
L293, L293D
QUADRUPLE HALF-H DRIVERS
SLRS008B – SEPTEMBER 1986 – REVISED JUNE 2002
1
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
D
Featuring Unitrode L293 and L293D
Products Now From Texas Instruments
D
Wide Supply-Voltage Range: 4.5 V to 36 V
D
Separate Input-Logic Supply
D
Internal ESD Protection
D
Thermal Shutdown
D
High-Noise-Immunity Inputs
D
Functional Replacements for SGS L293 and
SGS L293D
D
Output Current 1 A Per Channel
(600 mA for L293D)
D
Peak Output Current 2 A Per Channel
(1.2 A for L293D)
D
Output Clamp Diodes for Inductive
Transient Suppression (L293D)
description
The L293 and L293D are quadruple high-current
half-H drivers. The L293 is designed to provide
bidirectional drive currents of up to 1 A at voltages
from 4.5 V to 36 V. The L293D is designed to
provide bidirectional drive currents of up to
600-mA at voltages from 4.5 V to 36 V. Both
devices are designed to drive inductive loads such
as relays, solenoids, dc and bipolar stepping
motors, as well as other high-current/high-voltage
loads in positive-supply applications.
All inputs are TTL compatible. Each output is a complete totem-pole drive circuit, with a Darlington transistor
sink and a pseudo-Darlington source. Drivers are enabled in pairs, with drivers 1 and 2 enabled by 1,2EN and
drivers 3 and 4 enabled by 3,4EN. When an enable input is high, the associated drivers are enabled and their
outputs are active and in phase with their inputs. When the enable input is low, those drivers are disabled and
their outputs are off and in the high-impedance state. With the proper data inputs, each pair of drivers forms
a full-H (or bridge) reversible drive suitable for solenoid or motor applications.
On the L293, external high-speed output clamp diodes should be used for inductive transient suppression.
A VCC1 terminal, separate from VCC2, is provided for the logic inputs to minimize device power dissipation.
The L293and L293D are characterized for operation from 0°C to 70°C.
Copyright 2002, Texas Instruments Incorporated
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily include
testing of all parameters.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
HEAT SINK AND
GROUND
HEAT SINK AND
GROUND
1
2
3
4
5
6
7
8
16
15
14
13
12
11
10
9
1,2EN
1A
1Y
2Y
2A
VCC2
VCC1
4A
4Y
3Y
3A
3,4EN
N, NE PACKAGE
(TOP VIEW)
1
2
3
4
5
6
7
8
9
10
11
12
13
14
28
27
26
25
24
23
22
21
20
19
18
17
16
15
1,2EN
1A
1Y
NC
NC
NC
NC
NC
2Y
2A
VCC2
VCC1
4A
4Y
NC
NC
NC
NC
NC
3Y
3A
3,4EN
DWP PACKAGE
(TOP VIEW)
HEAT SINK AND
GROUND
HEAT SINK AND
GROUND