Pb
RoHS
EMCL12J2J-100.000M
EMCL12 J 2 J -100.000M
Series
RoHS Compliant (Pb-free) 2.5V 6 Pad 5mm x 7mm
Plastic SMD LVPECL MEMS Oscillator
Frequency Tolerance/Stability
±25ppm Maximum over -40°C to +85°C
Duty Cycle
50 ±5(%)
Nominal Frequency
100.000MHz
Logic Control / Additional Output
Standby (ST) and Complementary Output
ELECTRICAL SPECIFICATIONS
Nominal Frequency 100.000MHz
Frequency Tolerance/Stability ±25ppm Maximum over -40°C to +85°C (Inclusive of all conditions: Calibration Tolerance at 25°C,
Frequency Stability over the Operating Temperature Range, Supply Voltage Change, Output Load Change,
1st Year Aging at 25°C, Reflow, Shock, and Vibration)
Aging at 25°C ±1ppm First Year Maximum
Supply Voltage +2.5Vdc ±0.125Vdc
Input Current 75mA Maximum (Excluding Load Termination Current)
Output Voltage Logic High (Voh) 1.55Vdc Typical, Vcc-1.025Vdc Minimum
Output Voltage Logic Low (Vol) 0.80Vdc Typical, Vcc-1.62Vdc Maximum
Rise/Fall Time 150pSec Typical, 300pSec Maximum (Measured over 20% to 80% of waveform)
Duty Cycle 50 ±5(%) (Measured at 50% of waveform)
Load Drive Capability 50 Ohms into Vcc-2.0Vdc
Output Logic Type LVPECL
Logic Control / Additional Output Standby (ST) and Complementary Output
Output Control Input Voltage Vih of 70% of Vcc Minimum or No Connect to Enable Output and Complementary Output, Vil of 30% of Vcc
Maximum to Disable Output and Complementary Output (High Impedance)
Standby Current 30µA Maximum (ST) Without Load
Period Jitter (Deterministic) 0.2pSec Typical
Period Jitter (Random) 2.0pSec Typical
Period Jitter (RMS) 1.5pSec Typical, 3.0pSec Maximum
Period Jitter (pk-pk) 20pSec Typical, 25pSec Maximum
RMS Phase Jitter (Fj = 637kHz to
10MHz; Random) 1.7pSec Typical
RMS Phase Jitter (Fj = 1MHz to
20MHz; Random) 1.4pSec Typical
RMS Phase Jitter (Fj = 1.875MHz to
20MHz; Random) 1.1pSec Typical
Start Up Time 10mSec Maximum
Storage Temperature Range -55°C to +125°C
ENVIRONMENTAL & MECHANICAL SPECIFICATIONS
ESD Susceptibility MIL-STD-883, Method 3015, Class 2, HBM 2000V
Flammability UL94-V0
Mechanical Shock MIL-STD-883, Method 2002, Condition G, 30,000G
Moisture Resistance MIL-STD-883, Method 1004
Moisture Sensitivity Level J-STD-020, MSL 1
Resistance to Soldering Heat MIL-STD-202, Method 210, Condition K
Resistance to Solvents MIL-STD-202, Method 215
Solderability MIL-STD-883, Method 2003 (Six I/O Pads on bottom of package only)
Temperature Cycling MIL-STD-883, Method 1010, Condition B
Thermal Shock MIL-STD-883, Method 1011, Condition B
Vibration MIL-STD-883, Method 2007, Condition A, 20G
www.ecliptek.com | Specification Subject to Change Without Notice | Rev C 8/14/2010 | Page 1 of 5
EMCL12J2J-100.000M
MECHANICAL DIMENSIONS (all dimensions in millimeters)
3
2
1
A
4
5
6
7.00
±0.15 2.30
1.47
1.20 ±0.10 (x4)
5.00
±0.15
0.85
±0.15
0.08
MAX
1.40
±0.10 (x4)
Note A: Center paddle is connected
internally to oscillator ground (Pad 3).
5.08
±0.10
2.60
±0.15
2.54 TYP
PIN CONNECTION
1 Standby (ST)
2 No Connect
3 Case Ground
4 Output
5 Complementary Output
6 Supply Voltage
LINE MARKING
1XXXX or XXXXX
XXXX or XXXXX=Ecliptek
Manufacturing Lot Code
All Tolerances are ±0.1
Suggested Solder Pad Layout
Solder Land
(X6)
All Dimensions in Millimeters
0.54 (X4)
2.39 (X3)
1.80 (X6)
2.00 (X6)
www.ecliptek.com | Specification Subject to Change Without Notice | Rev C 8/14/2010 | Page 2 of 5
EMCL12J2J-100.000M
OUTPUT STANDBY
(HIGH IMPED ANCE
STATE)
OUTPUT WAVEFORM & TIMING DIAGRAM
VOH
VOL
80%
50%
20%
Fall
Time Rise
Time TW
T
Duty Cycle (%) = TW/T x 100
VIH
VIL
tPLZ tPZL
CLOCK OUTPUTS TRI-STATE INPUT
Q
Q
Pin Connections
1 Tri-State
2 No Connect
3 Ground
4 Output
5 Complementary Output
6 Supply Voltage (VDD)
Power
Supply
Power
Supply Power
Supply Power
Supply
Oscilloscope
Probe 2
(Note 2)
Probe 1
(Note 2)
Current
Meter
Voltage
Meter
Frequency
Counter
Switch
0.01µF
(Note 1)
0.1µF
(Note 1)
50 Ohms
Supply
Voltage
(VDD)
Tri-State
Complementary
Output
Output
No
Connect
Ground
50 Ohms
Note 1: An external 0.01µF ceramic bypass capacitor in parallel with a 0.1µF high frequency ceramic bypass capacitor close (less than 2mm)
to the package ground and supply voltage pin is required.
Note 2: A low capacitance (<12pF), 10X attenuation factor, high impedance (>10Mohms), and high bandwidth (>500MHz) passive probe is
recommended.
Note 3: Test circuit PCB traces need to be designed for a characteristic line impedance of 50 ohms.
Test Circuit for Tri-State and Complementary Output
www.ecliptek.com | Specification Subject to Change Without Notice | Rev C 8/14/2010 | Page 3 of 5
T Min
S
T Max
S
Critical Zone
T to T
L P
Ramp-up Ramp-down
TL
TP
t 25°C to Peak
t Preheat
StL
tP
Temperature (T)
Time (t)
Recommended Solder Reflow Methods
EMCL12J2J-100.000M
High Temperature Infrared/Convection
TS MAX to TL (Ramp-up Rate) 3°C/second Maximum
Preheat
- Temperature Minimum (TS MIN) 150°C
- Temperature Typical (TS TYP) 175°C
- Temperature Maximum (TS MAX) 200°C
- Time (tS MIN) 60 - 180 Seconds
Ramp-up Rate (TL to TP)3°C/second Maximum
Time Maintained Above:
- Temperature (TL)217°C
- Time (tL)60 - 150 Seconds
Peak Temperature (TP)260°C Maximum for 10 Seconds Maximum
Target Peak Temperature (TP Target) 250°C +0/-5°C
Time within 5°C of actual peak (tp)20 - 40 seconds
Ramp-down Rate 6°C/second Maximum
Time 25°C to Peak Temperature (t) 8 minutes Maximum
Moisture Sensitivity Level Level 1
www.ecliptek.com | Specification Subject to Change Without Notice | Rev C 8/14/2010 | Page 4 of 5
T Min
S
T Max
S
Critical Zone
T to T
L P
Ramp-up Ramp-down
TL
TP
t 25°C to Peak
t Preheat
StL
tP
Temperature (T)
Time (t)
Recommended Solder Reflow Methods
EMCL12J2J-100.000M
Low Temperature Infrared/Convection 240°C
TS MAX to TL (Ramp-up Rate) 5°C/second Maximum
Preheat
- Temperature Minimum (TS MIN) N/A
- Temperature Typical (TS TYP) 150°C
- Temperature Maximum (TS MAX) N/A
- Time (tS MIN) 60 - 120 Seconds
Ramp-up Rate (TL to TP)5°C/second Maximum
Time Maintained Above:
- Temperature (TL)150°C
- Time (tL)200 Seconds Maximum
Peak Temperature (TP)240°C Maximum
Target Peak Temperature (TP Target) 240°C Maximum 1 Time / 230°C Maximum 2 Times
Time within 5°C of actual peak (tp)10 seconds Maximum 2 Times / 80 seconds Maximum 1 Time
Ramp-down Rate 5°C/second Maximum
Time 25°C to Peak Temperature (t) N/A
Moisture Sensitivity Level Level 1
Low Temperature Manual Soldering
185°C Maximum for 10 seconds Maximum, 2 times Maximum.
High Temperature Manual Soldering
260°C Maximum for 5 seconds Maximum, 2 times Maximum.
www.ecliptek.com | Specification Subject to Change Without Notice | Rev C 8/14/2010 | Page 5 of 5