–1– ACCTB71E 201409-T
ORDERING INFORMATION
For board-to-FPC
B01
Stacking Connector
for High Current
FEATURES
1. High current rating: 6.0 A (3.0 A/pin
× 2 pin)
2. Miniature and low space
requirement
3. High removal force
4. Helps make mobile devices thinner
thanks to its low profile height of
0.6 mm.
APPLICATIONS
Battery section of miniature mobile
devices such as smartphones,
wearable terminals and tablet PCs
Socket Header
RoHS compliant
6A 6A
3.0A 3.0A
3.0A 3.0A
Socket
Header
1.80mm
3.76mm
4.45mm
2.40mm
New
Function
0: No polarity
3: Socket
4: Header
Stacking height
<Socket>/<Header>
1: 0.6 mm
AXF 5 0 016
Number of contacts (1 digit)
6: 6 contacts (Power contact and signal contact)
Current capacity
5: 3.0 A/Power pin
Stacking connector for high current B01
–2– ACCTB71E 201409-T
PRODUCT TYPES
Notes: 1. Order unit:
For volume production: 1-inner carton (1-reel) units
Samples for mounting check: 50-connector units. Please contact our sales office.
Samples: Small lot orders are possible. Please contact our sales office.
2. Please contact us for connectors having a number of pins other than those listed above.
SPECIFICATIONS
1. Characteristics
2. Material and surface treatment
Stacking height Number of contacts Part number Packing
Socket Header Inner carton (1-reel) Outer carton
0.6mm 6 AXF361500 AXF461500 15,000 pieces 30,000 pieces
Item Specifications Conditions
Electrical
characteristics
Rated current 3.0 A/pin (Power contact)
0.3 A/pin (Signal contact)
Rated voltage 30V AC/DC
Insulation resistance Min. 1,000MΩ (Initial stage) Using 250V DC megger (applied for 1 minute)
Breakdown voltage 150V AC for 1 minute No short-circuiting or damage at a detection current of 1 mA
when the specified voltage is applied for one minute.
Contact resistance Power contact: Max. 20mΩ
Signal contact: Max. 90mΩ
According to the contact resistance measurement method of
JIS C 5402
Mechanical
characteristics
Composite insertion force Max. 40 N
Composite removal force Min. 10 N (Initial stage)
Environmental
characteristics
Ambient temperature –55°C to +85°C No freezing at low temperatures or condensation
Storage temperature –55°C to +85°C (Products only)
–40°C to +50°C (Packaging structure) No freezing at low temperatures or condensation
Thermal shock resistance
(Header and socket mated)
After 5 cycles
Insulation resistance: Min. 100MΩ,
Contact resistance
Power contact: Max. 20mΩ
Signal contact: Max. 90mΩ
Conformed to MIL-STD-202F, method 107G
Humidity resistance
(Header and socket mated)
After 120 hours
Insulation resistance: Min. 100MΩ,
Contact resistance
Power contact: Max. 20mΩ
Signal contact: Max. 90mΩ
Conformed to MIL-STD-1344A, method 1002
Bath temperature 40±2°C,
Humidity 90 to 95% R.H.
Salt water spray resistance
(Header and socket mated)
After 24 hours
Insulation resistance: Min. 100MΩ,
Contact resistance
Power contact: Max. 20mΩ
Signal contact: Max. 90mΩ
Conformed to MIL-STD-1344A, method 1001
Bath temperature 35±2°C,
Salt water concentration 5±1%
H2S resistance
(Header and socket mated)
After 48 hours
Contact resistance
Power contact: Max. 20mΩ
Signal contact: Max. 90mΩ
Conformed to JEIDA-38-1984
Bath temperature 40±2°C, Gas concentration 3±1 ppm,
Humidity 75 to 80% R.H.
Life characteristics Insertion and removal life
with no load
30 times
• Contact resistance
Power contact: Max. 20mΩ
Signal contact: Max. 90mΩ
• Composite removal force: Min. 7 N
Repeated insertion and removal cycles of max. 200 times/
hour
Soldering heat resistance The initial specification must be satisfied electrically
and mechanically
Max. peak temperature of 260°C
Infrared reflow soldering (PC board surface temperature
near connector terminals)
Soldering iron
300°C within 5 sec.
350°C within 3 sec.
Unit weight 6 pins Socket h = 0.6 mm: 0.010 g
6 pins Header h = 0.6 mm: 0.004 g
Part name Material Surface treatment
Molded portion Heat resistant plastic (LCP resin)
(UL94V-0) —
Contact and Post Copper alloy
Contact portion (Main): Au plating (Min. 0.1μm) over nickel
Contact portion (Sub): Au plating (Min. 0. 05μm) over nickel
Terminal portion: Au plating over nickel (except for top of the terminal)
Soldering terminals (Socket): Pd + Au flash plating over nickel (except for top of the terminal)
Soldering terminals (Header): Au plating over nickel (except for top of the terminal)
Order Temperature (°C) Time (minutes)
1
2
3
4
–55
85
–55
0
−330
Max. 5
30
Max. 5
+3
0
0
−3
Stacking connector for high current B01
–3– ACCTB71E 201409-T
DIMENSIONS (Unit: mm)
Socket (Mated height: 0.6 mm)
Header (Mated height: 0.6 mm)
Socket and Header are mated
The CAD data of the products with a CAD Data mark can be downloaded from: http://industrial.panasonic.com/ac/e/
0.08
0.50 (Suction face)
2.40
0.86
The degree of terminal flat
(Contact and soldering terminals)
Y (Note 1)
Z (Note 1)
Signal contact (2 pins)
Power contact (4 pins)
0.18±0.03
0.20±0.03
3.12±0.1
C±0.1
0.58±0.03
0.14±0.03
0.59
2.16
B±0.1
A
General tolerance: ±0.2
Note: 1. Because the soldering terminal Y and Z are the unified structure, they are connected electrically.
Dimension table (mm)
Number of pins/
dimension A B C
6 4.45 1.60 3.85
CAD Data
0.08
1.51
(0.34)
0.88
The degree of terminal flat
(Post and soldering terminals)
Signal contact (2 pins)
Power contact (4 pins)
(Soldering
terminal)
C±0.1
0.20±0.03
0.70±0.03
0.14±0.03
B±0.1
A
0.47
0.70 (Suction face)
General tolerance: ±0.2
Dimension table (mm)
Number of pins/
dimension A B C
6 3.76 1.60 3.26
CAD Data
Socket
Header
0.60±0.1
Stacking connector for high current B01
–4– ACCTB71E 201409-T
EMBOSSED TAPE DIMENSIONS (Unit: mm)
• Dimension table (Unit: mm)
• Connector orientation with respect to embossed tape feeding direction
Type/Mated height Number of pins Type of taping A B C Quantity per reel
Common for socket and headers
0.6mm 6 Tape I 16.0 7.5 17.4 15,000
• Specifications for taping
(In accordance with JIS C 0806-3:1999. However, not applied to
the mounting-hole pitch of some connectors.)
• Specifications for the plastic reel
(In accordance with EIAJ ET-7200B.)
(A )
+0.3
−0.1
1.5 dia.
+0.1
0
Leading direction after packaging
4.0
(B)
(1.75)
(4.0)(2.0)
Tape I
Top cover tape
Embossed carrier tape
Embossed mounting-hole
Taping reel
(C±1)
380 dia.
Label
Type
Direction
of tape progress
Common for B01
Socket Header
Note: There is no indication on this product regarding top-bottom or left-right orientation.
Stacking connector for high current B01
–5– ACCTB71E 201409-T
NOTES
1. Design of PC board patterns
Conduct the recommended foot pattern design, in order to
preserve the mechanical strength of terminal solder areas.
2. Recommended PC board and metal mask patterns
Connectors are mounted with high pitch density, intervals of 0.35
mm, 0.4 mm or 0.5 mm.
In order to reduce solder and flux rise, solder bridges and other
issues make sure the proper levels of solder is used.
The figures to the right are recommended metal mask patterns.
Please use them as a reference.
• Socket (Mated height: 0.6 mm)
Recommended PC board pattern (TOP VIEW)
Recommended metal mask pattern
Metal mask thickness: When 100μm
(Power contact opening ratio: 88%)
(Signal contact opening ratio: 83%)
(Metal-part opening ratio: 100%)
• Header (Mated height: 0.6 mm)
Recommended PC board pattern (TOP VIEW)
Recommended metal mask pattern
Metal mask thickness: When 100μm
(Power contact opening ratio: 73%)
(Signal contact opening ratio: 75%)
(Metal-part opening ratio: 100%)
: Insulation area
2.80±0.03
1.70±0.03
0.20±0.03
0.22±0.03
0.66±0.03
3.56±0.03
1.60±0.03
0.70±0.03
2.80±0.03
1.70±0.03
0.20±0.03
2.80±0.03
1.80±0.03
1.80±0.03
0.20±0.03
0.64±0.03
3.56±0.03
1.60±0.03
0.70±0.03
2.80±0.03
1.70±0.03
Please refer to the latest product
specifications when designing your
product.
: Insulation area
3.30±0.03
1.60±0.03
0.22±0.03
0.78±0.030.32±0.03
2.20±0.03
1.08±0.03
0.80±0.03
1.71±0.03
0.74±0.03
3.30±0.03
1.60±0.03
0.20±0.03
0.76±0.03
2.20±0.03
1.36±0.03
1.28±0.03
1.71±0.03
0.74±0.03
0.32±0.03
Notes on Using Narrow pitch Connectors/Stacking Connectors for High Current
–6– ACCTB48E 201409-T
Regarding the design of devices and PC board patterns
Regarding the selection of the connector placement machine and the mounting
procedures
Notes on Using Narrow pitch Connectors/
Stacking Connectors for High Current
1) When connecting several connectors
together by stacking, make sure to
maintain proper accuracy in the design of
structure and mounting equipment so
that the connectors are not subjected to
twisting and torsional forces.
2) With mounting equipment, there may
be up to a ±0.2 to 0.3-mm error in
positioning. Be sure to design PC boards
and patterns while taking into
consideration the performance and
abilities of the required equipment.
3) Some connectors have tabs embossed
on the body to aid in positioning. When
using these connectors, make sure that
the PC board is designed with positioning
holes to match these tabs.
4) To ensure the required mechanical
strength when soldering the connector
terminals, make sure the PC board
meets recommended PC board pattern
design dimensions given.
5) For all connectors of the narrow pitch
series, to prevent the PC board from
coming off during vibrations or impacts,
and to prevent loads from falling directly
on the soldered portions, be sure to
design some means to fix the PC board
in place.
Example) Secure in place with screws
When connecting PC boards, take
appropriate measures to prevent the
connector from coming off.
6) Notes when using a FPC.
(1) When the connector is soldered to an
FPC board, during its insertion and
removal procedures, forces may be
applied to the terminals and cause the
soldering to come off. It is recommended
to use a reinforcement board on the
backside of the FPC board to which the
connector is being connected. Please
make the reinforcement board
dimensions bigger than the outer limits of
the recommended PC board pattern
(should be approximately 1 mm greater
than the outer limit).
Material should be glass epoxy or
polyimide, and the thickness should be
between 0.2 and 0.3 mm.
(2) Collisions, impacts, or turning of FPC
boards, may apply forces on the
connector and cause it to come loose.
Therefore, make to design retaining
plates or screws that will fix the connector
in place.
7) The narrow pitch connector series is
designed to be compact and thin.
Although ease of handling has been
taken into account, take care when
mating the connectors, as displacement
or angled mating could damage or
deform the connector.
Connector
Spacer
Spacer PC board
Screw
1) Select the placement machine taking
into consideration the connector height,
required positioning accuracy, and
packaging conditions.
2) Be aware that if the catching force of
the placement machine is too great, it
may deform the shape of the connector
body or connector terminals.
3) Be aware that during mounting,
external forces may be applied to the
connector contact surfaces and terminals
and cause deformations.
4) Depending on the size of the
connector being used, self alignment
may not be possible. In such cases, be
sure to carefully position the terminal with
the PC board pattern.
5) The positioning bosses give an
approximate alignment for positioning on
the PC board. For accurate positioning of
the connector when mounting it to the PC
board, we recommend using an
automatic positioning machine.
6) Excessive mounter chucking force may
deform the molded or metal part of the
connector. Consult us in advance if
chucking is to be applied.
Notes on Using Narrow pitch Connectors/Stacking Connectors for High Current
–7– ACCTB48E 201409-T
Regarding soldering
1. Reflow soldering
1) Measure the recommended profile
temperature for reflow soldering by
placing a sensor on the PC board near
the connector surface or terminals. (The
setting for the sensor will differ depending
on the sensor used, so be sure to
carefully read the instructions that comes
with it.)
2) As for cream solder printing, screen
printing is recommended.
3) To determine the relationship between
the screen opening area and the PC-
board foot pattern area, refer to the
diagrams in the recommended patterns
for PC boards and metal masks. Make
sure to use the terminal tip as a reference
position when setting. Avoid an excessive
amount of solder from being applied,
otherwise, interference by the solder will
cause an imperfect contact.
4) Consult us when using a screen-
printing thickness other than that
recommended.
5) When mounting on both sides of the
PC board and the connector is mounting
on the underside, use adhesives or other
means to ensure the connector is
properly fixed to the PC board. (Double
reflow soldering on the same side is
possible.)
6) N2 reflow, conducting reflow soldering
in a nitrogen atmosphere, increases the
solder flow too greatly, enabling wicking
to occur. Make sure that the solder feed
rate and temperature profile are
appropriate.
Soldering conditions
Please use the reflow temperature profile
conditions recommended below for
reflow soldering. Please contact us
before using a temperature profile other
than that described below (e.g. lead-free
solder).
• Narrow pitch connectors
(except P8 type)
• Narrow pitch connector (P8)
For products other than the ones above,
please refer to the latest product
specifications.
7) The temperatures are measured at the
surface of the PC board near the
connector terminals. (The setting for the
sensor will differ depending on the sensor
used, so be sure to carefully read the
instructions that comes with it.)
8) The temperature profiles given in this
catalog are values measured when using
the connector on a resin-based PC
board. When performed reflow soldering
on a metal board (iron, aluminum, etc.) or
a metal table to mount on a FPC, make
sure there is no deformation or
discoloration of the connector beforehand
and then begin mounting.
9) Consult us when using a screen-
printing thickness other than that
recommended.
10) Some solder and flux types may
cause serious solder or flux creeping.
Solder and flux characteristics should be
taken into consideration when setting the
reflow soldering conditions.
2. Hand soldering
1) Set the soldering iron so that the tip
temperature is less than that given in the
table below.
Table A
2) Do not allow flux to spread onto the
connector leads or PC board. This may
lead to flux rising up to the connector
inside.
3) Touch the soldering iron to the foot
pattern. After the foot pattern and
connector terminal are heated, apply the
solder wire so it melts at the end of the
connector terminals.
4) Be aware that soldering while applying
a load on the connector terminals may
cause improper operation of the
connector.
5) Thoroughly clean the soldering iron.
6) Flux from the solder wire may get on
the contact surfaces during soldering
operations. After soldering, carefully
check the contact surfaces and clean off
any solder before use.
7) For soldering of prototype devices
during product development, you can
perform soldering at the necessary
locations by heating with a hot-air gun by
applying cream solder to the foot pattern
beforehand. However, at this time, make
sure that the air pressure does not move
connectors by carefully holding them
down with tweezers or other similar tool.
Also, be careful not to go too close to the
connectors and melt any of the molded
components.
8) If an excessive amount of solder is
applied during manual soldering, the
solder may creep up near the contact
points, or solder interference may cause
imperfect contact.
3. Solder reworking
1) Finish reworking in one operation.
2) For reworking of the solder bridge, use
a soldering iron with a flat tip. To prevent
flux from climbing up to the contact
surfaces, do not add more flux.
3) Keep the soldering iron tip temperature
below the temperature given in Table A.
Terminal Paste
solder
PC board
foot pattern
60 to 120 sec.
Preheating
Peak temperature
200°C
220°C
Upper limited (Solder heat resistance)
Peak temperature 260°C
230°C
180°C
150°C
70 sec.
25 sec.
Lower limited (Solder wettability)
Time
Temperature
60 to 120 sec.
Preheating
Time
Temperature
Peak temperature
200°C
155 to 165°C
245°C max.
Within 30 sec.
Product name Soldering iron temperature
SMD type connectors 300°C within 5 sec.
350°C within 3 sec.
Apply the solder
wire here
Terminal
Pattern
PC board
Small angle as
possible up to
45 degrees
Soldering
iron
Notes on Using Narrow pitch Connectors/Stacking Connectors for High Current
–8– ACCTB48E 201409-T
Handling Single Components
Storage of connectors
Other Notes
1) Make sure not to drop or allow parts to
fall from work bench
2) Excessive force applied to the
terminals could cause warping, come
out, or weaken the adhesive strength of
the solder. Handle with care.
3) Repeated bending of the terminals
may cause terminals to break.
4) Do not insert or remove the connector
when it is not soldered. Forcibly applied
external pressure on the terminals can
weaken the adherence of the terminals to
the molded part or cause the terminals to
lose their evenness.
5) Excessive prying-force applied to one
end may cause product breakage and
separation of the solder joints at the
terminal.
Excessive force applied for insertion in a
pivot action as shown may also cause
product breakage.
Align the header and socket positions
before connecting them.
Cleaning flux from PC board
1) To increase the cleanliness of the
cleaning fluid and cleaning operations,
prepare equipment for cleaning process
beginning with boil cleaning, ultrasonic
cleaning, and then vapor cleaning.
2) Carefully oversee the cleanliness of
the cleaning fluids to make sure that the
contact surfaces do not become dirty
from the cleaning fluid itself.
3) Since some powerful cleaning
solutions may dissolve molded
components of the connector and wipe
off or discolor printed letters, we
recommend aqua pura electronic parts
cleaners. Please consult us if you wish to
use other types of cleaning fluids.
4) Please note that the surfaces of
molded parts may whiten when cleaned
with alcohol.
Handling the PC board
• Handling the PC board after
mounting the connector
When cutting or bending the PC board
after mounting the connector, be careful
that the soldered sections are subjected
to excessive force.
The soldered areas should not be subjected to force.
1) To prevent problems from voids or air
pockets due to heat of reflow soldering,
avoid storing the connectors in areas of
high humidity. When storing the
connectors for more than six months, be
sure to consider storage area where the
humidity is properly controlled.
2) Depending on the connector type, the
color of the connector may vary from
connector to connector depending on
when it is produced.
Some connectors may change color
slightly if subjected to ultraviolet rays
during storage. This is normal and will not
affect the operation of the connector.
3) When storing the connectors with the
PC boards assembled and components
alreeady set, be careful not to stack them
up so the connectors are subjected to
excessive forces.
4) Avoid storing the connectors in
locations with excessive dust. The dust
may accumulate and cause improper
connections at the contact surfaces.
1) Do not remove or insert the electrified
connector (in the state of carrying current
or applying voltage).
2) These products are made for the
design of compact and lightweight
devices and therefore the thickness of the
molded components has been made very
thin. Therefore, be careful during
insertion and removal operations for
excessive forces applied may damage
the products.
3) Dropping of the products or rough
mishandling may bend or damage the
terminals and possibly hinder proper
reflow soldering.
4) Before soldering, try not to insert or
remove the connector more than
absolutely necessary.
5) When coating the PC board after
soldering the connector to prevent the
deterioration of insulation, perform the
coating in such a way so that the coating
does not get on the connector.
6) There may be variations in the colors
of products from different production lots.
This is normal.
7) The connectors are not meant to be
used for switching.
8) Be sure not to allow external pressure
to act on connectors when assembling
PCBs or moving in block assemblies.
Notes on Using Narrow pitch Connectors/Stacking Connectors for High Current
–9– ACCTB48E 201409-T
Regarding sample orders to confirm proper mounting
When ordering samples to confirm
proper mounting with the placement
machine, connectors are delivered in 50-
piece units in the condition given right.
Consult a sale representative for ordering
sample units.
Condition when delivered from manufacturing
Required number
of products for
sample production
(Unit 50 pcs.)
Embossed tape
amount required for
the mounting
Reel
(Delivery can also be made on a reel by
customer request.)
Please refer to the latest product
specifications when designing your
product.
Notes on Using Narrow pitch Connectors/Stacking Connectors for High Current
–10– ACCTB48E 201409-T
