© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com T2058_T428 • 9/19/2012 1
One world. One KEMET
Benets
• High CV/cc
• Taped and reeled per EIA 481-1
• SnPb termination nish
• Laser-marked case
• 100% surge current test available
• Halogen-free epoxy
• Capacitance values of 16 to 470 μF
• Tolerances of ±5%, ±10% and ±20%
• Voltage rating of 4 to 50 VDC
• Extended range values
• Pick-and-place friendly
• RoHS Compliant and lead-free terminations available
• Operating temperature range of -55˚C to +125˚C
Applications
Typical applications include decoupling and ltering in
telecommunications, computer, industrial, defense and aerospace
applications.
Overview
The KEMET T428 Series was developed to provide the
volumetric efciency of a conformally coated capacitor in a pick-
and-place friendly molded package. The planerity of the molded
package eliminates the “drops” associated with the conformally
coated tantalum surface mount devices. This new package
design offers the highest CV/cc of any molded leadframe product.
In addition, the facedown construction offers higher power ratings
per cc. The robust design features and testing protocol make this
part suitable for application in the telecommunications, industrial,
military and aerospace markets.
High Reliability Commercial Off-the-Shelf (COTS)
T428 Series High Volumetric Efciency Facedown MnO2
Environmental Compliance
RoHS Compliant (6/6) according to Directive 2002/95/EC when ordered with 100% Sn solder.
SPICE
For a detailed analysis of specic part numbers, please visit www.kemet.com for a free download of KEMET's SPICE software.
The KEMET SPICE program is freeware intended to aid design engineers in analyzing the performance of these capacitors over
frequency, temperature, ripple, and DC bias conditions.
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com T2058_T428 • 9/19/2012 22
Tantalum Surface Mount Capacitors
High Reliability Commercial Off-the-Shelf (COTS) – T428 Series High Volumetric Efciency Facedown MnO2
Ordering Information
T428 P227 K006 AH61 10
Capacitor
Class Series Case
Size
Capacitance
Code (pF)
Capacitance
Tolerance Voltage Failure Rate/
Design Lead Material Surge ESR
T =
Tantalum
High
Volumetric
Efcient
Facedown
Hi-Rel MnO2
COTS
P First two digits
represent
signicant
gures. Third
digit species
number of
zeros.
J = ±5%
K = ±10%
M = ±20%
004 = 4 V
006 = 6.3 V
010 = 10 V
016 = 16 V
020 = 20 V
025 = 25 V
035 = 35 V
050 = 50 V
A = N/A
B = 0.1%/1,000
hours
H = Standard solder
coated (SnPb 5% Pb)
T = 100% tin (Sn)
61 = None
62 = 10 cycles,
25°C
63 = 10 cycles,
-55°C and 85°C
10 = Standard
20 = Low
30 = Ultra-low
Performance Characteristics
Item Performance Characteristics
Operating Temperature -55°C to 125°C
Rated Capacitance Range 16 – 470 μF @ 120 Hz/25°C
Capacitance Tolerance J Tolerance (5%), K Tolerance (10%), M Tolerance (20%)
Rated Voltage Range 4 – 50 V
DF (120 Hz) Refer to Part Number Electrical Specication Table
ESR (100 kHz) Refer to Part Number Electrical Specication Table
Leakage Current ≤ 0.01 CV (µA) at rated voltage after 5 minutes
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com T2058_T428 • 9/19/2012 33
Tantalum Surface Mount Capacitors
High Reliability Commercial Off-the-Shelf (COTS) – T428 Series High Volumetric Efciency Facedown MnO2
Qualication
Test Condition Characteristics
Endurance 85°C @ rated voltage, 2,000 hours
125°C @ 2/3 rated voltage, 2,000 hours
Δ C/C Within ±10% of initial value
DF Within initial limits
DCL Within 1.25 x initial limit
ESR Within initial limits
Storage Life 125°C @ 0 volts, 2,000 hours
Δ C/C Within ±10% of initial value
DF Within initial limits
DCL Within 1.25 x initial limit
ESR Within initial limits
Thermal Shock MIL–STD–202, Method 107, Condition B, mounted,
-55°C to 125°C, 1,000 cycles
Δ C/C Within ±5% of initial value
DF Within initial limits
DCL Within 1.25 x initial limit
ESR Within initial limits
Temperature Stability
Extreme temperature exposure at a
succession of continuous steps at +25°C,
-55°C, +25°C, +85°C, +125°C, +25°C
+25°C -55°C +85°C +125°C
Δ C/C IL* ±10% ±10% ±20%
DF IL IL 1.5 x IL 1.5 x IL
DCL IL n/a 10 x IL 12 x IL
Surge Voltage 25°C and 85°C, 1.32 x rated voltage 1,000 cycles
(125°C, 1.2 x rated voltage)
Δ C/C Within ±5% of initial value
DF Within initial limits
DCL Within initial limits
ESR Within initial limits
Mechanical Shock/Vibration
MIL–STD–202, Method 213, Condition I, 100 G peak
MIL–STD–202, Method 204, Condition D, 10 Hz to 2,000 Hz,
20 G peak
Δ C/C Within ±10 of initial value
DF Within initial limits
DCL Within initial limits
Additional Qualication Tests
per MIL–PRF–55365/8 Please contact KEMET for more information.
*IL = Initial limit
Certication
MIL–PRF–55365/8
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com T2058_T428 • 9/19/2012 44
Tantalum Surface Mount Capacitors
High Reliability Commercial Off-the-Shelf (COTS) – T428 Series High Volumetric Efciency Facedown MnO2
Electrical Characteristics
Impedance & ESR vs. Frequency
Capacitor vs. Frequency
0
0
1
10
100 1,000 10,000 100,000 1,000,000 10,000,000 100,000,000
Impedance & ESR
f (Hz)
T428P390u F6V Z
T428P390u F6V ES R vs. f
T428P330uF10V Z
T428P330uF10V ESR vs. f
T428P180uF16V Z
T428P180uF16V ESR vs. f
T428P68uF2 5V Z
T428P68uF2 5V ES R vs. f
T428P15uF5 0V Z
T428P15uF5 0V ES R vs. f
1
10
100
1,000
10,000
100 1,000 10,000 100,000 1,000,000 10,000,000
Capacitance (µF)
f (Hz)
T428P390uF6V
T428P330uF10V
T428P180uF16V
T428P68uF25V
T428P15uF50V
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com T2058_T428 • 9/19/2012 55
Tantalum Surface Mount Capacitors
High Reliability Commercial Off-the-Shelf (COTS) – T428 Series High Volumetric Efciency Facedown MnO2
Dimensions – Millimeters
Case Size Component
EIA LWH F ±0.2 S1 ±0.2 S2 ±0.2
7260-38 7.2 Max. 6.0 ± 0.3 3.5 ± 0.3 4.95 1.6 1.6
Note: Molded case dimensions are 7.0 mm L x 6.12 mm W x 3.78 mm H
Table 1 – Ratings & Part Number Reference
Rated
Voltage
Rated
Capacitance
Case Code/
Case Size
KEMET Part
Number
DC
Leakage DF Standard
ESR Low ESR Ultra-Low
ESR
VDC µF KEMET/EIA (See below for
part options)
μA @ +20ºC
Maximum/
5 Minutes
%@ +20ºC
120 Hz
Maximum
mΩ @ +20ºC
100 kHz
Maximum
mΩ @ +20ºC
100 kHz
Maximum
Ω @ +20ºC
100 kHz
Maximum
4470 P/7260-38 T428P477(1)004(2)(3)(4)(5) 18.8 10.0 130 45 NA
6.3 390 P/7260-38 T428P397(1)006(2)(3)(4)(5) 24.6 8.0 130 45 NA
6.3 470 P/7260-38 T428P477(1)006(2)(3)(4)(5) 29.6 10.0 120 50 NA
10 330 P/7260-38 T428P337(1)010(2)(3)(4)(5) 33.0 8.0 130 45 NA
16 180 P/7260-38 T428P187(1)016(2)(3)(4)(5) 28.8 8.0 130 55 NA
16 220 P/7260-38 T428P227(1)016(2)(3)(4)(5) 35.2 8.0 120 55 NA
20 150 P/7260-38 T428P157(1)020(2)(3)(4)(5) 30.0 8.0 140 100 NA
25 68 P/7260-38 T428P686(1)025(2)(3)(4)(5) 17.0 6.0 200 95 NA
35 22 P/7260-38 T428P226(1)035(2)(3)(4)(5) 7.7 6.0 280 220 NA
50 15 P/7260-38 T428P156(1)050(2)(3)(4)(5) 7.5 6.0 400 350 NA
VDC µF KEMET/EIA (See below for
part options)
μA @ +20ºC
Maximum/
5 Minutes
%@ +20ºC
120 Hz
Maximum
mΩ @ +20ºC
100 kHz
Maximum
mΩ @ +20ºC
100 kHz
Maximum
Ω @ +20ºC
100 kHz
Maximum
Rated
Voltage Rated
Capacitance Case Code/
Case Size KEMET Part
Number DC
Leakage DF Standard
ESR Low ESR Ultra-Low
ESR
(1) To complete KEMET part number, insert J for ±5%, K for ±10% and M for ±20%. Designates capacitance tolerance.
(2) To complete KEMET part number, insert B (0.1%/1,000 hours) or A = N/A.
(3) To complete KEMET part number, insert H = solder plated or T = 100% tin (Sn). Designates termination nish.
(4) To complete KEMET part number, insert 61 = none, 62 = 10 cycles +25°C or 63 = 10 cycles -55°C +85°C. Designates surge current option.
(5) To complete KEMET part number, insert 10 = standard, 20 = low or 30 = ultra-low. Designates ESR option.
Please refer to Ordering Information for additional details.
Roll Over for
Order Info.
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com T2058_T428 • 9/19/2012 66
Tantalum Surface Mount Capacitors
High Reliability Commercial Off-the-Shelf (COTS) – T428 Series High Volumetric Efciency Facedown MnO2
Recommended Voltage Derating Guidelines
-55°C to 125°C
% Change in Working DC
Voltage with Temperature
50% of VRVR
Recommended Maximum
Application Voltage
100% of VRVR
Ripple Current/Ripple Voltage
KEMET
Case Code
EIA
Case Code
Maximum Power
Dissipation (P max)
mWatts @ 25°C
with +20°C Rise
P7260–38 325
Temperature Compensation Multipliers
for Maximum Power Dissipation
≤ 25°C 85°C 125°C
1.00 0.90 0.40
T= Environmental Temperature
Using the P max of the device, the maximum allowable rms ripple current or voltage may be determined.
I(max) = √P max/R
E(max) = √P max*R
I = rms ripple current (amperes)
E = rms ripple voltage (volts)
P max = maximum power dissipation (watts)
R = ESR at specied frequency (ohms)
0
0.2
0.4
0.6
0.8
1
1.2
-55 25 85 125
% Working Voltage
Temperature (ºC)
% Change in Working DC Voltage
with Temperature
Recommended Maximum Application
Voltage (As % of Rated Voltage) 33%
67%
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com T2058_T428 • 9/19/2012 77
Tantalum Surface Mount Capacitors
High Reliability Commercial Off-the-Shelf (COTS) – T428 Series High Volumetric Efciency Facedown MnO2
Reverse Voltage
Solid tantalum capacitors are polar devices and may be permanently damaged or destroyed if connected with the wrong polarity. The
positive terminal is identied on the capacitor body by a stripe, plus in some cases a beveled edge. A small degree of transient reverse
voltage is permissible for short periods per the below table. The capacitors should not be operated continuously in reverse mode, even
within these limits.
Temperature Permissible Transient Reverse Voltage
25°C 15% of Rated Voltage
85°C 5% of Rated Voltage
125°C 1% of Rated Voltage
Table 2 – Land Dimensions/Courtyard
KEMET Metric
Size
Code
Density Level A:
Maximum (Most)
Land Protrusion (mm)
Density Level B:
Median (Nominal)
Land Protrusion (mm)
Density Level C:
Minimum (Least)
Land Protrusion (mm)
Case EIA X Y CV1 V2 X Y CV1 V2 X Y CV1 V2
P7260-38 5.25 1.80 2.35 8.50 7.30 5.15 1.70 2.35 8.00 6.80 5.05 1.60 2.35 7.70 6.50
Density Level A: For low-density product applications. Recommended for wave solder applications and provides a wider process window for reow solder processes.
Density Level B: For products with a moderate level of component density. Provides a robust solder attachment condition for reow solder processes.
Density Level C: For high component density product applications. Before adapting the minimum land pattern variations the user should perform qualication
testing based on the conditions outlined in IPC Standard 7351 (IPC–7351).
¹ Height of these chips may create problems in wave soldering.
² Land pattern geometry is too small for silkscreen outline.
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com T2058_T428 • 9/19/2012 88
Tantalum Surface Mount Capacitors
High Reliability Commercial Off-the-Shelf (COTS) – T428 Series High Volumetric Efciency Facedown MnO2
Construction
Tantalum
Carbon Silver Paint
Washer
Tantalum
Wire
Weld
Leadframe
(+ A node)
Leadframe
(-Cathode)
Ta2O5
MnO2
Epoxy
Time
Temperature
T
smin
25ºC to Peak
t
L
t
S
25
t
P
T
smax
T
L
T
P
Maximum Ramp Up Rate = 3ºC/seconds
Maximum Ramp Down Rate = 6ºC/seconds
Soldering Process
KEMET’s families of surface mount capacitors are compatible
with wave (single or dual), convection, IR, or vapor phase reow
techniques. Preheating of these components is recommended
to avoid extreme thermal stress. KEMET's recommended
prole conditions for convection and IR reow reect the prole
conditions of the IPC/J–STD–020D standard for moisture
sensitivity testing. The devices can safely withstand a maximum
of three reow passes at these conditions.
Note that although the X/7343–43 case size can withstand wave
soldering, the tall prole (4.3 mm maximum) dictates care in wave
process development.
Hand soldering should be performed with care due to the
difculty in process control. If performed, care should be taken to
avoid contact of the soldering iron to the molded case. The iron
should be used to heat the solder pad, applying solder between
the pad and the termination, until reow occurs. Once reow
occurs, the iron should be removed immediately. “Wiping” the
edges of a chip and heating the top surface is not recommended.
During typical reow operations, a slight darkening of the gold-
colored epoxy may be observed. This slight darkening is normal
and not harmful to the product. Marking permanency is not
affected by this change.
Prole Feature SnPb Assembly Pb-Free Assembly
Preheat/Soak
Temperature Minimum (TSmin)100°C 150°C
Temperature Maximum (TSmax)150°C 200°C
Time (ts) from Tsmin to Tsmax) 60 – 120 seconds 60 – 120 seconds
Ramp-up Rate (TL to TP)3°C/seconds maximum 3°C/seconds maximum
Liquidous Temperature (TL)183°C 217°C
Time Above Liquidous (tL) 60 – 150 seconds 60 – 150 seconds
Peak Temperature (TP)
220°C*
235°C**
250°C*
260°C**
Time within 5°C of Maximum
Peak Temperature (tP)
20 seconds maximum 30 seconds maximum
Ramp-down Rate (TP to TL)6°C/seconds maximum 6°C/seconds maximum
Time 25°C to Peak Temperature 6 minutes maximum 8 minutes maximum
Note: All temperatures refer to the center of the package, measured on the
package body surface that is facing up during assembly reow.
*Case Size D, E, P, Y, and X
**Case Size A, B, C, H, I, K, M, R, S, T, U, V, W, and Z
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com T2058_T428 • 9/19/2012 99
Tantalum Surface Mount Capacitors
High Reliability Commercial Off-the-Shelf (COTS) – T428 Series High Volumetric Efciency Facedown MnO2
Capacitor Marking
(FDM)
Facedown
MnO2
Rated
Voltage
337
2R5 K
030
FDM Polarity
Indicator (+)
Picofarad Code
KEMET ID
Date
Code*
* 030 = 30th week of 2010
Date Code *
1st digit = Last number of Year 9 = 2009
0 = 2010
1 =2011
2 = 2012
3 = 2013
4 =2014
3rd and 4th digit = Week of the Year 01 = 1st week of the Year to
52 = 52nd week of the Year
Storage
Tantalum chip capacitors should be stored in normal working environments. While the chips themselves are quite robust in other
environments, solderability will be degraded by exposure to high temperatures, high humidity, corrosive atmospheres, and long term
storage. In addition, packaging materials will be degraded by high temperature– reels may soften or warp and tape peel force may
increase. KEMET recommends that maximum storage temperature not exceed 40ºC and maximum storage humidity not exceed 60%
relative humidity. Temperature uctuations should be minimized to avoid condensation on the parts and atmospheres should be free of
chlorine and sulphur bearing compounds. For optimized solderability chip stock should be used promptly, preferably within three years
of receipt.
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com T2058_T428 • 9/19/2012 1010
Tantalum Surface Mount Capacitors
High Reliability Commercial Off-the-Shelf (COTS) – T428 Series High Volumetric Efciency Facedown MnO2
Tape & Reel Packaging Information
KEMET’s molded tantalum and aluminum chip capacitor families are packaged in 8 and 12 mm plastic tape on 7" and 13" reels in
accordance with EIA Standard 481–1: Embossed Carrier Taping of Surface Mount Components for Automatic Handling. This packaging
system is compatible with all tape-fed automatic pick-and-place systems.
Table 3 – Packaging Quantity
Case Code
Tape Width
(mm) 7" Reel* 13" Reel*
KEMET EIA
R
2012-12
8
2,500
10,000
I
3216-10
8
3,000
12,000
S
3216-12
8
2,500
10,000
T
3528-12
8
2,500
10,000
M
3528-15
8
2,000
8,000
U6032-15 12 1,000 5,000
L6032-19 12 1,000 5,000
W
7343-15
12
1,000
3,000
Z
7343-17
12
1,000
3,000
V
7343-20
12
1,000
3,000
A
3216-18
8
2,000
9,000
B
3528-21
8
2,000
8,000
C
6032-28
12
500
3,000
D
7343-31
12
500
2,500
Y7343-40 12 500 2,000
X
7343-43
12
500
2,000
E/T428P
7260-38
12
500
2,000
H
7360-20
12
1,000
2,500
* No C-Spec required for 7" reel packaging. C-7280 required for 13" reel packaging.
Top Tape Thickness
0.10 mm (0.004")
Maximum Thickness
8 mm (0.315")
or
12 mm (0.472") 180 mm (7.0")
or
330 mm (13.0")
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com T2058_T428 • 9/19/2012 1111
Tantalum Surface Mount Capacitors
High Reliability Commercial Off-the-Shelf (COTS) – T428 Series High Volumetric Efciency Facedown MnO2
Figure 1 – Embossed (Plastic) Carrier Tape Dimensions
Po
T
F
W
Center Lines of Cavity
Ao
Bo
User Direction of Unreeling
Cover Tape
Ko
B
1
is for tape feeder reference only,
including draft concentric about B
o
.
T
2
ØD
1
ØDo
B
1
S
1
T
1
E
1
E
2
P
1
P
2
Embossment
For cavity size,
see Note 1 Table 4
[10 pitches cumulative
tolerance on tape ± 0.2 mm]
Table 4 – Embossed (Plastic) Carrier Tape Dimensions
Metric will govern
Constant Dimensions — Millimeters (Inches)
Tape Size D0
D
1
Minimum
Note 1
E1P0 P2
R Reference
Note 2
S
1
Minimum
Note 3
T Maximum T1 Maximum
8 mm
1.5 +0.10/-0.0
(0.059 +0.004/-0.0)
1.0
(0.039)
1.75 ±0.10
(0.069 ±0.004)
4.0 ±0.10
(0.157 ±0.004)
2.0 ±0.05
(0.079 ±0.002)
25.0
(0.984)
0.600
(0.024)
0.600
(0.024)
0.100
(0.004)
12 mm 1.5
(0.059)
30
(1.181)
16 mm
Variable Dimensions — Millimeters (Inches)
Tape Size Pitch
B
1
Maximum
Note 4
E2 Minimum F P1 T2 Maximum W Maximum A0,B0 & K0
8 mm Single (4 mm)
4.35
(0.171)
6.25
(0.246)
3.5 ±0.05
(0.138 ±0.002)
4.0 ±0.10
(0.157 ±0.004)
2.5
(0.098)
8.3
(0.327)
Note 512 mm
Single (4 mm) &
Double (8 mm)
8.2
(0.323)
10.25
(0.404)
5.5 ±0.05
(0.217 ±0.002)
8.0 ±0.10
(0.315 ±0.004)
4.6
(0.181)
12.3
(0.484)
16 mm Triple (12 mm)
12.1
(0.476)
14.25
(0.561)
5.5 ±0.05
(0.217 ±0.002)
8.0 ±0.10
(0.315 ±0.004)
4.6
(0.181)
16.3
(0.642)
1. The embossment hole location shall be measured from the sprocket hole controlling the location of the embossment. Dimensions of embossment location and
hole location shall be applied independent of each other.
2. The tape, with or without components, shall pass around R without damage (see Figure 5).
3. If S1 < 1.0 mm, there may not be enough area for cover tape to be properly applied (see EIA Standard 481–D, paragraph 4.3, section b).
4. B1 dimension is a reference dimension for tape feeder clearance only.
5. The cavity de ned by A0, B0 and K0 shall surround the component with suf cient clearance that:
(a) the component does not protrude above the top surface of the carrier tape.
(b) the component can be removed from the cavity in a vertical direction without mechanical restriction, after the top cover tape has been removed.
(c) rotation of the component is limited to 20° maximum for 8 and 12 mm tapes and 10° maximum for 16 mm tapes (see Figure 2).
(d) lateral movement of the component is restricted to 0.5 mm maximum for 8 mm and 12 mm wide tape and to 1.0 mm maximum for 16 mm tape (see Figure 3).
(e) see Addendum in EIA Standard 481–D for standards relating to more precise taping requirements.
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com T2058_T428 • 9/19/2012 1212
Tantalum Surface Mount Capacitors
High Reliability Commercial Off-the-Shelf (COTS) – T428 Series High Volumetric Efciency Facedown MnO2
Packaging Information Performance Notes
1. Cover Tape Break Force: 1.0 Kg minimum.
2. Cover Tape Peel Strength: The total peel strength of the cover tape from the carrier tape shall be:
Tape Width Peel Strength
8 mm 0.1 to 1.0 Newton (10 to 100 gf)
12 and 16 mm 0.1 to 1.3 Newton (10 to 130 gf)
The direction of the pull shall be opposite the direction of the carrier tape travel. The pull angle of the carrier tape shall be 165° to 180°
from the plane of the carrier tape. During peeling, the carrier and/or cover tape shall be pulled at a velocity of 300 ±10 mm/minute.
3. Labeling: Bar code labeling (standard or custom) shall be on the side of the reel opposite the sprocket holes. Refer to EIA
Standards 556 and 624.
Figure 2 – Maximum Component Rotation
Ao
Bo
°
T
°
s
Maximum Component Rotation
Top View Maximum Component Rotation
Side View
Tape Maximum
Width (mm) Rotation (°
T)
8,12 20
16 – 200 10 Tape Maximum
Width (mm) Rotation ( °
S)
8,12 20
16 – 56 10
72 – 200 5
Typical Pocket Centerline
Typical Component Centerline
Figure 3 – Maximum Lateral Movement
0.5 mm maximum
0.5 mm maximum
8 mm & 12 mm Tape
1.0 mm maximum
1.0 mm maximum
16 mm Tape
Figure 4 – Bending Radius
RR
Bending
Radius
Embossed
Carrier Punched
Carrier
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com T2058_T428 • 9/19/2012 1313
Tantalum Surface Mount Capacitors
High Reliability Commercial Off-the-Shelf (COTS) – T428 Series High Volumetric Efciency Facedown MnO2
Figure 5 – Reel Dimensions
AD(See Note)
Full Radius,
See Note
B(see Note)
Access Hole at
Slot Location
(Ø 40 mm minimum)
If present,
tape slot in core
for tape start:
2.5 mm minimum width x
10.0 mm minimum depth
W3(Includes
flange distortion
at outer edge)
W2(Measured at hub)
W1(Measured at hub)
C
(Arbor hole
diameter)
Note: Drive spokes optional; if used, dimensions B and D shall apply.
N
Table 5 – Reel Dimensions
Metric will govern
Constant Dimensions — Millimeters (Inches)
Tape Size A B Minimum C D Minimum
8 mm
178 ±0.20
(7.008 ±0.008)
or
330 ±0.20
(13.000 ±0.008)
1.5
(0.059)
13.0 +0.5/-0.2
(0.521 +0.02/-0.008)
20.2
(0.795)
12 mm
16 mm
Variable Dimensions — Millimeters (Inches)
Tape Size N Minimum W1 W2 Maximum W3
8 mm
50
(1.969)
8.4 +1.5/-0.0
(0.331 +0.059/-0.0)
14.4
(0.567)
Shall accommodate tape width
without interference
12 mm
12.4 +2.0/-0.0
(0.488 +0.078/-0.0)
18.4
(0.724)
16 mm
16.4 +2.0/-0.0
(0.646 +0.078/-0.0)
22.4
(0.882)
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com T2058_T428 • 9/19/2012 1414
Tantalum Surface Mount Capacitors
High Reliability Commercial Off-the-Shelf (COTS) – T428 Series High Volumetric Efciency Facedown MnO2
Figure 6 – Tape Leader & Trailer Dimensions
Trailer
160 mm Minimum
Carrier Tape
END START
Round Sprocket Holes
Elongated Sprocket Holes
(32 mm tape and wider)
Top Cover Tape
Top Cover Tape
Punched Carrier
8 mm & 12 mm only
Embossed Carrier
Components
100 mm
Minimum Leader
400 mm Minimum
Figure 7 – Maximum Camber
Carrier Tape Round Sprocket Holes
1 mm Maximum, either direction
Straight Edge
250 mm
Elongated sprocket holes
(32 mm & wider tapes)
