Multilayer Chip Beads(SMD Array) For signal line MZA series Type: MZA1210 MZA2010 [0504 inch]* (2 lines) [0804 inch] (4 lines) * Dimensions Code JIS[EIA] Issue date: May 2011 * All specifications are subject to change without notice. * Conformity to RoHS Directive: This means that, in conformity with EU Directive 2002/95/EC, lead, cadmium, mercury, hexavalent chromium, and specific bromine-based flame retardants, PBB and PBDE, have not been used, except for exempted applications. (1/6) Chip Beads(SMD Array) For General Signal Line Conformity to RoHS Directive MZA Series MZA1210 Type SHAPES AND DIMENSIONS/RECOMMENDED PC BOARD PATTERN 1.250.15 0.5 1.000.15 0.5 0.4 0.350.15 0.350.15 0.500.10 0.200.15 FEATURES * A single MZA series chip provides noise attenuation for two lines, making it ideal for use with I/O lines of various highly miniaturized. * Electronic equipment, such as portable products, which comprise high density circuitry. * Low crosstalk between adjacent circuits. * Internal electrodes feature low DC resistance, minimizing wasteful power consumption. * Electroplated terminal electrodes accommodate reflow soldering. * Monolithic structure ensures high reliability. * The products contain no lead and also support lead-free soldering. * It is a product conforming to RoHS directive. 0.650.10 0.3 Weight: 3mg Dimensions in mm CIRCUIT DIAGRAM APPLICATIONS Removal of signal line noises of cellular phones, PCs, note PCs, TVs, DVDs, DSCs, game machines, digital photo frames, PNDs, etc. PRODUCT IDENTIFICATION MZA 1210 D 121 C T (1) (2) (3) (4) (5) (6) (1) Series name (2) Dimensions LxW (3) Material code (4) Nominal impedance 121:120 at 100MHz (5) Characteristic type (6) Packaging style T:Taping * No polarity TEMPERATURE RANGES Operating/storage -55 to +125C PACKAGING STYLE AND QUANTITIES Packaging style Taping Quantity 5000 pieces/reel RECOMMENDED SOLDERING CONDITION REFLOW SOLDERING 10s max. HANDLING AND PRECAUTIONS * Before soldering, be sure to preheat components. The preheating temperature should be set so that the temperature difference between the solder temperature and product temperature does not exceed 150C. * After mounting components onto the printed circuit board, do not apply stress through board bending or mishandling. * Do not expose the inductors to stray magnetic fields. * Avoid static electricity discharge during handling. * When hand soldering, apply the soldering iron to the printed circuit board only. Temperature of the iron tip should not exceed 350C. Soldering time should not exceed 3 seconds. * This product does not apply to flow soldering construction method. 250 to 260C Natural cooling 230C 180C 150C Preheating 60 to 120s Soldering 30 to 60s Time(s) * Conformity to RoHS Directive: This means that, in conformity with EU Directive 2002/95/EC, lead, cadmium, mercury, hexavalent chromium, and specific bromine-based flame retardants, PBB and PBDE, have not been used, except for exempted applications. * Please contact our Sales office when your application is considered the following: The device's failure or malfunction may directly endanger human life (e.g. application for automobile/aircraft/medical/nuclear power devices, etc.) * All specifications are subject to change without notice. 001-03 / 20110509 / e9421_mza (2/6) ELECTRICAL CHARACTERISTICS Impedance ( )[100MHz] 3325% 6825% 12025% 24025% Part No. MZA1210D330C MZA1210D680C MZA1210D121C MZA1210D241C Rated current (mA)max. 50 50 50 50 DC resistance ( )max. 0.30 0.50 0.80 1.20 Rated voltage (V)max. 5 5 5 5 Test equipment: E4991A or equivalent Test tool: 16192A or equivalent Test temperature: 2510C TYPICAL ELECTRICAL CHARACTERISTICS Z, X, R vs. FREQUENCY CHARACTERISTICS MZA1210D330C MZA1210D680C 250 500 200 400 MZA1210D121C 800 Z 150 R 100 X 50 Impedance() Impedance() Impedance() 700 Z 300 R 200 X 100 600 Z 500 R 400 300 X 200 100 0 1 10 100 1000 Frequency (MHz) 0 10000 1 10 100 1000 Frequency (MHz) 0 10000 1 10 100 1000 Frequency (MHz) 10000 MZA1210D241C 1600 Impedance() 1400 1200 Z 1000 R 800 600 X 400 200 10 100 1000 Frequency (MHz) 10000 PACKAGING STYLES REEL DIMENSIONS TAPE DIMENSIONS Sprocket hole 1.5 +0.1 -0.0 Cavity 0.8max. 1.20.2 4.00.1 4.00.1 2.00.05 2.00.5 8.4 +2.0 -0.0 o130.2 14.4max. 160min. Taping 1.450.2 o60min. 8.00.3 1.0 3.50.05 1 1.750.1 0 200min. o210.8 o1802.0 Dimensions in mm Drawing direction 300min. Dimensions in mm * All specifications are subject to change without notice. 001-03 / 20110509 / e9421_mza (3/6) Chip Beads(SMD Array) For General Signal Line Conformity to RoHS Directive MZA Series MZA2010 Type FEATURES * A single MZA series chip provides noise attenuation for four lines, making it ideal for use with I/O lines of various highly miniaturized. * Electronic equipment, such as portable products, which comprise high density circuitry. * Low crosstalk between adjacent circuits. * Internal electrodes feature low DC resistance, minimizing wasteful power consumption. * Electroplated terminal electrodes accommodate reflow soldering. * Monolithic structure ensures high reliability. * It is a product conforming to RoHS directive. APPLICATIONS Removal of signal line noises of cellular phones, PCs, note PCs, TVs, DVDs, DSCs, game machines, digital photo frames, PNDs, etc. PRODUCT IDENTIFICATION MZA 2010 D 121 C T (1) (2) (3) (4) (5) (6) (1) Series name (2) Dimensions LxW (3) Material code (4) Nominal impedance 121:120 at 100MHz (5) Characteristic type (6) Packaging style T:Taping MATERIAL CHARACTERISTICS B material: This type is perfectly suited for fast digital signals. By equalizing R components and X components that beads possess at a frequency of 5MHz, it is able to suppress overshooting, undershooting and ringing of fast digital signals. S material: Standard type that features impedance characteristics similar to those of a typical ferrite core. For signal line applications in which the blocking region is near 100MHz. Impedance values selected for effectiveness at 40 to 300MHz. Y material: High frequency range type intended for the 100MHz region and above. For signal line applications in which the signal frequency is far from the cutoff frequency. Impedance values selected for effectiveness at 80 to 400MHz. D material: For applications calling for low insertion loss at low frequencies and sharply increasing impedance at high frequencies. Designed for high impedance at high frequencies (300MHz to 1GHz) for signal line applications. F material: This new product inherits the characteristic of our Dmaterial, namely its sharp impedance rise time, and its impedance peak frequency has been shifted higher into range. The product offers excellent noise suppression from 600MHz to as high as in the GHz range. TYPICAL MATERIAL CHARACTERISTICS 2000 D 1800 1600 Impedance() HANDLING AND PRECAUTIONS * Before soldering, be sure to preheat components. The preheating temperature should be set so that the temperature difference between the solder temperature and product temperature does not exceed 150C. * After mounting components onto the printed circuit board, do not apply stress through board bending or mishandling. * Do not expose the inductors to stray magnetic fields. * Avoid static electricity discharge during handling. * When hand soldering, apply the soldering iron to the printed circuit board only. Temperature of the iron tip should not exceed 350C. Soldering time should not exceed 3 seconds. * This product does not apply to flow soldering construction method. Y 1400 1200 1000 F S 800 600 400 B 200 0 10 100 Frequency(MHz) 1000 * Conformity to RoHS Directive: This means that, in conformity with EU Directive 2002/95/EC, lead, cadmium, mercury, hexavalent chromium, and specific bromine-based flame retardants, PBB and PBDE, have not been used, except for exempted applications. * Please contact our Sales office when your application is considered the following: The device's failure or malfunction may directly endanger human life (e.g. application for automobile/aircraft/medical/nuclear power devices, etc.) * All specifications are subject to change without notice. 001-03 / 20110509 / e9421_mza (4/6) SHAPES AND DIMENSIONS/RECOMMENDED PC BOARD PATTERN Ferrite 0.6 Terminal electrode 0.6 10s max. 0.6 0.20.15 1.00.15 2.00.15 0.25+0.15/-0.10 0.50.1 0.50.1 RECOMMENDED SOLDERING CONDITION REFLOW SOLDERING 0.5 250 to 260C Natural cooling 230C 0.25 180C Weight: 5mg Dimensions in mm 150C Preheating 60 to 120s CIRCUIT DIAGRAM Soldering 30 to 60s Time(s) * No polarity TEMPERATURE RANGES Operating/storage -55 to +125C PACKAGING STYLE AND QUANTITIES Packaging style Taping Quantity 5000 pieces/reel ELECTRICAL CHARACTERISTICS Part No. MZA2010B241C MZA2010S800C MZA2010S121C MZA2010S241C MZA2010S601C MZA2010S102C MZA2010Y800C MZA2010Y121C MZA2010Y241C MZA2010Y601C MZA2010Y102C MZA2010D330C MZA2010D680C MZA2010D121C MZA2010D241C MZA2010F330C MZA2010F470C MZA2010F560C Impedance ( )[100MHz] 24025% 8025% 12025% 24025% 60025% 100025% 8025% 12025% 24025% 60025% 100025% 3325% 6825% 12025% 24025% 3325% 4725% 5625% DC resistance ( )max. 0.45 0.22 0.25 0.35 0.50 0.75 0.30 0.40 0.60 0.80 1.00 0.30 0.50 0.80 1.20 0.60 0.80 0.80 Rated current (mA)max. 100 100 100 100 100 100 100 100 100 100 100 50 50 50 50 100 100 100 Rated voltage (V)max. 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 Test equipment: E4991A or equivalent Test tool: 16192A or equivalent Test temperature: 2510C * All specifications are subject to change without notice. 001-03 / 20110509 / e9421_mza (5/6) TYPICAL ELECTRICAL CHARACTERISTICS Z, X, R vs. FREQUENCY CHARACTERISTICS MZA2010B241C MZA2010S800C 300 R 150 100 X 50 10 100 1000 Frequency (MHz) 40 0 X 300 Z 250 R 200 150 100 50 X 1 10 1 10 100 1000 Frequency (MHz) 100 1000 Frequency (MHz) 10000 MZA2010Y800C 900 800 700 600 500 400 300 200 100 0 Z R 10 100 1000 Frequency (MHz) 1 10 100 1000 Frequency (MHz) Z R 100 10 100 1000 Frequency (MHz) 10000 X 200 Z 10 100 1000 Frequency (MHz) R 800 600 400 10000 X 0 1 10 100 1000 Frequency (MHz) 10000 450 400 350 300 250 200 150 100 50 0 Z R X 1 10 100 1000 Frequency (MHz) 10000 200 1000 X 1 10 100 1000 Frequency (MHz) Z 150 R 100 X 50 200 1 600 MZA2010D330C Impedance() Impedance() R 400 R 800 250 1200 600 0 1 1400 Z Z 1000 0 X MZA2010Y102C 800 10000 MZA2010Y241C 150 0 1000 100 1000 Frequency (MHz) 1200 10000 Impedance() Impedance() MZA2010Y601C 10 200 200 10000 1 400 X 50 1 X 1400 250 X R MZA2010S102C 300 R Z 100 0 10000 MZA2010Y121C Z 150 50 MZA2010S601C Impedance() Impedance() 60 10000 350 Impedance() R Impedance() 1 400 Impedance() Z 80 20 MZA2010S241C 180 160 140 120 100 80 60 40 20 0 200 100 Impedance() Impedance() Impedance() Z 200 0 250 120 250 0 MZA2010S121C 140 10000 0 1 10 100 1000 Frequency (MHz) 10000 * All specifications are subject to change without notice. 001-03 / 20110509 / e9421_mza (6/6) TYPICAL ELECTRICAL CHARACTERISTICS Z, X, R vs. FREQUENCY CHARACTERISTICS MZA2010D680C MZA2010D121C R 200 100 1 10 100 1000 Frequency (MHz) 500 R 400 Z 300 200 100 X 100 1000 Frequency (MHz) 10000 1200 1000 1 10 900 800 700 600 500 400 300 200 100 0 Z 800 400 200 100 1000 Frequency (MHz) R 600 X 0 10000 MZA2010F470C Impedance() Impedance() 200 0 600 10 300 10000 700 1 R 400 100 MZA2010F330C 0 Z 500 X 1 10 100 1000 Frequency (MHz) 10000 MZA2010F560C 1200 1000 Impedance() 0 X 1400 600 R Z 800 600 Z 400 200 X 1 10 PACKAGING STYLES REEL DIMENSIONS 100 1000 Frequency (MHz) X 0 10000 1 10 R 100 1000 Frequency (MHz) 10000 TAPE DIMENSIONS Sprocket hole 1.5 +0.1 -0.0 Cavity 0.8max. 1.30.2 4.00.1 4.00.1 2.00.05 2.00.5 8.4 +2.0 -0.0 o130.2 14.4max. 160min. Taping 2.30.2 o60min. 8.00.3 1.0 3.50.05 Z 1600 700 1.750.1 300 Impedance () Impedance() 400 800 Impedance () 500 MZA2010D241C 200min. o210.8 o1802.0 Dimensions in mm Drawing direction 300min. Dimensions in mm * All specifications are subject to change without notice. 001-03 / 20110509 / e9421_mza