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LP2952-N
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LP295x Adjustable Micropower Low-Dropout Voltage Regulators
1 Features 3 Description
The LP2952 and LP2953 are micropower voltage
1• 2.3-V to 30-V Input Voltage Range regulators with very low quiescent current (130 μA
• Output Voltage Adjusts from 1.23 V to 29 V typical at 1-mA load) and very low dropout voltage
• 250-mA Output Current (typically 60 mV at light load and 470 mV at 250-mA
load current). They are ideally suited for battery-
• Extremely Low Quiescent Current powered systems. Furthermore, the quiescent current
• Low Dropout Voltage increases only slightly at dropout, which prolongs
• Extremely Tight Line and Load Regulation battery life.
• Very Low Temperature Coefficient The LP2952 and LP2953 retain all the desirable
• Current and Thermal Limiting characteristics of the LP2951, but offer increased
output current, additional features, and an improved
• Reverse Battery-Input Protection shutdown function.
• 50-mA (Typical) Automatic Output Discharge The automatic output discharge pulls the output down
• LP2953 Versions Only quickly when the shutdown is activated.
– Auxiliary Comparator Included With CMOS-
and TTL-Compatible Output Levels. Can Be The error flag goes low if the output voltage drops out
of regulation.
Used for Fault Detection, Low-Input Line
Detection, and so on. Reverse battery-input protection is provided.
The internal voltage reference is made available for
2 Applications external use, providing a low temperature coefficient
• High-Efficiency Linear Regulator (20 ppm/°C) reference with very good line (0.03%)
and load (0.04%) regulation.
• Regulator With Undervoltage Shutdown
• Low-Dropout Battery-Powered Regulator Device Information(1)
• Snap-ON/Snap-OFF Regulator PART NUMBER PACKAGE BODY SIZE (NOM)
LP2952x SOIC (16) 9.90 mm × 3.91 mm
SOIC (16) 9.90 mm × 3.91 mm
LP2953x PDIP (16) 21.755 mm × 6.35 mm
(1) For all available packages, see the orderable addendum at
the end of the data sheet.
Typical Application Schematic
1
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
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Table of Contents
7.3 Feature Description................................................. 15
1 Features.................................................................. 17.4 Device Functional Mode ......................................... 16
2 Applications ........................................................... 18 Application and Implementation ........................ 17
3 Description............................................................. 18.1 Application Information............................................ 17
4 Revision History..................................................... 28.2 Typical Applications ................................................ 21
5 Pin Configuration and Functions......................... 39 Power Supply Recommendations...................... 30
6 Specifications......................................................... 410 Layout................................................................... 31
6.1 Absolute Maximum Ratings ...................................... 410.1 Layout Guidelines ................................................. 31
6.2 ESD Ratings.............................................................. 410.2 Layout Example .................................................... 31
6.3 Recommended Operating Conditions....................... 410.3 Power Dissipation: Heatsink Requirements
6.4 Thermal Information.................................................. 5(Industrial Temperature Range Devices)................. 32
6.5 Electrical Characteristics: 3.3-V Versions................. 511 Device and Documentation Support................. 34
6.6 Electrical Characteristics: 5-V Versions.................... 511.1 Related Links ........................................................ 34
6.7 Electrical Characteristics: All Voltage Options.......... 611.2 Trademarks........................................................... 34
6.8 Typical Characteristics.............................................. 911.3 Electrostatic Discharge Caution............................ 34
7 Detailed Description............................................ 14 11.4 Glossary................................................................ 34
7.1 Overview................................................................. 14 12 Mechanical, Packaging, and Orderable
7.2 Functional Block Diagrams ..................................... 14 Information ........................................................... 34
4 Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
Changes from Revision E (December 2014) to Revision F Page
• Deleted "Assured" .................................................................................................................................................................. 1
• Changed "Output Pulldown Crowbar" to "Automatic Output Discharge" ............................................................................... 1
• Changed "internal crowbar" to "automatic output discharge"................................................................................................. 1
• Added word "input" after "battery" in Features and Description............................................................................................. 1
• Changed pin names for IN and OUT to match TI nomenclature; fix typos............................................................................ 1
• Changed max junc. temp from 125°C to 150°C .................................................................................................................... 4
• Changed wording of footnote 12 ........................................................................................................................................... 8
• Added second bullet for "LP2953 versions only" ................................................................................................................. 14
• Added Automatic Output Dischange subsection ................................................................................................................. 16
• Deleted sentence "To achieve the smallest form factor, the TO-92 package is selected.".................................................. 22
• Changed "With an efficiency of 83.3% and a 250-mA maximum load, the internal power dissipation is 250 mW,
which corresponds to a 19.2°C junction temperature rise for the SOIC package." to "With a VIN – VOUT differential of
1 V and a maximum load current of 250 mA the internal junction temperature (TJ) of the SOIC package will rise
19.2° above the ambient temperature."................................................................................................................................ 22
• Deleted "Thermal Resistance for Various Copper Heatsinking Patterns" table................................................................... 33
Changes from Revision D (September 2013) to Revision E Page
• Added Pin Configuration and Functions section, ESD Ratings table, Feature Description section, Device Functional
Modes,Application and Implementation section, Power Supply Recommendations section, Layout section, Device
and Documentation Support section, and Mechanical, Packaging, and Orderable Information section; updated
Thermal Information values; deleted obsolete LP2953AM references .................................................................................. 1
Changes from Revision C (March 2005) to Revision D Page
• Changed layout of National Data Sheet to TI format ........................................................................................................... 30
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5 Pin Configuration and Functions
16 Pins 16 Pins
LP2952 SOIC (D) Package LP2953 SOIC (D) Package
Top View Top View
16 Pins
LP2953 PDIP (NBG) Package
Top View
Pin Functions LP2952-N
PIN I/O DESCRIPTION
NAME SOIC(D)
ERROR 6 O Error signal output
FEEDBACK 14 I Error amplifier noninverting input
GROUND 1, 8, 9, 16 - Ground
IN 15 I Regulator power input
NC 2, 7, 10, 11 - NC
OUT 3 O Regulated output voltage
REFERENCE 12 O Internal reference voltage output
SENSE 4 I Feedback voltage sense input
SHUTDOWN 5 I Shutdown input
VTAP 13 I Internal resistor divider input
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Pin Functions LP2953
PIN I/O DESCRIPTION
NAME SOIC(D) PDIP(NBG)
COMPIN 10 15 I Auxiliary comparator input
COMPOUT 11 14 O Auxiliary comparator output
ERROR 6 10 O Error signal output
FEEDBACK 14 2 I Error amplifier noninverting input
GROUND 1, 8, 9, 16 4, 5, 12, 13 - Ground
IN 15 3 I Regulator power input
NC 2, 7 7, 11 - NC
OUT 3 6 O Regulated output voltage
REFERENCE 12 16 O Internal reference voltage output
SENSE 4 8 I Feedback voltage sense input
SHUTDOWN 5 9 I Shutdown input
VTAP 13 1 I Internal resistor divider input
6 Specifications
6.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted)(1)
MIN MAX UNIT
Power dissipation(2) Internally Limited
Input supply voltage −20 30 V
FEEDBACK input voltage(3) −0.3 5 V
Comparator input voltage(4) −0.3 30 V
SHUTDOWN input voltage(4) −0.3 30 V
Comparator output voltage(4) −0.3 30 V
Maximum junction temperature 150 °C
Storage temperature, Tstg −65 150 °C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) The maximum allowable power dissipation is a function of the maximum junction temperature, TJ(MAX), the junction-to-ambient thermal
resistance, RθJA, and the ambient temperature, TA. The maximum allowable power dissipation at any ambient temperature is calculated
using the equation for P(MAX): P(MAX) = (TJ(MAX) – TA) / RθJA.
Exceeding the maximum allowable power dissipation will cause excessive die temperature, and the regulator will go into thermal
shutdown. See Power Supply Recommendations for additional information on heatsinking and thermal resistance.
(3) When used in dual-supply systems where the regulator load is returned to a negative supply, the output voltage must be diode-clamped
to ground.
(4) May exceed the input supply voltage.
6.2 ESD Ratings VALUE UNIT
Electrostatic Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, all pins(1) ±2000
V(ESD) V
discharge
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
6.3 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted) MIN MAX UNIT
Operating junction temperature −40 125 °C
Input supply voltage 2.3 30 V
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6.4 Thermal Information LP2952, LP2953 LP2953
THERMAL METRIC(1) SOIC (D) PDIP (NBG) UNIT
16 PINS
RθJA Junction-to-ambient thermal resistance 76.9 42.1
RθJC(top) Junction-to-case (top) thermal resistance 37.4 28.1
RθJB Junction-to-board thermal resistance 34.6 22.2 °C/W
ψJT Junction-to-top characterization parameter 7.3 12.0
ψJB Junction-to-board characterization parameter 34.3 22.1
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
6.5 Electrical Characteristics: 3.3-V Versions
Limits are assured by production testing or correlation techniques using standard Statistical Quality Control (SQC) methods.
Unless otherwise specified: MIN (minimum) and MAX (maximum) specifications in apply over the full Operating Temperature
Range and TYP (typical) values apply at TJ= 25°C, VIN = VOUT(NOM) + 1 V, IOUT = 1 mA, COUT = 2.2 μF for 5-V parts and 4.7
μF for 3.3-V parts. FEEDBACK pin is tied to VTAP pin, OUT pin is tied to SENSE pin.
LP2952AI-3.3, LP2953AI-3.3 LP2952I-3.3, LP2953I-3.3
PARAMETER TEST CONDITIONS UNIT
MIN TYP MAX MIN TYP MAX
TJ= 25°C 3.284 3.3 3.317 3.267 3.3 3.333
VOUT Output voltage 3.260 3.3 3.340 3.234 3.3 3.366 V
1 mA ≤IOUT ≤250 mA 3.254 3.3 3.346 3.221 3.3 3.379
6.6 Electrical Characteristics: 5-V Versions
Limits are assured by production testing or correlation techniques using standard Statistical Quality Control (SQC) methods.
Unless otherwise specified, MIN (minimum) and MAX (maximum) specifications in apply over the full Operating Temperature
Range and TYP (typical) values apply at TJ= 25°C, VIN = VOUT(NOM) + 1 V, IOUT = 1 mA, COUT = 2.2 μF for 5-V parts and 4.7
μF for 3.3-V parts. FEEDBACK pin is tied to VTAP pin, OUT pin is tied to SENSE pin.
LP2952AI, LP2953AI LP2952I, LP2953I
PARAMETER TEST CONDITIONS UNIT
MIN TYP MAX MIN TYP MAX
TJ= 25°C 4.975 5 5.025 4.95 5 5.05
VOUT Output voltage 4.94 5 5.06 4.9 5 5.1 V
1 mA ≤IOUT ≤250 mA 4.93 5 5.07 4.88 5 5.12
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ûVOUT
ûPD
ûVOUT
ûV
ûVOUT
ûV
ûVOUT
ûT
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6.7 Electrical Characteristics: All Voltage Options
Limits are assured by production testing or correlation techniques using standard Statistical Quality Control (SQC) methods.
Unless otherwise specified, MIN (minimum) and MAX (maximum) specifications in apply over the full Operating Temperature
Range and TYP (typical) values apply at TJ= 25°C, VIN = VOUT(NOM) + 1 V, IOUT = 1 mA, COUT = 2.2 μF for 5-V parts and 4.7
μF for 3.3-V parts. FEEDBACK pin is tied to VTAP pin, OUT pin is tied to SENSE pin.
LP2952AI, LP2953AI, LP2952I, LP2953I,
LP2952AI-3.3, LP2953AI-3.3(1) LP2952I-3.3, LP2953I-3.3
PARAMETER TEST CONDITIONS UNIT
MIN TYP MAX MIN TYP MAX
REGULATOR
Output voltage
temperature See(2) 20 100 20 150 ppm/°C
coefficient TJ= 25°C 0.03% 0.1% 0.03% 0.2%
Output voltage VIN = VOUT(NOM) + 1 V to 30 V
line regulation VIN = VOUT(NOM) + 1 V to 30 V 0.03% 0.2% 0.03% 0.4%
TJ= 25°C 0.04% 0.16% 0.04% 0.20%
Output voltage IOUT = 1 mA to 250 mA
load regulation(3) IOUT = 0.1 mA to 1 mA 0.04% 0.20% 0.04% 0.30%
TJ= 25°C, IOUT = 1 mA 60 100 60 100
IOUT = 1 mA 60 150 60 150
IOUT = 50 mA 240 300 240 300
IOUT = 50 mA 240 420 240 420
Dropout
VIN – VOUT mV
voltage(4) TJ= 25°C, IOUT = 100 mA 310 400 310 400
IOUT = 100 mA 310 520 310 520
TJ= 25°C, IOUT = 250 mA 470 600 470 600
IOUT = 250 mA 470 800 470 800
TJ= 25°C, IOUT = 1 mA 130 170 130 170 μA
IOUT = 1 mA 130 200 130 200
TJ= 25°C, IOUT = 50 mA 1.1 2 1.1 2
IOUT = 50 mA 1.1 2.5 1.1 2.5
Ground pin
IGND current(5) TJ= 25°C, IOUT = 100 mA 4.5 6 4.5 6 mA
IOUT = 100 mA 4.5 8 4.5 8
TJ= 25°C, IOUT = 250 mA 21 28 21 28
IOUT = 250 mA 21 33 21 33
VIN = VOUT(NOM) −0.5 V 165 210 165 210
Ground pin
IGND current at μA
IOUT = 100 μA165 240 165 240
dropout –40°C ≤TJ≤125°C
Ground pin
IGND current at TJ= 25°C, VSHUTDOWN ≤1.1 V 105 140 105 140 μA
shutdown(5)
TJ= 25°C, VOUT = 0 380 500 380 500
ILIMIT Current limit mA
VOUT = 0 380 530 380 530
Thermal TJ= 25°C; see(6) 0.05 0.2 0.05 0.2 %/W
regulation
(1) Drive SHUTDOWN pin with TTL or CMOS low level to shut off regulator, high level to turn on regulator.
(2) Output or reference voltage temperature coefficient is defined as the worst-case voltage change divided by the total temperature range.
(3) Load regulation is measured at constant junction temperature using low duty-cycle pulse testing. Two separate tests are performed, one
for the range of IOUT = 100 μA to 1 mA and one for the range of IOUT =1 mA to 250 mA. Changes in output voltage due to heating
effects are covered by the thermal regulation specification.
(4) Dropout voltage is defined as the input-to-output differential at which the output voltage drops 100 mV below the value measured with a
1-V differential. At very low values of programmed output voltage, the input voltage minimum of 2 V (2.3 V over temperature) must be
observed.
(5) Ground pin current is the regulator quiescent current. The total current drawn from the source is the sum of the ground pin current,
output load current, and current through the external resistive divider (if used).
(6) Thermal regulation is the change in output voltage at a time t after a change in power dissipation, excluding load or line regulation
effects. Specifications are for a 200-mA load pulse at VIN = VOUT(NOM) + 15 V (3-W pulse) for t = 10 ms.
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Electrical Characteristics: All Voltage Options (continued)
Limits are assured by production testing or correlation techniques using standard Statistical Quality Control (SQC) methods.
Unless otherwise specified, MIN (minimum) and MAX (maximum) specifications in apply over the full Operating Temperature
Range and TYP (typical) values apply at TJ= 25°C, VIN = VOUT(NOM) + 1 V, IOUT = 1 mA, COUT = 2.2 μF for 5-V parts and 4.7
μF for 3.3-V parts. FEEDBACK pin is tied to VTAP pin, OUT pin is tied to SENSE pin.
LP2952AI, LP2953AI, LP2952I, LP2953I,
LP2952AI-3.3, LP2953AI-3.3(1) LP2952I-3.3, LP2953I-3.3
PARAMETER TEST CONDITIONS UNIT
MIN TYP MAX MIN TYP MAX
Output noise COUT = 4.7 μF 400 400
voltage (10 Hz μV
COUT = 33 μF 260 260
ento 100 kHz) RMS
COUT = 33 μF(7) 80 80
IOUT = 100 mA TJ= 25°C, see(8) 1.215 1.23 1.245 1.205 1.23 1.255
Reference
VREF V
voltage see(8), 1.205 1.255 1.19 1.27
Reference VIN = 2.5 V to VOUT + 1 V 0.03% 0.1% 0.03% 0.2%
voltage line VIN = VOUT(NOM)+ 1 V to 30 V(9) 0.03% 0.2% 0.03% 0.4%
regulation
Reference TJ= 25°C, IREF = 0 to 200 μA 0.25% 0.4% 0.25% 0.8%
voltage load IREF = 0 to 200 μA 0.25% 0.6% 0.25% 1.0%
regulation
Reference
voltage See(2), –40°C ≤TJ≤125°C 20 20 ppm/°C
temperature
coefficient TJ= 25°C 20 40 20 40
Feedback pin
IB(FB) nA
bias current 20 60 20 60
TJ= 25°C; see (10) 30 30
Output off
IO(SINK) mA
pulldown current See (10) 20 20
DROPOUT DETECTION COMPARATOR
TJ= 25°C, VOH = 30 V 0.01 1 0.01 1
Output high
IOH μA
leakage VOH = 30 V 0.01 2 0.01 2
TJ= 25°C, VIN = VOUT(NOM) −
0.5 V 150 250 150 250
Output low IOUT(COMP) = 400 μA
VOL mV
voltage VIN = VOUT(NOM) −0.5 V 150 400 150 400
IOUT(COMP) = 400 μA
TJ= 25°C, see(11) −80 −60 −35 −80 −60 −35
Upper threshold
VTHR(MAX) mV
voltage See(11) −95 −60 −25 −95 −60 −25
TJ= 25°C, see(11) −110 −85 −55 −110 −85 −55
Lower threshold
VTHR(MIN) mV
voltage See(11) −160 −85 −40 −160 −85 −40
HYST Hysteresis See(11) 15 15 mV
(7) Connect a 0.1-μF capacitor from the OUT pin to the FEEDBACK pin.
(8) VREF ≤VOUT ≤(VIN −1 V), 2.3 V ≤VIN ≤30 V, 100 μA≤IOUT ≤250 mA.
(9) Two separate tests are performed, one covering 2.5 V ≤VIN ≤VOUT(NOM)) + 1 V and the other test for VOUT(NOM) + 1 V ≤VIN ≤30 V.
(10) VSHUTDOWN ≤1.1 V, VOUT = VOUT(NOM)
(11) Comparator thresholds are expressed in terms of a voltage differential at the FEEDBACK pin below the nominal reference voltage
measured at VIN = VOUT(NOM) + 1 V. To express these thresholds in terms of output voltage change, multiply by the error amplifier gain,
which is VOUT / VREF = (R1 + R2) / R2 (see Figure 31).
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Electrical Characteristics: All Voltage Options (continued)
Limits are assured by production testing or correlation techniques using standard Statistical Quality Control (SQC) methods.
Unless otherwise specified, MIN (minimum) and MAX (maximum) specifications in apply over the full Operating Temperature
Range and TYP (typical) values apply at TJ= 25°C, VIN = VOUT(NOM) + 1 V, IOUT = 1 mA, COUT = 2.2 μF for 5-V parts and 4.7
μF for 3.3-V parts. FEEDBACK pin is tied to VTAP pin, OUT pin is tied to SENSE pin.
LP2952AI, LP2953AI, LP2952I, LP2953I,
LP2952AI-3.3, LP2953AI-3.3(1) LP2952I-3.3, LP2953I-3.3
PARAMETER TEST CONDITIONS UNIT
MIN TYP MAX MIN TYP MAX
SHUTDOWN INPUT(12)
TJ= 25°C −7.5 ±3 7.5 −7.5 ±3 7.5
Input offset (Referred to VREF)
VOS mV
voltage −10 10 −10 10
HYST Hysteresis 6 6 mV
TJ= 25°C −30 10 30 −30 10 −30
Input bias VIN(SD) = 0 V to 5 V
IBnA
current VIN(SD) = 0 V to 5 V −50 50 −50 50
AUXILIARY COMPARATOR (LP2953 Only)
TJ= 25°C −7.5 ±3 7.5 −7.5 ±3 7.5
Input offset (Referred to VREF)
VOS mV
voltage (Referred to VREF)−10 ±3 10 −10 ±3 10
HYST Hysteresis 6 6 mV
TJ= 25°C, VIN(COMP) = 0 V to 5 −30 10 30 −30 10 30
Input bias V
IBnA
current VIN(COMP) = 0 V to 5 V −50 10 50 −50 10 50
TJ= 25°C, VOH = 30 V 0.01 1 0.01 1
Output high
IOH μA
leakage VIN(COMP) = 1.3 V 0.01 2 0.01 2
TJ= 25°C, VIN(COMP) = 1.1 V 150 250 150 250
Output low
VOL mV
voltage IOUT(COMP) = 400 μA 150 400 150 400
(12) Drive SHUTDOWN pin with TTL or CMOS-low level to shut regulator OFF, high level to turn regulator ON.
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6.8 Typical Characteristics
Unless otherwise specified: VIN = 6 V, IOUT = 1 mA, COUT = 2.2 μF, VSD = 3 V, TA= 25°C, VOUT = 5 V.
Figure 1. Quiescent Current Figure 2. Quiescent Current
Figure 4. Ground Pin Current
Figure 3. Ground Pin Current vs Load
Figure 5. Ground Pin Current Figure 6. Output Noise Voltage
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Typical Characteristics (continued)
Unless otherwise specified: VIN = 6 V, IOUT = 1 mA, COUT = 2.2 μF, VSD = 3 V, TA= 25°C, VOUT = 5 V.
Figure 7. Ripple Rejection Figure 8. Ripple Rejection
Figure 10. Line Transient Response
Figure 9. Ripple Rejection
Figure 11. Line Transient Response Figure 12. Output Impedance
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Typical Characteristics (continued)
Unless otherwise specified: VIN = 6 V, IOUT = 1 mA, COUT = 2.2 μF, VSD = 3 V, TA= 25°C, VOUT = 5 V.
Figure 13. Load Transient Response Figure 14. Load Transient Response
Figure 16. Enable Transient
Figure 15. Dropout Characteristics
Figure 17. Enable Transient Figure 18. Short-Circuit Output Current and Maximum
Output Current
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Typical Characteristics (continued)
Unless otherwise specified: VIN = 6 V, IOUT = 1 mA, COUT = 2.2 μF, VSD = 3 V, TA= 25°C, VOUT = 5 V.
Figure 19. Feedback Bias Current Figure 20. FEEDBACK Pin Current
Figure 22. Comparator Sink Current
Figure 21. Error Output
Figure 23. Divider Resistance Figure 24. Dropout Detection Comparator Threshold
Voltages
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Typical Characteristics (continued)
Unless otherwise specified: VIN = 6 V, IOUT = 1 mA, COUT = 2.2 μF, VSD = 3 V, TA= 25°C, VOUT = 5 V.
Figure 25. Thermal Regulation Figure 26. Minimum Operating Voltage
Figure 27. Dropout Voltage
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7 Detailed Description
7.1 Overview
The LP2952 and LP2953 are very high accuracy micropower voltage regulators with low quiescent current (130
μA, typical) and low dropout voltage (typically 60 mV at light loads and 490 mV at 250 mA). They are ideally
suited for use in battery-powered systems.
The LP2952 and LP2953 block diagram contains several features, including:
• Very high accuracy 1.23-V reference.
• Internal protection circuitry, such as thermal foldback current limit, thermal shutdown protection, and reverse
battery-input protection.
• Fixed 5-V and 3.3-V versions.
• Error flag output which may be used for a power-on reset.
• Shutdown input, allowing turn off the regulator when the SHUTDOWN pin is pulled low.
LP2953 versions only:
• An auxiliary comparator is designed for customer special purpose when shutdown is activated, this is a
CMOS- or TTL-compatible output level.
• Automatic output discharge when the SHUTDOWN pin is pulled low.
7.2 Functional Block Diagrams
Figure 28. LP2952 Block Diagram
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