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Page <1> V1.025/02/13
Surface Mount Rectifier
Features:
• Low Prole Package
• For Surface Mounted Applications
• Built-In Strain Relief, Ideal for Automated Placement
• High Temperature Soldering : 260°C/10 seconds at Terminals
Mechanical Data
• Case : JEDEC SMA, molded plastic over passivated chip
• Terminals : solder plated, solderable per MIL-STD-750, method 2026
• Polarity : Colour band denotes cathode end
• Weight : 0.002oz, 0.064g
Maximum Ratings and Thermal Characteristics
Ratings at 25°C ambient temperature unless otherwise specied
Note:
(1) Reverse recovery time test conditions : IF=0.5A, IR=1.0A, Irr=0.25A
(2) Measured at 1MHz and applied reverse voltage of 4V
(3) Thermal resistance from junction to lead
Characteristic Symbol RS1D-13-F RS1J-13-F RS1K-13-F RS1M-13-F Units
Maximum repetitive peak reverse voltage VRRM 200 600 800 1,000 V
Maximum RMS voltage VRMS 140 420 560 700 V
Maximum DC blocking voltage V DC 200 600 800 1,000 V
Maximum average forward rectied current at
TL=90°C IF(AV) 1 A
Peak forward surge current 8.3ms single
half-sine-wave superimposed on rated load IFSM 30 A
Maximum Instantaneous Forward Voltage
at 1A VF1.3 V
Maximum DC reverse current TA=25°C
at rated DC blocking voltage TA=125°C IR5
50 μA
Typical reverse recovery time (Note 1) tIT 150 250 500 ns
Typical junction capacitance (Note 2) CJ10 7 pF
Typical thermal resistance (Note3) RθJA
RθJL
105
32 °C/W
Operating junction and storage temperature
range TJ, TSTG -55 to +175 °C
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Page <2> V1.025/02/13
Surface Mount Rectifier
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Page <3> V1.025/02/13
Surface Mount Rectifier
DO-214AC(SMA)
Dim. Min. Max.
A 4.25 4.65
B2.4 2.8
C 1.85 2.15
D 4.85 5.35
E 0.2 Typ.
F0.9 1.5
G 0.2 Max.
H1.9 2.3
I 1.35 1.65
Dimensions : Millimetres
Dimensions : Millimetres
Package Outline Dimensions
Soldering Footprint
Device Package Shipping
RS1D-13-F
RS1J-13-F
RS1K-13-F
RS1M-13-F
DO-214AC(SMA) 5,000 / Tape & Reel
Package Information
Description Part Number
Surface Mount Rectier
RS1D-13-F
RS1J-13-F
RS1K-13-F
RS1M-13-F
Part Number Table
Important Notice : This data sheet and its contents (the “Information”) belong to the members of the Premier Farnell group of companies (the “Group”) or are licensed to it. No licence is granted
for the use of it other than for information purposes in connection with the products to which it relates. No licence of any intellectual property rights is granted. The Information is subject to change
without notice and replaces all data sheets previously supplied. The Information supplied is believed to be accurate but the Group assumes no responsibility for its accuracy or completeness, any
error in or omission from it or for any use made of it. Users of this data sheet should check for themselves the Information and the suitability of the products for their purpose and not make any
assumptions based on information included or omitted. Liability for loss or damage resulting from any reliance on the Information or use of it (including liability resulting from negligence or where the
Group was aware of the possibility of such loss or damage arising) is excluded. This will not operate to limit or restrict the Group’s liability for death or personal injury resulting from its negligence.
Multicomp is the registered trademark of the Group. © Premier Farnell plc 2012.
