XC4000XV: Description - Xilinx, Inc.

DS015 (v1.3) October 18, 1999 - Product Speciﬁcation 6-157

XC4000XLA/XV Family Features

Note: XC4000XLA devices are improved versions of

XC4000XL devices. The XC4000XV devices have the

same features as XLA devices, incorporate additional inter-

connect resources and extend gate capacity to 500,000

system gates. The XC4000XV devices require a separate

2.5V power supply for internal logic but maintain 5V I/O

compatibility via a separate 3.3V I/O power supply. For

additional information about the XC4000XLA/XV device

architecture, refer to the XC4000E/X FPGA Series general

and functional descriptions.

• System-featured Field-Programmable Gate Arrays

- Select-RAMTM memory: on-chip ultra-fast RAM with

- Synchronous write option

- Dual-port RAM option

- Flexible function generators and abundant ﬂip-ﬂops

- Dedicated high-speed carry logic

- Internal 3-state bus capability

- Eight global low-skew clock or signal distribution

networks

• Flexible Array Architecture

• Low-power Segmented Routing Architecture

• Systems-oriented Features

- IEEE 1149.1-compatible boundary scan

- Individually programmable output slew rate

- Programmable input pull-up or pull-down resistors

- Unlimited reprogrammability

• Read Back Capability

- Program veriﬁcation and internal node observability

Electrical Features

• XLA Devices Require 3.0 - 3.6 V (VCC)

• XV Devices Require 2.3- 2.7 V (VCCINT)

and 3.0 - 3.6 V (VCCIO)

• 5.0 V TTL compatible I/O

• 3.3 V LVTTL, LVCMOS compliant I/O

• 5.0 V and 3.0 V PCI Compliant I/O

• 12 mA or 24 mA Current Sink Capability

• Safe under All Power-up Sequences

• XLA Consumes 40% Less Power than XL

• XV Consumes 65% Less Power than XL

• Optional Input Clamping to VCC (XLA) or VCCIO (XV)

Additional Features

• Footprint Compatible with XC4000XL FPGAs - Lower

cost with improved performance and lower power

• Advanced Technology — 5 layer metal, 0.25 µm CMOS

process (XV) or 0.35 µm CMOS process (XLA)

• Highest Performance — System erformance beyond

100 MHz

• High Capacity — Up to 500,000 system gates and

270,000 synchronous SRAM bits

• Low Power — 3.3 V/2.5 V technology plus segmented

routing architecture

• Safe and Easy to Use — Interfaces to any combination

of 3.3 V and 5.0 V TTL compatible devices

0XC4000XLA/XV Field Programmable

Gate Arrays

DS015 (v1.3) October 18, 1999 00*

Product Specification

Table 1: XC4000XLA Series Field Programmable Gate Arrays

Device Logic

Cells

Max Logic

Gates

(No RAM)

Max. RAM

Bits

(No Logic)

Typical

Gate Range

(Logic and RAM)* CLB

Matrix Total

CLBs

Number

Flip-Flops Max.

User I/O

Required

Conﬁgur-

ation Bits

XC4013XLA 1,368 13,000 18,432 10,000 - 30,000 24 x 24 576 1,536 192 393,632

XC4020XLA 1,862 20,000 25,088 13,000 - 40,000 28 x 28 784 2,016 224 521,880

XC4028XLA 2,432 28,000 32,768 18,000 - 50,000 32 x 32 1,024 2,560 256 668,184

XC4036XLA 3,078 36,000 41,472 22,000 - 65,000 36 x 36 1,296 3,168 288 832,528

XC4044XLA 3,800 44,000 51,200 27,000 - 80,000 40 x 40 1,600 3,840 320 1,014,928

XC4052XLA 4,598 52,000 61,952 33,000 - 100,000 44 x 44 1,936 4,576 352 1,215,368

XC4062XLA 5,472 62,000 73,728 40,000 - 130,000 48 x 48 2,304 5,376 384 1,433,864

XC4085XLA 7,448 85,000 100,352 55,000 - 180,000 56 x 56 3,136 7,168 448 1,924,992

XC40110XV 9,728 110,000 131,072 75,000 - 235,000 64 x 64 4,096 9,216 448 2,686,136

XC40150XV 12,312 150,000 165,888 100,000 - 300,000 72 x 72 5,184 11,520 448 3,373,448

XC40200XV 16,758 200,000 225,792 130,000 - 400,000 84 x 84 7,056 15,456 448 4,551,056

XC40250XV 20,102 250,000 270,848 180,000 - 500,000 92 x 92 8,464 18,400 448 5,433,888

* Maximum values of gate range assume 20-30% of CLBs used as RAM

XC4000XLA/XV Field Programmable Gate Arrays

6-158 DS015 (v1.3) October 18, 1999 - Product Speciﬁcation

General Description

XC4000 Series high-performance, high-capacity Field Pro-

grammable Gate Arrays (FPGAs) provide the beneﬁts of

custom CMOS VLSI, while avoiding the initial cost, long

development cycle, and inherent risk of a conventional

masked gate array.

The result of ﬁfteen years of FPGA design experience and

feedback from thousands of customers, these FPGAs com-

bine architectural versatility, increased speed, abundant

routing resources, and new, sophisticated software to

achieve fully automated implementation of complex,

high-density, high-performance designs.

Technology Advantage

XC4000XLA/XV FPGAs use 5 layer metal silicon technol-

ogy to improve performance while reducing device cost and

power. In addition, IOB enhancements provide full PCI

compliance and the JTAG functionality is expanded.

Low Power Internal Logic

XC4000XV FPGAs incorporate all the features of the XLA

devices but require a separate 2.5V power supply for inter-

nal logic. I/O pads are still driven from a 3.3V power supply.

The 2.5V logic supply is named VCCINT and the 3.3 V IO

supply is named VCCIO.

The XV devices also incorporate additional routing

resources in the form of 8 octal-length segmented routing

channels vertically and horizontally per row and column.

XLA/XV and XL Family Differences

The XC4000XLA/XV families of FPGAs are logically identi-

cal to XC4000EX and XC4000XL FPGAs, however I/O,

conﬁguration logic, JTAG functionality, and performance

have been enhanced. In addition, they deliver:

•Improved Performance

XLA/XV devices beneﬁt from advance processing

technology and a reduction in interconnect capacitance

which improves performance over XL devices by more

than 30%.

•Lower Power

XLA/XV devices have reduced power requirements

compared to equivalent XL devices.

•Shorter routing delays

The smaller die of XLA/XV devices directly reduces

clock delays and the delay of high-fanout signals. The

reduction in clock delay allows improved pin-to-pin I/O

speciﬁcations.

•Lower Cost

XLA/XV device cost is directly related to the die size

and has been reduced signiﬁcantly from that of

equivalent XL devices.

•Express mode conﬁguration

Express mode conﬁguration is available on the XLA and

XV devices.

IOB Enhancements

•12/24 mA Output Drive

The XLA/XV family of FPGAs allow individual IOBs to

be conﬁgured as high drive outputs. Each output can be

conﬁgured to have 24 mA drive strength as opposed to

the standard default strength of 12 mA.

•VCC Clamping Diode

XLA and XV FPGAs have an optional clamping diode

connected from each output to VCC (VCCIO for XV).

When enabled they clamp ringing transients back to the

3.3V supply rail. This clamping action is required in

3.3V PCI applications. VCC clamping is a global option

affecting all I/O pins. If enabled, TTL I/O compatibility is

maintained, but full 5.0 Volt I/O tolerance is sacriﬁced.

•Enhanced ESD protection

An improved ESD structure allows XV devices to safely

pass the stringent 5V PCI (4.2.1.3) ringing test. This

test applies an 11V pulse to each IOB for 11 ns via a 55

ohm resistor.

•Full 3.3V and 5.0V PCI compliance

The addition of 12/24 mA drive, optional 3.3V clamping

and improved ESD provides full compliance with either

3.3V or 5.0V PCI speciﬁcations.

Figure 1: Cross Section of Xilinx 0.25 micron, 5 layer

metal XC4000XV FPGA. Visible features are ﬁve layers of

metallization, tungsten plug vias and trench isolation. The

small gaps above the lowest layer are 0.25 micron

polysilicon MOSFET gates. The excellent planarity of each

metal layer is due to the use of “chemical-mechanical

polishing” or CMP. In effect, each layer is ground ﬂat before

a new layer is added.

DS015 (v1.3) October 18, 1999 - Product Speciﬁcation 6-159

XC4000XLA/XV Field Programmable Gate Arrays

Three-State Register

XC4000XLA/XV devices incorporate an optional register

controlling the three-state enable in the IOBs.The use of

the three-state control register can signiﬁcantly improve

output enable and disable time.

FastCLK Clock Buffers

The XLA/XV devices incorporate FastCLK clock buffers.

Two FastCLK buffers are available on each of the right and

left edges of the die. Each FastCLK buffer can provide a

fast clock signal (typically < 1.5 ns clock delay) to all the

IOBs within the IOB octant containing the buffer. The Fast-

CLK buffers can be instantiated by use of the BUFFCLK

symbols. (In addition to FastCLK buffers, the Global Early

BUFGE clock buffers #1, #2, #5, and #6 can also provide

fast clock signals (typically < 1.5 ns clock delay) to IOBs on

the top and bottom of the die.

XLA/XV Power Requirements

XC4000XLA devices require 40% less power per CLB than

equivalent XL devices. XC4000XV devices require 42%

less power per CLB than equivalent XLA devices and 65%

less power than XL devices The representative K-Factor for

the following families can be found in Table 2. The K-Factor

predicts device current for typical user designs and is

based on ﬁlling the FPGA with active 16-Bit counters and

measuring the device current at 1 MHz. This technique is

described in XBRF14 “A Simple Method of Estimating

Power in XC4000XL/EX/E FPGAs”. To predict device

power (P) using the K-Factor use the following formula:

P=V*K*N*F; where:

P= Device Power

V= Power supply voltage

K= the Device K-Factor

N = number of active registers

F = Frequency in MHz

XLA/XV Logic Performance

XC4000XLA/XV devices feature 30% faster device speed

than XL devices, and consistent performance is achieved

across all family members. Table 3 illustrates the perfor-

mance of the XLA devices. For details regarding the imple-

mentation of these benchmarks refer to XBRF15 “Speed

Metrics for High Performance FPGAs”.

Table 2: K-Factor and Relative Power.

FPGA Family K-Factor

Power

RelativeTo

Power

RelativeTo

XLA

XC4000XL 28 1.00 1.65

XC4000XLA 17 0.60 1.00

XC4000XV 13 0.35 0.58

Table 3: XLA/XV Estimated Benchmark Performance

Benchmarks Size Maximum

Frequency

Adder 8-Bit 172 MHz

16-Bit 144 MHz

32-Bit 108 MHz

2 Cascaded Adders 16-Bit 94 MHz

4 Cascaded Adders 16-Bit 57 MHz

Cascaded 4LUTs

1 Level 314 MHz

2 Level 193 MHz

4 Level 108 MHz

6 Level 75 MHz

Interconnect

(Manhattan Distance)

1 CLBs 325 MHz

4 CLBs 260 MHz

16 CLBs 185 MHz

64 CLBs 108 MHz

128 CLBs 81 MHz

Dual Port RAM

(Pipelined) 8-Bits by 16 172 MHz

8-Bits by 256 172 MHz

XC4000XLA/XV Field Programmable Gate Arrays

6-160 DS015 (v1.3) October 18, 1999 - Product Speciﬁcation

Using Fast I/O CLKS

There are several issues associated with implementing fast

I/O clocks by using multiple FastCLK and BUFGE clock

buffers for I/O transfers and a BUFGLS clock buffer for

internal logic.

Reduced Clock to Out Period - When transferring data

from a BUFGLS clocked register to an IOB output register

which is clocked with a fast I/O clock, the total amount of

time available for the transfer is reduced.

Using Fast Capture Latch in IOB input - It is necessary to

transfer data captured with the fast I/O clock edge to a

delayed BUFGLS clock without error. The use of the Fast

Capture Latch in the IOBs provides this functionality.

Driving multiple clock inputs - Since each FastCLK input

can only reach one octant of IOBs it will usually be neces-

sary to drive multiple FastCLK and BUFGE input pads with

a copy of the system clock. Xilinx recommends that sys-

tems which use multiple FastCLK and BUFGE input buffers

use a “Zero Delay” clock buffer such as the Cypress

CY2308 to drive up to 8 input pins. These devices contain a

Phase locked loop to eliminate clock delay, and specify less

than 250ps output jitter.

PCB layout - The recommended layout is to place the PLL

underneath the FPGA on the reverse side of the PCB. All 8

clock lines should be of equal length. This arrangement will

allow all the clock line to be less than 2 cm in length which

will generally eliminate the need for clock termination.

Advancing the FPGAs clock - An additional advantage to

using a PLL-equipped clock buffer is that it can advance the

FPGA clocks relative to the system clock by incorporating

additional board delay in the feedback path. Approximately

6 inches of trace length are necessary to delay the signal

by 1 ns.

Advancing the FPGA’s clock directly reduces input hold

requirements and improves clock to out delay. FPGA clocks

should not be advanced more than the guaranteed mini-

mum Output Hold Time (minus any associated clock jitter)

or the outputs may change state before the system clock

edge. For XLA and XV FPGAs the Output Hold Time is

speciﬁed as a minimum Clock to Output Delay in the tables

in the respective family Electrical Speciﬁcation sections.

The maximum recommended clock advance equals this

value minus any clock jitter.

Instantiating I/O elements- Depending on the design

environment, it may be necessary to instantiate the fast I/O

elements. They are found in the libraries as:

•BUFGE (I,O) - The Global Early Buffer

•BUFGLS (I,O)- The Global Low Skew Buffer

•BUFFCLK (I,O) - The FastCLK Buffer

•ILFFX (D, GF, CE, C, Q) - The Fast Capture Latch

Macro

Locating I/O elements - It is necessary to connect these

elements to a particular I/O pad in order to select which

buffer or fast capture latch will be used.

Restricted Clock Loading - Because the input hold

requirement is a function of internal clock delay, it may be

necessary to restrict the routing of BUFGE to IOBs along

the top and bottom of the die to obtain sub-ns clock delays.

BUFGE 1

BUFGE 2

FCLK 3

FCLK 4

BUFGE 5

FCLK 2

FCLK 1

BUFGE 6

BUFGLS 2

Figure 2: Location of FastCLK, BUFGE and BUFGLS

Clock Buffers in XC4000XLA/XV FPGAs

BUFGE1

BUFGE2

BUFGE5

BUFGE6

FCLK1

FCLK2

FCLK3

FCLK4

PLL

Clock

Buffer O0

Ref

XC4000XLA

XC4000XV

SysClk

Figure 3: Diagram of XC4000XLA/XV FPGA

Connected to PLL Clock Buffer Driving 4 BUFGE and

4 FastCLK Clock Buffers.

DS015 (v1.3) October 18, 1999 - Product Speciﬁcation 6-161

XC4000XLA/XV Field Programmable Gate Arrays

JTAG Enhancements

XC4000XLA/XV devices have improved JTAG functionality

and performance in the following areas:

•IDCODE - The IDCODE register in JTAG is now

supported. All future Xilinx FPGAs will support the

IDCODE register. By using the IDCODE, the device

connected to the JTAG port can be determined. The

use of the IDCODE enables selective conﬁguration

dependent upon the FPGA found. The IDCODE register

has the following binary format:

vvvv:ffff:fffa:aaaa:aaaa:cccc:cccc:ccc1

Where:

c = the company code;

a = the array dimension in CLBs;

f = the Family code;

v = the die version number

Xilinx company code = 49 (hex)

•Conﬁguration State - The conﬁguration state is

available to JTAG controllers.

•Conﬁgure Disable - The JTAG port can be prevented

from reconﬁguring the FPGA

•TCK Startup - TCK can now be used to clock the

start-up block in addition to other user clocks.

•CCLK holdoff - Changed the requirement for Boundary

Scan Conﬁgure or EXTEST to be issued prior to the

release of INIT pin and CCLK cycling.

•Reissue conﬁgure - The Boundary Scan Conﬁgure

can be reissued to recover from an unﬁnished attempt

to conﬁgure the device.

•Bypass FF - Bypass FF and IOB is modiﬁed to provide

DRCLOCK only during BYPASS for the bypass ﬂip-ﬂop

and during EXTEST or SAMPLE/PRELOAD for the IOB

XV and XLA Family Differences

The high density of the XC4000XV family FPGAs is

achieved by using advanced 0.25 micron silicon technol-

ogy. A 2.5 Volt power supply (VCCINT) is necessary to pro-

vide the reduced supply voltage required by 0.25 micron

internal logic, however to maintain TTL compatibility a 3.3V

power supply (VCCIO) is required by the I/O.

To accommodate the higher gate capacity of XV devices,

additional interconnect has been added. These differences

are detailed below.

•VCCINT (2.5 Volt) Power Supply Pins

The XV family of FPGAs requires a 2.5V power supply

for internal logic, which is named VCCINT. The pins

assigned to the VCCINT supply are named in the pinout

guide for the XC4000XV FPGAs and in Table 5 on page

162.

•VCCIO (3.3 Volt) Power Supply Pins

Both the XV and XLA FPGAs use a 3.3V power supply

to power the I/O pins. The I/O supply is named VCCIO

in the XV family.

•Octal-Length Interconnect Channels

The XC40110XV, XC40150XV, XC40200XV, and

XC40250XV have enhanced routing. Eight routing

channels of octal length have been added to each CLB

in both vertical and horizontal dimensions.

XLA-to-XL Socket Compatibility

The XC4000XLA devices are generally available in the

same packages as equivalent XL devices, however the

range of packages available for the XC4085XLA has been

extended to include smaller packages such as the HQ240.

XV-to-XL/XLA Socket Compatibility

XC4000XV devices are available in ﬁve package options,

pin-grid PG599 and ball-grid BG560, BG432, and BG352

and quad-ﬂatpack HQ240. With the exception of the

VCCINT power pins, XC4000XV FPGAs are compatible

with XL and XLA devices in these packages if the following

guidelines are followed:

• Lay out the PCB for the XV pinout.

• When an XL or XLA device is installed disconnect the

VCCINT (2.5 V) supply. For the PG599, VCCINT should

be connected to 3.3V. For BG560, BG432 and BG352

and HQ240 packages, the VCCINT voltage source

should be left unconnected. The unused I/O pins in the

XL/XLA devices connected to VCCINT will be pulled up

to 3.3V. Care must be taken to insure that these pins

are not driven when the XL/XLA device is operative.

• When an XC4000XV is installed, the VCCINT pins must

Family Codes = 01 for XLA;

= 02 for SpartanXL;

= 03 for Virtex;

= 07 for XV.

Table 4: IDCODEs assigned to XC4000XLA/XV FPGAs

FPGA IDCODE

XC4013XLA 0x00218093

XC4020XLA 0x0021c093

XC4028XLA 0x00220093

XC4036XLA 0x00224093

XC4044XLA 0x00228093

XC4052XLA 0x0022c093

XC4062XLA 0x00230093

XC4085XLA 0x00238093

XC40110XV 0x00e40093

XC40150XV 0x00e48093

XC40200XV 0x00e54093

XC40250XV 0x00e5c093

XC4000XLA/XV Field Programmable Gate Arrays

6-162 DS015 (v1.3) October 18, 1999 - Product Speciﬁcation

be connected to a 2.5V power supply.

The differences between the XL and XV packages are

detailed below:

PG559 - XLA and XL devices in the PG599 package have

56 VCC pins.The XC4000XV devices allocate 16 of these

I/O pins to VCCINT (2.5V).

BG560 - XLA and XL devices in the BG560 package have

448 I/O pins.The XC4000XV devices allocate 16 of these

I/O pins to VCCINT (2.5V).

BG432- XLA and XL devices in the BG432 package have

352 I/O pins. The XC4000XV devices allocate 16 of these

I/O pins to VCCINT (2.5V).

BG352 - XLA and XL devices in the BG352 package have

289 I/O pins.The XC4000XV devices allocate 15 of these

I/O pins to VCCINT (2.5V).

HQ240- XLA and XL devices in the HQ240 package have

193 I/O pins.The XC4000XV devices allocate 15 of these

I/O pins to VCCINT (2.5V).

Table 5: VCCINT (2.5 V) Pins in XV Packages

HQ240 BG352 BG432 BG560 PG559

P198 D10 A10 E12 H12

P185 D5 AB2 AD2 H18

P164 K4 AB30 AD32 H26

P154 N3 AG28 AK31 H32

P137 W2 AH15 AM17 M8

P116 AE3 AH5 AK5 M36

P104 AC10 AJ10 AK11 V8

P93 AC13 AK22 AN25 V36

P77 AE19 B23 C24 AF8

P55 AB24 B4 D6 AF36

P43 V24 C16 C17 AM8

P27 N24 E28 E30 AM36

P16 J24 K29 K32 AT12

P4 D24 K3 J1 AT18

P225 A20 R2 T3 AT26

- - R29 U32 AT32

DS015 (v1.3) October 18, 1999 - Product Speciﬁcation 6-163

XC4000XLA/XV Field Programmable Gate Arrays

I/O Signalling Standards

XLA and XV devices are compatible with TTL, LVTTL, PCI

3V, PCI 5V and LVCMOS signalling. The various standards

are illustrated in Table 6 and the signaling environment is

illustrated in Figure 4.

VCC Clamping

XLA/XV devices are fully 5V TTL I/O compatible if VCC

clamping is not enabled. The I/O pins can withstand input

voltages up to 7V. With VCC clamping enabled, the XLA/XV

devices will begin to clamp input voltages to one diode volt-

age drop above VCC. In both cases negative voltage is

clamped to one diode voltage drop below ground.

XLA/XV devices maintain LVTTL I/O compatibility when

VCC clamping is enabled, however full 5.0V TTL I/O com-

patibility is sacriﬁced.

Overshoot and Undershoot

Ringing wave forms are allowed on XLA/XV inputs as long

as undershoot is limited to -2.0V and overshoot is limited to

+7.0V and current is limited to 100 mA for less than 10 ns.

If VCC clamping is enabled then overshoot will begin to be

clamped at VCC/VCCIO plus one diode voltage drop and

undershoot will be clamped to ground minus one diode volt-

age drop. In either case the current must be limited to 100

mA per pin for less than 10 ns.

Express Conﬁguration Mode

Express conﬁguration mode is similar to Slave Serial con-

ﬁguration mode, except that data is processed one byte per

CCLK cycle instead of one bit per CCLK cycle. An external

source is used to drive CCLK, while byte-wide data is

loaded directly into the conﬁguration data shift registers

(Figure 5). A CCLK frequency of 10 MHz is equivalent to a

80 MHz serial rate, because eight bits of conﬁguration data

are loaded per CCLK cycle. Express mode does not sup-

port CRC error checking, but does support constant-ﬁeld

error checking. A length count is not used in Express mode.

Express mode must be speciﬁed as an option to the BitGen

program, which generates the bitstream. The Express

mode bitstream is not compatible with the other conﬁgura-

tion modes. Express mode is selected by a <010> on the

mode pins (M2, M1, M0).

The ﬁrst byte of parallel conﬁguration data must be avail-

able at the D inputs of the FPGA a short setup time before

the second rising CCLK edge. Subsequent data bytes are

Table 6: I/O Standards supported by XC4000XLA and XV FPGAs

Signaling

Standard VCC

Clamping Output Drive VIH_MAX VIH MIN VIL MAX VOH MIN VOL MAX

TTL Not allowed 12/24 mA 5.5 2.0 0.8 2.4 0.4

LVTTL OK 12/24 mA 3.6 2.0 0.8 2.4 0.4

PCI5V Not allowed 24 mA 5.5 2.0 0.8 2.4 0.4

PCI3V Required 12 mA 3.6 50% of

VCC/VCCIO 30% of

VCC/VCCIO 90% of

VCC/VCCIO 10% of

VCC/VCCIO

LVCMOS 3V OK 12/24 mA 3.6 50% of

VCC/VCCIO 30% of

VCC/VCCIO 90% of

VCC/VCCIO 10% of

VCC/VCCIO

(5 V)

5.0 V Power

3.3 V Power

2.5 V Power

Ground

TTL

LVTTL

5 Volt Device

CCIO

CCINT

LVTTL

XC4000XV

(3.3 V)

3.3 Volt Device

X7147

Figure 4: The Signalling Environment for XLA/XV FPGAS. For XLA devices the VCCIO and VCCINT supplies are

replaced by a single 3.3 Volt VCC supply, however, all indicated I/O signalling is still supported.

XC4000XLA/XV Field Programmable Gate Arrays

6-164 DS015 (v1.3) October 18, 1999 - Product Speciﬁcation

clocked in on each consecutive rising CCLK edge

(Figure 6).

Pseudo Daisy Chain

As illustrated in Figures 5 and 6, multiple devices with dif-

ferent conﬁgurations can be conﬁgured in a pseudo daisy

chain provided that all of the devices are in Express mode.

A single combined byte-wide data stream is used to conﬁg-

ure the chain of Express mode devices. CCLK pins are tied

together and D0-D7 pins are tied together as a data buss

for all devices along the chain. A status signal is passed

from DOUT of each device to the CS1 input of the device

which follows it in the chain. Frame data is accepted only

when CS1 is High and the device’s conﬁguration memory is

not already full. The lead device in the chain has its CS1

input tied High (or ﬂoating, since there is an internal pullup).

The status pin DOUT is initially High for all devices in the

chain until the data stream header of seven bytes is loaded.

This allows header data to be loaded into all devices in the

chain simultaneously. After the header is loaded in all

devices, their DOUT pins are pulled Low disabling conﬁgu-

ration of all devices in the chain except the ﬁrst device. As

each device in the chain is ﬁlled, its DOUT goes High driv-

ing High the CS1 input of the next device, thereby enabling

conﬁguration of the next device in the pseudo daisy chain.

The requirement that all DONE pins in a daisy chain be

wired together applies only to Express mode, and only if all

devices in the chain are to become active simultaneously.

All 4000XLA/XV devices in Express mode are synchro-

nized to the DONE pin. User I/O for each device becomes

active after the DONE pin for that device goes High (The

exact timing is determined by BitGen options.)

Since the DONE pin is open-drain and does not drive a

High value, tying the DONE pins of all devices together pre-

vents all devices in the chain from going High until the last

device in the chain has completed its conﬁguration cycle. If

the DONE pin of a device is left unconnected, the device

becomes active as soon as that device has been conﬁg-

ured.

Because only XC4000XLA/XV, SpartanXL, and XC5200

devices support Express mode, only these devices can be

used to form an Express mode pseudo daisy chain.

Table 7: Pin Functions During Conﬁguration

(4000XLA/XV Express mode only)

CONFIGURATION MODE

<M2:M1:M0> USER

OPERATION

EXPRESS MODE

<0:1:0> PIN FUNCTION

M2(LOW) (I) M2

M1(HIGH) (I) M1

M0(LOW) (I) M0

HDC (HIGH) I/O

LDC (LOW) I/O

INIT I/O

DONE DONE

PROGRAM (I) PROGRAM

CCLK (I) CCLK (I)

DATA 7 (I) I/O

DATA 6 (I) I/O

DATA 5 (I) I/O

DATA 4 (I) I/O

DATA 3 (I) I/O

DATA 2 (I) I/O

DATA 1 (I) I/O

DATA 0 (I) I/O

DOUT SGCK4-I/O

TDI TDI-I/O

TCK TCK-I/O

TMS TMS-I/O

TDO TDO-(O)

CS1 I/O

Notes 1. A shaded table cell represents the internal

pull-up used before and during

conﬁguration.

2. (I) represents an input; (O) represents an

output.

3. INIT is an open-drain output during

conﬁguration.

DS015 (v1.3) October 18, 1999 - Product Speciﬁcation 6-165

XC4000XLA/XV Field Programmable Gate Arrays

Table 8: Express Mode Programming Switching Characteristic

Description Symbol Min Max Units

CCLK

INIT (High) setup time TIC 5µs

D0 - D7 setup time TDC 20 ns

D0 - D7 hold time TCD 0ns

CCLK High time TCCH 45 ns

CCLK Low time TCCL 45 ns

CCLK Frequency FCC 10 MHz

Preliminary

INIT

CCLK CCLK

4000XLA/XV

M0 M2

CS1

D0-D7

DATA BUS

PROGRAM

INIT

CCLK

PROGRAM

INIT

DOUT

DONEDONE

DOUT

To Additional

Optional

Daisy-Chained

Devices

To Additional

Optional

Daisy-Chained

Devices

Optional

Daisy-Chained

4000XLA/XV

M0 M2

VCC

4.7K

CS1

D0-D7

PROGRAM

99010800

M1 M1

Figure 5: Express Mode Circuit Diagram

XC4000XLA/XV Field Programmable Gate Arrays

6-166 DS015 (v1.3) October 18, 1999 - Product Speciﬁcation

Data Stream Format

The data stream (“bitstream”) format is identical for all

serial conﬁguration modes, but different for the

4000XLA/XV Express mode. In Express mode, the device

becomes active when DONE goes High, therefore no

length count is required. Additionally, CRC error checking is

not supported in Express mode. The data stream format is

shown in Table 9. Express mode data is shown with D0 at

the left and D7 at the right.

The conﬁguration data stream begins with two bytes of

eight ones each, a preamble code of one byte, followed by

three bytes of eight ones each, and ﬁnally an end-of-

header ﬁeld check byte. This header of seven bytes is fol-

lowed by the actual conﬁguration data in frames. The

length and number of frames depends on the device type.

Each frame begins with a start ﬁeld and ends with an

end-of-frame ﬁeld check byte. In all cases, additional

start-up bytes of data are required to provide six, or more,

clocks for the start-up sequence at the end of conﬁguration.

Long daisy chains require additional startup bytes to shift

the last data through the chain. All startup bytes are

don’t-cares; these bytes are not included in bitstreams cre-

ated by the Xilinx software.

A selection of CRC or non-CRC error checking is allowed

by the bitstream generation software. The 4000XLA

Express mode only supports non-CRC error checking. The

non-CRC error checking tests for a designated

end-of-frame ﬁeld check byte for each frame. non-CRC

error checking tests for a designated end-of-frame ﬁeld

check byte for each frame.

LEGEND:

Detection of an error results in the suspension of data load-

ing and the pulling down of the INIT pin. The user must

detect INIT and initialize a new conﬁguration by pulsing the

PROGRAM pin Low or cycling VCC.

Note: CS1

must

remain High throughout loading of the conﬁguration data stream. In the pseudo daisy chain of Figure 5, the 7 byte

data stream header is loaded into all devices simultaneously. Each device’s data frames are then loaded in turn when its

CS1 pin is driven High by the DOUT of the preceding device in the chain.

99012600

BYTE

CCLK

INIT

D0-D7

DOUT

CS1

First

FPGA

BYTE

1BYTE

2BYTE

First FPGA Filled

BYTE

4BYTE

5BYTE

Header

Header Loaded

CS1

Second

FPGA

CS1 all

downstream

FPGAs

Byte A is first frame byte for first FPGA

Byte B is last frame byte for first FPGA

Byte C is first frame byte for second FPGA

BYTE

ABYTE

BYTE

Figure 6: Express Mode Conﬁguration Switching Waveforms

Table 9: 4000XLA/XV Express Mode Data Stream

Format

Data Type Express Mode

(D0-D7)

(4000XLA only)

Fill Byte FFFFh

Preamble Code 11110010b

Fill Byte FFFFFFh

End-of-Header

Field Check Byte 11010010b

Start Field 11111110b

Data Frame DATA(n-1:0)

End-of-Frame

Field Check Byte 11010010b

Extend Write Cycle FFD2FFFFFFh

Start-Up Bytes FFFFFFFFFFFFh

Unshaded Once per data stream

Light Once per data frame

DS015 (v1.3) October 18, 1999 - Product Speciﬁcation 6-167

XC4000XLA/XV Field Programmable Gate Arrays

Serial PROM Recommendation

Table 10 shows the physical characteristics of each XLA/XV family member and the recommended Xilinx Serial PROM

recommended for use as conﬁguration storage.

Table 10: Physical Characteristics and Recommended Serial PROM

User I/O Per Package

Table 11 shows the number of user I/Os available in each package for XC4000XLA/XV-Series devices. Call your local sales

ofﬁce for the latest availability information.

Device Max.

User I/O CLB

Matrix Total

CLBs Logic

Cells

Number

Flip-Flops

Max. RAM

Bits

(No Logic)

Required

Conﬁgur-

ation Bits Serial PROM

XC4013XLA 192 24 x 24 576 1,368 1,536 18,432 393,632 XC17512L

XC4020XLA 224 28 x 28 784 1,862 2,016 25,088 521,880 XC17512L

XC4028XLA 256 32 x 32 1,024 2,432 2,560 32,768 668,184 XC1701L

XC4036XLA 288 36 x 36 1,296 3,078 3,168 41,472 832,528 XC1701L

XC4044XLA 320 40 x 40 1,600 3,800 3,840 51,200 1,014,928 XC1701L

XC4052XLA 352 44 x 44 1,936 4,598 4,576 61,952 1,215,368 XC1702L

XC4062XLA 384 48 x 48 2,304 5,472 5,376 73,728 1,433,864 XC1702L

XC4085XLA 448 56 x 56 3,136 7,448 7,168 100,352 1,924,992 XC1702L

XC40110XV 448 64 x 64 4,096 9,728 9,216 131,072 2,686,136 XC1704L

XC40150XV 448 72 x 72 5,184 12,312 11,520 165,888 3,373,448 XC1704L

XC40200XV 448 84 x 84 7,056 16,758 15,456 225,792 4,551,056 XC1704L+XC17512L

XC40250XV 448 92 x 92 8,464 20,102 18,400 270,848 5,433,888 XC1704L+XC1702L

Table 11: User I/O Pins Available by Device and Package

Maximum I/O Accessible per Package

Device Max

I/O

HQ160

PQ160

HQ208

PQ208

HQ240

PQ240

BG256

HQ304

BG352

BG432

PG559

BG560

XC4013XLA 192 129 160 192 192

XC4020XLA 224 129 160 193 205

XC4028XLA 256 129 160 193 205 256

XC4036XLA 288 129 160 193 288 288

XC4044XLA 320 129 160 193 256 289 320

XC4052XLA 352 129 160 193 256 289 352 352

XC4062XLA 384 129 160 193 256 289 352 384

XC4085XLA 448 129 160 193 256 289 352 448

XC40110XV 448 178 274 336 432

XC40150XV 448 178 274 336 448 432

XC40200XV 448 336 432

XC40250XV 448 336 448 432

XC4000XLA/XV Field Programmable Gate Arrays

6-168 DS015 (v1.3) October 18, 1999 - Product Speciﬁcation

Product Availability

XLA Family

Table 12 shows the current available package and speed grade combinations for XC4000XLA Series devices. Call your local

sales ofﬁce for the latest availability information, or see the Xilinx WEBLINX at http://www.xilinx.com for the latest revision of

the speciﬁcations.

Table 12: Component Availability Chart for XC4000XLA FPGAs

PINS 84 100 100 144 144 160 160 176 176 208 208 240 240 256 299 304 352 411 432 475 559 560

TYPE

Plast.

PLCC

Plast.

PQFP

Plast.

VQFP

Plast.

TQFP

High-Perf.

TQFP

High-Perf.

QFP

Plast.

PQFP

Plast.

TQFP

High-Perf.

TQFP

High-Perf.

QFP

Plast.

PQFP

High-Perf.

QFP

Plast.

PQFP

Plast.

BGA

Ceram.

PGA

High-Perf.

QFP

Plast.

BGA

Ceram.

PGA

Plast.

BGA

Ceram.

PGA

Ceram.

PGA

Plast.

BGA

CODE

PC84

PQ100

VQ100

TQ144

HT144

HQ160

PQ160

TQ176

HT176

HQ208

PQ208

HQ240

PQ240

BG256

PG299

HQ304

BG352

PG411

BG432

PG475

PG559

BG560

XC4013XLA -09 C I C I C I C I

-08 C I C I C I C I

-07 CC

XC4020XLA -09 C I C I C I C I

-08 C I C I C I C I

-07 CC

XC4028XLA -09 C I C I C I C I C I

-08 C I C I C I C I C I

-07 CC

XC4036XLA -09 C I C I C I C I C I

-08 C I C I C I C I C I

-07 CC

XC4044XLA -09 C I C I C I C I C I C I

-08 C I C I C I C I C I C I

-07 CC

CCC C

XC4052XLA -09 C I C I C I C I C I C I C I

-08 C I C I C I C I C I C I C I

-07 CC

CCC C C

XC4062XLA -09 C I C I C I C I C I C I C I

-08 C I C I C I C I C I C I C I

-07 CC

CCC C C

XC4085XLA -09 C I C I C I C I C I C I C I

-08 C I C I C I C I C I C I C I

-07 CC

CCC C C

1/25/99

C = Commercial TJ = 0° to +85°C

I= Industrial TJ = -40°C to +100°C

DS015 (v1.3) October 18, 1999 - Product Speciﬁcation 6-169

XC4000XLA/XV Field Programmable Gate Arrays

XV Family

Table 13 show the current available package and speed grade combinations for the XC4000XV Series devices. Call your

local sales ofﬁce for the latest availability information, or see the Xilinx WEBLINX at http://www.xilinx.com for the latest

revision of the speciﬁcations.

Table 13: Component Availability Chart for XC4000XV FPGAs

PINS 84 100 100 144 144 160 160 176 176 208 208 240 240 256 299 304 352 411 432 475 559 560

TYPE

Plast.

PLCC

Plast.

PQFP

Plast.

VQFP

Plast.

TQFP

High-Perf.

TQFP

High-Perf.

QFP

Plast.

PQFP

Plast.

TQFP

High-Perf.

TQFP

High-Perf.

QFP

Plast.

PQFP

High-Perf.

QFP

Plast.

PQFP

Plast.

BGA

Ceram.

PGA

High-Perf.

QFP

Plast.

BGA

Ceram.

PGA

Plast.

BGA

Ceram.

PGA

Ceram.

PGA

Plast.

BGA

CODE

PC84

PQ100

VQ100

TQ144

HT144

HQ160

PQ160

TQ176

HT176

HQ208

PQ208

HQ240

PQ240

BG256

PG299

HQ304

BG352

PG411

BG432

PG475

PG559

BG560

XC40110XV -09 C I C I C I C I

-08 C I C I C I C I

-07 CCCC

XC40150XV -09 C I C I C I C I C I

-08 C I C I C I C I C I

-07 C CCCC

XC40200XV -09 C I C I

-08 C I C I

-07 CC

XC40250XV -09 C I C I C I

-08 C I C I C I

-07 CCC

11/24/98

C = Commercial TJ = 0° to +85°C

I= Industrial TJ = -40°C to +100°C

XC4000XLA/XV Field Programmable Gate Arrays

6-170 DS015 (v1.3) October 18, 1999 - Product Speciﬁcation

XC4000 Series Electrical Characteristics and Device-Speciﬁc Pinout Tables

For the latest Electrical Characteristics and pinout information for each XC4000 Family, see the Xilinx web site at

http://www.xilinx.com/partinfo/databook.htm#xc4000

Revision Control

Version Description

2/1/99 (1.0) Release included in 1999 data book, section 6

2/19/99 (1.1) Updated Switching Characteristics Tables

5/14/99 (1.2) Replaced Electrical Specification pages for XLA and XV families with separate updates and added

URL link on placeholder page for electrical specifications/pinouts for WebLINX users.

10/18/99 (1.3) Deleted HQ304 package/XC4028XLA and XC4036XLA entries from Table 11, page 6-168. Changed

do DS015.