TLE42744DV50XT - INFINEON TECHNOLOGIES AG

TLE42744

Low Dropout Linear Voltage Regulator

Data Sheet, Rev. 1.1, January 2010

Automotive Power

TLE42744

Type Package Marking

TLE42744DV50 PG-TO252-3 42744V5

TLE42744GV50 PG-TO263-3 42744V5

TLE42744EV50 PG-SSOP-14 exposed pad 42744V5

TLE42744DV33 PG-TO252-3 42744V33

TLE42744GV33 PG-TO263-3 42744V33

TLE42744GSV33 PG-SOT223-4 42744V33

Data Sheet 2 Rev. 1.1, 2010-01-13

PG-TO252-3

PG-TO263-3

PG-SSOP-14 exposed pad

PG-SOT223-4

Low Dropout Linear Voltage Regulator

1Overview

Features

• Very Low Current Consumption

• Output Voltages 5 V and 3.3 V ±2%

• Output Current up to 400 mA

• Very Low Dropout Voltage

• Output Current Limitation

• Reverse Polarity Protection

• Overtemperature Shutdown

• Wide Temperature Range

From -40 °C up to 150 °C

• Green Product (RoHS compliant)

• AEC Qualified

Description

The TLE42744 is a monolithic integrated low dropout voltage regulator for load currents up to 400 mA. An input

voltage up to 40 V is regulated to VQ,nom = 5 V / 3.3 V with a precision of ±2%. The device is designed for the harsh

environment of automotive applications. Therefore it is protected against overload, short circuit and

overtemperature conditions by the implemented output current limitation and the overtemperature shutdown

circuit. The TLE42744 can be also used in all other applications requiring a stabilized 5 V / 3.3 V voltage.

Due to its very low quiescent current the TLE42744 is dedicated for use in applications permanently connected to

VBAT.

Data Sheet 3 Rev. 1.1, 2010-01-13

TLE42744

Block Diagram

2 Block Diagram

Figure 1 Block Diagram

AEB01959

GND

Bandgap

Reference

Control

Amplifier

Sensor

Temperature

Buffer

Saturation

Control and

Protection

Circuit

TLE42744

Pin Configuration

Data Sheet 4 Rev. 1.1, 2010-01-13

3 Pin Configuration

3.1 Pin Assignment PG-TO252-3, PG-TO263-3 and PG-SOT223-4

Figure 2 Pin Configuration (top view)

3.2 Pin Definitions and Functions PG-TO252-3, PG-TO263-3and PG-SOT223-4

Pin No. Symbol Function

1IInput

block to ground directly at the IC with a ceramic capacitor

2GNDGround

internally connected to heat slug

3QOutput

block to ground with a capacitor close to the IC terminals, respecting the values given

for its capacitance and ESR in “Functional Range” on Page 7

Heat Slug / 4 – Heat Slug

internally connected to GND;

connect to GND and heatsink area

AEP02561

ΙQ

GND

AEP02281

PinConfig_PG-SOT223-

4 .vsd

123

IGND

GND

Data Sheet 5 Rev. 1.1, 2010-01-13

TLE42744

Pin Configuration

3.3 Pin Assignment PG-SSOP-14 exposed pad

Figure 3 Pin Configuration (top view)

3.4 Pin Definitions and Functions PG-SSOP-14 exposed pad

Pin No. Symbol Function

1, 2, 3, 5, 6, 7 n.c. not connected

can be open or connected to GND

4GNDGround

8, 10, 11, 12,

n.c. not connected

can be open or connected to GND

9QOutput

block to ground with a capacitor close to the IC terminals, respecting the values given

for its capacitance and ESR in “Functional Range” on Page 7

13 I Input

block to ground directly at the IC with a ceramic capacitor

Pad – Exposed Pad

connect to GND and heatsink area

QF

*1'

QF





























7/(B3,1&21),*B6623

69*

TLE42744

General Product Characteristics

Data Sheet 6 Rev. 1.1, 2010-01-13

4 General Product Characteristics

4.1 Absolute Maximum Ratings

Note: Stresses above the ones listed here may cause permanent damage to the device. Exposure to absolute

maximum rating conditions for extended periods may affect device reliability.

Note: Integrated protection functions are designed to prevent IC destruction under fault conditions described in the

data sheet. Fault conditions are considered as “outside” normal operating range. Protection functions are

not designed for continuous repetitive operation.

Absolute Maximum Ratings1)

Tj= -40 °C to 150 °C; all voltages with respect to ground, (unless otherwise specified)

1) not subject to production test, specified by design

Pos. Parameter Symbol Limit Values Unit Test Condition

Min. Max.

Input I

4.1.1 Voltage VI-42 45 V –

Output Q

4.1.2 Voltage VQ-1 40 V –

Temperature

4.1.3 Junction temperature Tj-40 150 °C–

4.1.4 Storage temperature Tstg -50 150 °C–

ESD Susceptibility

4.1.5 ESD Absorption VESD,HBM -4 4 kV Human Body Model

(HBM)2)

2) ESD susceptibility Human Body Model “HBM” according to AEC-Q100-002 - JESD22-A114

4.1.6 VESD,CDM -1000 1000 V Charge Device

Model (CDM)3) at all

pins

3) ESD susceptibility Charged Device Model “CDM” according to ESDA STM5.3.1

Data Sheet 7 Rev. 1.1, 2010-01-13

TLE42744

General Product Characteristics

4.2 Functional Range

Note: Within the functional or operating range, the IC operates as described in the circuit description. The electrical

characteristics are specified within the conditions given in the Electrical Characteristics table.

4.3 Thermal Resistance

Note: This thermal data was generated in accordance with JEDEC JESD51 standards. For more information, go

to www.jedec.org.

Pos. Parameter Symbol Limit Values Unit Remarks

Min. Max.

4.2.1 Input voltage VI5.5 40 V TLE42744DV50,

TLE42744GV50,

TLE42744EV50

4.2.2 Input voltage VI4.7 40 V TLE42744GV33,

TLE42744DV33,

TLE42744GSV33

4.2.3 Output Capacitor’s

Requirements for Stability

CQ22 – µF 1)

1) the minimum output capacitance requirement is applicable for a worst case capacitance tolerance of 30%

4.2.4 ESR(CQ)–3Ω2)

2) relevant ESR value at f=10kHz

4.2.5 Junction temperature Tj-40 150 °C–

Pos. Parameter Symbol Limit Values Unit Conditions

Min. Typ. Max.

TLE42744DV50, TLE42744DV33 (PG-TO252-3)

4.3.1 Junction to Case1) RthJC – 3.6 – K/W measured to heat

slug

4.3.2 Junction to Ambient1) RthJA –27–K/W

4.3.3 – 115 – K/W footprint only3)

4.3.4 – 52 – K/W 300 mm² heatsink

area3)

4.3.5 – 40 – K/W 600 mm² heatsink

area3)

TLE42744GV50, TLE42744GV33 (PG-TO263-3)

4.3.6 Junction to Case1) RthJC – 3.6 – K/W measured to heat

slug

4.3.7 Junction to Ambient1) RthJA –22– 2)

4.3.8 – 74 – K/W footprint only3)

4.3.9 – 42 – K/W 300 mm² heatsink

area3)

4.3.10 – 34 – K/W 600 mm² heatsink

area3)

TLE42744

General Product Characteristics

Data Sheet 8 Rev. 1.1, 2010-01-13

TLE42744EV50 (PG-SSOP-14 exposed pad)

4.3.11 Junction to Case1) RthJC – 7 – K/W measured to

exposed pad

4.3.12 Junction to Ambient1) RthJA –43–K/W

4.3.13 – 120 – K/W footprint only3)

4.3.14 – 59 – K/W 300 mm² heatsink

area3)

4.3.15 – 49 – K/W 600 mm² heatsink

area3)

TLE42744GSV33 (PG-SOT223-4)

4.3.16 Junction to Case1) RthJC – 17 – K/W measured to heat

slug

4.3.17 Junction to Ambient1) RthJA –54–K/W

4.3.18 – 139 – K/W footprint only3)

4.3.19 – 73 – K/W 300 mm² heatsink

area3)

4.3.20 – 64 – K/W 600 mm² heatsink

area3)

1) Not subject to production test, specified by design.

2) Specified RthJA value is according to Jedec JESD51-2,-5,-7 at natural convection on FR4 2s2p board; The Product

(Chip+Package) was simulated on a 76.2 x 114.3 x 1.5 mm³ board with 2 inner copper layers (2 x 70µm Cu, 2 x 35µm Cu).

Where applicable a thermal via array under the exposed pad contacted the first inner copper layer.

3) Specified RthJA value is according to Jedec JESD 51-3 at natural convection on FR4 1s0p board; The Product

(Chip+Package) was simulated on a 76.2 × 114.3 × 1.5 mm3 board with 1 copper layer (1 x 70µm Cu).

Pos. Parameter Symbol Limit Values Unit Conditions

Min. Typ. Max.

Data Sheet 9 Rev. 1.1, 2010-01-13

TLE42744

Electrical Characteristics

5 Electrical Characteristics

5.1 Electrical Characteristics Voltage Regulator

Electrical Characteristics

VI =13.5 V; Tj= -40 °C to 150 °C; all voltages with respect to ground (unless otherwise specified)

Pos. Parameter Symbol Limit Values Unit Measuring Condition

Min. Typ. Max.

Output Q

5.1.1 Output Voltage VQ4.9 5.0 5.1 V TLE42744DV50,

TLE42744GV50,

TLE42744EV50

5mA<IQ<400mA

6V<VI<28V

5.1.2 Output Voltage VQ4.9 5.0 5.1 V TLE42744DV50,

TLE42744GV50,

TLE42744EV50

5mA<IQ<200 mA

6V<VI<40V

5.1.3 Output Voltage VQ3.23 3.3 3.37 V TLE42744GV33,

TLE42744DV33,

TLE42744GSV33;

5mA<IQ<400mA

4.7 V < VI<28V

5.1.4 Output Voltage VQ3.23 3.3 3.37 V TLE42744GV33,

TLE42744DV33,

TLE42744GSV33;

5mA<IQ<200 mA

4.7 V < VI<40V

5.1.5 Dropout Voltage Vdr – 250 500 mV TLE42744DV50,

TLE42744GV50,

TLE42744EV50

IQ=250mA

Vdr =VI–VQ

5.1.6 Load Regulation ∆VQ, lo – 20 50 mV TLE42744DV50,

TLE42744GV50,

TLE42744EV50;

IQ= 5 mA to 400 mA

VI=6V

5.1.7 Load Regulation ∆VQ, lo – 40 70 mV TLE42744GV33,

TLE42744DV33,

TLE42744GSV33;

IQ= 5 mA to 300 mA

5.1.8 Line Regulation ∆VQ, li – 1025mVVl= 12 V to 32 V

IQ=5mA

5.1.9 Output Current Limitation IQ400 600 1100 mA 1)

5.1.10 Power Supply Ripple Rejection2) PSRR –60–dBfr=100Hz; Vr=0.5Vpp

TLE42744

Electrical Characteristics

Data Sheet 10 Rev. 1.1, 2010-01-13

5.1.11 Temperature Output Voltage Drift2) –0.5–mV/K–

5.1.12 Overtemperature Shutdown

Threshold

Tj,sd 151 – 200 °C Tj increasing2)

5.1.13 Overtemperature Shutdown

Threshold Hysteresis

Tj,sdh –25–°CTj decreasing2)

Current Consumption

5.1.14 Quiescent Current

Iq=II–IQ

Iq–100220µAIQ=1mA

5.1.15 Current Consumption

Iq=II–IQ

Iq–815mAIQ=250mA

5.1.16 Iq– 15 25 mA TLE42744DV50,

TLE42744GV50,

TLE42744EV50;

IQ=400mA

5.1.17 – 20 30 mA TLE42744GV33,

TLE42744DV33,

TLE42744GSV33;

IQ=400mA

1) Measured when the output voltage VQ has dropped 100 mV from the nominal value obtained at VI = 13.5 V.

2) not subject to production test, specified by design

Electrical Characteristics

VI =13.5 V; Tj= -40 °C to 150 °C; all voltages with respect to ground (unless otherwise specified)

Pos. Parameter Symbol Limit Values Unit Measuring Condition

Min. Typ. Max.

dVQ

-----------

Data Sheet 11 Rev. 1.1, 2010-01-13

TLE42744

Electrical Characteristics

5.2 Typical Performance Characteristics Voltage Regulator

Current Consumption Iq versus

Output Current IQ

Current Consumption Iq versus

Low Output Current IQ

Output Voltage Variation

∆

VQ versus

Junction Temperature TJ

Dropout Voltage Vdr versus

Output Current IQ (5 V versions only)

01_IQ_IQ.VSD

0 100 200 300 400

[mA]

= 13.5 V

= 25 °C

02_IQ_IQLOW.VSD

0,2

0,4

0,6

0,8

1,2

1,4

0 20406080100

[mA]

= 13.5 V

= 25 °C

03_VQ_TJ.VSD

-0,5

-0,4

-0,3

-0,2

-0,1

0,1

0,2

0,3

0,4

0,5

-40 0 40 80 120

[°C]

∆

[%]

= 5 mA

= 13.5 V

150

04_VDR_IQ.VSD

100

150

200

250

300

350

400

450

500

0 100 200 300 400

[mA]

[mV]

= 150 °C

= 25 °C

= -40 °C

TLE42744

Electrical Characteristics

Data Sheet 12 Rev. 1.1, 2010-01-13

Dropout Voltage Vdr versus

Junction Temperature (5 V versions only)

Maximum Output Current IQ versus

Input Voltage VI

Region Of Stability: Output Capacitor’s ESR

ESR(CQ) versus Output Current IQ

05_VDR_TJ.VSD

100

150

200

250

300

350

400

450

500

-40 0 40 80 120 160

[°C]

[mV]

= 400 mA

= 100 mA

= 10 mA

0 6 _ IQM AX_ VI.VSD

100

200

300

400

500

600

700

800

900

010203040

[V]

Q,max

[mA]

= V

Q,nom

- 100 mV

= -40 °C

= 25 °C

= 150 °C

07_ESR_IQ.VSD

0,01

0,1

0 100 200 300 400

[mA]

ESR(C

)

[Ω]

= 22 µF

= 13.5 V

Stable

Region

Unstable

Region

Data Sheet 13 Rev. 1.1, 2010-01-13

TLE42744

Package Outlines

6 Package Outlines

Figure 4 PG-TO252-3

5.4 ±0.1

-0.10

6.5 +0.15

±0.5

9.9

6.22

-0.2

±0.1

±0.15

0.8

0.15

±0.1

MAX.

per side 0.75

2.28

4.57

+0.08

-0.04

0.9

2.3 -0.10

+0.05

MIN.0.51

±0.1

+0.08

-0.04

0.5

0...0.15

A0.25 M0.1

All metal surfaces tin plated, except area of cut.

3 x

TLE42744

Package Outlines

Data Sheet 14 Rev. 1.1, 2010-01-13

Figure 5 PG-TO263-3

BA0.25

0.1

Typical

±0.2

GPT09362

8.5

7.55

(15)

±0.2

9.25

±0.3

0...0.15

5.08

2.54

0.75

±0.1

1.05

±0.1

1.27

4.4

0.5

±0.1

±0.3

2.7

4.7

±0.5

0.05

0.1

All metal surfaces: tin plated, except area of cut.

2.4

Metal surface min. x=7.25, y=6.9

0...0.3

8˚ MAX.

Data Sheet 15 Rev. 1.1, 2010-01-13

TLE42744

Package Outlines

Figure 6 PG-SSOP-14 exposed pad

PG-SSOP-14-1,-2,-3-PO V02

14 8

14x

0.25

±0.05 2)

0.15 DC A-B

0.65 C

Stand Off

0 ... 0.1

(1.45)

1.7 MAX.

0.08 C

4.9

±0.11)

A-BC0.1 2x

1) Does not include plastic or metal protrusion of 0.15 max. per side

2) Does not include dambar protrusion

Bottom View

±0.2

2.65

0.2

±0.2

D 8x

0.64

±0.25

3.9

±0.11)

0.35 x 45˚

0.1 CD

+0.06

0.19

MAX.

Index Marking

Exposed

Diepad

TLE42744

Package Outlines

Data Sheet 16 Rev. 1.1, 2010-01-13

Figure 7 PG-SOT223-4

Green Product (RoHS compliant)

To meet the world-wide customer requirements for environmentally friendly products and to be compliant with

government regulations the device is available as a green product. Green products are RoHS-Compliant (i.e

Pb-free finish on leads and suitable for Pb-free soldering according to IPC/JEDEC J-STD-020).

SOT223-PO V04

123

±0.1

±0.04

0.5 MIN.

0.28

0.1 MAX.

6.5±0.2

4.6

2.3

0.7 ±0.1

0.25 MA

1.6±0.1

±0.3

B0.25 M

±0.2

3.5

0...10˚

For further information on alternative packages, please visit our website:

http://www.infineon.com/packages.Dimensions in mm

Data Sheet 17 Rev. 1.1, 2010-01-13

TLE42744

Revision History

7 Revision History

Revision Date Changes

1.1 2010-01-13 Updated Version Data Sheet:

version TLE42744EV50 in PG-SSOP-14 exposed pad and all related description

added;

3.3V versions TLE42744GV33 in PG-TO263-3, TLE42744DV33 in PG-TO252-3

and TLE42744GSV33 in PG-SOT223-4 and all related description added

1.0 2009-01-14 Initial Version final Data Sheet

Edition 2010-01-13

Published by

Infineon Technologies AG

81726 Munich, Germany

Legal Disclaimer

The information given in this document shall in no event be regarded as a guarantee of conditions or

characteristics. With respect to any examples or hints given herein, any typical values stated herein and/or any

information regarding the application of the device, Infineon Technologies hereby disclaims any and all warranties

and liabilities of any kind, including without limitation, warranties of non-infringement of intellectual property rights

of any third party.

Information

For further information on technology, delivery terms and conditions and prices, please contact the nearest

Infineon Technologies Office (www.infineon.com).

Warnings

Due to technical requirements, components may contain dangerous substances. For information on the types in

question, please contact the nearest Infineon Technologies Office.

Infineon Technologies components may be used in life-support devices or systems only with the express written

approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure

of that life-support device or system or to affect the safety or effectiveness of that device or system. Life support

devices or systems are intended to be implanted in the human body or to support and/or maintain and sustain

and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other persons may

be endangered.