Features
l Ideally Suited for Automatic Insertion
l 150oC Junction Temperature
l For Switching and AF Amplifier Applications
l Epitaxial Planar Die Construction
Mechanical Data
l Case: SOT-23, Molded Plastic
l Terminals: Solderable per MIL-STD-202, Method 208
l Polarity: See Diagram
l Weight: 0.008 grams ( approx.)
l Marking: BC817-16 6A
BC817-25 6B
BC817-40 6C
Maximum Ratings @ 25oC Unless Otherwise Specified
Charateristic Symbol Value Unit
Collector-Emitter Voltage VCEO 45 V
Emitter-Base Voltage VEBO 5V
Collector Current I
800 mA
Peak Collector Current I
1000 mA
Peak Emitter Current I
1000 mA
Power Dissipation@T
=50oC(Note1) P
310 mW
Operating & Storage Temperature Tj, TSTG -55~150 oC
Note: 1. Device mounted on Ceramic Substrate 0.7mm X 2.5cm2 area
THRU
BC817-40
NPN Small
Signal Transistor
310mW
Suggested Solder
Pad Layout
DIMENSIONS
INCHES MM
DIM MIN MAX MIN MAX NOTE
A.110 .120 2.80 3.04
B.083 .098 2.10 2.64
C.047 .055 1.20 1.40
D.035 .041 .89 1.03
E.070 .081 1.78 2.05
F.018 .024 .45 .60
G.0005 .0039 .013 .100
H.035 .044 .89 1.12
J.003 .007 .085 .180
K.015 .020 .37 .51
A
B
D
F
G
mm
SOT-23
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Revision: 2 2003/04/30
omponents
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