RGF1A thru RGF1M
Vishay Semiconductors
for merly General Semiconductor
Document Number 88697 www.vishay.com
08-Feb-02 1
Surface Mount Glass Passivated Junction
Fast Switching Rectifier Rever se V oltage 50 to 1000V
Forward Current 1.0A
Patented*
0.167 (4.24)
0.187 (4.75)
0.0065 (0.17)
0.015 (0.38)
0.030 (0.76)
0.060 (1.52)
0.196 (4.98)
0.226 (5.74)
0.094 (2.39)
0.114 (2.90)
0.100 (2.54)
0.118 (3.00)
0.040 (1.02)
0.066 (1.68)
0.098 (2.49)
0.108 (2.74)
0.006 (0.152) TYP.
DO-214BA (GF1)
Features
• Plastic package has Underwriters Laboratories
Flammability Classification 94V-0
• Ideal for surface mount automotive applications
• High temperature metallurgically bonded construction
• Cavity-free glass passivated junction
•
Capable of meeting environmental standards of MIL-S-19500
• Built-in strain relief • Easy pick and place
• Fast switching for high efficiency
• High temperature soldering guaranteed:
450°C/5 seconds at terminals.
• Complete device submersible temperature of 265°C for
10 seconds in solder bath
Mechanical Data
Case: JEDEC DO-214BA, molded plastic over glass body
Terminals: Solder plated, solderable per MIL-STD-750,
Method 2026
Polarity: Color band denotes cathode end
Mounting Position: Any Weight: 0.0048 oz, 0.12 g
Packaging codes/options:
19/6.5K per 13” Reel (12mm Tape)
17/1.5K per 7” Reel (12mm Tape)
Dimensions in inches and (millimeters)
Glass-plastic encapsulation technique is covered by Patent
No. 3,996,602, brazed-lead assembly by Patent No.
3,930,306 and lead forming by Patent No. 5,151,846
0.094 MAX.
(2.38 MAX.)
0.220
(5.58) REF
0.066 MIN.
(1.68 MIN.)
0.052 MIN.
(1.32 MIN.)
Mounting Pad Layout
Maximum Ratings & Thermal Characteristics Ratings at 25°C ambient temperature unless otherwise specified.
Parameter Symbol RGF1A RGF1B RGF1D RGF1G RGF1J RGF1K RGF1M Unit
Device mar king code RA RB RD RG RJ RK RM
Maximum repetitive peak reverse voltage VRRM 50 100 200 400 600 800 1000 V
Maximum RMS voltage VRMS 35 70 140 280 420 560 700 V
Maximum DC blocking voltage VDC 50 100 200 400 600 800 1000 V
Maximum average forward rectified current at TL= 120°CI
F(AV) 1.0 A
Peak forward surge current 8.3ms single half sine-wave IFSM 30 A
superimposed on rated load (JEDEC Method)
Max. full load reverse current, full cycle average TA= 55°CI
R(AV) 50 µA
Typical ther mal resistance(1) RΘJA 80 °C/W
RΘJL 28
Operating junction and storage temperature range TJ,TSTG –65 to +175 °C
Electrical Characteristics(TJ= 25°C unless otherwise noted)
Parameter Symbol RGF1A RGF1B RGF1D RGF1G RGF1J RGF1K RGF1M Unit
Maximum instantaneous forward voltage at 1.0A VF1.30 V
Maximum DC reverse current TA= 25°C IR5.0 µA
at rated DC blocking voltage TA= 125°C 100
Typical reverse recover y time at trr 150 250 500 ns
IF= 0.5A, IR= 1.0A, Irr = 0.25 A
Typical junction capacitance at 4.0V, 1MHz CJ8.5 pF
Note: (1) Thermal resistance from junction to ambient and from junction to lead, P.C.B. mounted on 0.2 x 0.2”(5.0 x 5.0mm) copper pad areas
®
RGF1A thru RGF1M
Vishay Semiconductors
for merly General Semiconductor
www.vishay.com Document Number 88697
208-Feb-02
Ratings and
Characteristic Curves(TA= 25°C unless otherwise noted)
Lead Temperature (°C)
Fig. 1 – Forward Current
Derating Curve
Average Forward Rectified Current (A)
Fig. 3 – Typical Instantaneous
Forward Characteristics
Instantaneous Forward Voltage (V)
Instantaneous Forward Current (A)
Percent of Rated Peak Reverse Voltage (%)
Instantaneous Reverse Current (µA)
Fig. 4 – Typical Reverse
Characteristics
Fig. 6 – Typical Transient
Thermal Impedance
Number of Cycles at 60 HZ
t, Pulse Duration (sec.)
Fig. 2 – Maximum Non-Repetitive
Peak Forward Surge Current
Peak Forward Surge Current (A)
Reverse Voltage (V)
Junction Capacitance (pF)
Transient Thermal Impedance (°CW)
Fig. 5 – Typical Junction
Capacitance
0.5
100 110 120 130 140 150 160 175
0
1
60 HZ
Resistive or
Inductive Load
P.C.B. Mounted on
0.2 x 0.2" (5.0 x 5.0mm)
Copper Pad Areas
110 100
0
5
10
15
20
25
30
TJ = TJ max.
8.3ms Single Half Sine-Wave
(JEDEC Method)
0.4 0.6 0.8 1.0 1.2 1.4 1.6
0.01
0.1
1
10
TJ = 25°C
Pulse Width = 300µs
1% Duty Cycle
020 40 60 80 100
0.01
0.1
1
10
110 100
1
10
100
TJ = 25°C
f = 1.0MHZ
Vsig = 50mVp-p
0.01 0.1 110 100
0.1
1
10
100
Mounted on
0.2 x 0.2" (5. x 7mm)
Copper Pad Areas
TJ = 25°C
TJ = 100°C
TJ = 125°C
