(1/2) Chip Beads(SMD Array) For General Signal Line Conformity to RoHS Directive MZA Series MZA1210 Type SHAPES AND DIMENSIONS/RECOMMENDED PC BOARD PATTERN 1.250.15 0.5 1.000.15 0.5 0.4 0.350.15 0.350.15 0.500.10 0.200.15 FEATURES * A single MZA series chip provides noise attenuation for two lines, making it ideal for use with I/O lines of various highly miniaturized. * Electronic equipment, such as portable products, which comprise high density circuitry. * Low crosstalk between adjacent circuits. * Internal electrodes feature low DC resistance, minimizing wasteful power consumption. * Electroplated terminal electrodes accommodate reflow soldering. * Monolithic structure ensures high reliability. * The products contain no lead and also support lead-free soldering. * It is a product conforming to RoHS directive. 0.650.10 0.3 Weight: 3mg Dimensions in mm CIRCUIT DIAGRAM APPLICATIONS Removal of signal line noises of cellular phones, PCs, note PCs, TVs, DVDs, DSCs, game machines, digital photo frames, PNDs, etc. PRODUCT IDENTIFICATION MZA 1210 D 121 C T (1) (2) (3) (4) (5) (6) (1) Series name (2) Dimensions Lx W (3) Material code (4) Nominal impedance 121:120 at 100MHz (5) Characteristic type (6) Packaging style T:Taping * No polarity TEMPERATURE RANGES Operating/storage -55 to +125C PACKAGING STYLE AND QUANTITIES Packaging style Taping Quantity 5000 pieces/reel RECOMMENDED SOLDERING CONDITION REFLOW SOLDERING 10s max. HANDLING AND PRECAUTIONS * Before soldering, be sure to preheat components. The preheating temperature should be set so that the temperature difference between the solder temperature and product temperature does not exceed 150C. * After mounting components onto the printed circuit board, do not apply stress through board bending or mishandling. * Do not expose the inductors to stray magnetic fields. * Avoid static electricity discharge during handling. * When hand soldering, apply the soldering iron to the printed circuit board only. Temperature of the iron tip should not exceed 350C. Soldering time should not exceed 3 seconds. * This product does not apply to flow soldering construction method. 250 to 260C Natural cooling 230C 180C 150C Preheating 60 to 120s Soldering 30 to 60s Time(s) * Conformity to RoHS Directive: This means that, in conformity with EU Directive 2002/95/EC, lead, cadmium, mercury, hexavalent chromium, and specific bromine-based flame retardants, PBB and PBDE, have not been used, except for exempted applications. * Please contact our Sales office when your application are considered the following: The device's failure or malfunction may directly endanger human life (e.g. application for automobile/aircraft/medical/nuclear power devices, etc.) * All specifications are subject to change without notice. 007-01 / 20090910 / e9421_mza1210.fm (2/2) ELECTRICAL CHARACTERISTICS Impedance() 25%[100MHz] 33 68 120 240 Part No. MZA1210D330C MZA1210D680C MZA1210D121C MZA1210D241C Rated current (mA)max. 50 50 50 50 DC resistance ()max. 0.3 0.5 0.8 1.2 Rated voltage (V)max. 5 5 5 5 Test equipment: E4991A or equivalent Test tool: 16192A or equivalent Test temperature: 2510C MZA1210D121C 1000 400 400 800 300 200 Z R Z 300 R 200 X 100 100 Impedance() 500 500 Impedance() Impedance() TYPICAL ELECTRICAL CHARACTERISTICS Z, X, R vs. FREQUENCY CHARACTERISTICS MZA1210D330C MZA1210D680C 600 Z R 400 X 200 X 0 1 10 100 1000 Frequency (MHz) 0 10000 1 10 100 1000 Frequency (MHz) 0 10000 1 10 100 1000 Frequency (MHz) 10000 MZA1210D241C 1600 Impedance() 1200 Z R 800 X 400 10 100 1000 Frequency (MHz) 10000 PACKAGING STYLES REEL DIMENSIONS TAPE DIMENSIONS Sprocket hole 1.5 +0.1 -0.0 Cavity 0.8max. 1.20.2 4.00.1 4.00.1 2.00.05 2.00.5 8.4 +2.0 -0.0 o130.2 14.4max. 160min. Taping 1.450.2 o60min. 8.00.3 1.0 3.50.05 1 1.750.1 0 200min. o210.8 o1802.0 Dimensions in mm Drawing direction 300min. Dimensions in mm * All specifications are subject to change without notice. 007-01 / 20090910 / e9421_mza1210.fm