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007-01 / 20090910 / e9421_mza1210.fm
• All specifications are subject to change without notice.
Chip Beads(SMD Array)
For General Signal Line
MZA Series MZA1210 Type
FEATURES
• A single MZA series chip provides noise attenuation for two
lines, making it ideal for use with I/O lines of various highly
miniaturized.
• Electronic equipment, such as portable products, which
comprise high density circuitry.
• Low crosstalk between adjacent circuits.
• Internal electrodes feature low DC resistance, minimizing
wasteful power consumption.
• Electroplated terminal electrodes accommodate reflow
soldering.
• Monolithic structure ensures high reliability.
• The products contain no lead and also support lead-free
soldering.
• It is a product conforming to RoHS directive.
APPLICATIONS
Removal of signal line noises of cellular phones, PCs, note PCs,
TVs, DVDs, DSCs, game machines, digital photo frames, PNDs,
etc.
PRODUCT IDENTIFICATION
(1) Series name
(2) Dimensions L×W
(3) Material code
(4) Nominal impedance
121:120Ω at 100MHz
(5) Characteristic type
(6) Packaging style
T:Taping
HANDLING AND PRECAUTIONS
• Before soldering, be sure to preheat components. The preheat-
ing temperature should be set so that the temperature difference
between the solder temperature and product temperature does
not exceed 150°C.
• After mounting components onto the printed circuit board, do not
apply stress through board bending or mishandling.
• Do not expose the inductors to stray magnetic fields.
• Avoid static electricity discharge during handling.
• When hand soldering, apply the soldering iron to the printed cir-
cuit board only. Temperature of the iron tip should not exceed
350°C. Soldering time should not exceed 3 seconds.
• This product does not apply to flow soldering construction
method.
SHAPES AND DIMENSIONS/RECOMMENDED PC BOARD
PATTERN
CIRCUIT DIAGRAM
TEMPERATURE RANGES
PACKAGING STYLE AND QUANTITIES
RECOMMENDED SOLDERING CONDITION
REFLOW SOLDERING
Conformity to RoHS Directive
MZA 1210 D 121 C T
(1) (2) (3) (4) (5) (6) Operating/storage –55 to +125°C
Packaging style Quantity
Taping 5000 pieces/reel
1.25±0.15
0.20±0.15
1.00±0.15
0.50±0.10
0.65±0.10
Weight: 3mg
Dimensions in mm
0.35±0.15 0.35±0.15
0.5
0.5
0.4
0.3
• No polarity
Natural
cooling
10s max.
Preheating
60 to 120s
Soldering
30 to 60s
230˚C
250 to 260˚C
180˚C
150˚C
Time(s)
• Please contact our Sales office when your application are considered the following:
The device’s failure or malfunction may directly endanger human life (e.g. application for automobile/aircraft/medical/nuclear power devices, etc.)
• Conformity to RoHS Directive: This means that, in conformity with EU Directive 2002/95/EC, lead, cadmium, mercury, hexavalent chromium, and specific
bromine-based flame retardants, PBB and PBDE, have not been used, except for exempted applications.
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007-01 / 20090910 / e9421_mza1210.fm
• All specifications are subject to change without notice.
ELECTRICAL CHARACTERISTICS
∗Test equipment: E4991A or equivalent
Test tool: 16192A or equivalent
Test temperature: 25±10°C
TYPICAL ELECTRICAL CHARACTERISTICS
Z, X, R vs. FREQUENCY CHARACTERISTICS
MZA1210D330C MZA1210D680C MZA1210D121C
MZA1210D241C
PACKAGING STYLES
REEL DIMENSIONS TAPE DIMENSIONS
Part No. Impedance(Ω)
±25%[100MHz]∗
DC resistance
(Ω)max.
Rated current
(mA)max.
Rated voltage
(V)max.
MZA1210D330C 33 0.3 50 5
MZA1210D680C 68 0.5 50 5
MZA1210D121C 120 0.8 50 5
MZA1210D241C 240 1.2 50 5
500
400
300
200
100
01 10 100 1000 10000
Frequency(MHz)
Impedance(Ω)
Z
X
R
500
400
300
200
100
01 10 100 1000 10000
Frequency(MHz)
Impedance(Ω)
Z
X
R
1000
800
600
400
200
01 10 100 1000 10000
Frequency(MHz)
Impedance(Ω)
Z
X
R
1600
1200
800
400
01 10 100 1000 10000
Frequency(MHz)
Impedance(Ω)
Z
X
R
1.0
ø180±2.0
2.0±0.5
ø13±0.2
ø21±0.8
ø60min.
14.4max.
Dimensions in mm
8.4 +2.0
–0.0
8.0±0.3 3.5±0.05
1.75±0.1
4.0±0.1 4.0±0.1
2.0±0.05
1.5 +0.1
–0.0
Sprocket hole Cavity
1.45±0.2
0.8max. 1.2±0.2
160min. Taping 200min.
300min.
Drawing direction
Dimensions in mm
