1.0 3.3 3.6 V
VIInput voltage 0 VCC V
VOOutput voltage 0 VCC V
Tamb Operating ambient temperature range in free air See DC and AC
characteristics –40
–40 +85
+125 °C
tr, tfInput rise and fall times VCC = 1.0V to 2.0V
VCC = 2.0V to 2.7V
VCC = 2.7V to 3.6V
500
200
100 ns/V
NOTE:
1. The LV is guaranteed to function down to VCC = 1.0V (input levels GND or VCC); DC characteristics are guaranteed from VCC = 1.2V to VCC = 3.6V.
ABSOLUTE MAXIMUM RATINGS1, 2
In accordance with the Absolute Maximum Rating System (IEC 134).
Voltages are referenced to GND (ground = 0V).
SYMBOL PARAMETER CONDITIONS RATING UNIT
VCC DC supply voltage –0.5 to +4.6 V
±IIK DC input diode current VI < –0.5 or VI > VCC + 0.5V 20 mA
±IOK DC output diode current VO < –0.5 or VO > VCC + 0.5V 50 mA
±IODC output source or sink current
– bus driver outputs –0.5V < VO < VCC + 0.5V 35 mA
±IGND,
±ICC
DC VCC or GND current for types with
–bus driver outputs 70 mA
Tstg Storage temperature range –65 to +150 °C
Power dissipation per package for temperature range: –40 to +125°C
Ptt
–plastic DIL above +70°C derate linearly with 12mW/K 750
mW
P
tot –plastic mini-pack (SO) above +70°C derate linearly with 8 mW/K 500
mW
–plastic shrink mini-pack (SSOP and TSSOP) above +60°C derate linearly with 5.5 mW/K 400
NOTES:
1. Stresses beyond those listed may cause permanent damage to the device. These are stress ratings only and functional operation of the
device at these or any other conditions beyond those indicated under “recommended operating conditions” is not implied. Exposure to
absolute-maximum-rated conditions for extended periods may affect device reliability.
2. The input and output voltage ratings may be exceeded if the input and output current ratings are observed.
Philips Semiconductors Product specification
74LV541Octal buffer/line driver (3-State)
1998 Jun 10 5
DC CHARACTERISTICS FOR THE LV FAMILY
Over recommended operating conditions. Voltages are referenced to GND (ground = 0V). LIMITS
SYMBOL PARAMETER TEST CONDITIONS -40°C to +85°C -40°C to +125°CUNIT
MIN TYP1MAX MIN MAX
HIGH l l I t
VCC = 1.2V 0.9 0.9
VIH HIGH level Input
voltage
VCC = 2.0V 1.4 1.4 V
voltage
VCC = 2.7 to 3.6V 2.0 2.0
LOW l l I t
VCC = 1.2V 0.3 0.3
VIL LOW level Input
voltage
VCC = 2.0V 0.6 0.6 V
voltage
VCC = 2.7 to 3.6V 0.8 0.8
VCC = 1.2V ; V I = VIH or VIL; –IO = 100µA 1.2
HIGH level output VCC = 2.0V ; V I = VIH or VIL; –IO = 100µA 1.8 2.0 1.8
V
voltage; all outputs VCC = 2.7V ; V I = VIH or VIL; –IO = 100µA 2.5 2.7 2.5
V
VOH VCC = 3.0V ; V I = VIH or VIL; –IO = 100µA 2.8 3.0 2.8 V
HIGH level output
voltage; BUS driver
outputs VCC = 3.0V ; V I = VIH or VIL; –IO = 8mA 2.40 2.82 2.20
VCC = 1.2V ; V I = VIH or VIL; IO = 100µA 0
LOW level output VCC = 2.0V ; V I = VIH or VIL; IO = 100µA 0 0.2 0.2
V
voltage; all outputs VCC = 2.7V ; V I = VIH or VIL; IO = 100µA 0 0.2 0.2
V
VOL VCC = 3.0V ; V I = VIH or VIL; IO = 100µA 0 0.2 0.2 V
LOW level output
voltage; BUS driver
outputs VCC = 3.0V ; V I = VIH or VIL; IO = 8mA 0.20 0.40 0.50
IIInput leakage
current VCC = 3.6V ; V I = VCC or GND 1.0 1.0 µA
IOZ 3-State output
OFF-state current VCC = 3.6V; VI = VIH or VIL;
VO = VCC or GND 5 10 µA
ICC Quiescent supply
current; MSI VCC = 3.6V ; V I = VCC or GND; IO = 0 20.0 160 µA
ICC Additional
quiescent supply
current per input VCC = 2.7V to 3.6V; VI = VCC – 0.6V 500 850 µA
NOTE:
1. All typical values are measured at Tamb = 25°C.
Philips Semiconductors Product specification
74LV541Octal buffer/line driver (3-State)
1998 Jun 10 6
AC CHARACTERISTICS
GND = 0V ; tr = tf 2.5ns; C L = 50pF; RL = 1KW
CONDITION
LIMITS
SYMBOL PARAMETER WAVEFORM
CONDITION
–40 to +85 °C–40 to +125 °CUNIT
VCC(V) MIN TYP1MAX MIN MAX
1.2 60
t/t
Propagation delay
Figure 1
2.0 20 39 46
t
PHL/
t
PLH
gy
An to Yn
Fig
u
re
1
2.7 15 29 34
3.0 to 3.6 11223 27
1.2 100
t/t
3-State output enable time
Figure 2
2.0 34 65 77
t
PZH/
t
PZL OEn to Yn
Fig
u
re
2
2.7 25 48 56
3.0 to 3.6 19238 45
1.2 100
t/t
3-State output disable time
Figure 2
2.0 36 66 78
t
PHZ/
t
PLZ OEn to Yn
Fig
u
re
2
2.7 27 48 58
3.0 to 3.6 21239 47
NOTES:
1. Unless otherwise stated, all typical values are at Tamb = 25°C.
2. Typical value measured at VCC = 3.3V.
AC WAVEFORMS
VM = 1.5V at VCC 2.7V
VM = 0.5 * VCC at VCC 2.7V
VOL and VOH are the typical output voltage drop that occur with the
output load.
VX = VOL + 0.3V at VCC 2.7V
VX = VOL + 0.1VCC at VCC < 2.7V
VY = VOH – 0.3V at VCC 2.7V
VY = VOH – 0.1 VCC at VCC < 2.7V
SV00684
VM
An INPUT
Yn OUTPUT VM
tPLH
tPHL
GND
VOL
V1
VOH
Figure 1. Input (An) to output (Yn) propagation delays
SV00685
outputs
disabled outputs
enabled
outputs
enabled
tPHZ tPZH
tPZL
tPLZ
OUTPUT
HIGH-to-OFF
OFF–to-HIGH
OUTPUT
LOW-to-OFF
OFF-to-LOW
VM
VM
OEn INPUT
VX
VOL
VOH VY
GND
GND
VCC
VI
VM
Figure 2. 3-State enable and disable times
Philips Semiconductors Product specification
74LV541Octal buffer/line driver (3-State)
1998 Jun 10 7
TEST CIRCUIT
SWITCH POSITION
PULSE
GENERATOR
RT
VID.U.T.
VO
CL
VCC
RL = 1k
Test Circuit for switching times
Open
GND
S1
DEFINITIONS
VCC VI
< 2.7V VCC
TEST S1
tPLH/tPHL Open
RL = Load resistor
CL = Load capacitance includes jig and probe capacitance
RT = Termination resistance should be equal to ZOUT of pulse generators.
2 VCC
tPLZ/tPZL 2.7V2.7–3.6V
tPHZ/tPZH GND
50pF
SV00895
RL = 1k
2 * VCC
Figure 3. Load circuitry for switching times
Philips Semiconductors Product specification
74LV541Octal buffer/line driver (3-State)
1998 Jun 10 8
DIP20: plastic dual in-line package; 20 leads (300 mil) SOT146-1
Philips Semiconductors Product specification
74LV541Octal buffer/line driver (3-State)
1998 Jun 10 9
SO20: plastic small outline package; 20 leads; body width 7.5 mm SOT163-1
Philips Semiconductors Product specification
74LV541Octal buffer/line driver (3-State)
1998 Jun 10 10
SSOP20: plastic shrink small outline package; 20 leads; body width 5.3 mm SOT339-1
Philips Semiconductors Product specification
74LV541Octal buffer/line driver (3-State)
1998 Jun 10 11
TSSOP20: plastic thin shrink small outline package; 20 leads; body width 4.4 mm SOT360-1
Philips Semiconductors Product specification
74LV541Octal buffer/line driver (3-State)
1998 Jun 10 12
Philips Semiconductors and Philips Electronics North America Corporation reserve the right to make changes, without notice, in the products,
including circuits, standard cells, and/or software, described or contained herein in order to improve design and/or performance. Philips
Semiconductors assumes no responsibility or liability for the use of any of these products, conveys no license or title under any patent, copyright,
or mask work right to these products, and makes no representations or warranties that these products are free from patent, copyright, or mask
work right infringement, unless otherwise specified. Applications that are described herein for any of these products are for illustrative purposes
only. Philips Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing
or modification.
LIFE SUPPORT APPLICATIONS
Philips Semiconductors and Philips Electronics North America Corporation Products are not designed for use in life support appl iances, devices,
or systems where malfunction of a Philips Semiconductors and Philips Electronics North America Corporation Product can reasonably be expected
to result in a personal injury. Philips Semiconductors and Philips Electronics North America Corporation customers using or selling Philips
Semiconductors and Philips Electronics North America Corporation Products for use in such applications do so at their own risk and agree to fully
indemnify Philips Semiconductors and Philips Electronics North America Corporation for any damages resulting from such improper use or sale.
This data sheet contains preliminary data, and supplementary data will be published at a later date. Philips
Semiconductors reserves the right to make changes at any time without notice in order to improve design
and supply the best possible product.
Philips Semiconductors
811 East Arques Avenue
P.O. Box 3409
Sunnyvale, California 94088–3409
Telephone 800-234-7381
DEFINITIONS
Data Sheet Identification Product Status Definition
Objective Specification
Preliminary Specification
Product Specification
Formative or in Design
Preproduction Product
Full Production
This data sheet contains the design target or goal specifications for product development. Specifications
may change in any manner without notice.
This data sheet contains Final Specifications. Philips Semiconductors reserves the right to make changes
at any time without notice, in order to improve design and supply the best possible product.
Copyright Philips Electronics North America Corporation 1998
All rights reserved. Printed in U.S.A.
print code Date of release: 05-96
Document order number: 9397-750-04452
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