Sense & Control
Data Sheet
Revision 1.0, 2012-05-15
TLE4964-1K
High Precision Automotive Hall Effect Switch
Edition 2012-05-15
Published by
Infineon Technologies AG
81726 Munich, Germany
© 2012 Infineon Technologies AG
All Rights Reserved.
Legal Disclaimer
The information given in this document shall in no event be regarded as a guarantee of conditions or
characteristics. With respect to any examples or hints given herein, any typical values stated herein and/or any
information regarding the application of the device, Infineon Technologies hereby disclaims any and all warranties
and liabilities of any kind, including without limitation, warranties of non-infringement of intellectual property rights
of any third party.
Information
For further information on technology, delivery terms and conditions and prices, please contact the nearest
Infineon Technologies Office (www.infineon.com).
Warnings
Due to technical requirements, components may contain dangerous substances. For information on the types in
question, please contact the nearest Infineon Technologies Office.
Infineon Technologies components may be used in life-support devices or systems only with the express written
approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure
of that life-support device or system or to affect the safety or effectiveness of that device or system. Life support
devices or systems are intended to be implanted in the human body or to support and/or maintain and sustain
and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other persons may
be endangered.
TLE4964-1K
Data Sheet 3 Revision 1.0, 2012-05-15
Trademarks of Infineon Technologies AG
AURIX™, C166™, CanPAK™, CIPOS™, CIPURSE™, EconoPACK™, CoolMOS™, CoolSET™,
CORECONTROL™, CROSSAVE™, DAVE™, EasyPIM™, EconoBRIDGE™, EconoDUAL™, EconoPIM™,
EiceDRIVER™, eupec™, FCOS™, HITFET™, HybridPACK™, I²RF™, ISOFACE™, IsoPACK™, MIPAQ™,
ModSTACK™, my-d™, NovalithIC™, OptiMOS™, ORIGA™, PRIMARION™, PrimePACK™, PrimeSTACK™,
PRO-SIL™, PROFET™, RASIC™, ReverSave™, SatRIC™, SIEGET™, SINDRION™, SIPMOS™,
SmartLEWIS™, SOLID FLASH™, TEMPFET™, thinQ!™, TRENCHSTOP™, TriCore™.
Other Trademarks
Advance Design System™ (ADS) of Agilent Technologies, AMBA™, ARM™, MULTI-ICE™, KEIL™,
PRIMECELL™, REALVIEW™, THUMB™, µVision™ of ARM Limited, UK. AUTOSAR™ is licensed by AUTOSAR
development partnership. Bluetooth™ of Bluetooth SIG Inc. CAT-iq™ of DECT Forum. COLOSSUS™,
FirstGPS™ of Trimble Navigation Ltd. EMV™ of EMVCo, LLC (Visa Holdings Inc.). EPCOS™ of Epcos AG.
FLEXGO™ of Microsoft Corporation. FlexRay™ is licensed by FlexRay Consortium. HYPERTERMINAL™ of
Hilgraeve Incorporated. IEC™ of Commission Electrotechnique Internationale. IrDA™ of Infrared Data
Association Corporation. ISO™ of INTERNATIONAL ORGANIZATION FOR STANDARDIZATION. MATLAB™ of
MathWorks, Inc. MAXIM™ of Maxim Integrated Products, Inc. MICROTEC™, NUCLEUS™ of Mentor Graphics
Corporation. Mifare™ of NXP. MIPI™ of MIPI Alliance, Inc. MIPS™ of MIPS Technologies, Inc., USA. muRata™
of MURATA MANUFACTURING CO., MICROWAVE OFFICE™ (MWO) of Applied Wave Research Inc.,
OmniVision™ of OmniVision Technologies, Inc. Openwave™ Openwave Systems Inc. RED HAT™ Red Hat, Inc.
RFMD™ RF Micro Devices, Inc. SIRIUS™ of Sirius Satellite Radio Inc. SOLARIS™ of Sun Microsystems, Inc.
SPANSION™ of Spansion LLC Ltd. Symbian™ of Symbian Software Limited. TAIYO YUDEN™ of Taiyo Yuden
Co. TEAKLITE™ of CEVA, Inc. TEKTRONIX™ of Tektronix Inc. TOKO™ of TOKO KABUSHIKI KAISHA TA.
UNIX™ of X/Open Company Limited. VERILOG™, PALLADIUM™ of Cadence Design Systems, Inc. VLYNQ™
of Texas Instruments Incorporated. VXWORKS™, WIND RIVER™ of WIND RIVER SYSTEMS, INC. ZETEX™ of
Diodes Zetex Limited.
Last Trademarks Update 2011-02-24
Revision History
Page or Item Subjects (major changes since previous revision)
Revision 1.0, 2012-05-15
13 Table 3-1 Lifetime statement added
13,14 VQ Min changed
17 Packing Information added
TLE4964-1K
Table of Contents
Data Sheet 4 Revision 1.0, 2012-05-15
Table of Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
List of Figures . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
List of Tables . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
1 Product Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
1.1 Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
1.2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
1.3 Target Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
2 Functional Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
2.1 General . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
2.2 Pin Configuration (top view) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
2.3 Pin Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
2.4 Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
2.5 Functional Block Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
2.6 Start-up behavior . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
3 Specification . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
3.1 Application Circuit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
3.2 Absolute Maximum Ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
3.3 Operating Range . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
3.4 Electrical and Magnetic Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
3.5 Electro Magnetic Compatibility . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
4 Package Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
4.1 Package Outline PG-SC59-3-5 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
4.2 Packing Information PG-SC59-3-5 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
4.3 Footprint PG-SC59-3-5 and PG-SOT23-3-15 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
4.4 PG-SC59-3-5 Distance between Chip and Package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
4.5 Package Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
5 Graphs of the Magnetic Parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
6 Graphs of the Electrical Parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
Table of Contents
TLE4964-1K
List of Figures
Data Sheet 5 Revision 1.0, 2012-05-15
Figure 1-1 Image of TLE4964-1K in the PG-SC59-3-5 package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Figure 2-1 Pin Configuration and Center of Sensitive Area . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Figure 2-2 Functional Block Diagram TLE4964-1K . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Figure 2-3 Timing Diagram TLE4964-1K . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Figure 2-4 Output Signal TLE4964-1K. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Figure 2-5 Illustration of the start-up behavior of the TLE4964-1K . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Figure 3-1 Application Circuit 1: with external resistor. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Figure 3-2 Application Circuit 2: without external resistor . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Figure 3-3 Definition of magnetic field direction PG-SC59-3-5 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Figure 3-4 EMC test circuit. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
Figure 4-1 PG-SC59-3-5 Package Outline (All dimensions in mm) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
Figure 4-2 Packing of the PG-SC59-3-5 in a tape . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
Figure 4-3 Footprint PG-SC59-3-5 and PG-SOT23-3-15. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
Figure 4-4 Distance between chip and package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
Figure 4-5 Marking of TLE4964-1K . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
Figure 5-1 Operating Point (BOP) of the TLE4964-1K over Temperature. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
Figure 5-2 Release Point (BRP) of the TLE4964-1K over Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
Figure 5-3 Hysteresis (BHys) of the TLE4964-1K over Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
Figure 6-1 Power On Time tPON of the TLE4964-1K over Temperature. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
Figure 6-2 Signal Delay Time of the TLE4964-1K over Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
Figure 6-3 Supply Current of the TLE4964-1K over Temperature. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
Figure 6-4 Supply Current of the TLE4964-1K over Supply Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
Figure 6-5 Output Current Limit of the TLE4964-1K over Temperature. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
Figure 6-6 Output Current Limit of the TLE4964-1K over applied Pull-up Voltage . . . . . . . . . . . . . . . . . . . . . 22
Figure 6-7 Output Fall Time of the TLE4964-1K over Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
Figure 6-8 Output Fall Time of the TLE4964-1K over applied Pull-up Voltage . . . . . . . . . . . . . . . . . . . . . . . . 23
Figure 6-9 Output Rise Time of the TLE4964-1K over Temperature. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
Figure 6-10 Output Rise Time of the TLE4964-1K over applied Pull-up Voltage. . . . . . . . . . . . . . . . . . . . . . . . 23
Figure 6-11 Output Leakage Current of the TLE4964-1K over Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . 24
Figure 6-12 Saturation Voltage of the TLE4964-1K over Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
Figure 6-13 Saturation Voltage of the TLE4964-1K over Output Current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
Figure 6-14 Effective Noise of the TLE4964-1K Thresholds over Temperature . . . . . . . . . . . . . . . . . . . . . . . . 25
Figure 6-15 Output Signal Jitter of the TLE4964-1K over Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
List of Figures
TLE4964-1K
List of Tables
Data Sheet 6 Revision 1.0, 2012-05-15
Table 1-1 Ordering Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Table 2-1 Pin Description PG-SC59-3-5 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Table 3-1 Absolute Maximum Rating Parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Table 3-2 ESD Protection (TA = 25°C) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Table 3-3 Operating Conditions Parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Table 3-4 General Electrical Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Table 3-5 Magnetic Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Table 3-6 Magnetic Compatibility . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
Table 3-7 Electro Magnetic Compatibility . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
List of Tables
TLE4964-1K
Product Description
Data Sheet 7 Revision 1.0, 2012-05-15
1 Product Description
1.1 Overview
Figure 1-1 Image of TLE4964-1K in the PG-SC59-3-5 package
1.2 Features
3.0 V to 32 V operating supply voltage
Operation from unregulated power supply
Reverse polarity protection (-18 V)
Overvoltage capability up to 42 V without external resistor
Output overcurrent & overtemperature protection
Active error compensation
High stability of magnetic thresholds
Low jitter (typ. 0.35 μs)
High ESD performance
SOT23 like SMD package PG-SC59-3-5 (TLE4964-1K)
1.3 Target Applications
Target applications for the TLE496x Hall switch family are all applications which require a high precision Hall
switch with an operating temperature range from -40°C to 170°C. Its superior supply voltage range from 3.0 V to
32 V with overvoltage capability (e.g. load-dump) up to 42 V without external resistor makes it ideally suited for
automotive and industrial applications.
The TLE4964-1K is a unipolar switch with a typical operating point BOP = 18 mT and a hysteresis of BHYS = 5.5 mT.
It is ideally suited for various position detection applications.
Characteristic Supply Voltage Supply Current Sensitivity Interface Temperature
Unipolar Hall
Effect Switch
3.0~32 V 1.6 mA Low
BOP:18 mT
BRP:12.5 mT
Open Drain
Output
-40°C to 170°C
Table 1-1 Ordering Information
Product Name Product Type Ordering Code Package
TLE4964-1K Unipolar Hall Switch SP000848000 PG-SC59-3-5
TLE4964-1K
Functional Description
Data Sheet 8 Revision 1.0, 2012-05-15
2 Functional Description
2.1 General
The TLE4964-1K is an integrated Hall effect switch designed specifically for highly accurate applications with
superior supply voltage capability, operating temperature range and temperature stability of the magnetic
thresholds.
2.2 Pin Configuration (top view)
Figure 2-1 Pin Configuration and Center of Sensitive Area
2.3 Pin Description
Table 2-1 Pin Description PG-SC59-3-5
Pin No. Symbol Function
1 VDD Supply voltage
2 Q Output
3 GND Ground
Center of
Sensitive Area
1
1.5
±0.1
2
3
SC59
0.8
±0.1
TLE4964-1K
Functional Description
Data Sheet 9 Revision 1.0, 2012-05-15
2.4 Block Diagram
Figure 2-2 Functional Block Diagram TLE4964-1K
2.5 Functional Block Description
The chopped Hall IC switch comprises a Hall probe, bias generator, compensation circuits, oscillator and output
transistor.
The bias generator provides currents for the Hall probe and the active circuits. Compensation circuits stabilize the
temperature behavior and reduce influence of technology variations.
The active error compensation (chopping technique) rejects offsets in the signal path and the influence of
mechanical stress to the Hall probe caused by molding and soldering processes and other thermal stress in the
package. The chopped measurement principle together with the threshold generator and the comparator ensures
highly accurate and temperature stable magnetic thresholds.
The output transistor has an integrated overcurrent and overtemperature protection.
Voltage
Regulator
Bias and
Compensation
Circuits
Oscillator and
Sequencer
To All Subcircuits
Spinning Hall
Probe
Chopper
Multiplexer
Amplifier
Demodulator
Low Pass
Filter
Comparator
with
Hysteresis
Control
Overtemperature
& overcurrent
protection
GND
Q
V
DD
Reference
TLE4964-1K
Functional Description
Data Sheet 10 Revision 1.0, 2012-05-15
Figure 2-3 Timing Diagram TLE4964-1K
Figure 2-4 Output Signal TLE4964-1K
Applied
Magnetic
Field
90%
10%
V
Q
t
f
t
d
t
r
t
d
B
OP
B
RP
V
Q
B
OP
B
RP
0
B
TLE4964-1K
Functional Description
Data Sheet 11 Revision 1.0, 2012-05-15
2.6 Start-up behavior
The magnetic threshold exhibit a hysteresis BHYS = BOP-BRP. In case of a power-on with a magnetic field B within
hysteresis (BRP < B < BOP) the output of the sensor is set to “HIGH” per default. After the first crossing of BOP or
BRP of the magnetic field the output is set to the correct value.
Figure 2-5 Illustration of the start-up behavior of the TLE4964-1K
t
3V
t
t
V
Q
t
B > B
OP
B < B
RP
B
OP
> B > B
RP
Magnetic field above threshold
Magnetic field below threshold
Magnetic field in hysteresis
Power on ramp The device always applies
V
Q
level at start -up
independent from the
applied magnetic field !
V
Q
V
Q
V
S
t
Pon
TLE4964-1K
Specification
Data Sheet 12 Revision 1.0, 2012-05-15
3 Specification
3.1 Application Circuit
The following Figure 3-1 shows one option of an application circuit. As explained above the resistor RS can be left
out (see Figure 3-2). The resistor RQ has to be in a dimension to match the applied VS to keep IQ limited to the
operating range of maximum 25 mA.
e.g.:
VS = 12 V
IQ = 12 V/1200 = 10 mA
Figure 3-1 Application Circuit 1: with external resistor
Figure 3-2 Application Circuit 2: without external resistor
TLE496x
GND
Vs
R
Q
= 1.2kΩ
C
DD
= 47nF
V
DD
Q
TVS diode
e.g. ESD24VS2U
R
S
= 100Ω
TLE496x
GND
Vs
R
Q
= 1.2kΩ
C
DD
= 47nF
V
DD
Q
TVS diode
e.g. ESD24VS2U
TLE4964-1K
Specification
Data Sheet 13 Revision 1.0, 2012-05-15
3.2 Absolute Maximum Ratings
Attention: Stresses above the max. values listed here may cause permanent damage to the device.
Exposure to absolute maximum rating conditions for extended periods may affect device
reliability. Maximum ratings are absolute ratings; exceeding only one of these values may
cause irreversible damage to the integrated circuit.
Calculation of the dissipated power PDIS and junction temperature TJ of the chip (SC59 example):
e.g for: VDD = 12 V, IS = 2.5 mA, VQSAT = 0.5 V, IQ = 20 mA
Power dissipation: PDIS = 12 V x 2.5 mA + 0.5 V x 20 mA = 30 mW + 10 mW = 40 mW
Temperature T = RthJA x PDIS = 300 K/W x 40 mW = 12 K
For TA = 150 °C: TJ = TA + T = 150 °C + 12 K = 162 °C
Table 3-1 Absolute Maximum Rating Parameters
Parameter Symbol Values Unit Note / Test Condition
Min. Typ. Max.
Supply voltage VDD -18 32
42
V
10h, no external resistor required
Output voltage VQ-0.5 32 V
Reverse output current IQ-70 mA
Junction temperature1)
1) This lifetime statement is an anticipation based on an extrapolation of Infineon’s qualification test results. The actual lifetime
of a component depends on its form of application and type of use etc. and may deviate from such statement. The lifetime
statement shall in no event extend the agreed warranty period.
TJ-40 155
165
175
195
°C for 2000h (not additive)
for 1000h (not additive)
for 168h (not additive)
for 3 x 1h (additive)
Storage temperature TS-40 150 °C
Thermal resistance
Junction ambient
RthJA 300 K/W for PG-SC59-3-5 (2s2p)
Thermal resistance
Junction lead
RthJL 100 K/W for PG-SC59-3-5
Table 3-2 ESD Protection1) (TA = 25°C)
1) Characterization of ESD is carried out on a sample basis, not subject to production test.
Parameter Symbol Values Unit Note / Test Condition
Min. Typ. Max.
ESD voltage (HBM)2)
2) Human Body Model (HBM) tests according to EIA/JESD22-A114.
VESD -7 7 kV R = 1.5 k, C = 100 pF
ESD voltage (SDM)3)
3) Socket device model (SDM) tests according to EOS/ESD-DS5.3-1993.
-1 1
ESD voltage (system level)4)
4) Gun test (2k / 330pF or 330 / 150pF) according to ISO 10605-2008.
-15 15 with circuit shown in
Figure 3-1 & Figure 3-2
TLE4964-1K
Specification
Data Sheet 14 Revision 1.0, 2012-05-15
3.3 Operating Range
The following operating conditions must not be exceeded in order to ensure correct operation of the TLE4964-1K.
All parameters specified in the following sections refer to these operating conditions unless otherwise mentioned.
3.4 Electrical and Magnetic Characteristics
Product characteristics involve the spread of values guaranteed within the specified voltage and ambient
temperature range. Typical characteristics are the median of the production and correspond to VDD = 12 V and
TA = 25°C. The below listed specification is valid in combination with the application circuit shown in Figure 3-1
and Figure 3-2
Table 3-3 Operating Conditions Parameters
Parameter Symbol Values Unit Note / Test Condition
Min. Typ. Max.
Supply voltage VDD 3.0 321)
1) Latch-up test with factor 1.5 is not covered. Please see max ratings also.
V
Output voltage VQ-0.3 32 V
Junction temperature Tj-40 170 °C
Output current IQ025mA
Magnetic signal input frequency2)
2) For operation at the maximum switching frequency the magnetic input signal must be 1.4 times higher than for static fields.
This is due to the -3dB corner frequency of the internal low-pass filter in the signal path.
fSW 010kHz
Table 3-4 General Electrical Characteristics
Parameter Symbol Values Unit Note / Test Condition
Min. Typ. Max.
Supply current IS1.11.62.5mA
Reverse current ISR 0.05 1 mA for VDD = -18 V
Output saturation
voltage
VQSAT 0.2 0.5 V IQ = 20 mA
0.24 0.6 V IQ = 25 mA
Output leakage
current
IQLEAK 10 μA
Output current
limitation
IQLIMIT 30 56 70 mA internally limited & thermal
shutdown
Output fall time1)
1) Not subject to production test, verified by design/characterization.
tf0.17 0.4 1 μs1.2k / 50 pF, see Figure 2-3
Output rise time1) tr0.4 0.5 1 μs1.2k / 50 pF, see Figure 2-3
Output jitter1)2)
2) Output jitter is the 1σ value of the output switching distribution.
tQJ 0.35 1 μs For square wave signal with 1 kHz
Delay time1)3)
3) Systematic delay between magnetic threshold reached and output switching.
td12 15 30 μssee Figure 2-3
Power-on time1)4)
4) Time from applying VDD = 3.0 V to the sensor until the output is valid.
tPON 80 150 μsV
DD =3V,BBRP -0.5mTor
BBOP +0.5mT
Chopper frequency1) fOSC 350 kHz
TLE4964-1K
Specification
Data Sheet 15 Revision 1.0, 2012-05-15
Field Direction Definition
Positive magnetic fields are defined with the south pole of the magnet to the branded side of package.
Figure 3-3 Definition of magnetic field direction PG-SC59-3-5
Table 3-5 Magnetic Characteristics
Parameter Symbol T (°C) Values Unit Note / Test
Condition
Min. Typ. Max.
Operating point BOP -40 13.5 19.4 25.3 mT
25 12.5 18.0 23.5
170 10.2 14.9 19.6
Release point BRP -40 9.1 13.5 17.9 mT
25 8.4 12.5 16.6
170 6.7 10.3 13.9
Hysteresis BHYS -40 4.4 5.9 8.0 mT
25 4.1 5.5 7.5
170 3.4 4.6 6.3
Effective noise value of the
magnetic switching points1)
1) The magnetic noise is normal distributed and can be assumed as nearly independent to frequency without sampling noise
or digital noise effects. The typical value represents a the rms-value and corresponds therefore to a 1 σ probability of
normal distribution. Consequently a 3 σ value corresponds to 99.7% probability of appearance.
BNeff 25 62 μT
Temperature compensation of
magnetic thresholds2)
2) Not subject to production test, verified by design/characterization.
TC-1200 ppm/K
TLE4964-1K
Specification
Data Sheet 16 Revision 1.0, 2012-05-15
3.5 Electro Magnetic Compatibility
Characterization of Electro Magnetic Compatibility is carried out on a sample basis from one qualification lot. Not
all specification parameters have been monitored during EMC exposure.
Figure 3-4 EMC test circuit
Ref: ISO 7637-2 (Version 2004), test circuit Figure 3.4 (with external resistor, RS = 100 )
Ref: ISO 7637-2 (Version 2004), test circuit Figure 3.4 (without external resistor, RS = 0)
Table 3-6 Magnetic Compatibility
Parameter Symbol Level / Type Status
Testpulse 1
Testpulse 2a1)
Testpulse 2b
Testpulse 3a
Testpulse 3b
Testpulse 42)
Testpulse 5b3)
1) ISO 7637-2 (2004) describes internal resistance = 2 (former 10 ).
2) According to 7637-2 for test pulse 4 the test voltage shall be 12 V +/- 0.2 V.
3) A central load dump protection of 42 V is used. Us* = 42 V-13.5 V.
VEMC -100 V
60 V/110 V
10 V
-150 V
100 V
-7 V / -5.5 V
US = 86.5 V / US* = 28.5 V
C
A/C
C
A
A
A
A
Table 3-7 Electro Magnetic Compatibility
Parameter Symbol Level / Type Status
Testpulse 1
Testpulse 2a1)
Testpulse 2b
Testpulse 3a
Testpulse 3b
Testpulse 42)
Testpulse 5b3)
1) ISO 7637-2 (2004) describes internal resistance = 2 (former 10 ).
2) According to 7637-2 for test pulse 4 the test voltage shall be 12 V +/- 0.2 V.
3) A central load dump protection of 42 V is used. Us* = 42 V-13.5 V.
VEMC -50 V
50 V
10 V
-150 V
100 V
-7 V / 5.5 V
US = 86.5 V / US* = 28.5 V
C
A
C
A
A
A
A
TLE496x
GND
Vs
R
Q
= 1.2kΩ
C
DD
= 10nF
R
s
V
DD
Q
C
Q
= 10nF
+5V
TLE4964-1K
Package Information
Data Sheet 17 Revision 1.0, 2012-05-15
4 Package Information
The TLE4964-1K is available in the halogen free SMD package PG-SC59-3-5 with a SOT23 like pinout and
footprint.
4.1 Package Outline PG-SC59-3-5
Figure 4-1 PG-SC59-3-5 Package Outline (All dimensions in mm)
4.2 Packing Information PG-SC59-3-5
Figure 4-2 Packing of the PG-SC59-3-5 in a tape
3x0.4
+0.05
-0.1 M
0.1
0.95
0.95
(0.55)
3±0.1
+0.2
2.8
-0.1
0.15 MAX.
1.1
±0.1
0.2
+0.1
+0.1
-0.05
0.15
0˚...8˚ MAX.
GPS09473
0.45
±0.15
+0.15
-0.3
1.6
0.1
M
0.1
3
21
SC59-TP V04
4
3.18
3.28
8
0.2
1.32
Pin 1
TLE4964-1K
Package Information
Data Sheet 18 Revision 1.0, 2012-05-15
4.3 Footprint PG-SC59-3-5 and PG-SOT23-3-15
Figure 4-3 Footprint PG-SC59-3-5 and PG-SOT23-3-15
4.4 PG-SC59-3-5 Distance between Chip and Package
Figure 4-4 Distance between chip and package
4.5 Package Marking
Figure 4-5 Marking of TLE4964-1K
Reflow Soldering Wave Soldering
0.8
0.8
1.2
0.9 1.3 0.9
0.8
0.8
1.2
1.6 1.4 min1.4 min
Branded Side
d: Distance chip to upper side of IC
SC59: 0.515
±0 .05
mm
d
Year (y) = 0...9
Month (m) = 1...9,
o - October
n - November
d - December
y m
H41
TLE4964-1K
Graphs of the Magnetic Parameters
Data Sheet 19 Revision 1.0, 2012-05-15
5 Graphs of the Magnetic Parameters
Figure 5-1 Operating Point (BOP) of the TLE4964-1K over Temperature
Figure 5-2 Release Point (BRP) of the TLE4964-1K over Temperature
Figure 5-3 Hysteresis (BHys) of the TLE4964-1K over Temperature
10
15
20
25
30
BOP[mT]
Typ
Min
0
5
50,00 0,00 50,00 100,00 150,00
TA[°C]
Max
6
8
10
12
14
16
18
20
BRP[mT]
Typ
Min
0
2
4
6
50,00 0,00 50,00 100,00 150,00
TA[°C]
Max
3
4
5
6
7
8
9
BHys[mT]
Typ
Min
0
1
2
50,00 0,00 50,00 100,00 150,00
TA[°C]
Max
TLE4964-1K
Graphs of the Electrical Parameters
Data Sheet 20 Revision 1.0, 2012-05-15
6 Graphs of the Electrical Parameters
Figure 6-1 Power On Time tPON of the TLE4964-1K over Temperature
Figure 6-2 Signal Delay Time of the TLE4964-1K over Temperature
60
65
70
75
80
tPON_max [μs]
3V
50
55
60
50 30 10 10 30 50 70 90 110 130 150
T[°C]
14
14,5
15
15,5
tD[µs]
3V 12V
12,5
13
13,5
-50 -30 -10 10 30 50 70 90 110 130 150
T [°C]
TLE4964-1K
Graphs of the Electrical Parameters
Data Sheet 21 Revision 1.0, 2012-05-15
Figure 6-3 Supply Current of the TLE4964-1K over Temperature
Figure 6-4 Supply Current of the TLE4964-1K over Supply Voltage
1,4
1,5
1,6
1,7
1,8
1,9
2
IS[mA]
Vs=3V
Vs=12V
Vs=32V
1
1,1
1,2
1,3
-50 -30 -10 10 30 50 70 90 110 130 150
T [°C]
Vs=42V
1,4
1,5
1,6
1,7
1,8
1,9
2
IS[mA]
-40°C
25°C
150°C
1
1,1
1,2
1,3
0 5 10 15 20 25 30 35 40 45
VS[V]
TLE4964-1K
Graphs of the Electrical Parameters
Data Sheet 22 Revision 1.0, 2012-05-15
Figure 6-5 Output Current Limit of the TLE4964-1K over Temperature
Figure 6-6 Output Current Limit of the TLE4964-1K over applied Pull-up Voltage
Figure 6-7 Output Fall Time of the TLE4964-1K over Temperature
57,0
58,0
59,0
60,0
61,0
62,0
63,0
IQLIMIT [mA]
5V
12V
32V
54,0
55,0
56,0
5030101030507090110130150
T[°C]
57,0
58,0
59,0
60,0
61,0
62,0
63,0
IQLIMIT [mA]
40
°
C
25
°
C
150
°
C
54,0
55,0
56,0
0 5 10 15 20 25 30 35
VQ[V]
400
500
600
700
tf[ns]
3V
12V
100
200
300
-50-30-101030507090110130150
T [°C]
32V
TLE4964-1K
Graphs of the Electrical Parameters
Data Sheet 23 Revision 1.0, 2012-05-15
Figure 6-8 Output Fall Time of the TLE4964-1K over applied Pull-up Voltage
Figure 6-9 Output Rise Time of the TLE4964-1K over Temperature
Figure 6-10 Output Rise Time of the TLE4964-1K over applied Pull-up Voltage
400
500
600
700
tf[ns]
-40°C
25°C
100
200
300
0 5 10 15 20 25 30 35
VQ[V]
150°C
500
600
700
tr[ns]
3V
12V
300
400
-50 -30 -10 10 30 50 70 90 110 130 150
T [°C]
32V
400
500
600
700
tf[ns]
-40°C
25°C
100
200
300
0 5 10 15 20 25 30 35
VQ[V]
150°C
TLE4964-1K
Graphs of the Electrical Parameters
Data Sheet 24 Revision 1.0, 2012-05-15
Figure 6-11 Output Leakage Current of the TLE4964-1K over Temperature
Figure 6-12 Saturation Voltage of the TLE4964-1K over Temperature
Figure 6-13 Saturation Voltage of the TLE4964-1K over Output Current
0,1
1
10
I
QLEAK [µA]
32V
0,001
0,01
80 90 100 110 120 130 140 150 160 170 180
I
T [°C]
150
200
250
300
350
400
V
QSAT
[mV]
10mA
15mA
20mA
0
50
100
-50 -30 -10 10 30 50 70 90 110 130 150
T [°C]
25mA
150
200
250
300
350
400
V
QSAT
[mV]
-40°C
25°C
150°C
0
50
100
8 101214161820222426
I
Q
[mA]
TLE4964-1K
Graphs of the Electrical Parameters
Data Sheet 25 Revision 1.0, 2012-05-15
Figure 6-14 Effective Noise of the TLE4964-1K Thresholds over Temperature
Figure 6-15 Output Signal Jitter of the TLE4964-1K over Temperature
60
70
80
90
100
110
120
N
eff [µT(rms)]
12V
20
30
40
50
-50 -30 -10 10 30 50 70 90 110 130 150
B
N
T [°C]
03
0,4
0,5
0,6
0,7
0,8
t
QJ [µs(rms)]
12V
0
0,1
0,2
0
,
3
-50-30-101030507090110130150
t
T [°C]
Published by Infineon Technologies AG
www.infineon.com