www.ti.com
FEATURES
DESCRIPTION/ORDERING INFORMATION
1
2
3
4
5
6
7
14
13
12
11
10
9
8
1OE
1A
1Y
2OE
2A
2Y
GND
VCC
4OE
4A
4Y
3OE
3A
3Y
D, DB, DGV, NS, OR PW PACKAGE
(TOP VIEW)
RGY PACKAGE
(TOP VIEW)
1 14
7 8
2
3
4
5
6
13
12
11
10
9
4OE
4A
4Y
3OE
3A
1A
1Y
2OE
2A
2Y
1OE
3Y V
GND
CC
To ensure the high-impedance state during power up or power down, OE should be tied to GND through a
SN74LVC126AQUADRUPLE BUS BUFFER GATEWITH 3-STATE OUTPUTS
SCAS339Q – MARCH 1994 – REVISED JULY 2005
•Operates From 1.65 V to 3.6 V•Specified From –40 °C to 85 °C andFrom –40 °C to 125 °C•Inputs Accept Voltages to 5.5 V•Max t
pd
of 4.7 ns at 3.3 V•Typical V
OLP
(Output Ground Bounce)< 0.8 V at V
CC
= 3.3 V, T
A
= 25 °C•Typical V
OHV
(Output V
OH
Undershoot)> 2 V at V
CC
= 3.3 V, T
A
= 25 °C•Latch-Up Performance Exceeds 250 mA PerJESD 17•ESD Protection Exceeds JESD 22– 2000-V Human-Body Model (A114-A)– 200-V Machine Model (A115-A)
This quadruple bus buffer gate is designed for 1.65-Vto 3.6-V V
CC
operation.
The SN74LVC126A features independent line driverswith 3-state outputs. Each output is disabled whenthe associated output-enable (OE) input is low.
pulldown resistor; the minimum value of the resistor is determined by the current-sourcing capability of the driver.
Inputs can be driven from either 3.3-V or 5-V devices. This feature allows the use of this device as a translator ina mixed 3.3-V/5-V system environment.
ORDERING INFORMATION
T
A
PACKAGE
(1)
ORDERABLE PART NUMBER TOP-SIDE MARKING
–40 °C to 85 °C QFN – RGY Reel of 1000 SN74LVC126ARGYR LC126ATube of 50 SN74LVC126ADSOIC – D Reel of 2500 SN74LVC126ADR LVC126AReel of 250 SN74LVC126ADTSOP – NS Reel of 2000 SN74LVC126ANSR LVC126A–40 °C to 125 °C SSOP – DB Reel of 2000 SN74LVC126ADBR LC126ATube of 90 SN74LVC126APWTSSOP – PW Reel of 2000 SN74LVC126APWR LC126AReel of 250 SN74LVC126APWTTVSOP – DGV Reel of 2000 SN74LVC126ADGVR LC126A
(1) Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available atwww.ti.com/sc/package.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of TexasInstruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Copyright © 1994–2005, Texas Instruments IncorporatedProducts conform to specifications per the terms of the TexasInstruments standard warranty. Production processing does notnecessarily include testing of all parameters.
www.ti.com
1
1OE
2
1A 1Y
3
4
2OE
5
2A 2Y
6
10
3OE
9
3A 3Y
8
13
4OE
12
4A 4Y
11
Absolute Maximum Ratings
(1)
SN74LVC126A
QUADRUPLE BUS BUFFER GATEWITH 3-STATE OUTPUTS
SCAS339Q – MARCH 1994 – REVISED JULY 2005
FUNCTION TABLE(EACH BUFFER)
INPUTS
OUTPUT
YOE A
H H HH L LL X Z
LOGIC DIAGRAM (POSITIVE LOGIC)
over operating free-air temperature range (unless otherwise noted)
MIN MAX UNIT
V
CC
Supply voltage range –0.5 6.5 VV
I
Input voltage range
(2)
–0.5 6.5 VV
O
Output voltage range
(2) (3)
–0.5 V
CC
+ 0.5 VI
IK
Input clamp current V
I
< 0 –50 mAI
OK
Output clamp current V
O
< 0 –50 mAI
O
Continuous output current ±50 mAContinuous current through V
CC
or GND ±100 mAD package
(4)
86DB package
(4)
96DGV package
(4)
127θ
JA
Package thermal impedance °C/WNS package
(4)
76PW package
(4)
113RGY package
(5)
47T
stg
Storage temperature range –65 150 °CP
tot
Power dissipation T
A
= –40 °C to 125 °C
(6) (7)
500 mW
(1) Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratingsonly, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operatingconditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.(2) The input and output negative-voltage ratings may be exceeded if the input and output current ratings are observed.(3) The value of V
CC
is provided in the recommended operating conditions table.(4) The package thermal impedance is calculated in accordance with JESD 51-7.(5) The package thermal impedance is calculated in accordance with JESD 51-5.(6) For the D package: above 70 °C, the value of P
tot
derates linearly with 8 mW/K.(7) For the DB, NS, and PW packages: above 60 °C, the value of P
tot
derates linearly with 5.5 mW/K.
2
www.ti.com
Recommended Operating Conditions
(1)
Electrical Characteristics
SN74LVC126AQUADRUPLE BUS BUFFER GATEWITH 3-STATE OUTPUTS
SCAS339Q – MARCH 1994 – REVISED JULY 2005
T
A
= 25°C –40 TO 85°C –40 TO 125°C
UNITMIN MAX MIN MAX MIN MAX
Operating 1.65 3.6 1.65 3.6 1.65 3.6V
CC
Supply voltage VData retention only 1.5 1.5 1.5V
CC
= 1.65 V to 1.95 V 0.65 ×V
CC
0.65 ×V
CC
0.65 ×V
CCHigh-level
V
IH
V
CC
= 2.3 V to 2.7 V 1.7 1.7 1.7 Vinput voltage
V
CC
= 2.7 V to 3.6 V 2 2 2V
CC
= 1.65 V to 1.95 V 0.35 ×V
CC
0.35 ×V
CC
0.35 ×V
CCLow-level
V
IL
V
CC
= 2.3 V to 2.7 V 0.7 0.7 0.7 Vinput voltage
V
CC
= 2.7 V to 3.6 V 0.8 0.8 0.8V
I
Input voltage 0 5.5 0 5.5 0 5.5 VV
O
Output voltage 0 V
CC
0 V
CC
0 V
CC
VV
CC
= 1.65 V –4 –4 –4V
CC
= 2.3 V –8 –8 –8High-level
I
OH
mAoutput current
V
CC
= 2.7 V –12 –12 –12V
CC
= 3 V –24 –24 –24V
CC
= 1.65 V 4 4 4V
CC
= 2.3 V 8 8 8Low-level
I
OL
mAoutput current
V
CC
= 2.7 V 12 12 12V
CC
= 3 V 24 24 24∆t/ ∆v Input transition rise or fall rate 10 10 10 ns/V
(1) All unused inputs of the device must be held at V
CC
or GND to ensure proper device operation. Refer to the TI application report,Implications of Slow or Floating CMOS Inputs, literature number SCBA004.
over recommended operating free-air temperature range (unless otherwise noted)
T
A
= 25 °C –40 TO 85 °C –40 TO 125 °CPARAMETER TEST CONDITIONS V
CC
UNITMIN TYP MAX MIN MAX MIN MAX
I
OH
= –100 µA 1.65 V to 3.6 V V
CC
– 0.2 V
CC
– 0.2 V
CC
– 0.3I
OH
= –4 mA 1.65 V 1.29 1.2 1.05I
OH
= –8 mA 2.3 V 1.9 1.7 1.55V
OH
V2.7 V 2.2 2.2 2.05I
OH
= –12 mA
3 V 2.4 2.4 2.25I
OH
= –24 mA 3 V 2.3 2.2 2I
OL
= 100 µA 1.65 V to 3.6 V 0.1 0.2 0.3I
OL
= 4 mA 1.65 V 0.24 0.45 0.6V
OL
I
OL
= 8 mA 2.3 V 0.3 0.7 0.75 VI
OL
= 12 mA 2.7 V 0.4 0.4 0.6I
OL
= 24 mA 3 V 0.55 0.55 0.8I
I
V
I
= 5.5 V or GND 3.6 V ±1±5±20 µAI
OZ
V
O
= V
CC
or GND 3.6 V ±1±10 ±20 µAI
CC
V
I
= V
CC
or GND, I
O
= 0 3.6 V 1 10 40 µAOne input at V
CC
– 0.6 V,∆I
CC
2.7 V to 3.6 V 500 500 5000 µAOther inputs at V
CC
or GNDC
i
V
I
= V
CC
or GND 3.3 V 4.5 pFC
o
V
O
= V
CC
or GND 3.3 V 7 pF
3
www.ti.com
Switching Characteristics
Operating Characteristics
SN74LVC126A
QUADRUPLE BUS BUFFER GATEWITH 3-STATE OUTPUTS
SCAS339Q – MARCH 1994 – REVISED JULY 2005
over recommended operating free-air temperature range (unless otherwise noted) (see Figure 1 )
T
A
= 25 °C –40 TO 85 °C –40 TO 125 °CFROM TOPARAMETER V
CC
UNIT(INPUT) (OUTPUT)
MIN TYP MAX MIN MAX MIN MAX
1.8 V ±0.15 V 1 4.2 9.3 1 9.8 1 11.32.5 V ±0.2 V 1 2.7 6.7 1 7.2 1 9.3t
pd
A Y ns2.7 V 1 2.9 5 1 5.2 1 6.53.3 V ±0.3 V 1 2.5 4.5 1 4.7 1 61.8 V ±0.15 V 1 4.8 9.5 1 10 1 11.52.5 V ±0.2 V 1 2.8 7.8 1 8.3 1 10.4t
en
OE Y ns2.7 V 1 3.1 6.1 1 6.3 1 83.3 V ±0.3 V 1 2.5 5.5 1 5.7 1 7.51.8 V ±0.15 V 1 4.4 12.1 1 12.6 1 14.12.5 V ±0.2 V 1 2.7 8.2 1 8.7 1 10.8t
dis
OE Y ns2.7 V 1 2.7 6.5 1 6.7 1 8.53.3 V ±0.3 V 1.3 2.3 5.8 1.3 6 1.3 7.5t
sk(o)
3.3 V ±0.3 V 1 1.5 ns
T
A
= 25 °C
TESTPARAMETER V
CC
TYP UNITCONDITIONS
1.8 V 20Outputs enabled 2.5 V 213.3 V 22C
pd
Power dissipation capacitance per gate f = 10 MHz pF1.8 V 2Outputs disabled 2.5 V 33.3 V 4
4
www.ti.com
PARAMETER MEASUREMENT INFORMATION
VM
th
tsu
From Output
Under Test
CL
(see Note A)
LOAD CIRCUIT
S1 VLOAD
Open
GND
RL
RL
Data Input
Timing Input VI
0 V
VI
0 V
0 V
tw
Input
VOLTAGE WA VEFORMS
SETUP AND HOLD TIMES
VOLTAGE WA VEFORMS
PROPAGATION DELAY TIMES
INVERTING AND NONINVERTING OUTPUTS
VOLTAGE WA VEFORMS
PULSE DURATION
tPLH
tPHL
tPHL
tPLH
VOH
VOH
VOL
VOL
VI
0 V
Input
Output
Waveform 1
S1 at VLOAD
(see Note B)
Output
Waveform 2
S1 at GND
(see Note B)
VOL
VOH
tPZL
tPZH
tPLZ
tPHZ
VLOAD/2
0 V
VOL + V∆
VOH - V∆≈0 V
VI
VOLTAGE WA VEFORMS
ENABLE AND DISABLE TIMES
LOW- AND HIGH-LEVEL ENABLING
Output
Output
tPLH/tPHL
tPLZ/tPZL
tPHZ/tPZH
Open
VLOAD
GND
TEST S1
NOTES: A. CL includes probe and jig capacitance.
B. Waveform 1 is for an output with internal conditions such that the output is low, except when disabled by the output control.
Waveform2 is for an output with internal conditions such that the output is high, except when disabled by the output control.
C. All input pulses are supplied by generators having the following characteristics: PRR ≤ 10 MHz, ZO = 50 Ω.
D. The outputs are measured one at a time, with one transition per measurement.
E. tPLZ and tPHZ are the same as tdis.
F. tPZL and tPZH are the same as ten.
G. tPLH and tPHL are the same as tpd.
H. All parameters and waveforms are not applicable to all devices.
Output
Control
VMVM
VMVM
VMVM
VM
VMVM
VM
VM
VM
VI
VM
VM
1.8 V ± 0.15 V
2.5 V ± 0.2 V
2.7 V
3.3 V ± 0.3 V
1 kΩ
500 Ω
500 Ω
500 Ω
VCC RL
2 × VCC
2 × VCC
6 V
6 V
VLOAD CL
30 pF
30 pF
50 pF
50 pF
0.15 V
0.15 V
0.3 V
0.3 V
V∆
VCC
VCC
2.7 V
2.7 V
VI
VCC/2
VCC/2
1.5 V
1.5 V
VM
tr/tf
≤2 ns
≤2 ns
≤2.5 ns
≤2.5 ns
INPUTS
SN74LVC126AQUADRUPLE BUS BUFFER GATEWITH 3-STATE OUTPUTS
SCAS339Q – MARCH 1994 – REVISED JULY 2005
Figure 1. Load Circuit and Voltage Waveforms
5
PACKAGING INFORMATION
Orderable Device Status (1) Package
Type Package
Drawing Pins Package
Qty Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
SN74LVC126AD ACTIVE SOIC D 14 50 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74LVC126ADBLE OBSOLETE SSOP DB 14 TBD Call TI Call TI
SN74LVC126ADBR ACTIVE SSOP DB 14 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74LVC126ADBRE4 ACTIVE SSOP DB 14 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74LVC126ADBRG4 ACTIVE SSOP DB 14 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74LVC126ADE4 ACTIVE SOIC D 14 50 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74LVC126ADG4 ACTIVE SOIC D 14 50 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74LVC126ADGVR ACTIVE TVSOP DGV 14 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74LVC126ADGVRE4 ACTIVE TVSOP DGV 14 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74LVC126ADGVRG4 ACTIVE TVSOP DGV 14 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74LVC126ADR ACTIVE SOIC D 14 2500 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74LVC126ADRE4 ACTIVE SOIC D 14 2500 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74LVC126ADRG4 ACTIVE SOIC D 14 2500 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74LVC126ADT ACTIVE SOIC D 14 250 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74LVC126ADTE4 ACTIVE SOIC D 14 250 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74LVC126ADTG4 ACTIVE SOIC D 14 250 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74LVC126ANSR ACTIVE SO NS 14 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74LVC126ANSRE4 ACTIVE SO NS 14 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74LVC126ANSRG4 ACTIVE SO NS 14 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74LVC126APW ACTIVE TSSOP PW 14 90 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74LVC126APWE4 ACTIVE TSSOP PW 14 90 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74LVC126APWG4 ACTIVE TSSOP PW 14 90 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74LVC126APWLE OBSOLETE TSSOP PW 14 TBD Call TI Call TI
SN74LVC126APWR ACTIVE TSSOP PW 14 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74LVC126APWRE4 ACTIVE TSSOP PW 14 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74LVC126APWRG4 ACTIVE TSSOP PW 14 2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
PACKAGE OPTION ADDENDUM
www.ti.com 21-Dec-2009
Addendum-Page 1
Orderable Device Status (1) Package
Type Package
Drawing Pins Package
Qty Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
no Sb/Br)
SN74LVC126APWT ACTIVE TSSOP PW 14 250 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74LVC126APWTE4 ACTIVE TSSOP PW 14 250 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74LVC126APWTG4 ACTIVE TSSOP PW 14 250 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74LVC126ARGYR ACTIVE VQFN RGY 14 3000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR
SN74LVC126ARGYRG4 ACTIVE VQFN RGY 14 3000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
OTHER QUALIFIED VERSIONS OF SN74LVC126A :
•Automotive: SN74LVC126A-Q1
NOTE: Qualified Version Definitions:
•Automotive - Q100 devices qualified for high-reliability automotive applications targeting zero defects
PACKAGE OPTION ADDENDUM
www.ti.com 21-Dec-2009
Addendum-Page 2
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device Package
Type Package
Drawing Pins SPQ Reel
Diameter
(mm)
Reel
Width
W1 (mm)
A0
(mm) B0
(mm) K0
(mm) P1
(mm) W
(mm) Pin1
Quadrant
SN74LVC126ADBR SSOP DB 14 2000 330.0 16.4 8.2 6.6 2.5 12.0 16.0 Q1
SN74LVC126ADGVR TVSOP DGV 14 2000 330.0 12.4 6.8 4.0 1.6 8.0 12.0 Q1
SN74LVC126ADR SOIC D 14 2500 330.0 16.4 6.5 9.0 2.1 8.0 16.0 Q1
SN74LVC126ADT SOIC D 14 250 330.0 16.4 6.5 9.0 2.1 8.0 16.0 Q1
SN74LVC126ANSR SO NS 14 2000 330.0 16.4 8.2 10.5 2.5 12.0 16.0 Q1
SN74LVC126APWR TSSOP PW 14 2000 330.0 12.4 6.9 5.6 1.6 8.0 12.0 Q1
SN74LVC126APWT TSSOP PW 14 250 330.0 12.4 6.9 5.6 1.6 8.0 12.0 Q1
SN74LVC126ARGYR VQFN RGY 14 3000 330.0 12.4 3.75 3.75 1.15 8.0 12.0 Q1
PACKAGE MATERIALS INFORMATION
www.ti.com 14-Jul-2012
Pack Materials-Page 1
*All dimensions are nominal
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
SN74LVC126ADBR SSOP DB 14 2000 367.0 367.0 38.0
SN74LVC126ADGVR TVSOP DGV 14 2000 367.0 367.0 35.0
SN74LVC126ADR SOIC D 14 2500 367.0 367.0 38.0
SN74LVC126ADT SOIC D 14 250 367.0 367.0 38.0
SN74LVC126ANSR SO NS 14 2000 367.0 367.0 38.0
SN74LVC126APWR TSSOP PW 14 2000 367.0 367.0 35.0
SN74LVC126APWT TSSOP PW 14 250 367.0 367.0 35.0
SN74LVC126ARGYR VQFN RGY 14 3000 367.0 367.0 35.0
PACKAGE MATERIALS INFORMATION
www.ti.com 14-Jul-2012
Pack Materials-Page 2
MECHANICAL DATA
MPDS006C – FEBRUAR Y 1996 – REVISED AUGUST 2000
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
DGV (R-PDSO-G**) PLASTIC SMALL-OUTLINE
24 PINS SHOWN
14
3,70
3,50 4,90
5,10
20
DIM
PINS **
4073251/E 08/00
1,20 MAX
Seating Plane
0,05
0,15
0,25
0,50
0,75
0,23
0,13
112
24 13
4,30
4,50
0,16 NOM
Gage Plane
A
7,90
7,70
382416
4,90
5,103,70
3,50
A MAX
A MIN
6,60
6,20
11,20
11,40
56
9,60
9,80
48
0,08
M
0,07
0,40
0°–8°
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice.
C. Body dimensions do not include mold flash or protrusion, not to exceed 0,15 per side.
D. Falls within JEDEC: 24/48 Pins – MO-153
14/16/20/56 Pins – MO-194
MECHANICAL DATA
MSSO002E – JANUARY 1995 – REVISED DECEMBER 2001
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
DB (R-PDSO-G**) PLASTIC SMALL-OUTLINE
4040065 /E 12/01
28 PINS SHOWN
Gage Plane
8,20
7,40
0,55
0,95
0,25
38
12,90
12,30
28
10,50
24
8,50
Seating Plane
9,907,90
30
10,50
9,90
0,38
5,60
5,00
15
0,22
14
A
28
1
2016
6,50
6,50
14
0,05 MIN
5,905,90
DIM
A MAX
A MIN
PINS **
2,00 MAX
6,90
7,50
0,65 M
0,15
0°–ā8°
0,10
0,09
0,25
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice.
C. Body dimensions do not include mold flash or protrusion not to exceed 0,15.
D. Falls within JEDEC MO-150
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other
changes to its semiconductor products and services per JESD46C and to discontinue any product or service per JESD48B. Buyers should
obtain the latest relevant information before placing orders and should verify that such information is current and complete. All
semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of sale supplied at the time
of order acknowledgment.
TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms
and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary
to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily
performed.
TI assumes no liability for applications assistance or the design of Buyers’ products. Buyers are responsible for their products and
applications using TI components. To minimize the risks associated with Buyers’ products and applications, Buyers should provide
adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or
other intellectual property right relating to any combination, machine, or process in which TI components or services are used. Information
published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or
endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the
third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration
and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altered
documentation. Information of third parties may be subject to additional restrictions.
Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service
voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice.
TI is not responsible or liable for any such statements.
Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements
concerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or support
that may be provided by TI. Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which
anticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might cause
harm and take appropriate remedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the use
of any TI components in safety-critical applications.
In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TI’s goal is to
help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and
requirements. Nonetheless, such components are subject to these terms.
No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties
have executed a special agreement specifically governing such use.
Only those TI components which TI has specifically designated as military grade or “enhanced plastic” are designed and intended for use in
military/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI components
which have not been so designated is solely at the Buyer's risk, and that Buyer is solely responsible for compliance with all legal and
regulatory requirements in connection with such use.
TI has specifically designated certain components which meet ISO/TS16949 requirements, mainly for automotive use. Components which
have not been so designated are neither designed nor intended for automotive use; and TI will not be responsible for any failure of such
components to meet such requirements.
Products Applications
Audio www.ti.com/audio Automotive and Transportation www.ti.com/automotive
Amplifiers amplifier.ti.com Communications and Telecom www.ti.com/communications
Data Converters dataconverter.ti.com Computers and Peripherals www.ti.com/computers
DLP® Products www.dlp.com Consumer Electronics www.ti.com/consumer-apps
DSP dsp.ti.com Energy and Lighting www.ti.com/energy
Clocks and Timers www.ti.com/clocks Industrial www.ti.com/industrial
Interface interface.ti.com Medical www.ti.com/medical
Logic logic.ti.com Security www.ti.com/security
Power Mgmt power.ti.com Space, Avionics and Defense www.ti.com/space-avionics-defense
Microcontrollers microcontroller.ti.com Video and Imaging www.ti.com/video
RFID www.ti-rfid.com
OMAP Mobile Processors www.ti.com/omap TI E2E Community e2e.ti.com
Wireless Connectivity www.ti.com/wirelessconnectivity
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2012, Texas Instruments Incorporated