TPS73219 SBVS166 - JUNE 2011 www.ti.com 250mA Low-Dropout Regulator for C2000TM Check for Samples: TPS73219 FEATURES DESCRIPTION * * * * The TPS73219 family is a low-dropout (LDO) voltage regulator that offers very good line and load transient response even without the use of an output capacitor. The TPS73219 is ideal for driving the C2000 MCUs fron Texas Instruments. The device offers very low dropout voltage, thereby reducing power loss. 1 23 * * * * Optimal Output Voltage for Core Rail of C2000 Good Line/Load Transient Response for MCUs 250mA LDO Voltage Regulator with Enable Very Low Dropout Voltage: 40mV (typ) at 250mA Reverse Current Protection Stable with or without Output Capacitor 1% Overall Accuracy (Line, Load, and Temperature) Available in a 5-Pin SOT23 Package In combination with a voltage supervisor such as the TPS3808G19 or TPS3808G01, the TPS73219 can deliver tight VCORE voltages and generate accurate power-good signals that meet or exceed power requirements for the C2000. The TPS73219 is available in a 5-pin SOT23 package. APPLICATIONS * C2000 Core Power Rail Supply DBV PACKAGE SOT23 (TOP VIEW) IN 1 GND 2 EN 3 5 OUT 4 NR/FB 1.8 V 3.3 V 10 kW TPS3808G01 or TPS3808G19 TPS73219 or TPS73619 OUT EN LDO 1.8 V SENSE 51 kW 15 kW RESET SVS 1.8 V 10 kW C2000 TPS73534 or TPS73734 TPS3808G01 OUT EN LDO 3.3 V SENSE 91 kW RESET XRS SVS 3.3 V 13 kW Figure 1. Typical Application 1 2 3 Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. C2000 is a trademark of Texas Instruments. All other trademarks are the property of their respective owners. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright (c) 2011, Texas Instruments Incorporated TPS73219 SBVS166 - JUNE 2011 www.ti.com This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. ORDERING INFORMATION (1) PRODUCT TPS732xx yy yz (1) (2) (3) VOUT (2) XX is nominal output voltage (for example, 25 = 2.5V, 01 = Adjustable (3)). YYY is package designator. Z is package quantity. For the most current specification and package information, refer to the Package Option Addendum located at the end of this datasheet or see the TI website at www.ti.com. Most output voltages of 1.25V and 1.3V to 5.0V in 100mV increments are available through the use of innovative factory EEPROM programming; minimum order quantities may apply. Contact factory for details and availability. For fixed 1.20V operation, tie FB to OUT. ABSOLUTE MAXIMUM RATINGS Over operating junction temperature range unless otherwise noted. (1) PARAMETER TPS73219 UNIT VIN range -0.3 to 6.0 V VEN range -0.3 to 6.0 V VOUT range -0.3 to 5.5 V -0.3 to 6.0 V VNR, VFB range Peak output current Output short-circuit duration Internally limited Indefinite Continuous total power dissipation See Thermal Information Table Junction temperature range, TJ -55 to +150 Storage temperature range -65 to +150 C ESD rating, HBM 2 kV ESD rating, CDM 500 V (1) 2 C Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under the Electrical Characteristics is not implied. Exposure to absolute maximum rated conditions for extended periods may affect device reliability. Copyright (c) 2011, Texas Instruments Incorporated TPS73219 SBVS166 - JUNE 2011 www.ti.com THERMAL INFORMATION TPS73219 (3) THERMAL METRIC (1) (2) DBV UNITS 5 PINS Junction-to-ambient thermal resistance (4) JA (5) 180 JCtop Junction-to-case (top) thermal resistance JB Junction-to-board thermal resistance (6) 35 JT Junction-to-top characterization parameter (7) N/A JB Junction-to-board characterization parameter (8) N/A JCbot Junction-to-case (bottom) thermal resistance (9) N/A (1) (2) (3) (4) (5) (6) (7) (8) (9) 64 C/W For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953A. For thermal estimates of this device based on PCB copper area, see the TI PCB Thermal Calculator. Thermal data for the DRB, DCQ, and DRV packages are derived by thermal simulations based on JEDEC-standard methodology as specified in the JESD51 series. The following assumptions are used in the simulations: (a) There is no exposed pad with the DBV package. (b) The top and bottom copper layers are assumed to have a 20% thermal conductivity of copper representing a 20% copper coverage. (c) These data were generated with only a single device at the center of a JEDEC high-K (2s2p) board with 3in x 3in copper area. To understand the effects of the copper area on thermal performance, see the Power Dissipation section of this data sheet. The junction-to-ambient thermal resistance under natural convection is obtained in a simulation on a JEDEC-standard, high-K board, as specified in JESD51-7, in an environment described in JESD51-2a. The junction-to-case (top) thermal resistance is obtained by simulating a cold plate test on the top of the package. No specific JEDEC-standard test exists, but a close description can be found in the ANSI SEMI standard G30-88. The junction-to-board thermal resistance is obtained by simulating in an environment with a ring cold plate fixture to control the PCB temperature, as described in JESD51-8. The junction-to-top characterization parameter, JT, estimates the junction temperature of a device in a real system and is extracted from the simulation data to obtain JA using a procedure described in JESD51-2a (sections 6 and 7). The junction-to-board characterization parameter, JB, estimates the junction temperature of a device in a real system and is extracted from the simulation data to obtain JA using a procedure described in JESD51-2a (sections 6 and 7). The junction-to-case (bottom) thermal resistance is obtained by simulating a cold plate test on the exposed (power) pad. No specific JEDEC standard test exists, but a close description can be found in the ANSI SEMI standard G30-88. Copyright (c) 2011, Texas Instruments Incorporated 3 TPS73219 SBVS166 - JUNE 2011 www.ti.com ELECTRICAL CHARACTERISTICS Over operating temperature range (TJ = -40C to +125C), VIN = 2.4V, IOUT = 10mA, VEN = 1.7V, and COUT = 0.1F, unless otherwise noted. Typical values are at TJ = 25C. PARAMETER TEST CONDITIONS VIN Input voltage range VOUT Accuracy VOUT%/VIN Line regulation VOUT%/IOUT Load regulation VDO Dropout voltage (VIN = VOUT (nom) - 0.1V) IOUT = 250mA ZO(DO) Output impedance in dropout 1.7 V VIN VOUT + VDO ICL Output current limit VOUT = 0.9 x VOUT(nom) ISC Short-circuit current IREV MIN +0.5 TJ = +25C -0.5 VIN, IOUT, and T VOUT + 0.5V VIN 5.5V; 10 mA IOUT 250mA -1.0 Reverse leakage current VOUT(nom) + 0.5V VIN 5.5V 0.5 1mA IOUT 250mA 0.002 10mA IOUT 250mA 0.0005 40 425 IOUT = 250mA 650 950 VEN 0.5V, VOUT VIN 5.5, -40C TJ +100C 0.02 1 f = 10kHz, IOUT = 250 mA 37 VN Output noise voltage BW = 10Hz - 100kHz COUT = 10F, No CNR 27 x VOUT COUT = 10F, CNR = 0.01F 8.5 x VOUT tSTR Startup time VOUT = 3V, RL = 30 COUT = 1 F, CNR = 0.01 F 600 VEN(HI) EN pin high (enabled) VEN(LO) EN pin low (shutdown) IEN(HI) EN pin current (enabled) 4 mA 10 58 (1) 550 f = 100Hz, IOUT = 250 mA Operating junction temperature mA 0.1 Power-supply rejection ratio (ripple rejection) TJ 600 400 PSRR Thermal shutdown temperature mV IOUT = 10mA (IQ) Shutdown current (IGND) % 150 VEN 0.5V, 0V VIN VOUT ISHDN V %/mA 300 GND pin current UNIT %/V 0.25 250 IGND TSD +1.0 0.01 VOUT = 0V (-IIN) MAX 5.5 Nominal (1) TYP 2.05 A A A dB VRMS s 1.7 VIN V 0 0.5 V 0.1 A VEN = 5.5V 0.02 Shutdown Temp increasing +160 Reset Temp decreasing +140 -40 C +125 C Fixed-voltage versions only; refer to Applications section for more information. Copyright (c) 2011, Texas Instruments Incorporated TPS73219 SBVS166 - JUNE 2011 www.ti.com FUNCTIONAL BLOCK DIAGRAM IN 4MHz Charge Pump EN Thermal Protection Ref Servo 27k Bandgap Error Amp Current Limit OUT 8k GND R1 R1 + R2 = 80k R2 NR Figure 2. Fixed Voltage Version Copyright (c) 2011, Texas Instruments Incorporated 5 TPS73219 SBVS166 - JUNE 2011 www.ti.com PIN CONFIGURATION DBV PACKAGE SOT23 (TOP VIEW) IN 1 GND 2 EN 3 5 OUT 4 NR/FB PIN DESCRIPTIONS 6 NAME SOT23 (DBV) PIN NO. DESCRIPTION IN 1 Input supply GND 2 Ground EN 3 Driving the enable pin (EN) high turns on the regulator. Driving this pin low puts the regulator into shutdown mode. Refer to the Shutdown section under Applications Information for more details. EN can be connected to IN if not used. NR 4 Fixed voltage versions only--connecting an external capacitor to this pin bypasses noise generated by the internal bandgap, reducing output noise to very low levels. FB 4 Adjustable voltage version only--this is the input to the control loop error amplifier, and is used to set the output voltage of the device. OUT 5 Output of the Regulator. There are no output capacitor requirements for stability. Copyright (c) 2011, Texas Instruments Incorporated TPS73219 SBVS166 - JUNE 2011 www.ti.com TYPICAL CHARACTERISTICS For all voltage versions at TJ = 25C, VIN = 2.4V, IOUT = 10mA, VEN = 1.7V, and COUT = 0.1F, unless otherwise noted. LOAD REGULATION LINE REGULATION 0.5 0.20 Referred to IOUT = 10mA -40_C +25_C +125_C Change in VOUT (%) 0.3 0.2 0.1 0 -0.1 -0.2 -0.3 Referred to VIN = VOUT + 0.5V at IOUT = 10mA 0.15 Change in VOUT (%) 0.4 0.10 +25_ C +125_C 0.05 0 -0.05 -40_ C -0.10 -0.15 -0.4 -0.5 -0.20 0 50 100 150 200 0 250 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 VIN - VOUT (V) IOUT (mA) Figure 3. Figure 4. DROPOUT VOLTAGE vs OUTPUT CURRENT DROPOUT VOLTAGE vs TEMPERATURE 100 100 TPS73225DBV 80 80 TPS73225DBV IOUT = 250mA 60 VDO (mV) VDO (mV) +125_ C +25_ C 40 60 40 20 20 -40_C 0 -50 0 0 50 100 150 200 250 -25 0 25 50 IOUT (mA) Temperature (_C) Figure 5. Figure 6. OUTPUT VOLTAGE ACCURACY HISTOGRAM 75 100 125 OUTPUT VOLTAGE DRIFT HISTOGRAM 30 18 IOUT = 10mA 16 25 I OUT = 10mA All Voltage Versions Percent of Units (%) Percent of Units (%) 14 20 15 10 12 10 8 6 4 5 2 0 -1.0 -0.9 -0.8 -0.7 -0.6 -0.5 -0.4 -0.3 -0.2 -0.1 0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 -100 -90 -80 -70 -60 -50 -40 -30 -20 -10 0 10 20 30 40 50 60 70 80 90 100 0 VOUT Error (%) Worst Case dVOUT/dT (ppm/_ C) Figure 7. Copyright (c) 2011, Texas Instruments Incorporated Figure 8. 7 TPS73219 SBVS166 - JUNE 2011 www.ti.com TYPICAL CHARACTERISTICS (continued) For all voltage versions at TJ = 25C, VIN = 2.4V, IOUT = 10mA, VEN = 1.7V, and COUT = 0.1F, unless otherwise noted. GROUND PIN CURRENT vs OUTPUT CURRENT GROUND PIN CURRENT vs TEMPERATURE 1000 800 900 700 IOUT = 250mA 800 600 600 I GND (A) I GND (A) 700 500 400 300 100 50 100 150 200 300 VIN = 5.5V VIN = 4V VIN = 2V 100 0 -50 0 0 400 200 VIN = 5.5V VIN = 4V VIN = 2V 200 500 250 -25 0 Figure 9. 50 75 100 125 Figure 10. GROUND PIN CURRENT IN SHUTDOWN vs TEMPERATURE CURRENT LIMIT vs VOUT (FOLDBACK) 500 1 VENABLE = 0.5V VIN = VOUT + 0.5V 450 ICL 400 Output Current (mA) IGND (A) 25 Temperature (_C) IOUT (mA) 0.1 350 300 ISC 250 200 150 100 50 0.01 -50 -25 0 25 50 75 100 0 -0.5 125 TPS73233 0 0.5 Figure 11. 2.0 2.5 3.0 3.5 CURRENT LIMIT vs TEMPERATURE 600 600 550 550 500 500 Current Limit (mA) Current Limit (mA) 1.5 Figure 12. CURRENT LIMIT vs VIN 450 400 350 300 450 400 350 300 250 1.5 2.0 2.5 3.0 3.5 VIN (V) Figure 13. 8 1.0 Output Voltage (V) Temperature (_C) 4.0 4.5 5.0 5.5 250 -50 -25 0 25 50 75 100 125 Temperature (_ C) Figure 14. Copyright (c) 2011, Texas Instruments Incorporated TPS73219 SBVS166 - JUNE 2011 www.ti.com TYPICAL CHARACTERISTICS (continued) For all voltage versions at TJ = 25C, VIN = 2.4V, IOUT = 10mA, VEN = 1.7V, and COUT = 0.1F, unless otherwise noted. PSRR (RIPPLE REJECTION) vs FREQUENCY PSRR (RIPPLE REJECTION) vs VIN - VOUT 40 90 IOUT = 100mA COUT = Any 80 35 30 IOUT = 1mA COUT = 10F 60 50 IO = 100mA CO = 1F IOUT = 1mA C OUT = Any 40 25 PSRR (dB) Ripple Rejection (dB) 70 IOUT = 1mA COUT = 1F 20 15 30 20 IOUT = Any COUT = 0F 10 VIN = VOUT + 1V 0 10 100 1k 10k Frequency = 10kHz COUT = 10mF VOUT = 2.5V IOUT = 100mA 10 I OUT = 100mA COUT = 10F 5 0 100k 1M 0 10M 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 Frequency (Hz) VIN - VOUT (V) Figure 15. Figure 16. NOISE SPECTRAL DENSITY CNR = 0F NOISE SPECTRAL DENSITY CNR = 0.01F 1 1.8 2.0 1 eN (V/Hz) eN (V/Hz) C OUT = 1F COUT = 0F 0.1 COUT = 10F COUT = 1F 0.1 COUT = 0F COUT = 10F IOUT = 150mA IOUT = 150mA 0.01 0.01 10 100 1k 10k 100k 10 100 1k Frequency (Hz) Frequency (Hz) Figure 17. Figure 18. RMS NOISE VOLTAGE vs COUT 10k 100k RMS NOISE VOLTAGE vs CNR 60 140 50 120 VOUT = 5.0V VOUT = 5.0V 100 30 VN (RMS) VN (RMS) 40 VOUT = 3.3V 20 10 20 CNR = 0.01F 10Hz < Frequency < 100kHz 0.1 1 COUT (F) Figure 19. Copyright (c) 2011, Texas Instruments Incorporated 0 10 VOUT = 3.3V 60 40 VOUT = 1.5V 0 80 VOUT = 1.5V COUT = 0F 10Hz < Frequency < 100kHz 1p 10p 100p 1n 10n CNR (F) Figure 20. 9 TPS73219 SBVS166 - JUNE 2011 www.ti.com TYPICAL CHARACTERISTICS (continued) For all voltage versions at TJ = 25C, VIN = 2.4V, IOUT = 10mA, VEN = 1.7V, and COUT = 0.1F, unless otherwise noted. TPS73233 LOAD TRANSIENT RESPONSE VIN = 3.8V TPS73233 LINE TRANSIENT RESPONSE COUT = 0F 50mV/tick IOUT = 250mA VOUT COUT = 0F 50mV/div COUT = 1F 50mV/tick COUT = 10F 50mV/tick VOUT VOUT VOUT C OUT = 100F 50mV/div = 0.5V/s dt 50mA/tick 10mA 4.5V 1V/div VIN I OUT 10s/div 10s/div Figure 21. Figure 22. TPS73233 TURN-ON RESPONSE TPS73233 TURN-OFF RESPONSE RL = 1k COUT = 0F RL = 20 COUT = 10F VOUT R L = 20 C OUT = 1F R L = 20 C OUT = 1F 1V/div RL = 1k COUT = 0F RL = 20 COUT = 10F VOUT 2V 2V VEN 1V/div 1V/div 0V 0V VEN 100s/div 100s/div Figure 23. Figure 24. TPS73233 POWER UP / POWER DOWN IENABLE vs TEMPERATURE 10 6 5 4 VIN VOUT IENABLE (nA) 3 Volts dVIN 5.5V 250mA 1V/div VOUT 2 1 1 0.1 0 -1 -2 50ms/div 0.01 -50 -25 0 25 50 75 100 125 Temperature (C) Figure 25. 10 Figure 26. Copyright (c) 2011, Texas Instruments Incorporated TPS73219 SBVS166 - JUNE 2011 www.ti.com TYPICAL CHARACTERISTICS (continued) For all voltage versions at TJ = 25C, VIN = 2.4V, IOUT = 10mA, VEN = 1.7V, and COUT = 0.1F, unless otherwise noted. TPS73201 IFB vs TEMPERATURE 60 160 55 140 50 120 45 100 I FB (nA) VN (rms) TPS73201 RMS NOISE VOLTAGE vs CFB 40 35 30 25 80 60 VOUT = 2.5V COUT = 0F R1 = 39.2k 10Hz < Frequency < 100kHz 20 10p 100p 40 20 1n 10n 0 -50 -25 CFB (F) 0 25 50 75 100 Figure 27. Figure 28. TPS73201 LOAD TRANSIENT, ADJUSTABLE VERSION TPS73201 LINE TRANSIENT, ADJUSTABLE VERSION CFB = 10nF R1 = 39.2k COUT = 0F 100mV/div 125 Temperature (_C) COUT = 0F VOUT 100mV/div VOUT 100mV/div C OUT = 10F 100mV/div COUT = 10F VOUT = 2.5V CFB = 10nF VOUT VOUT 4.5V 250mA 3.5V VIN 10mA IOUT 10s/div 5s/div Figure 29. Figure 30. Copyright (c) 2011, Texas Instruments Incorporated 11 TPS73219 SBVS166 - JUNE 2011 www.ti.com APPLICATION INFORMATION The TPS73219 belongs to a family of new generation LDO regulators that use an NMOS pass transistor to achieve ultra-low-dropout performance, reverse current blockage, and freedom from output capacitor constraints. These features, combined with low noise and an enable input, make the TPS73219 ideal for portable applications. This regulator family offers a wide selection of fixed output voltage versions and an adjustable output version. All versions have thermal and over-current protection, including foldback current limit. Figure 31 shows the basic circuit connections for the fixed voltage models. Optional input capacitor. May improve source impedance, noise, or PSRR. VIN Optional output capacitor. May improve load transient, noise, or PSRR. IN OUT VOUT TPS732xx EN GND NR Optional bypass capacitor to reduce output noise. Figure 31. Typical Application Circuit for Fixed-Voltage Versions For best accuracy, make the parallel combination of R1 and R2 approximately equal to 19k. This 19k, in addition to the internal 8k resistor, presents the same impedance to the error amp as the 27k bandgap reference output. This impedance helps compensate for leakages into the error amp terminals. INPUT AND OUTPUT CAPACITOR REQUIREMENTS Although an input capacitor is not required for stability, it is good analog design practice to connect a 0.1F to 1F low ESR capacitor across the input supply near the regulator. This counteracts reactive input sources and improves transient response, noise rejection, and ripple rejection. A higher-value capacitor may be necessary if large, fast rise-time load transients are anticipated or the device is located several inches from the power source. The TPS73219 does not require an output capacitor for stability and has maximum phase margin with no capacitor. It is designed to be stable for all available 12 OUTPUT NOISE A precision band-gap reference is used to generate the internal reference voltage, VREF. This reference is the dominant noise source within the TPS73219 and it generates approximately 32VRMS (10Hz to 100kHz) at the reference output (NR). The regulator control loop gains up the reference noise with the same gain as the reference voltage, so that the noise voltage of the regulator is approximately given by: VOUT (R1 ) R2) V N + 32mVRMS + 32mVRMS R2 VREF (1) Since the value of VREF is 1.2V, this relationship reduces to: ON OFF types and values of capacitors. In applications where multiple low ESR capacitors are in parallel, ringing may occur when the product of COUT and total ESR drops below 50nF. Total ESR includes all parasitic resistances, including capacitor ESR and board, socket, and solder joint resistance. In most applications, the sum of capacitor ESR and trace resistance will meet this requirement. mVV RMS V N(mVRMS) + 27 V OUT(V) (2) for the case of no CNR. An internal 27k resistor in series with the noise reduction pin (NR) forms a low-pass filter for the voltage reference when an external noise reduction capacitor, CNR, is connected from NR to ground. For CNR = 10nF, the total noise in the 10Hz to 100kHz bandwidth is reduced by a factor of ~3.2, giving the approximate relationship: mVV V N(mVRMS) + 8.5 RMS V OUT(V) (3) for CNR = 10nF. This noise reduction effect is shown as RMS Noise Voltage vs CNR (Figure 20) in the Typical Characteristics section. The TPS73219 uses an internal charge pump to develop an internal supply voltage sufficient to drive the gate of the NMOS pass element above VOUT. The charge pump generates ~250V of switching noise at ~4MHz; however, charge-pump noise contribution is negligible at the output of the regulator for most values of IOUT and COUT. Copyright (c) 2011, Texas Instruments Incorporated TPS73219 SBVS166 - JUNE 2011 www.ti.com BOARD LAYOUT RECOMMENDATION TO IMPROVE PSRR AND NOISE PERFORMANCE To improve ac performance such as PSRR, output noise, and transient response, it is recommended that the PCB be designed with separate ground planes for VIN and VOUT, with each ground plane connected only at the GND pin of the device. In addition, the ground connection for the bypass capacitor should connect directly to the GND pin of the device. time after VIN has been removed. This scenario can result in reverse current flow (if the IN pin is low impedance) and faster ramp times upon power-up. In addition, for VIN ramp times slower than a few milliseconds, the output may overshoot upon power-up. Note that current limit foldback can prevent device start-up under some conditions. See the Internal Current Limit section. INTERNAL CURRENT LIMIT DROPOUT VOLTAGE The TPS73219 internal current limit helps protect the regulator during fault conditions. Foldback current limit helps to protect the regulator from damage during output short-circuit conditions by reducing current limit when VOUT drops below 0.5V. See Figure 12 in the Typical Characteristics section for a graph of IOUT vs VOUT. The TPS73219 uses an NMOS pass transistor to achieve extremely low dropout. When (VIN - VOUT) is less than the dropout voltage (VDO), the NMOS pass device is in its linear region of operation and the input-to-output resistance is the RDS-ON of the NMOS pass element. Note from Figure 12 that approximately -0.2V of VOUT results in a current limit of 0mA. Therefore, if OUT is forced below -0.2V before EN goes high, the device may not start up. In applications that work with both a positive and negative voltage supply, the TPS73219 should be enabled first. ENABLE PIN AND SHUTDOWN The enable pin (EN) is active high and is compatible with standard TTL-CMOS levels. A VEN below 0.5V (max) turns the regulator off and drops the GND pin current to approximately 10nA. When EN is used to shutdown the regulator, all charge is removed from the pass transistor gate, and the output ramps back up to a regulated VOUT (see Figure 23). When shutdown capability is not required, EN can be connected to VIN. However, the pass gate may not be discharged using this configuration, and the pass transistor may be left on (enhanced) for a significant Copyright (c) 2011, Texas Instruments Incorporated For large step changes in load current, the TPS73219 requires a larger voltage drop from VIN to VOUT to avoid degraded transient response. The boundary of this transient dropout region is approximately twice the dc dropout. Values of VIN - VOUT above this line insure normal transient response. Operating in the transient dropout region can cause an increase in recovery time. The time required to recover from a load transient is a function of the magnitude of the change in load current rate, the rate of change in load current, and the available headroom (VIN to VOUT voltage drop). Under worst-case conditions [full-scale instantaneous load change with (VIN - VOUT) close to dc dropout levels], the TPS73219 can take a couple of hundred microseconds to return to the specified regulation accuracy. 13 TPS73219 SBVS166 - JUNE 2011 www.ti.com TRANSIENT RESPONSE The low open-loop output impedance provided by the NMOS pass element in a voltage follower configuration allows operation without an output capacitor for many applications. As with any regulator, the addition of a capacitor (nominal value 1F) from the OUT pin to ground will reduce undershoot magnitude but increase its duration. In the adjustable version, the addition of a capacitor, CFB, from the OUT pin to the FB pin will also improve the transient response. The TPS73219 does not have active pull-down when the output is over-voltage. This allows applications that connect higher voltage sources, such as alternate power supplies, to the output. This also results in an output overshoot of several percent if the load current quickly drops to zero when a capacitor is connected to the output. The duration of overshoot can be reduced by adding a load resistor. The overshoot decays at a rate determined by output capacitor COUT and the internal/external load resistance. The rate of decay is given by: (Fixed voltage version) VOUT dVdt + C OUT 80kW o R LOAD (4) REVERSE CURRENT The NMOS pass element of the TPS73219 provides inherent protection against current flow from the output of the regulator to the input when the gate of the pass device is pulled low. To ensure that all charge is removed from the gate of the pass element, the EN pin must be driven low before the input voltage is removed. If this is not done, the pass element may be left on due to stored charge on the gate. After the EN pin is driven low, no bias voltage is needed on any pin for reverse current blocking. Note that reverse current is specified as the current flowing out of the IN pin due to voltage applied on the OUT pin. There will be additional current flowing into the OUT pin due to the 80k internal resistor divider to ground (see Figure 2). THERMAL PROTECTION Thermal protection disables the output when the junction temperature rises to approximately +160C, allowing the device to cool. When the junction temperature cools to approximately +140C, the output circuitry is again enabled. Depending on power dissipation, thermal resistance, and ambient temperature, the thermal protection circuit may cycle on and off. This limits the dissipation of the regulator, protecting it from damage due to overheating. 14 Any tendency to activate the thermal protection circuit indicates excessive power dissipation or an inadequate heatsink. For reliable operation, junction temperature should be limited to +125C maximum. To estimate the margin of safety in a complete design (including heatsink), increase the ambient temperature until the thermal protection is triggered; use worst-case loads and signal conditions. For good reliability, thermal protection should trigger at least +35C above the maximum expected ambient condition of your application. This produces a worst-case junction temperature of +125C at the highest expected ambient temperature and worst-case load. The internal protection circuitry of the TPS73219 has been designed to protect against overload conditions. It was not intended to replace proper heatsinking. Continuously running the TPS73219 into thermal shutdown will degrade device reliability. POWER DISSIPATION The ability to remove heat from the die is different for each package type, presenting different considerations in the PCB layout. The PCB area around the device that is free of other components moves the heat from the device to the ambient air. Performance data for JEDEC low- and high-K boards are shown in the Thermal Information table. Using heavier copper will increase the effectiveness in removing heat from the device. The addition of plated through-holes to heat-dissipating layers will also improve the heat-sink effectiveness. Power dissipation depends on input voltage and load conditions. Power dissipation (PD) is equal to the product of the output current times the voltage drop across the output pass element (VIN to VOUT): P D + (VIN * VOUT) I OUT (5) Power dissipation can be minimized by using the lowest possible input voltage necessary to assure the required output voltage. PACKAGE MOUNTING Solder pad footprint recommendations for the TPS73219 are presented in Application Bulletin Solder Pad Recommendations for Surface-Mount Devices (SBFA015), available from the Texas Instruments web site at www.ti.com. Copyright (c) 2011, Texas Instruments Incorporated PACKAGE OPTION ADDENDUM www.ti.com 7-Apr-2011 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Qty Eco Plan (2) Lead/ Ball Finish MSL Peak Temp TPS73219DBVR ACTIVE SOT-23 DBV 5 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TPS73219DBVRG4 ACTIVE SOT-23 DBV 5 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TPS73219DBVT ACTIVE SOT-23 DBV 5 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TPS73219DBVTG4 ACTIVE SOT-23 DBV 5 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM (3) Samples (Requires Login) (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 29-Jul-2011 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) TPS73219DBVR SOT-23 DBV 5 3000 178.0 9.0 TPS73219DBVT SOT-23 DBV 5 250 178.0 9.0 Pack Materials-Page 1 B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant 3.23 3.17 1.37 4.0 8.0 Q3 3.23 3.17 1.37 4.0 8.0 Q3 PACKAGE MATERIALS INFORMATION www.ti.com 29-Jul-2011 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) TPS73219DBVR SOT-23 DBV 5 3000 180.0 180.0 18.0 TPS73219DBVT SOT-23 DBV 5 250 180.0 180.0 18.0 Pack Materials-Page 2 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All products are sold subject to TI's terms and conditions of sale supplied at the time of order acknowledgment. TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI's standard warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where mandated by government requirements, testing of all parameters of each product is not necessarily performed. TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and applications using TI components. To minimize the risks associated with customer products and applications, customers should provide adequate design and operating safeguards. TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask work right, or other TI intellectual property right relating to any combination, machine, or process in which TI products or services are used. Information published by TI regarding third-party products or services does not constitute a license from TI to use such products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI. Reproduction of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an unfair and deceptive business practice. TI is not responsible or liable for such altered documentation. Information of third parties may be subject to additional restrictions. Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all express and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice. TI is not responsible or liable for any such statements. TI products are not authorized for use in safety-critical applications (such as life support) where a failure of the TI product would reasonably be expected to cause severe personal injury or death, unless officers of the parties have executed an agreement specifically governing such use. Buyers represent that they have all necessary expertise in the safety and regulatory ramifications of their applications, and acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any use of TI products in such safety-critical applications, notwithstanding any applications-related information or support that may be provided by TI. Further, Buyers must fully indemnify TI and its representatives against any damages arising out of the use of TI products in such safety-critical applications. TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products are specifically designated by TI as military-grade or "enhanced plastic." Only products designated by TI as military-grade meet military specifications. Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is solely at the Buyer's risk, and that they are solely responsible for compliance with all legal and regulatory requirements in connection with such use. TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products are designated by TI as compliant with ISO/TS 16949 requirements. Buyers acknowledge and agree that, if they use any non-designated products in automotive applications, TI will not be responsible for any failure to meet such requirements. Following are URLs where you can obtain information on other Texas Instruments products and application solutions: Products Applications Audio www.ti.com/audio Communications and Telecom www.ti.com/communications Amplifiers amplifier.ti.com Computers and Peripherals www.ti.com/computers Data Converters dataconverter.ti.com Consumer Electronics www.ti.com/consumer-apps DLP(R) Products www.dlp.com Energy and Lighting www.ti.com/energy DSP dsp.ti.com Industrial www.ti.com/industrial Clocks and Timers www.ti.com/clocks Medical www.ti.com/medical Interface interface.ti.com Security www.ti.com/security Logic logic.ti.com Space, Avionics and Defense www.ti.com/space-avionics-defense Power Mgmt power.ti.com Transportation and Automotive www.ti.com/automotive Microcontrollers microcontroller.ti.com Video and Imaging www.ti.com/video RFID www.ti-rfid.com Wireless www.ti.com/wireless-apps RF/IF and ZigBee(R) Solutions www.ti.com/lprf TI E2E Community Home Page e2e.ti.com Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265 Copyright (c) 2011, Texas Instruments Incorporated